Wafer overturning and centering device and single-chip type cleaning machine

Abstract

The utility model relates to a wafer overturning and centering device and a monolithic cleaning machine. The wafer overturning and centering device comprises a mounting mechanism, an overturning mechanism and a centering mechanism, the overturning mechanism is arranged on the mounting mechanism, and the overturning mechanism can clamp or release a wafer and can control the wafer to overturn when clamping the wafer; the centering mechanism comprises a centering piece arranged on the mounting mechanism, the centering piece can bear and center the wafer, the centering piece can be switched between a first position and a second position, when the centering piece is in the first position, the overturning mechanism can clamp the wafer located on the centering piece, and when the centering piece is in the second position, the centering piece is located outside the overturning space of the overturning mechanism. The wafer overturning and centering device has relatively low requirements on overturning performance.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer flipping and centering device and a single-chip cleaning machine. Background Art

[0002] The wafer backside cleaning process is a very important process in the semiconductor production process. Wafer backside cleaning is to remove metal contaminants on the back of the wafer, clean the particles, and allow the wafer to enter the next processing technology in the best condition, avoiding the processing machine (for example, photolithography machine) in the next processing technology from shutting down due to defects on the back of the wafer (metal and particles). The related technology usually uses a single-wafer cleaning machine to clean the back of the wafer. In the specific cleaning process, the wafer needs to be aligned so that the subsequent process can accurately grasp the wafer, and the wafer needs to be flipped to clean the back of the wafer. In some wafer flipping and centering devices, the centering mechanism is arranged on the flipping mechanism. When the flipping mechanism flips, the centering mechanism flips along with the flipping mechanism, and the flipping performance of the flipping mechanism is required to be high. Utility Model Content

[0003] Based on this, it is necessary to provide a wafer flipping and centering device with relatively low flipping performance requirements to address the above problems.

[0004] A wafer flipping and centering device, comprising:

[0005] Installation mechanism;

[0006] a flipping mechanism, disposed on the mounting mechanism, the flipping mechanism being capable of clamping or releasing the wafer and controlling the wafer to flip when the wafer is clamped; and

[0007] The centering mechanism includes a centering piece arranged on the mounting mechanism, the centering piece can carry and center the wafer, the centering piece can be switched between a first position and a second position, when in the first position, the flipping mechanism can clamp the wafer on the centering piece, when in the second position, the centering piece is located outside the flipping space of the flipping mechanism.

[0008] In one embodiment, the centering member includes a plurality of support columns, which are spaced apart and arranged in a centering ring that matches the shape of the wafer, and the inner diameter of the centering ring gradually decreases in the direction in which the wafer is placed into the centering ring.

[0009] In one embodiment, the support column is truncated cone-shaped or conical; and / or

[0010] The number of the support columns is an even number, and the plurality of support columns comprises at least one group of support columns, each group of support columns comprises two support columns connected by a line passing through the center of the centering ring; and / or

[0011] There are six supporting columns.

[0012] In one embodiment, the centering member also includes a plurality of mounting posts. In the direction in which the wafer is placed in the centering ring, the plurality of mounting posts are located below the plurality of support posts and are connected one-to-one with the plurality of support posts. The end surfaces of the mounting posts connected to the support posts include a limiting area. The limiting area is located on the outer periphery of the support posts and inside the centering ring, thereby preventing the wafer from slipping into the space enclosed by the plurality of mounting posts.

[0013] In one embodiment, the support column is truncated cone or conical, the mounting column is cylindrical, the center line of the mounting column is concentric with the center line of the support column, and the outer diameter of the mounting column is larger than the outer diameter of the support column.

[0014] In one embodiment, the first position and the second position are arranged at intervals in the vertical direction, and the centering mechanism further comprises a lifting assembly capable of driving the centering member to switch between the first position and the second position; and / or

[0015] The wafer flipping and centering device also includes a sensor mechanism, which includes a first sensor communicatively connected to the flipping mechanism and a second sensor communicatively connected to the flipping mechanism, the first sensor and the second sensor can respectively detect whether the centering member is located at the first position and whether the centering member is located at the second position, when the first sensor detects that the centering member is located at the first position, the flipping mechanism clamps or releases the wafer, and when the second sensor detects that the centering member is located at the second position, the flipping mechanism controls the wafer flipping.

