Improved wafer transmission device

Abstract

The utility model discloses an improved wafer transmission device, which comprises a transmission body, the transmission body comprises a transmission chamber, a first pipeline, a second pipeline and a control piece, one end of the first pipeline is communicated with the transmission chamber, the other end of the first pipeline is suitable for being communicated with vacuumizing equipment, one end of the second pipeline is communicated with the transmission chamber, and the other end of the second pipeline is suitable for being communicated with a clean air source. The first detection piece is arranged on the transmission cavity, the second detection piece is arranged on the second pipeline and is electrically connected with the control piece, and the control piece generates first state information when a first vacuum degree value, obtained by the first detection piece, in the transmission cavity is smaller than or equal to a first threshold value; and when a second vacuum degree value in the transmission chamber acquired by the second detection piece is greater than or equal to a second threshold value, second state information is generated. Through the first detection piece and the second detection piece, the working state in the transmission cavity can be fed back in real time, the process cavity is prevented from being polluted, and taking and placing of wafers in the transmission cavity and stable operation of the wafer transmission device are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to an improved wafer transmission device. Background Art

[0002] During the manufacturing process, semiconductor devices need to go through a series of process steps (such as etching, photolithography, thin film deposition, etc.), and these process steps require the use of corresponding semiconductor equipment (such as etcher, photolithography machine, coater, etc.). Since both semiconductor equipment and process steps will have a significant impact on the performance of semiconductor devices, a small number of wafers are usually used for trial production or testing in the initial research and development stage or process testing stage to verify the stability of the semiconductor equipment and the feasibility of the process.

[0003] All semiconductor equipment has a process chamber, which is used to execute corresponding process steps. In order to ensure the accuracy and stability of the semiconductor manufacturing process, most process chambers are in a vacuum environment. The fully automatic conveying platform can realize the placement and loading of wafers into the process chamber in a vacuum environment. However, the cost and energy consumption of transferring wafers by the fully automatic conveying platform are high, and it will also cause waste, so it is not suitable for trial production or testing of a small number of wafers. If the wafer is manually placed into the process chamber in a vacuum environment, it will not only contaminate the wafer, but also destroy the vacuum environment of the process chamber, and the efficiency of manual placement is low. Therefore, the applicant has designed and developed a wafer transfer device with a publication number of CN114496877A, which can meet the fast test switching function through a simple and reliable conveying plate and drive structure, improve the transmission and transfer efficiency of wafers, and has good practicality under the conditions of small batch testing and trial production.

[0004] The above-mentioned wafer transfer device has a transfer chamber. When placing wafers in the transfer chamber, gas needs to be filled to adjust the pressure in the transfer chamber to atmospheric pressure, and then the wafers in the transfer chamber are placed; when transferring wafers to a process chamber in a vacuum environment, the gas in the transfer chamber needs to be extracted and adjusted to a vacuum state, and then the wafers in the process chamber are placed. During the wafer transfer process, the upper computer software stores the working status of the transfer chamber; however, due to sudden shutdowns during the operation of the wafer transfer device, the working status of the transfer chamber stored in the software is inconsistent with the actual working status of the transfer chamber, which can easily lead to the wafers being placed in the process chamber under atmospheric pressure, or the wafers being placed in the transfer chamber under vacuum, which in turn causes the process chamber to be contaminated or the wafer placement operation in the transfer chamber to be unable to be performed. Utility Model Content

[0005] In view of this, the utility model provides an improved wafer transfer device to solve the problem that the existing wafer transfer device may suddenly stop during operation, resulting in the working state of the transfer chamber stored in the software being inconsistent with the actual working state of the transfer chamber, which may easily lead to wafer placement in the process chamber in the atmospheric state, or wafer placement in the transfer chamber in the vacuum state, thereby causing the process chamber to be contaminated or the wafer placement operation in the transfer chamber to be unable to be performed.

[0006] The utility model provides an improved wafer transmission device, comprising:

[0007] The transmission body comprises a transmission chamber, a first pipeline, a second pipeline and a control member, wherein one end of the first pipeline is connected to the transmission chamber, and the other end is suitable for connecting to a vacuum pump, and one end of the second pipeline is connected to the transmission chamber, and the other end is suitable for connecting to a clean gas source;

[0008] A first detection member, disposed on the transmission chamber;

[0009] A second detection member is arranged on the second pipeline;

[0010] The first detection component and the second detection component are both electrically connected to the control component;

[0011] The control component generates first state information when the first vacuum value in the transmission chamber obtained by the first detection component is less than or equal to a first threshold value; and generates second state information when the second vacuum value in the transmission chamber obtained by the second detection component is greater than or equal to a second threshold value.

