High-sealing compression ring assembly

Abstract

The utility model provides a high sealing pressure ring assembly comprising a workbench, the workbench is provided with a collecting groove, the collecting groove is internally and movably provided with a rotating seat used for placing a wafer, an anti-bias pressure ring is arranged above the rotating seat, two sides of the anti-bias pressure ring are provided with moving seats, the bottom of each moving seat is provided with a connecting frame, and the connecting frames are connected with the rotating seat. The bottom of the connecting frame is fixedly connected with the anti-bias pressing ring, an air cylinder is installed on each moving seat, the output end of each air cylinder is fixedly connected with the top of the corresponding connecting frame, a base is arranged on one side of each moving seat, two limiting seats are symmetrically fixed to each base, and a plurality of sliding rails are fixed between the two limiting seats. According to the wafer polishing device, the problems that if the edge of a wafer is warped during polishing, the whole wafer is driven by polishing equipment to deviate greatly, the equipment is prone to being polluted by scraps, and materials are prone to being damaged are solved. The wafer polishing device solves the problems that in the polishing process, if the edge of the wafer is warped, the whole wafer is driven by the polishing equipment to deviate greatly, and the equipment is prone to being polluted by the scraps.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a high-sealing pressure ring component. Background Art

[0002] With the rapid development of science and technology, electronic products such as smart phones and tablet computers have become indispensable products in modern people's lives. These electronic products contain many semiconductor chips, and the main manufacturing material of semiconductor chips is wafers. During the processing of wafers, circuit patterns need to be etched. This process usually uses semiconductor (etching) process equipment to process the wafers.

[0003] In the related art, wafers are processed in a process chamber of semiconductor process equipment. If the edge of the wafer is warped during polishing, the entire wafer will be driven by the polishing equipment to shift significantly, which can easily result in debris contaminating the equipment and damaging the material.

[0004] Therefore, it is necessary to provide a new high-seal pressure ring assembly to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a high-sealing pressure ring assembly, which solves the problem that if the edge of the wafer is warped during grinding, the entire wafer will be driven by the grinding equipment to cause a large deviation, which may easily cause debris to contaminate the equipment and damage the material.

[0006] The high-sealing pressure ring assembly provided by the utility model comprises a workbench, a grinding mechanism is arranged above the workbench, a collecting tank is arranged on the workbench, a rotating seat for placing wafers is movably arranged inside the collecting tank, an anti-bias pressure ring is arranged above the rotating seat, moving seats are arranged on both sides of the anti-bias pressure ring, a connecting frame is arranged at the bottom of the moving seat, and the bottom of the connecting frame is fixedly connected to the anti-bias pressure ring;

[0007] A cylinder is installed on the movable seat, and an output end of the cylinder is fixedly connected to the top of the connecting frame.

[0008] In a preferred embodiment, a base is provided on one side of each of the two movable seats, the base is fixed on the workbench, two limit seats are symmetrically fixed on the base, a plurality of slide rails are fixed between the two limit seats, and the slide rails are slidably connected to the movable seat.

[0009] In a preferred embodiment, a screw rod is movably arranged between the two limit seats through a bearing, the screw rod passes through the movable seat, and the screw rod is threadedly connected to the movable seat;

[0010] One end of the screw rod extends out of the limit seat and is installed with a first bevel gear. A motor is installed on the workbench. A second bevel gear is installed at the output end of the motor. The second bevel gear is meshed with the first bevel gear.

[0011] In a preferred embodiment, an annular baffle is fixed on the outside of the anti-bias pressure ring, an inner baffle is fixed inside the anti-bias pressure ring, and a through hole is opened on the surface of the inner baffle.

[0012] In a preferred embodiment, the through hole is larger than the grinding head of the grinding mechanism.

[0013] In a preferred embodiment, the anti-bias pressure ring is provided with a plurality of chip removal grooves in an annular shape.