[0016] In one embodiment, the flipping mechanism includes a flipping member disposed on the mounting mechanism and a clamping member disposed on the flipping member, wherein the flipping member can drive the clamping member to flip, and the clamping member can clamp or release the wafer;

[0017] The clamping member comprises a plurality of clamping blocks, which are arranged at intervals to form a clamping ring shape matching the shape of the wafer. The clamping blocks can move toward or away from the wafer in the radial direction of the clamping ring to clamp or release the wafer.

[0018] In one embodiment, the clamp block has a clamping groove for inserting the wafer, and in the circumferential direction of the clamping ring, the depth of the clamping groove in the radial direction of the clamping ring gradually decreases from the middle to both ends; and / or

[0019] The clamping ring is located on a horizontal plane, the first position and the second position are arranged at intervals in the vertical direction, the centering piece includes a plurality of support columns, and the plurality of support columns are arranged at intervals to form a centering ring that matches the shape of the wafer, the clamping block has an avoidance groove, the avoidance groove passes through both sides of the clamping block in the vertical direction and passes through the side of the clamping block close to the wafer in the radial direction of the clamping ring, when the centering piece is in the first position and the clamping ring clamps the wafer, each clamping block is arranged corresponding to a support column, and the support column corresponding to the clamping block is inserted into the avoidance groove.

[0020] In one embodiment, the number of the clamping blocks is two, namely a first clamping block and a second clamping block, the clamping member further comprises a first connecting rod, a second connecting rod, a first tension spring and a second tension spring provided on the flip member, the first connecting rod is connected to the first clamping block, the second connecting rod is connected to the second clamping block, the first tension spring connects the first clamping block and the flip member, and the second tension spring connects the second clamping block and the flip member;

[0021] When force is applied to the first connecting rod and the second connecting rod at the same time, the first clamp block and the second clamp block both move away from the wafer to release the wafer and cause the first tension spring and the second tension spring to be stretched. When the force applied to the first connecting rod and the second connecting rod is released, the first tension spring controls the first clamp block to move closer to the wafer, and the second tension spring controls the second clamp block to move closer to the wafer to clamp the wafer.

[0022] In one embodiment, the flipping mechanism includes a flipping member, a clamping member, a rotating cylinder and a clamping cylinder, the flipping member is arranged on the mounting mechanism, the clamping member is arranged on the flipping member, the flipping member can drive the clamping member to flip, the clamping member can clamp or release the wafer, the rotating cylinder can drive the flipping member to flip, the clamping cylinder can drive the clamping member to clamp or release the wafer, and the centering mechanism also includes a centering cylinder that can drive the centering member to switch between the first position and the second position;

[0023] The wafer flipping and centering device further comprises a negative pressure adsorption mechanism, and at least one of the rotating cylinder, the clamping cylinder and the centering cylinder is provided with the negative pressure adsorption mechanism; and / or

[0024] The speed control valve of the rotating cylinder, the speed control valve of the clamping cylinder and the speed control valve of the centering cylinder are integrated in the same area of ​​the mounting mechanism.

[0025] The utility model also provides a single-wafer cleaning machine, comprising the above-mentioned wafer flipping and centering device.

[0026] When the wafer flipping and centering device is working, a wafer can be placed on the centering piece at the first position or the second position to realize the bearing and centering of the wafer, and then the flipping mechanism is controlled to clamp the wafer on the centering piece at the first position to realize the clamping of the wafer, and then the centering piece is controlled to move from the first position to the second position, and the centering piece is avoided from flipping the wafer while separating the centering piece from the wafer, and finally the flipping mechanism is controlled to flip to realize the flipping of the wafer clamped on the flipping mechanism. The wafer flipping and centering device can realize the centering and flipping of the wafer, and during the flipping process, the centering piece is separated from the flipping mechanism, and only the flipping mechanism and the wafer clamped on the flipping mechanism need to be flipped, and the centering piece does not need to be flipped, so the flipping performance requirements of the flipping mechanism are relatively low. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a schematic diagram of the three-dimensional structure of a wafer flipping and centering device in one embodiment of the utility model;

[0029] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure of the wafer flipping and centering device from another perspective is shown;

[0030] Figure 3 for Figure 1 A side view of the wafer flip centering device shown;

[0031] Figure 4 for Figure 1 A top view of the wafer flip centering device shown;

[0032] Figure 5 for Figure 1 A schematic diagram of the three-dimensional structure of the support column and the mounting column of the centering member of the wafer flipping and centering device shown;