[0012] Optionally, in the above-mentioned improved wafer transmission device, the transmission body further comprises a first on-off switch, the transmission chamber has a discharge port, one end of the first on-off switch is installed at the discharge port, and the other end can be communicated with the process chamber, and the first on-off switch is electrically connected to the control component, and the first on-off switch is used to control the on-off between the discharge port and the process chamber;

[0013] The first on-off switch has a first pick-and-place state for connecting the transfer chamber with the process chamber according to the first state information.

[0014] Optionally, in the above-mentioned improved wafer transmission device, the transmission body also includes a cover plate, the transmission chamber has a feed port, the cover plate is covered on the feed port, and the cover plate has a second pick-up and placement state separated from the feed port based on the second state information.

[0015] Optionally, in the above-mentioned improved wafer transmission device, the transmission body further comprises:

[0016] A support member, the cover plate is hingedly mounted on the transmission chamber, the support member is rotatably connected to the cover plate, and the support member has a limiting groove;

[0017] The cover plate is provided with a limiting protrusion;

[0018] In the second placement state, the limiting groove is engaged with the limiting protrusion to limit the supporting state of the supporting member; and the limiting groove is separated from the limiting protrusion to release the linkage state of the supporting member;

[0019] The support member can rotate under the action of external force to switch between the support state and the linkage state.

[0020] Optionally, in the above-mentioned improved wafer transfer device, a slide groove is provided on the support member, the slide groove is connected to the limiting groove, the slide groove is sleeved outside the limiting protrusion, and the limiting protrusion can slide along the slide groove.

[0021] Optionally, in the above-mentioned improved wafer transmission device, the transmission body further comprises:

[0022] A second on-off switch, two ends of which are respectively connected to the first pipeline and the transmission chamber, and are electrically connected to the control element, and the second on-off switch is used to control the on-off of the first pipeline and the transmission chamber;

[0023] a third detection component, disposed on the first pipeline and electrically connected to the control component, and used for obtaining a third vacuum value in the first pipeline;

[0024] The second on-off switch is configured to connect the first pipeline with the transmission chamber when the third vacuum value is less than or equal to a third threshold value.

[0025] Optionally, in the above-mentioned improved wafer transmission device, the transmission body includes a base, which is fixedly connected to the transmission chamber, the base is provided with an installation cavity, the first pipeline and the second pipeline are both arranged in the installation cavity, and the base has a first interface and a second interface, the second interface and the first interface are located on the same side of the base, the first pipeline is connected to the vacuum equipment through the first interface, and the second pipeline is connected to the clean gas source through the second interface.

[0026] Optionally, in the above-mentioned improved wafer transmission device, the transmission body further comprises:

[0027] A driving member connected to the base and electrically connected to the control member;

[0028] A carrier connected to the driving member and disposed in the transmission chamber, the carrier being used to carry a wafer;

[0029] The driving member can drive the bearing member to move;

[0030] The fourth detection component is arranged on the chamber and is electrically connected to the control component, and is used to obtain detection information of the presence of wafers on the carrier.

[0031] Optionally, in the above-mentioned improved wafer transmission device, the transmission body comprises:

[0032] A status indicator, disposed on the base, for outputting indication information;

[0033] An emergency stop button is arranged on the base and is used to control the emergency stop of the driving member.

[0034] Optionally, in the above-mentioned improved wafer transmission device, the transmission body includes a transparent window, which is arranged on the transmission chamber or on the cover plate.

[0035] The technical solution provided by the utility model has the following advantages:

[0036] The improved wafer transmission device provided by the utility model comprises a transmission body, the transmission body comprises a transmission chamber, a first pipeline, a second pipeline and a control part, one end of the first pipeline is connected to the transmission chamber, and the other end is suitable for being connected to a vacuum pumping device, one end of the second pipeline is connected to the transmission chamber, and the other end is suitable for being connected to a clean gas source, a first detection part is arranged on the transmission chamber, and a second detection part is arranged on the second pipeline, and both are electrically connected to the control part, and the control part has a function of generating first state information when the first detection part obtains a first vacuum value in the transmission chamber that is less than or equal to a first threshold value, and generating second state information when the second detection part obtains a second vacuum value in the transmission chamber that is greater than or equal to a second threshold value. The first detection part can detect the vacuum value in the transmission chamber in real time, and when the first vacuum value in the transmission chamber is less than or equal to the first threshold value, the vacuum degree of the transmission chamber meets the requirements of the vacuum environment, and the wafer in the process chamber can be taken and placed. Since the second pipeline is connected to the clean gas source and communicates with the transfer chamber, the vacuum value in the second pipeline is the same as the vacuum value in the transfer chamber, so that the vacuum value in the second pipeline can be detected by the second detection component and then the second vacuum value in the transfer chamber can be monitored. When the second vacuum value is greater than or equal to the second threshold value, the vacuum degree of the transfer chamber meets the requirements of the atmospheric environment, and the wafers in the transfer chamber can be taken and placed. The working status in the transfer chamber can be fed back in real time through the first detection component and the second detection component, avoiding the situation where the working status of the transfer chamber stored in the control component is inconsistent with the actual working status of the transfer chamber, preventing contamination of the process chamber and ensuring the wafer taking and placing in the transfer chamber and the stable operation of the wafer transfer device. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 It is a structural schematic diagram of the improved wafer transmission device provided by the utility model;

[0039] Figure 2 It is a structural schematic diagram of the improved wafer transmission device provided by the utility model with part of the base removed;

[0040] Figure 3 The schematic diagram of the structure of the improved wafer transmission device provided by the utility model without part of the base, part of the first pipeline and part of the second pipeline;

[0041] Figure 4 It is a cross-sectional view of the improved wafer transmission device provided by the utility model;

[0042] Figure 5 yes Figure 1 A partial enlarged schematic diagram of the middle circle A.

[0043] Description of reference numerals:

[0044] 101, transmission chamber; 102, first pipeline; 103, second pipeline; 104, control member; 105, first on-off switch member; 106, cover plate; 107, support member; 1071, limit groove; 1072, slide groove; 108, limit protrusion; 109, second on-off switch member; 110, third detection member; 111, base; 1111, first interface; 1112, second interface; 1113, third interface; 1114, fourth interface; 112, driving member; 113, bearing member; 114, fourth detection member; 115, status indicator; 116, emergency stop button; 117, start / stop light; 118, transparent window;

[0045] 200, second test piece;

[0046] 300, wafer;

[0047] 400. First detection component. DETAILED DESCRIPTION

[0048] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0049] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0050] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0052] Example 1

[0053] This embodiment provides an improved wafer transmission device, such as Figures 1 to 5 As shown, it includes a transmission body, a first pipeline 102, a second pipeline 103 and a control component 104. One end of the first pipeline 102 is connected to the transmission chamber 101, and the other end is suitable for connecting to a vacuum pumping device. One end of the second pipeline 103 is connected to the transmission chamber 101, and the other end is suitable for connecting to a clean gas source. The first detection component 400 is arranged on the transmission chamber 101, and the second detection component 200 is arranged on the second pipeline 103. The first detection component 400 and the second detection component 200 are both electrically connected to the control component 104. The control component 104 has a function of generating first state information when a first vacuum value in the transmission chamber 101 obtained by the first detection component is less than a first threshold value, and generating second state information when a second vacuum value in the transmission chamber 101 obtained by the second detection component 200 is greater than or equal to a second threshold value.

