Sensor separation blade structure of VI machine

Abstract

The utility model provides a sensor separation blade structure of a VI machine table, which comprises a wafer push rod and a separation blade unit, and the top end of the wafer push rod is provided with a contact part in contact with a wafer; the separation blade unit comprises a main body separation blade and a length control mechanism connected with the main body separation blade, the main body separation blade is fixedly arranged on the wafer push rod, and at least one protruding part is arranged at one end, far away from the end connected with the main body separation blade, of the length control mechanism. The sensor separation blade structure of the VI machine can rapidly sense the states of the wafers of different sizes, the wafer push rod does not need to be disassembled or the position of the sensor does not need to be moved, and the situation that the sensor cannot be detected after being adjusted for a long time is avoided. Rapid switching of different detection tasks of the visual detection machine is realized, and the detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a sensor baffle structure of a VI machine. Background Art

[0002] The inspection principle of wafers in VI (Visual Inspection) machines is that a metal baffle is generally connected to the wafer push rod of the wafer, and a protrusion is provided at the tail end of the baffle, such as Figure 1 The figure shows a schematic diagram of the structure of the sensor baffle structure of the VI machine, including a wafer push rod 01, a baffle unit 02, a main baffle 021, a first baffle 022, a protrusion 0221, a wafer 03, a contact portion 04, a sensor 05, a first sensing portion 051 and a second sensing portion 052, wherein the baffle and the wafer push rod move as a whole. If the protrusion is within the detection range of the sensor, the protrusion blocks the sensor light, and a wafer presence signal can be generated. Generally, the length and position of the baffle are fixed, and the sensor can be moved and adjusted within a certain range to sense the protrusion on the baffle. For non-standard size wafers, the sensor position needs to be adjusted and the process of adjusting the sensor position is time-consuming (usually about 1 hour). There is also a situation where when the sensor is adjusted to the extreme position, the protrusion at the tail of the baffle is still beyond the sensor sensing range, resulting in the inability to detect the wafer.

[0003] In view of this, there is an urgent need for a sensor baffle structure of a VI machine that can be applicable to the detection of wafers of different sizes and improve the detection efficiency. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a sensor baffle structure of a VI machine, which is used to solve the problem that the sensor baffle structure of the VI machine in the prior art cannot quickly detect wafers of different sizes and has low detection efficiency.

[0005] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a sensor baffle structure of a VI machine, comprising:

[0006] A wafer push rod, the top of which is provided with a contact portion for contacting the wafer;

[0007] The baffle unit comprises a main baffle and a length control mechanism connected to the main baffle, wherein the main baffle is fixed on the wafer push rod, and the length control mechanism is provided with at least one protrusion at one end away from the end connected to the main baffle.

[0008] Optionally, the length control mechanism includes a first baffle, and the first baffle is provided with at least one first hole.

[0009] Optionally, the protrusion is located at an end of the first blocking piece away from the end connected to the main body blocking piece.

[0010] Optionally, the length control mechanism also includes a second baffle having a preset length, the protrusion is located at an end of the second baffle away from the connection between the first baffle and the main structure, the second baffle is provided with at least one second hole, and the second baffle is fixed to a preset position on the first baffle through the first hole and the second hole.

[0011] Optionally, a fastener is further provided in the length control mechanism, and the second baffle is fixed to a preset position on the first baffle through the first hole and the second hole by the fastener.

[0012] Optionally, the length control mechanism includes a first baffle and a second baffle slidably disposed on the first baffle, and the protrusion is located at an end of the second baffle away from the connection between the first baffle and the main baffle.

[0013] Optionally, a locking member is further provided in the baffle unit, and the second baffle can be controlled to be set at different positions on the first baffle by locking or releasing the locking member.

[0014] Optionally, the baffle unit is further provided with a measuring part for precisely adjusting the length of the length control mechanism.

[0015] Optionally, the sensor baffle structure of the VI machine further includes a sensor, the sensor is spaced apart from the baffle unit by a preset distance, and the sensor includes a through-beam sensor, and the protrusion is located within the sensing range of the sensor.

[0016] Optionally, the sensor includes a first sensing portion and a second sensing portion which are spaced apart from each other, and the protruding portion is located between the first sensing portion and the second sensing portion.