[0033] Figure 6 for Figure 1 A schematic diagram of the three-dimensional structure of the flipping mechanism of the wafer flipping and centering device shown;

[0034] Figure 7 for Figure 6 A top view of the wafer flip centering device shown;

[0035] Figure 8 for Figure 6A bottom view of the wafer flip centering device is shown. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0042] like Figure 1-Figure 4 As shown, the utility model discloses a wafer flipping and centering device 10. The wafer flipping and centering device 10 includes a mounting mechanism 300, a flipping mechanism 400 and a centering mechanism 500. The flipping mechanism 400 is arranged on the mounting mechanism 300, and the flipping mechanism 400 can clamp or release the wafer 20 and can control the flipping of the wafer 20 when the wafer 20 is clamped. The centering mechanism 500 includes a centering member 510. The centering member 510 is arranged on the mounting mechanism 300, and can carry the wafer 20 and center the wafer 20. The centering member 510 can switch between a first position and a second position. In the first position, the flipping mechanism 400 can clamp the wafer 20 located on the centering member 510. In the second position, the centering member 510 is located outside the flipping space of the flipping mechanism 400 (at this time, the centering member 510 will not interfere with the flipping of the flipping mechanism 400, leaving enough space for the flipping of the wafer 20).

[0043] When the wafer flipping and centering device 10 is working, the wafer 20 can be placed on the centering member 510 at the first position or the second position to realize the bearing and centering of the wafer 20, and then the clamping member 420 is controlled to clamp the wafer 20 on the centering member 510 at the first position to realize the clamping of the wafer 20, and then the centering member 510 is controlled to move from the first position to the second position, and the centering member 510 is realized to avoid the flipping of the wafer 20 while realizing the separation of the centering member 510 and the wafer 20, and finally the flipping mechanism 400 is controlled to flip to realize the flipping of the wafer 20 clamped on the flipping mechanism 400. The wafer flipping and centering device 10 can realize the centering and flipping of the wafer 20, and during the flipping process, the centering member 510 is separated from the flipping mechanism 400, and only the flipping mechanism 400 and the wafer 20 clamped on the flipping mechanism 400 need to be flipped, and the centering member 510 does not need to be flipped, and the flipping performance requirements of the flipping mechanism 400 are relatively low.

[0044] In this embodiment, the flip mechanism 400 includes a flip member 410 and a clamping member 420. The flip member 410 is disposed on the mounting mechanism 300. The flip member 410 can drive the clamping member 420 to flip. The clamping member 420 is disposed on the flip member 410 and can clamp or release the wafer 20. In this way, it is very convenient to realize that the flip mechanism 400 clamps or releases the wafer 20 and controls the wafer 20 to flip when the wafer 20 is clamped.

[0045] In this embodiment, if Figure 1-Figure 5 As shown, the centering member 510 includes a plurality of support columns 512. The plurality of support columns 512 are arranged at intervals to form a centering ring that matches the shape of the wafer 20. In the direction in which the wafer 20 is placed in the centering ring ( Figure 1 As shown in the top-to-bottom direction, the inner diameter of the centering ring gradually decreases. In this way, not only can the wafer 20 be placed on the centering piece 510 smoothly, but the wafer 20 can also be stably supported and centered. In addition, the contact area between the wafer 20 and the centering piece 510 can be reduced, and the centering piece 510 and the wafer 20 can be in low contact, thereby reducing the probability of contamination or even scratches on the surface of the wafer 20, which affects the cleanliness of the wafer 20. It can be understood that in other embodiments, the centering piece 510 can also be an annular structure with a continuous wall (the centering ring formed by multiple support columns 512 is equivalent to an intermittent annular structure with a notch in the wall). It can be understood that in other embodiments, the inner diameter of the centering ring can also remain unchanged in the direction in which the wafer 20 is placed in the centering ring.

[0046] In the present embodiment, the support column 512 is in the shape of a truncated cone or a cone. In this way, the side of the support column 512 close to the wafer 20 is an inclined arc surface, which can make the contact between the support column 512 and the outer side of the wafer 20 a point contact, thereby further reducing the contact area between the wafer 20 and the centering member 510. It is understood that in other embodiments, the shape of the support column 512 can also be an irregular shape (a truncated cone and a cone can be considered as a regular shape), for example, the side of the support column 512 close to the wafer 20 is an inclined arc surface, and the other surfaces are vertical planes. It is understood that in other embodiments, the side of the support column 512 close to the wafer 20 can also be an inclined plane.