[0054] Specifically, the transfer chamber 101 is surrounded by plates, and the cross-sectional shape of the transfer chamber 101 can be circular, elliptical, square or other shapes. Those skilled in the art can adjust the shape of the transfer chamber 101 as needed; the vacuum pump is a vacuum pump, and the clean gas source is a gas supply device. The gas used by the clean gas source can be one or more of inert gases such as nitrogen or argon. Nitrogen is preferably used in this embodiment. By filling the transfer chamber 101 with clean gas and simultaneously pumping the gas, impurities can be removed to create a dust-free environment, thereby preventing dust and impurities from contaminating the wafer 300 in the transfer chamber 101. The first pipeline 102 is a vacuum pipe. The material of the vacuum pipe includes one or more of metals and non-metals. The vacuum pipe has good sealing, strength, stability and thermal conductivity to meet the use of a vacuum environment. The second pipeline 103 is a gas pipeline. The gas pipeline has Good sealing to prevent external gas from entering the transmission chamber 101. The first detection component 400 can be a vacuum gauge or other vacuum detection instrument. The first detection component 400 is connected to the transmission chamber 101 and is used to obtain the vacuum value in the transmission chamber 101. The second detection component 200 is a vacuum switch or other air pressure detection sensor. The second detection component 200 is arranged on the second pipeline 103 to obtain the air pressure value in the second pipeline 103. The control component 104 includes a valve island and an electrical module. The control component 104 is used to receive an input signal and send an output signal after processing, or the control component 104 is used to transmit a signal. The control component 104 can also provide power. The control component 104 is electrically connected to the first detection component and the second detection component 200 through a communication interface or a cable respectively. The communication interface supports multiple communication protocols, including but not limited to Modbus, PROFI BUS and OP, when the first vacuum value detected by the first detection component is less than or equal to the first threshold value (the first threshold value can be set according to the actual working conditions), the first threshold value is 0-10 Torr (Torr, vacuum unit, 1 Torr = 133.3 Pa), at this time, the vacuum degree of the transmission chamber is consistent with the vacuum degree of the process chamber, that is, the vacuum degree in the transmission chamber 101 meets the preset vacuum environment, and the control component 104 generates the first state information, and the first state information is that the wafer 300 in the process chamber can be taken and placed, and the transmission body can be carried out later The wafer 300 in the process gas chamber is continued to be taken and placed; when the second vacuum value detected by the second detection component 200 is greater than or equal to the second threshold value (the second threshold value can be set according to the actual working conditions), the second threshold value is 750Torr, and the vacuum degree in the transmission chamber 101 is the atmospheric pressure value, that is, the pressure in the transmission chamber 101 is consistent with the external pressure, and the vacuum degree in the transmission chamber 101 meets the preset atmospheric environment. The second detection component 200 generates second state information, and the second state information indicates that the wafer 300 in the transmission chamber 101 can be taken and placed.

[0055] The improved wafer transfer device provided in this embodiment has a first detection component that can detect the vacuum value in the transfer chamber 101 in real time. When the first vacuum value in the transfer chamber 101 is less than or equal to the first threshold value, the vacuum degree of the transfer chamber 101 meets the requirements of the vacuum environment, and the wafer 300 in the process chamber can be taken and placed. Since the second pipeline is connected to the clean gas source and communicates with the transfer chamber, the vacuum value in the second pipeline 103 is the same as the vacuum value in the transfer chamber 101, so that the vacuum value in the second pipeline can be detected by the second detection component and then the second vacuum value in the transfer chamber can be monitored. When the second vacuum value in the second pipeline 103 is greater than or equal to the second threshold value, the vacuum degree of the transfer chamber 101 meets the requirements of the atmospheric environment, and the wafer 300 in the transfer chamber 101 can be taken and placed. Through the first detection component and the second detection component 200, the working status in the transfer chamber 101 can be fed back in real time, avoiding the situation that the working status of the transfer chamber 101 stored in the control component 104 is inconsistent with the actual working status of the transfer chamber 101, preventing process chamber contamination, and ensuring the wafer taking and placing in the transfer chamber 101 and the stable operation of the wafer transfer device.

[0056] like Figures 1 to 4 As shown, the improved wafer transmission device provided in this embodiment, the transmission body also includes a first on-off switch 105, the first on-off switch 105 can be a vacuum gate valve or other vacuum gates, the transmission chamber 101 has a discharge port, the discharge port is arranged on the right side of the transmission chamber 101, as a replaceable embodiment, the discharge port can be arranged on other sides of the transmission chamber 101, by arranging the discharge port on the right side of the transmission chamber 101, it is convenient to connect with the process chamber, the cross-sectional area of ​​the discharge port is larger than the maximum cross-sectional area of ​​the wafer 300, it is convenient for the wafer 300 to pass through the discharge port, the first on-off switch 105 is fixed to the outer wall of the transmission chamber 101 The first on-off switch 105 is connected to the discharge port, and the end of the first on-off switch 105 away from the transmission chamber 101 is connected to the process chamber. The first on-off switch 105 is used to control the on-off between the process chamber and the transmission chamber 101. The first on-off switch 105 is electrically connected to the control component 104 through a cable or a communication interface. The control component 104 sends the first state information to the first on-off switch 105. After the first on-off switch 105 receives the first state information, the first on-off switch 105 is opened to connect the transmission chamber 101 and the process chamber, and the subsequent wafer 300 handling operation can be carried out normally. Through the cooperation of the first on-off switch 105, the first detection component and the control component 104, the first on-off switch 105 can be automatically opened after the transmission chamber 101 meets the vacuum environment.