[0017] As described above, the sensor baffle structure of the VI machine of the utility model has the following beneficial effects: by directly changing the length of the main body or fixing the second baffle of different lengths on the first baffle as the length adjustment mechanism, the protrusion located at the end of the length control mechanism away from the connection with the main body baffle can be sensed by the sensor, so that the registration status of the wafers of different sizes can be quickly sensed without disassembling the wafer push rod or moving the position of the sensor, avoiding the situation where the machine is adjusted for a long time or even cannot be detected after adjustment, realizing the rapid switching of different detection tasks of the visual inspection machine, and improving the detection efficiency; by sliding the second baffle on the first baffle as the length control mechanism, the second baffle can be controlled to be set at different positions on the first baffle by unscrewing or tightening the locking piece, so that the protrusion can be sensed by the sensor, and the registration status of the wafers of different sizes can be quickly sensed, avoiding the replacement of the second baffle, and further improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of a sensor baffle structure of a VI machine in the prior art.

[0019] Figure 2 The figure shows a state schematic diagram of a wafer size detected by the sensor baffle structure of the VI machine of the present invention when the wafer size is larger than the standard size.

[0020] Figure 3 It is a side view structural schematic diagram of the length control mechanism and the protrusion of the sensor baffle structure of the VI machine of the present invention.

[0021] Figure 4 It is a schematic diagram of the top view of the length control mechanism and the protruding part of the sensor baffle structure of the VI machine of the present invention.

[0022] Figure 5 The figure shows a state schematic diagram when the wafer size detected by the sensor baffle structure of the VI machine of the present invention is a standard size.

[0023] Figure 6 The diagram shows a state diagram of a wafer size detected by the sensor baffle structure of the VI machine of the present invention when the wafer size is smaller than the standard size.

[0024] Figure 7 It is a schematic diagram showing another state when the wafer size detected by the sensor baffle structure of the VI machine of the present invention is larger than the standard size.

[0025] Figure 8The diagram shows another state when the wafer size detected by the sensor baffle structure of the VI machine of the present invention is a standard size.

[0026] Fig. 9 It is a schematic diagram showing another state when the wafer size detected by the sensor baffle structure of the VI machine of the present invention is smaller than the standard size.

[0027] Component number description

[0028] 01 Wafer Pusher

[0029] 02 Baffle unit

[0030] 021 Main body baffle

[0031] 022 First Block

[0032] 0221 Protrusion

[0033] 03 Wafer

[0034] 04 Contact Department

[0035] 05 Sensor

[0036] 051 First Sensing Department

[0037] 052 Second Sensing Department

[0038] 1 Wafer push rod

[0039] 2 Baffle unit

[0040] 21 Main body baffle

[0041] 22 Length control mechanism

[0042] 221 protrusion

[0043] 222 First stopper

[0044] 222a First screw hole

[0045] 222b First hollow part

[0046] 223 Second stopper

[0047] 223a Second screw hole

[0048] 223b Second hollow part

[0049] 3 Wafer

[0050] 4 contact part

[0051] 5 Sensors

[0052] 51 First Sensing Unit

[0053] 52 Second Sensing Unit

[0054] 6 Fasteners

[0055] 7 Locking piece DETAILED DESCRIPTION

[0056] The following is a description of the implementation of the present invention by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0057] See also Figures 2 to 9 It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any modification of the structure, change in the proportion relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the utility model without affecting the effects and purposes that can be achieved by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the utility model without substantially changing the technical content.

[0058] Embodiment 1

[0059] The utility model provides a sensor baffle structure of a VI machine, such as Figure 2-Figure 6 The figures are respectively a schematic diagram of a state when the size of the wafer 3 detected by the sensor baffle structure of the VI machine is larger than the standard size, a side view structural diagram of the length control mechanism 22 and the protrusion 221, a top view structural diagram of the length control mechanism 22 and the protrusion 221, a schematic diagram of a state when the size of the wafer 3 detected by the sensor baffle structure of the VI machine is the standard size, and a schematic diagram of a state when the size of the wafer 3 detected by the sensor baffle structure of the VI machine is smaller than the standard size, comprising: a wafer push rod 1 and a baffle unit 2, wherein the top end of the wafer push rod 1 is provided with a contact portion 4 for contacting the wafer 3; the baffle unit 2 comprises a main baffle 21 and a length control mechanism 22 connected to the main baffle 21, the main baffle 21 is fixedly arranged on the wafer push rod 1, and the length control mechanism 22 is provided with at least one protrusion 221 at one end away from the connection with the main baffle 21.