[0047] In this embodiment, the number of support columns 512 is an even number, and the plurality of support columns 512 includes at least one group of support columns 512. Each group of support columns 512 includes two support columns 512 connected by a line passing through the center of the centering ring. In this way, in the direction in which the wafer 20 is placed in the centering ring, each group of support columns 512 constructs a V-shaped structure, so that the centering member 510 can more stably carry and center the wafer 20. It can be understood that in other embodiments, the number of support columns 512 can also be an odd number.

[0048] In this embodiment, the number of the support columns 512 is 6. It is understood that in other embodiments, the number of the support columns 512 may also be 2, 4, or 8.

[0049] In the present embodiment, the centering member 510 further includes a plurality of mounting posts 514. In the direction in which the wafer 20 is placed in the centering ring, the plurality of mounting posts 514 are located below the plurality of support posts 512 and are connected one-to-one with the plurality of support posts 512. The end surface where the mounting posts 514 are connected to the support posts 512 includes a limiting area 514a. The limiting area 514a is located at the outer periphery of the support posts 512 and inside the centering ring, which can prevent the wafer 20 from sliding into the space enclosed by the plurality of mounting posts 514. In this way, the centering member 510 can more stably carry and center the wafer 20. It is to be understood that in other embodiments, a mounting ring with a continuous wall surface can be used to replace the plurality of mounting posts 514 mentioned above. It is to be understood that in other embodiments, the mounting posts 514 can also be omitted.

[0050] In this embodiment, the mounting column 514 is cylindrical, the center line of the mounting column 514 is concentric with the center line of the support column 512, and the outer diameter of the mounting column 514 is larger than the outer diameter of the support column 512. In this way, it is very convenient to form a limiting area. It can be understood that in other embodiments, the center line of the mounting column 514 and the center line of the support column 512 can also be non-concentric, as long as the limiting area can be formed.

[0051] In the present embodiment, the first position and the second position are arranged at intervals in the vertical direction. The centering mechanism 500 also includes a lifting assembly 520. The lifting assembly 520 is connected to the centering member 510, and can drive the centering member 510 to switch between the first position and the second position. Specifically, in the present embodiment, the lifting assembly 520 is connected to a plurality of mounting columns 514. In this way, the above-mentioned wafer flipping centering device 10 can have a smaller size in the horizontal direction. It can be understood that in other embodiments, the first position and the second position can also be arranged at intervals in the horizontal direction. In this case, the above-mentioned wafer flipping centering device 10 can have a smaller size in the vertical direction.

[0052] In the present embodiment, the lifting assembly 520 includes a centering cylinder 522 and a bracket 524. The centering cylinder 522 is arranged on the mounting mechanism 300. The centering cylinder 522 is connected to the bracket 524 and can drive the bracket 524 to move in the vertical direction. The centering member 510 is arranged on the bracket 524. Specifically, in the present embodiment, the bracket 524 is provided with a slider, the mounting mechanism 300 is provided with a slide rail, and the bracket 524 is slidably mounted on the slide rail through the slider. In this way, the bracket 524 can be lifted and lowered along the slide rail. Specifically, in the present embodiment, the centering cylinder 522 is a rodless cylinder. Specifically, in the present embodiment, a hydraulic buffer corresponding to the first position and a hydraulic buffer corresponding to the second position are provided on the mounting mechanism 300, so that the centering member 510 can accurately reach the first position and the second position, and provide a buffer for the centering member 510 to avoid the centering member 510 from being damaged by a hard collision.

[0053] In this embodiment, the wafer flipping and centering device 10 further includes a sensor mechanism 600. The sensor mechanism 600 includes a first sensor 610 that is communicatively connected to the flipping mechanism 400 (clamping member 420) and a second sensor 620 that is communicatively connected to the flipping mechanism 400 (flipping member 410). The first sensor 610 can detect whether the centering member 510 is located at the first position. The second sensor 620 can detect whether the centering member 510 is located at the second position. When the first sensor 610 detects that the centering member 510 is located at the first position, the flipping mechanism 400 (clamping member 420) clamps or releases the wafer 20. When the second sensor 620 detects that the centering member 510 is located at the second position, the flipping mechanism 400 controls the wafer 20 to flip (the flipping member 410 controls the clamping member 420 to flip). In this way, it is very convenient for the wafer flipping and centering device 10 to realize automatic operation. It can be understood that in other embodiments, the wafer flipping and centering device 10 can also be operated manually.