[0014] Beneficial effects of the utility model:

[0015] 1. When using this ring assembly, the staff can place the wafer on the rotating seat, and then start the motor to drive the screw to rotate, so that the two moving seats move along the slide rail until the anti-bias ring moves to the top of the rotating seat. The cylinder is started to drive the anti-bias ring to press the outermost side of the wafer to prevent the wafer from being driven by the grinding mechanism to deviate. During the grinding process, the generated debris will enter the collection tank along the chip removal groove for collection;

[0016] 2. The annular baffle and the inner baffle can seal the processing area to prevent a large amount of debris generated by processing from falling onto the workbench surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The main structure of the high-sealing pressure ring assembly provided by the utility model is a three-dimensional view Figure 1 ;

[0018] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of shown;

[0019] Figure 3 for Figure 1 A schematic diagram of the enlarged structure of B shown;

[0020] Figure 4 The main structure of the high-sealing pressure ring assembly provided by the utility model is a three-dimensional view Figure 2 .

[0021] Numbers in the figure: 1. workbench; 2. grinding mechanism; 3. collecting tank; 4. rotating seat; 5. anti-bias pressure ring; 6. moving seat; 7. connecting frame; 8. cylinder; 9. base; 10. limit seat; 11. slide rail; 12. screw; 13. first bevel gear; 14. motor; 15. second bevel gear; 16. annular baffle; 17. inner baffle; 18. through hole; 19. chip groove; 20. grinding head. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0023] Please refer to Figure 1 , Figure 2 , Figure 3 as well as Figure 4 ,in Figure 1 The main structure of the high-sealing pressure ring assembly provided by the utility model is a three-dimensional view Figure 1 ; Figure 2 for Figure 1 A schematic diagram of the enlarged structure of shown; Figure 3 for Figure 1 A schematic diagram of the enlarged structure of B shown; Figure 4 The main structure of the high-sealing pressure ring assembly provided by the utility model is a three-dimensional view Figure 2 .

[0024] In the specific implementation process, Figure 1-Figure 4 As shown, it includes a workbench 1, a grinding mechanism 2 is arranged above the workbench 1, a collecting tank 3 is arranged on the workbench 1, a rotating seat 4 for placing wafers is movably arranged inside the collecting tank 3, an anti-bias pressure ring 5 is arranged above the rotating seat 4, movable seats 6 are arranged on both sides of the anti-bias pressure ring 5, a connecting frame 7 is arranged at the bottom of the movable seat 6, the bottom of the connecting frame 7 is fixedly connected to the anti-bias pressure ring 5, an annular baffle 16 is fixed on the outside of the anti-bias pressure ring 5, an inner baffle 17 is fixed inside the anti-bias pressure ring 5, a through hole 18 is opened on the surface of the inner baffle 17, the size of the through hole 18 is larger than the grinding head 20 of the grinding mechanism 2, when the anti-bias pressure plate 5 fixes the wafer, the grinding head 20 at the grinding mechanism 2 can fall along the through hole 18 to the position in contact with the wafer, and the wafer can be ground by the grinding head 20.

[0025] A plurality of chip grooves 19 are provided in an annular shape on the anti-bias ring 5. The annular baffle plate 16 and the inner baffle plate 17 can seal the processing area to prevent a large amount of debris generated during processing from falling onto the surface of the workbench 1. During the grinding process, the debris generated will enter the collecting tank 3 along the chip grooves 19 for collection.