[0060] Specifically, the wafer pusher 1 is used for accurate transmission and positioning of the wafer 3 .

[0061] Specifically, the wafer push rod 1 contacts the wafer 3 through the contact portion 4 and positions the wafer 3 .

[0062] Specifically, under the condition that the performance of the sensor baffle structure of the VI machine is met, the size, material and shape of the wafer push rod 1 can be selected according to actual conditions and are not limited here.

[0063] Specifically, one end of the main body baffle 21 is fixed to the wafer push rod 1 , and the other end of the main body baffle 21 is connected to the length control mechanism 22 .

[0064] As an example, the sensor baffle structure of the VI machine further includes a sensor 5 , the sensor 5 is spaced apart from the baffle unit 2 by a preset distance, and the sensor 5 includes a through-beam sensor, and the protrusion 221 is located within the sensing range of the sensor 5 .

[0065] As an example, the sensor 5 includes a first sensing portion 51 and a second sensing portion 52 that are spaced apart from each other, and the protruding portion 221 is located between the first sensing portion 51 and the second sensing portion 52 .

[0066] Specifically, under the condition that the performance of the sensor baffle structure of the VI machine is met, the spacing distance between the first sensing portion 51 and the second sensing portion 52 can be selected according to actual conditions, and is not limited here.

[0067] As an example, the length control mechanism 22 includes a first baffle 222 , and the first baffle 222 is provided with at least one first hole 222 a .

[0068] Specifically, the first hole 222a may penetrate the first blocking piece 222 or may not penetrate the first blocking piece 222, and the selection may be made according to actual conditions.

[0069] As an example, the protrusion 221 is located at an end of the first blocking piece 222 away from the connection with the main structure 21 .

[0070] For details, please refer to Figure 2 When the size of the wafer 3 is larger than the standard size, such as when the diameter of the wafer 3 is 302 mm, the length control mechanism 22 only includes a first baffle 222, and the protrusion 221 is located on the first baffle 222. The protrusion 221 can be located between the first sensing portion 51 and the second sensing portion 52, and the in-registration signal of the wafer 3 of this size can be generated, and the sensor 5 detects the in-registration status of the wafer 3.

[0071] Specifically, when the protruding portion 221 is located between the first sensing portion 51 and the second sensing portion 52 , the protruding portion 221 blocks the light from the first sensing portion 51 and the second sensing portion 52 , thereby generating a corresponding on-site signal of the wafer 3 .

[0072] Specifically, when the size of the wafer 3 is larger than the standard size, compared with the traditional baffle 022, the length of the first baffle 222 is directly reduced to adjust the length of the length control mechanism 22. For example, when the diameter of the wafer 3 is 302 mm, the size of the first baffle 222 is reduced by 2 mm. The sensor 5 can sense the protrusion 221 and then detect the registered state of the wafer 3.

[0073] Specifically, the length of the length control mechanism 22 can be adjusted by changing the length of the first baffle 222, thereby adjusting the protrusion 221 to be within the sensing range of the sensor 5, thereby improving the adjustment efficiency.

[0074] As an example, the length control mechanism 22 further includes a second baffle 223 having a preset length, the protrusion 221 is located at one end of the second baffle 223 away from the connection between the first baffle 222 and the main structure 21, and at least one second hole 223a is provided on the second baffle 223. The second baffle 223 is fixed to a preset position on the first baffle 222 through the first hole 222a and the second hole 223a. In this embodiment, the second baffle 223 includes a second baffle 223 having a first preset length and a second baffle 223 having a second preset length.

[0075] Specifically, the second hole 223a may penetrate the second blocking piece 223 or may not penetrate the second blocking piece 223, which can be selected according to actual conditions.

[0076] Specifically, the first preset length is smaller than the second preset length. In this embodiment, the first preset length is 2 mm larger than the second preset length.