[0054] In the present embodiment, the clamping member 420 includes a plurality of clamping blocks 422. The plurality of clamping blocks 422 are arranged at intervals to form a clamping ring that matches the shape of the wafer 20. The clamping blocks 422 can move toward or away from the wafer 20 in the radial direction of the clamping ring to clamp or release the wafer 20. In this way, the outer side surface of the wafer 20 can be clamped from the radial direction of the wafer 20, which can avoid contact between the clamping member 420 and the surface of the wafer 20 relative to clamping the surface of the wafer 20 from the axial direction of the wafer 20, thereby achieving low contact between the clamping member 420 and the wafer 20, and reducing the probability of contamination or even scratches on the surface of the wafer 20, which affects the cleanliness of the wafer 20. It can be understood that in other embodiments, the surface of the wafer 20 can also be clamped from the axial direction of the wafer 20.

[0055] In this embodiment, if Figure 4 and Figure 6 As shown, the clamp block 422 has a clamping groove 422a for inserting the wafer 20. In the circumferential direction of the clamping ring, the depth of the clamping groove 422a in the radial direction of the clamping ring gradually decreases from the middle to the two ends. In this way, when the clamp block 422 clamps the wafer 20, the clamping groove 422a can eliminate the errors of the height and tilt of the wafer 20 (in the circumferential direction of the clamping ring, the clamping groove 422a tilts from the two ends to the middle), and can effectively clamp the wafer 20, so as to achieve low contact between the clamp block 422 and the wafer 20 (in the circumferential direction of the clamping ring, the middle part of the clamping groove 422a may not contact the wafer 20). It can be understood that in other embodiments, in the circumferential direction of the clamping ring, the depth of the clamping groove 422a in the radial direction of the clamping ring may also remain unchanged from the middle to the two ends.

[0056] In this embodiment, the clamping ring is located on a horizontal plane. The clamping block 422 also has an avoidance groove 422b. The avoidance groove 422b runs through both sides of the clamping block 422 in the vertical direction and runs through the side of the clamping block 422 close to the wafer 20 in the radial direction of the clamping ring. When the centering member 510 is in the first position and the clamping ring clamps the wafer 20, each clamping block 422 is arranged corresponding to a support column 512, and the support column 512 corresponding to the clamping block 422 is inserted into the avoidance groove 422b. In this way, it is not only convenient to arrange multiple clamping blocks 422 and multiple support columns 512 at the first position at the same time, but also can effectively avoid interference between multiple clamping blocks 422 and multiple support columns 512. It can be understood that in other embodiments, when the clamping block 422 and the support column 512 are not arranged correspondingly, for example, when multiple clamping blocks 422 and multiple support columns 512 are misaligned, the avoidance groove 422b can be omitted.

[0057] In this embodiment, if Figure 4 and Figure 6-Figure 8As shown, there are two clamping blocks 422, namely a first clamping block 422c and a second clamping block 422d. In this way, it is not only convenient for the clamping member 420 to clamp the wafer 20, but also convenient to simplify the structure of the clamping member 420. It is understandable that in other embodiments, there may be three, four or even more clamping blocks 422.

[0058] In the present embodiment, the clamping member 420 further includes a first link member 423, a second link member 424, a first tension spring 425, and a second tension spring 426 disposed on the flip member 410. The first link member 423 is connected to the first clamp block 422c. The second link member 424 is connected to the second clamp block 422d. The first tension spring 425 connects the first clamp block 422c and the flip member 410. The second tension spring 426 connects the second clamp block 422d and the flip member 410. When force is applied to the first link member 423 and the second link member 424 at the same time, the first clamp block 422c and the second clamp block 422d both move away from the wafer 20 to release the wafer 20 and cause the first tension spring 425 and the second tension spring 426 to be stretched. When the force applied to the first link member 423 and the second link member 424 is released, the first tension spring 425 controls the first clamping block 422c to move close to the wafer 20, and the second tension spring 426 controls the second clamping block 422d to move close to the wafer 20 to clamp the wafer 20. In this way, not only the first clamping block 422c and the second clamping block 422d can be moved simultaneously to avoid the situation that the first clamping block 422c and the second clamping block 422d move asynchronously and affect the clamping of the wafer 20, but also it is very convenient to control the clamping force of the clamping member 420 to clamp the wafer 20, to avoid the wafer 20 being damaged due to the clamping force of the wafer 20 being too large, and to avoid the wafer 20 being too small to achieve the effect of clamping the wafer 20. It is understandable that in other embodiments, the first connecting rod 423, the second connecting rod 424, the first tension spring 425 and the second tension spring 426 can be omitted. In this case, the wafer 20 can be released or clamped by directly applying force or no force to the first clamp 422c and the second clamp 422d.