[0057] like Figures 1 to 4As shown, the improved wafer transmission device provided in this embodiment, the transmission body also includes a cover plate 106, the transmission chamber 101 has a feed port, and the feed port is arranged on the top surface of the transmission chamber 101. As an alternative embodiment, the feed port can also be opened on other sides of the transmission chamber 101. The shape of the feed port is square. Of course, the shape of the feed port can also be adjusted as needed. The cross-sectional area of ​​the feed port is larger than the cross-sectional area of ​​the wafer 300 to ensure that the wafer 300 can pass through the feed port. The cover plate 106 and the feed port are arranged on the same side of the transmission chamber 101. On the side, the cross-sectional area of ​​the cover plate 106 is larger than the cross-sectional area of ​​the feed port. The cover plate 106 and the transfer chamber 101 can be threadedly connected, plugged in, snapped in or other detachable connection methods. When the cover plate 106 is covered on the feed port, the cover plate 106 completely covers the feed port, and a sealing ring or sealant is also provided between the cover plate 106 and the feed port to form a sealed space in the transfer chamber 101, which can not only prevent outside air from entering the sealed chamber and contaminating the wafer 300 therein, but also help to improve the efficiency of vacuuming the transfer chamber 101.

[0058] like Figure 1 and Figure 5 As shown, the improved wafer transmission device provided in this embodiment, the transmission body also includes a support member 107 and a limiting protrusion 108, the cover plate 106 is hinged to the outer wall of the transmission chamber 101, the support member 107 is hinged to the side of the cover plate 106, a limiting groove 1071 is provided on the support member 107, the limiting protrusion 108 is fixedly connected to the outer wall of the transmission chamber 101, in the second pick-up and placement state, the limiting groove 1071 has a snap connection with the limiting protrusion 108 to limit the supporting state of the support member 107, and the limiting groove 1071 is separated from the limiting protrusion 108 to release the linkage state of the support member 107; and the support member 107 has a switching state of rotating under the action of an external force to switch between the supporting state and the linkage state. Figure 1Taking the perspective of as an example, the support member 107 rotates in the ZOX plane, that is, the support member 107 rotates around the Y axis, the limiting protrusion 108 can be a columnar protrusion, and the limiting groove 1071 is a groove or a through groove adapted to the limiting protrusion 108. When it is necessary to support the cover plate 106, since the support member 107 is in the ZOX plane, the support member 107 can rotate clockwise under the action of gravity, so that the limiting groove 1071 approaches the limiting protrusion 108 until the limiting groove 1071 is sleeved on the outer periphery of the limiting protrusion 108. At this time, since the limiting protrusion 108 is located in the limiting groove 1071, so the support member 107 cannot continue to rotate clockwise, and the gravity of the cover plate 106 makes the inner wall of the limiting groove 1071 press against the limiting protrusion 108 to limit the cover plate 106 and prevent the cover plate 106 from rotating under the action of gravity. This is the supporting state; when the cover plate 106 needs to be rotated, the limiting groove 1071 is disengaged from the limiting protrusion 108, and the cover plate 106 can rotate under the action of gravity until the cover plate 106 is covered on the feed port. This is the linkage state of the support member 107.

[0059] In a replaceable embodiment, the support member 107 can rotate around the X-axis, that is, the support member 107 rotates in the ZOY plane. When it is necessary to support the cover plate 106, the support member 107 is pulled by hand to rotate the support member 107 around the X-axis until the limiting groove 1071 is buckled on the limiting protrusion 108. At this time, the limiting groove 1071 is plugged into the limiting protrusion 108 to prevent the cover plate 106 from continuing to rotate.

[0060] like Figure 5 As shown, the improved wafer transmission device provided in this embodiment has a slide groove 1072 on the support member 107, and the slide groove 1072 can be a groove or a through groove. The slide groove 1072 is connected with the limiting groove 1071, and the slide groove 1072 and the limiting groove 1071 have a smooth transition, and the limiting groove 1071 is located above the slide groove 1072. When the cover plate 106 is in a switching state, the cover plate 106 rotates, driving the support rod to move, so that the inner wall of the slide groove 1072 slides with the limiting protrusion 108, thereby making the opening and closing of the cover plate 106 smoother.