[0077] As an example, a fastener 6 is further provided in the baffle unit 2 , and the second baffle 223 is fixed to a preset position on the first baffle 222 by the fastener 6 passing through the first hole 222 a and the second hole 223 a .

[0078] Specifically, the fastener 6 includes a screw or other suitable fasteners.

[0079] Specifically, the second blocking piece 223 partially overlaps with the first blocking piece 222 .

[0080] Specifically, the material of the first baffle 222 includes metal material or other suitable materials; the material of the second baffle 223 includes metal material or other suitable materials.

[0081] Specifically, under the condition that the performance of the sensor baffle structure of the VI machine is met, the size and shape of the main baffle 21 can be selected according to actual conditions, and are not limited here; the size and shape of the first baffle 222 can be selected according to actual conditions, and are not limited here; the size and shape of the second baffle 223 can be selected according to actual conditions, and are not limited here.

[0082] For details, please refer to Figure 5 When the size of the wafer 3 is in a standard size, such as when the diameter of the wafer 3 is 300 mm, the second baffle 223 having a first preset length is fixed on the first baffle 222, so that the protrusion 221 is located between the first sensing portion 51 and the second sensing portion 52, and a registration signal of the wafer 3 of this size can be generated, that is, the sensor 5 detects the registration state of the wafer 3.

[0083] For details, please refer to Figure 6 When the diameter of the wafer 3 is smaller than the standard size, such as when the diameter of the wafer 3 is 298 mm, the second baffle 223 having a second preset length is fixed on the first baffle 222, so that the protrusion 221 is located between the first sensing portion 51 and the second sensing portion 52, and a registration signal of the wafer 3 of this size can be generated, that is, the sensor 5 detects the registration status of the wafer 3.

[0084] Specifically, by arranging the second baffle 223 with different preset lengths on the first baffle 222 as the length adjustment mechanism 2, and arranging the protrusion 221 on the second baffle 223, the protrusion 221 can be made to sense the sensor 5, so that the registration status of the wafers 3 of different sizes can be quickly sensed without disassembling the wafer push rod or moving the position of the sensor 5, thereby avoiding the situation where the machine cannot be detected for a long time or even after adjustment, and realizing the rapid switching of different detection tasks of the visual inspection machine, thereby improving the detection efficiency.

[0085] As an example, the baffle unit 2 is further provided with a measuring part (not shown) for precisely adjusting the length of the length control mechanism 22 .

[0086] Specifically, by providing the measuring part, the position of the protruding part 221 can be more accurately regulated, thereby improving the detection accuracy.

[0087] The sensor baffle structure of the VI machine of the present embodiment directly changes the length of the first baffle 222 or sets the second baffle 223 of different preset lengths on the first baffle 222 as the length adjustment mechanism. The protrusion 221 can quickly sense the sensor 5, and can quickly sense the registration status of the wafers 3 of different sizes without disassembling the wafer push rod 1 or moving the position of the sensor 5. It also avoids the situation where the machine cannot be detected for a long time or even after adjustment, thereby realizing the rapid switching of different detection tasks of the visual inspection machine and improving the detection efficiency.

[0088] Embodiment 2

[0089] This embodiment provides another sensor baffle structure of a VI machine, such as Figure 7-Figure 9 As shown, they are respectively another state schematic diagram when the size of the wafer 3 detected by the sensor baffle structure of the VI machine is larger than the standard size, another state schematic diagram when the size of the wafer 3 detected by the sensor baffle structure of the VI machine is the standard size, and another state schematic diagram when the size of the wafer 3 detected by the sensor baffle structure of the VI machine is smaller than the standard size. The sensor baffle structure of the VI machine in this embodiment is different from the sensor baffle structure of the VI machine described in Example 1 in that the length control mechanism 22 includes a first baffle 222 and a second baffle 223 slidably disposed on the first baffle 222, and the protrusion 221 is located at an end of the second baffle 223 away from the connection between the first baffle 222 and the main structure 21.

[0090] As an example, a locking member 7 is further provided in the baffle unit 2 , and the second baffle 223 can be controlled to be set at different positions on the first baffle 222 by locking and releasing the locking member 7 .

[0091] Specifically, the locking member 7 includes a screw or other suitable locking members.