[0059] In this embodiment, the clamping member 420 further includes a first clamping jaw 427 and a second clamping jaw 428. The first clamping jaw 427 connects the first clamping block 422c and the first connecting rod 423. The second clamping jaw 428 connects the second clamping block 422d and the second connecting rod 424. The first tension spring 425 connects the first clamping jaw 427 and the flipping member 410. The second tension spring 426 connects the second clamping jaw 428 and the flipping member 410.

[0060] In this embodiment, the flip member 410 is provided with a first slide rail 430 and a second slide rail 440. The first clamping jaw 427 is provided with a first slider 450. The second clamping jaw 428 is provided with a second slider 460. The first slider 450 and the second slider 460 are respectively slidably disposed on the first slide rail 430 and the second slide rail 440. The first clamping jaw 427 is connected to the first connecting rod 423 through the first slider 450. The second clamping jaw 428 is connected to the second connecting rod 424 through the second slider 460. The first tension spring 425 is connected to the first clamping jaw 427 through the first slider 450. The second tension spring 426 is connected to the second clamping jaw 428 through the second slider 460.

[0061] In this embodiment, the flip mechanism 400 further includes a clamping cylinder 470. When the cylinder rod 470a of the clamping cylinder 470 is retracted, the clamping cylinder 470 applies force to the first connecting rod 423 and the second connecting rod 424. When the cylinder rod 470a of the clamping cylinder 470 is extended, the clamping cylinder 470 releases the force applied to the first connecting rod 423 and the second connecting rod 424. In this way, it is very convenient to automatically control the operation of the clamping member 420. It can be understood that in other embodiments, the operation of the clamping member 420 can also be controlled manually. It is understandable that in other embodiments, when the cylinder rod 470a of the clamping cylinder 470 is extended, the clamping cylinder 470 applies force to the first connecting rod member 423 and the second connecting rod member 424, and when the cylinder rod 470a of the clamping cylinder 470 is retracted, the clamping cylinder 470 releases the force applied to the first connecting rod member 423 and the second connecting rod member 424.

[0062] In this embodiment, the flip mechanism 400 further includes a rotating cylinder 480 and a telescopic rod 490. The rotating cylinder 480 is disposed on the mounting mechanism 300. The flip member 410 is sleeved on the rotating shaft 480a of the rotating cylinder 480. The clamping block 422, the first connecting rod 423, the second connecting rod 424, the first tension spring 425 and the second tension spring 426 are located on the same side of the flip member 410. The telescopic rod 490 is movably penetrated on the rotating shaft 480a of the rotating cylinder 480. The telescopic rod 490 can rotate relative to the rotating shaft 480a of the rotating cylinder 480 and can be telescoped within the rotating shaft 480a of the rotating cylinder 480 to approach or move away from the first connecting rod 423 and the second connecting rod 424.

[0063] The clamping cylinder 470 is arranged on the mounting mechanism 300 and is located on the side of the flipping member 410 away from the clamping member 420. The cylinder rod 470a of the clamping cylinder 470 is connected to the telescopic rod 490. When the cylinder rod 470a of the clamping cylinder 470 is retracted, the telescopic rod 490 contacts the first connecting rod 423 and the second connecting rod 424 and applies force to the first connecting rod 423 and the second connecting rod 424. When the cylinder rod of the clamping cylinder 470 is extended, the telescopic rod 490 is spaced from the first connecting rod 423 and the second connecting rod 424 and releases the force applied to the first connecting rod 423 and the second connecting rod 424. At this time, when the rotating shaft 480a of the rotating cylinder 480 rotates relative to the telescopic rod 490 to drive the flipping member 410 to flip, the telescopic rod 490 and the clamping cylinder 470 do not flip, and the flip performance requirements of the wafer flip centering device 10 are relatively low.