[0061] like Figures 1 to 4As shown, the improved wafer transmission device provided in this embodiment, the transmission body also includes a second on-off switch 109 and a third detection member 110, the second on-off switch 109 and the third detection member 110 are electrically connected to the control member 104 through cables or communication protocols, the second on-off switch 109 is a vacuum angle valve or other vacuum valve, the second on-off switch 109 is fixedly connected to the transmission chamber 101, the two ends of the second on-off switch 109 are respectively connected to the transmission chamber 101 and the first pipeline 102, the second on-off switch 109 is used to control the on-off between the first pipeline 102 and the transmission chamber 101; the third detection member 110 is a vacuum switch or other air pressure detection sensor, the third detection member 110 is arranged on the first pipeline 102, and is used to obtain the air pressure value in the first pipeline 102; when the third detection member 110 detects When the third vacuum value in the first pipeline 102 is less than or equal to the third threshold value (the third threshold value can be adjusted according to the actual working conditions), the first threshold value is 75 Torr. At this time, the vacuum degree in the first pipeline 102 is lower than the external atmospheric pressure, that is, the vacuum pumping equipment has started to work, and the third detection component 110 sends information that the vacuum pumping equipment has been turned on to the control component 104. The control component 104 transmits the information that the vacuum pumping equipment has been turned on to the second on-off switch component 109. After receiving the information, the second on-off switch component 109 opens to connect the first pipeline 102 with the transmission chamber 101, and the vacuum pumping equipment vacuumizes the transmission chamber 101. The air pressure value in the first pipeline 102 is monitored by the third detection component 110 to avoid the vacuum pumping equipment not being turned on and the second on-off switch component 109 being turned on in advance, which causes the transmission chamber 101 to be contaminated.

[0062] like Figures 1 to 4As shown, the improved wafer transmission device provided in this embodiment, the transmission body also includes a base 111, the base 111 is fixedly connected to the transmission chamber 101, the base 111 is used to support the transmission chamber 101, and can provide a certain height, which is convenient for the staff to operate the wafer 300 transmission device, and an installation cavity is provided in the base 111, the first pipeline 102 and the second pipeline 103 are both arranged in the installation cavity, and the installation cavity is used to accommodate the first pipeline 102 and the second pipeline 103; a first interface 1111, a second interface 1112, a third interface 1113, and a fourth interface 1114 are provided on the base 111; the first interface 1111, the second interface 1112, the third interface 1113, and the fourth interface 1114 are all located on the same side of the base 111, which is convenient for the staff to quickly find the corresponding interface and improves the space utilization rate. If a new interface needs to be added, it is only necessary to replace the plate with the interface of the base 111 without changing the entire device. The two ends of the first interface 1111 are respectively connected to the vacuum pumping equipment and the end of the first pipeline 102 away from the transmission chamber 101; the two ends of the second interface 1112 are respectively connected to the clean gas source and the end of the second pipeline 103 away from the transmission chamber 101. By filling the transmission chamber 101 with clean gas, the vacuum environment of the transmission chamber can be broken to reach the atmospheric pressure value. In the early stage of vacuum pumping, the clean gas can be filled into the transmission chamber while the gas is exhausted to allow the clean gas to circulate, and the dust and impurities in the transmission chamber can be beaten during the circulation process to create a dust-free environment; the third interface 1113 is a cable interface, which is respectively connected to the external power supply and the control component 104, and the fourth interface 1114 is a CDA air inlet interface, which is connected to the vacuum angle valve, and the CDA air inlet interface is used to provide pneumatic power to the vacuum angle valve. Of course, there is also a third pipeline between the fourth interface 1114 and the transmission chamber 101, and the third pipeline is used to transmit CDA gas.

[0063] like Figure 2 and Figure 3As shown, the improved wafer transmission device provided in this embodiment, the transmission body also includes a driving member 112, a bearing member 113 and a fourth detection member 114, the driving member 112 and the fourth detection member 114 are electrically connected to the control member 104 through cables or communication protocols, the driving member 112 is a motor, the driving member 112 can be installed in the transmission chamber 101, and can also be installed outside the transmission chamber 101. The driving member 112 in this embodiment is installed outside the transmission chamber 101 to prevent the tiny debris generated by the driving member 112 during the working process from entering the transmission chamber 101. The carrier can be a kind of mechanical arm, robot, and bearing plate. The driving member 112 is fixedly connected to the mechanical arm through a slider guide to ensure the positioning accuracy and stability of the mechanical arm. The bearing member 113 is arranged in the transmission chamber 101, and the bearing member 113 is used to carry the wafer 300; the driving member 112 can drive the bearing member 113 to move. The fourth detection member 114 is a laser infrared sensor, an ultrasonic sensor or other distance measuring sensor. The fourth detection member 114 is arranged in the transmission chamber 101 or outside the transmission chamber 101. The fourth detection member 114 is used to detect whether there is a wafer 300 on the carrier 113. After the fourth detection member 114 detects that the wafer 300 is placed on the carrier 113, the driving member 112 can drive the carrier 113 to move, and the working state of the carrier 113 is initialized by the fourth detection member 114, avoiding the use of the control member 104 to store the number of movements and movement time of the carrier 113 to determine the state of the carrier 113, thereby avoiding the situation in which the state of the carrier 113 stored by the control member 104 is inconsistent with the actual state in the case of sudden shutdown.