[0026] A cylinder 8 is installed on the moving seat 6, and the output end of the cylinder 8 is fixedly connected to the top of the connecting frame 7. A base 9 is provided on one side of the two moving seats 6, and the base 9 is fixed on the workbench 1. Two limit seats 10 are symmetrically fixed on the base 9. A plurality of slide rails 11 are fixed between the two limit seats 10. The slide rails 11 are slidably connected to the moving seat 6. A screw rod 12 is movably arranged between the two limit seats 10 through a bearing. The screw rod 12 passes through the moving seat 6, and the screw rod 12 is threadedly connected to the moving seat 6. One end of the screw rod 12 extends out of the limit seat 10 and is installed with a first bevel gear 13. A motor 14 is installed on the workbench 1, and a second bevel gear 13 is installed at the output end of the motor 14. Gear 15, the second bevel gear 15 is meshed with the first bevel gear 13. When the annular assembly is in use, the staff can place the wafer on the rotating seat 4, and then start the motor 14. Under the transmission action of the first bevel gear 13 and the second bevel gear 15, the screw rod 12 will be driven to rotate, so that the two moving seats 6 move along the slide rail 11 until the anti-bias ring 5 moves to the top of the rotating seat 4. The cylinder 8 is started to drive the anti-bias ring 5 to press the outermost side of the wafer to prevent the wafer from being driven by the grinding mechanism 2 to deviate. During the grinding process, the debris generated will enter the collection tank 3 along the chip groove 19 for collection.

[0027] Working principle of the utility model: When the ring assembly is used, the staff can place the wafer on the rotating seat 4, and then start the motor 14. Under the transmission action of the first bevel gear 13 and the second bevel gear 15, the screw rod 12 will be driven to rotate, so that the two moving seats 6 move along the slide rail 11 until the anti-bias ring 5 moves to the top of the rotating seat 4;

[0028] The cylinder 8 is activated to drive the anti-bias ring 5 to press the outermost side of the wafer to prevent the wafer from being deflected by the grinding mechanism 2. During the grinding process, the generated debris will enter the collecting tank 3 along the chip groove 19 for collection;

[0029] The annular baffle 16 and the inner baffle 17 can seal the processing area to prevent a large amount of debris generated during processing from falling onto the surface of the workbench 1 .

[0030] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0031] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A high-sealing pressure ring assembly, comprising a workbench (1), a grinding mechanism (2) is arranged above the workbench (1), a collecting tank (3) is arranged on the workbench (1), a rotating seat (4) for placing wafers is movably arranged inside the collecting tank (3), characterized in that: An anti-bias pressure ring (5) is arranged above the rotating seat (4), movable seats (6) are arranged on both sides of the anti-bias pressure ring (5), a connecting frame (7) is arranged at the bottom of the movable seat (6), and the bottom of the connecting frame (7) is fixedly connected to the anti-bias pressure ring (5); A cylinder (8) is installed on the movable seat (6), and an output end of the cylinder (8) is fixedly connected to the top of the connecting frame (7).

2. The high-seal pressure ring assembly according to claim 1, characterized in that: A base (9) is provided on one side of each of the two movable seats (6), the base (9) being fixed on the workbench (1), two limit seats (10) being symmetrically fixed on the base (9), a plurality of slide rails (11) being fixed between the two limit seats (10), and the slide rails (11) being slidably connected to the movable seats (6).

3. The high-seal pressure ring assembly according to claim 2, characterized in that: A screw rod (12) is movably arranged between the two limit seats (10) via a bearing, the screw rod (12) penetrates the movable seat (6), and the screw rod (12) is threadedly connected to the movable seat (6); One end of the screw rod (12) extends out of the limit seat (10) and is installed with a first bevel gear (13); a motor (14) is installed on the workbench (1); a second bevel gear (15) is installed at the output end of the motor (14); the second bevel gear (15) is meshed with the first bevel gear (13).

4. The high-seal pressure ring assembly according to claim 3, characterized in that: An annular baffle (16) is fixed on the outside of the anti-bias pressure ring (5), an inner baffle (17) is fixed inside the anti-bias pressure ring (5), and a through hole (18) is opened on the surface of the inner baffle (17).

5. The high-seal pressure ring assembly according to claim 4, characterized in that: The through hole (18) is larger in size than the grinding head (20) of the grinding mechanism (2).

6. The high-seal pressure ring assembly according to claim 5, characterized in that: The anti-bias pressure ring (5) is provided with a plurality of chip removal grooves (19) in an annular shape.

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