[0064] In the present embodiment, the rotation angle of the rotating shaft 480a of the rotating cylinder 480 is 0-190°. It is understood that in other embodiments, the rotation angle of the rotating shaft 480a of the rotating cylinder 480 may also be 0-360°. In the present embodiment, the mounting mechanism 300 is also provided with a hydraulic buffer corresponding to the forward rotation of the rotating cylinder 480 and a hydraulic buffer corresponding to the reverse rotation of the rotating cylinder 480. In this way, the wafer 20 can be smoothly turned over and decelerated to stop in place. It is understood that in other embodiments, when the accuracy of the rotation angle of the rotating cylinder 480 is very high, the hydraulic buffer may also be omitted.

[0065] In the present embodiment, the wafer flipping and centering device 10 further includes a negative pressure adsorption mechanism 700. Negative pressure adsorption mechanisms 700 are respectively provided at the centering cylinder 522, the clamping cylinder 470 and the rotating cylinder 480. In this way, the air flow particles of the cylinder accessories can be effectively removed by the negative pressure adsorption mechanism 700, and the air flow particles can be effectively controlled to prevent the air flow particles from contaminating the wafer 20. In the present embodiment, the clamping cylinder 470 and the rotating cylinder 480 are integrated together, and only one negative pressure adsorption mechanism 700 can be provided at the integration of the clamping cylinder 470 and the rotating cylinder 480, so that one negative pressure adsorption mechanism 700 can be omitted.

[0066] In this embodiment, the speed control valve of the centering cylinder 522, the speed control valve of the clamping cylinder, and the speed control valve of the rotating cylinder 480 are integrated in the same area 300a of the mounting mechanism 300. In this way, it is very convenient to adjust the flow of the cylinders. It can be understood that in other embodiments, the speed control valve of the centering cylinder 522, the speed control valve of the clamping cylinder, and the speed control valve of the rotating cylinder 480 can also be dispersed in various places of the mounting mechanism 300.

[0067] In this embodiment, the initial position of the centering member 510 is the first position. When the wafer flipping and centering device 10 is working, when the first sensor 610 detects that the centering member 510 is located at the first position, the wafer 20 is first placed on the centering member 510 at the first position to achieve the bearing and centering of the wafer 20, and then the clamping member 420 is controlled to clamp the wafer 20 on the centering member 510 at the first position to achieve the clamping of the wafer 20, and then the centering member 510 is controlled to move from the first position to the second position, and the centering member 510 is separated from the wafer 20 while avoiding the flipping of the wafer 20 by the centering member 510, and when the second sensor 620 detects that the centering member 510 is located at the second position, the flipping member 410 is controlled to flip, and the flipping of the clamping member 420 and the wafer 20 clamped on the clamping member 420 is achieved.

[0068] The wafer flipping and centering device 10 can realize the centering and flipping of the wafer 20, and during the flipping process, the centering member 510 is separated from the flipping member 410, and only the clamping member 420 provided on the flipping member 410 and the wafer 20 clamped on the clamping member 420 need to be flipped, and the centering member 510 does not need to be flipped, and the flipping performance requirements of the flipping member 410 are relatively low. In addition, the wafer flipping and centering device 10 can realize low contact with the wafer 20, and the whole process is precisely controlled, which greatly improves the production efficiency and cleanliness of the wafer 20 and improves the automation level of the equipment.

[0069] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer flipping and centering device, characterized in that: include: Installation mechanism; A flipping mechanism, arranged on the mounting mechanism, the flipping mechanism can clamp or release the wafer and can control the wafer to flip when clamping the wafer; as well as The centering mechanism includes a centering piece arranged on the mounting mechanism, the centering piece can carry and center the wafer, the centering piece can be switched between a first position and a second position, when in the first position, the flipping mechanism can clamp the wafer on the centering piece, when in the second position, the centering piece is located outside the flipping space of the flipping mechanism.

2. The wafer flipping and centering device according to claim 1, characterized in that: The centering member comprises a plurality of supporting columns, which are arranged at intervals to form a centering ring that matches the shape of the wafer. In the direction in which the wafer is placed into the centering ring, the inner diameter of the centering ring gradually decreases.

3. The wafer flipping and centering device according to claim 2, characterized in that: The support column is in a truncated cone or conical shape; and / or The number of the support columns is an even number, and the plurality of support columns comprises at least one group of support columns, each group of support columns comprises two support columns connected by a line passing through the center of the centering ring; and / or There are six supporting columns.