[0064] like Figures 1 to 4 As shown, the improved wafer transmission device provided in this embodiment, the transmission body also includes a transparent window 118, and the transparent window 118 is installed on the cover plate 106. As an alternative implementation, the transparent window 118 can also be installed on the side wall of the transmission chamber 101. The transparent window 118 can be glass or other transparent materials. The transparent window 118 is used for the operator to observe the condition of the wafer 300 in the transmission chamber 101.

[0065] like Figure 1 to Figure 2As shown, the improved wafer transmission device provided in this embodiment also includes a status indicator 115, an emergency stop button 116, and a start-stop light 117. The status indicator 115 is used to output indication information, and the indication information is equipment status information, such as operation, maintenance, failure or other equipment status information. The preferred status indicator 115 is a display lamp column, and different working states of the wafer 300 transmission device are indicated by lights of different colors, so that the operator can easily know the working state of the wafer 300 transmission device. The status indicator 115 is arranged on the transmission chamber 101, and the emergency stop button 116 is arranged on the transmission chamber 101. The emergency stop button 116 is used to control the emergency stop of the transfer drive 112 to ensure the safety of the operator in an emergency situation. The start-stop light 117 is arranged on the transmission chamber 101, and the start-stop light 117 is used to indicate the start and stop of the carrier. The status indicator 115, the emergency stop button 116, and the start-stop light 117 are all connected to the control component 104 through a cable or a communication interface.

[0066] When it is necessary to place the wafer 300 into the transfer chamber 101, first, pull the cover plate 106 by hand to rotate the cover plate 106, and the cover plate 106 drives the support member 107 to move, so that the inner wall of the slide groove 1072 and the limiting protrusion 108 slide until the cover plate 106 rotates to the set position. At this time, the limiting groove 1071 is located above the limiting protrusion 108, and the support member 107 rotates under the action of gravity, so that the limiting groove 1071 is sleeved on the limiting protrusion 108 ... The groove 1071 limits the cover plate 106, and the support member 107 supports the cover plate 106 to prevent the cover plate 106 from falling back, and then the wafer 300 is clamped and placed on the carrier 113. After the fourth detection member 114 detects that the wafer 300 is placed on the carrier 113, it pushes the support member 107 to reverse so that the limiting groove 1071 is separated from the limiting protrusion 108. When the limiting protrusion 108 is located in the slide groove 1072, the cover plate 106 can be rotated until the cover plate 106 is covered on the feed port.

[0067] When it is necessary to place the wafer 300 in the process chamber and the fourth detection member 114 detects that the wafer 300 is placed on the carrier 113, the vacuum pumping equipment starts to work. When the third detection member 110 detects that the pressure value in the first pipeline 102 is less than or equal to the third threshold value, the second on-off switch 109 is opened to allow the vacuum pumping equipment to continue to vacuum the transfer chamber 101. When the first detection member detects that the vacuum degree in the transfer chamber 101 is less than or equal to the first threshold value, at this time, the first on-off switch valve is opened, the driving member 112 drives the carrier 113 to move, and the wafer 300 is sent into the process chamber. After the transfer is completed, the driving member 112 drives the carrier 113 to move into the transfer chamber 101, and the first on-off switch 105 is closed. After the processing of the wafer 300 is completed, the first on-off switch 105 is opened, and the transfer driving member 112 drives the carrier 113 to retrieve the wafer 300 to the transfer chamber 101, and the vacuum pumping equipment is closed, and the second on-off switch 109 is closed.

[0068] When the wafer 300 in the transfer chamber 101 needs to be taken out, the clean gas source delivers clean gas to the transfer chamber 101 through the second pipeline 103 to reduce the vacuum degree in the transfer chamber 101. When the pressure value detected by the second detection component 200 is greater than or equal to the second threshold, the cover 106 is opened as described above to take out the wafer 300.