[0092] Specifically, the first blocking piece 222 includes a first hollow portion 222b; the second blocking piece 223 includes a second hollow portion 223b.

[0093] Specifically, by releasing or locking the locking member 7 located in the first hollow portion 222b and the second hollow portion 223b, the second baffle 223 can be controlled to be set at different positions on the first baffle 222, thereby quickly sensing the registration status of the wafers 3 of different sizes.

[0094] Specifically, the protrusion 221 can sense the sensor 5 by slidingly adjusting the position of the second baffle 223, so as to quickly sense the registered status of the wafers 3 of different sizes, thereby avoiding the replacement of the second baffle 223 and further improving the detection efficiency.

[0095] The sensor baffle structure of the VI machine of this embodiment can make the protrusion 221 sense with the sensor 5 by slidingly adjusting the position of the second baffle 223, quickly sense the status of the wafers 3 of different sizes, avoid the replacement of the second baffle 223, and further improve the detection efficiency.

[0096] In summary, the utility model directly changes the length of the first baffle or sets a second baffle of different lengths on the first baffle as a length control mechanism, so that the protrusion located at the end of the length control mechanism away from the connection with the main baffle is sensed by the sensor, and the in-registration status of wafers of different sizes can be quickly sensed without disassembling the wafer push rod or moving the position of the sensor, avoiding the situation where the sensor cannot be detected even after long-term adjustment, and realizing the rapid switching of different detection tasks of the visual inspection machine, thereby improving the detection efficiency; by sliding the second baffle on the first baffle as a length control mechanism, the second baffle is controlled to be set at different positions on the first baffle by unscrewing or tightening the locking member, so that the protrusion can be sensed by the sensor, and the in-registration status of wafers of different sizes can be quickly sensed, and the replacement of the second baffle is avoided, thereby further improving the detection efficiency. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0097] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A sensor baffle structure for a VI machine, characterized in that: include: A wafer push rod, the top of which is provided with a contact portion for contacting the wafer; The baffle unit comprises a main baffle and a length control mechanism connected to the main baffle, wherein the main baffle is fixed on the wafer push rod, and the length control mechanism is provided with at least one protrusion at one end away from the end connected to the main baffle.

2. The sensor baffle structure of the VI machine according to claim 1, characterized in that: The length control mechanism includes a first baffle, and the first baffle is provided with at least one first hole.

3. The sensor baffle structure of the VI machine according to claim 2, characterized in that: The protrusion is located at an end of the first blocking piece away from the end connected to the main body blocking piece.

4. The sensor baffle structure of the VI machine according to claim 2, characterized in that: The length control mechanism also includes a second baffle with a preset length, the protrusion is located at an end of the second baffle away from the connection between the first baffle and the main baffle, the second baffle is provided with at least one second hole, and the second baffle is fixed to a preset position on the first baffle through the first hole and the second hole.

5. The sensor baffle structure of the VI machine according to claim 4, characterized in that: The length control mechanism is further provided with a fastener, and the second baffle is fixed to a preset position on the first baffle through the first hole and the second hole via the fastener.

6. The sensor baffle structure of the VI machine according to claim 1, characterized in that: The length control mechanism includes a first baffle and a second baffle slidably disposed on the first baffle, and the protrusion is located at an end of the second baffle away from the connection between the first baffle and the main baffle.

7. The sensor baffle structure of the VI machine according to claim 6, characterized in that: The baffle unit is also provided with a locking member, and the second baffle can be controlled to be set at different positions on the first baffle by locking and releasing the locking member.

8. The sensor baffle structure of the VI machine according to claim 1, characterized in that: The baffle unit is also provided with a measuring part for accurately adjusting the length of the length control mechanism.

9. The sensor baffle structure of the VI machine according to claim 1, characterized in that: The sensor baffle structure of the VI machine further comprises a sensor, the sensor is spaced apart from the baffle unit by a preset distance, and the sensor comprises a through-beam sensor, and the protrusion is located within the sensing range of the sensor.

10. The sensor baffle structure of the VI machine according to claim 9, characterized in that: The sensor includes a first sensing portion and a second sensing portion which are spaced apart from each other, and the protruding portion is located between the first sensing portion and the second sensing portion.

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