[0069] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. An improved wafer transfer device, characterized in that: include: A transmission body, comprising a transmission chamber (101), a first pipeline (102), a second pipeline (103) and a control element (104), wherein one end of the first pipeline (102) is in communication with the transmission chamber (101), and the other end is suitable for being in communication with a vacuum pumping device, and one end of the second pipeline (103) is in communication with the transmission chamber (101), and the other end is suitable for being in communication with a clean gas source; A first detection member (400) is arranged on the transmission chamber (101); A second detection member (200) is arranged on the second pipeline (103); The first detection component (400) and the second detection component (200) are both electrically connected to the control component (104); The control component (104) generates first state information when the first vacuum value in the transmission chamber (101) obtained by the first detection component (400) is less than or equal to a first threshold value; and generates second state information when the second vacuum value in the transmission chamber (101) obtained by the second detection component (200) is greater than or equal to a second threshold value.

2. The improved wafer transfer device according to claim 1, characterized in that: The transmission body further comprises a first on-off switch (105), the transmission chamber (101) has a discharge port, one end of the first on-off switch (105) is mounted on the discharge port, and the other end can be communicated with the process chamber, and the first on-off switch (105) is electrically connected to the control element (104), and the first on-off switch (105) is used to control the on-off between the discharge port and the process chamber. The first on-off switch (105) has a first pick-and-place state for connecting the transfer chamber (101) with the process chamber according to the first state information.

3. The improved wafer transfer device according to claim 1 or 2, characterized in that: The transmission body also includes a cover plate (106), the transmission chamber (101) has a feed port, the cover plate (106) is covered on the feed port, and the cover plate (106) has a second pick-and-place state separated from the feed port according to the second state information.

4. The improved wafer transfer device according to claim 3, characterized in that: The transmission body also includes: Support member (107); The cover plate (106) is hingedly mounted on the transmission chamber (101), the support member (107) is rotatably connected to the cover plate (106), and the support member (107) has a limiting groove (1071); The cover plate (106) is provided with a limiting protrusion (108); In the second placement and picking state, the limiting groove (1071) is engaged with the limiting protrusion (108) to limit the supporting state of the supporting member (107); and the limiting groove (1071) is separated from the limiting protrusion (108) to release the linkage state of the limiting of the supporting member (107); The support member (107) is capable of rotating under the action of an external force to switch between the support state and the linkage state.

5. The improved wafer transfer device according to claim 4, characterized in that: The support member (107) is provided with a slide groove (1072), the slide groove (1072) is communicated with the limiting groove (1071), the slide groove (1072) is sleeved outside the limiting protrusion (108), and the limiting protrusion (108) can slide along the slide groove (1072).

6. The improved wafer transfer device according to claim 1 or 5, characterized in that: The transmission body also includes: a second on-off switch (109), two ends of which are respectively connected to the first pipeline (102) and the transmission chamber (101), and are electrically connected to the control element (104), the second on-off switch (109) being used to control the on-off of the first pipeline (102) and the transmission chamber (101); A third detection component (110), arranged on the first pipeline (102) and electrically connected to the control component (104), and used for obtaining a third vacuum value in the first pipeline (102); The second on-off switch (109) is configured to connect the first pipeline (102) with the transmission chamber (101) when the third vacuum value is less than or equal to a third threshold value.

7. The improved wafer transfer device according to claim 6, characterized in that: The transmission body also includes a base (111), which is fixedly connected to the transmission chamber (101); the base (111) is provided with an installation cavity; the first pipeline (102) and the second pipeline (103) are both arranged in the installation cavity; and the base (111) has a first interface (1111) and a second interface (1112); the second interface (1112) and the first interface (1111) are located on the same side of the base (111); the first pipeline (102) is connected to the vacuum pumping device through the first interface (1111); and the second pipeline (103) is connected to the clean gas source through the second interface (1112).

8. The improved wafer transfer device according to claim 7, characterized in that: The transmission body also includes: A driving member (112) connected to the base (111) and electrically connected to the control member (104); A carrier (113) connected to the driving member (112) and arranged in the transmission chamber (101), the carrier (113) being used to carry a wafer (300); The driving member (112) is capable of driving the bearing member (113) to move; A fourth detection component (114) is arranged on the chamber and is electrically connected to the control component (104), and is used to obtain detection information of the presence of a wafer (300) on the carrier (113).

9. The improved wafer transfer device according to claim 8, characterized in that: The transmission entity comprises: A status indicator (115), arranged on the base (111) and used for outputting indication information; An emergency stop button (116) is arranged on the base (111) and is used to control the drive member (112) to stop suddenly.

10. The improved wafer transfer device according to claim 3, characterized in that: The transmission body comprises a transparent window (118) which is arranged on the transmission chamber (101) or on the cover plate (106).

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