4. The wafer flipping and centering device according to claim 2, characterized in that: The centering piece also includes a plurality of mounting posts. In the direction in which the wafer is placed in the centering ring, the plurality of mounting posts are located below the plurality of support posts and are connected one-to-one with the plurality of support posts. The end surfaces of the mounting posts connected to the support posts include limiting areas. The limiting areas are located on the outer periphery of the support posts and inside the centering ring, thereby preventing the wafer from slipping into the space enclosed by the plurality of mounting posts.

5. The wafer flipping and centering device according to claim 4, characterized in that: The support column is in a truncated cone or conical shape, the mounting column is in a cylindrical shape, the center line of the mounting column is concentrically arranged with the center line of the support column, and the outer diameter of the mounting column is larger than the outer diameter of the support column.

6. The wafer flipping and centering device according to claim 1, characterized in that: The first position and the second position are arranged at intervals in the vertical direction, and the centering mechanism further includes a lifting component capable of driving the centering member to switch between the first position and the second position; and / or The wafer flipping and centering device also includes a sensor mechanism, which includes a first sensor communicatively connected to the flipping mechanism and a second sensor communicatively connected to the flipping mechanism, the first sensor and the second sensor can respectively detect whether the centering member is located at the first position and whether the centering member is located at the second position, when the first sensor detects that the centering member is located at the first position, the flipping mechanism clamps or releases the wafer, and when the second sensor detects that the centering member is located at the second position, the flipping mechanism controls the wafer flipping.

7. The wafer flipping and centering device according to claim 1, characterized in that: The flip mechanism includes a flip member arranged on the mounting mechanism and a clamping member arranged on the flip member, wherein the flip member can drive the clamping member to flip, and the clamping member can clamp or release the wafer; The clamping member comprises a plurality of clamping blocks, which are arranged at intervals to form a clamping ring shape matching the shape of the wafer. The clamping blocks can move toward or away from the wafer in the radial direction of the clamping ring to clamp or release the wafer.

8. The wafer flipping and centering device according to claim 7, characterized in that: The clamp block has a clamping groove for inserting the wafer, and in the circumferential direction of the clamping ring, the depth of the clamping groove in the radial direction of the clamping ring gradually decreases from the middle to both ends; and / or The clamping ring is located on a horizontal plane, the first position and the second position are arranged at intervals in the vertical direction, the centering piece includes a plurality of support columns, and the plurality of support columns are arranged at intervals to form a centering ring that matches the shape of the wafer, the clamping block has an avoidance groove, the avoidance groove passes through both sides of the clamping block in the vertical direction and passes through the side of the clamping block close to the wafer in the radial direction of the clamping ring, when the centering piece is in the first position and the clamping ring clamps the wafer, each clamping block is arranged corresponding to a support column, and the support column corresponding to the clamping block is inserted into the avoidance groove.

9. The wafer flipping and centering device according to claim 7, characterized in that: The clamping block is two and respectively comprises a first clamping block and a second clamping block, the clamping member further comprises a first connecting rod, a second connecting rod, a first tension spring and a second tension spring provided on the flipping member, the first connecting rod is connected to the first clamping block, the second connecting rod is connected to the second clamping block, the first tension spring connects the first clamping block and the flipping member, and the second tension spring connects the second clamping block and the flipping member; When force is applied to the first connecting rod and the second connecting rod at the same time, the first clamp block and the second clamp block both move away from the wafer to release the wafer and cause the first tension spring and the second tension spring to be stretched. When the force applied to the first connecting rod and the second connecting rod is released, the first tension spring controls the first clamp block to move closer to the wafer, and the second tension spring controls the second clamp block to move closer to the wafer to clamp the wafer.

10. The wafer flipping and centering device according to claim 1, characterized in that: The flipping mechanism comprises a flipping member, a clamping member, a rotating cylinder and a clamping cylinder, wherein the flipping member is arranged on the mounting mechanism, the clamping member is arranged on the flipping member, the flipping member can drive the clamping member to flip, the clamping member can clamp or release the wafer, the rotating cylinder can drive the flipping member to flip, the clamping cylinder can drive the clamping member to clamp or release the wafer, and the centering mechanism also comprises a centering cylinder capable of driving the centering member to switch between the first position and the second position; The wafer flipping and centering device further comprises a negative pressure adsorption mechanism, and at least one of the rotating cylinder, the clamping cylinder and the centering cylinder is provided with the negative pressure adsorption mechanism; and / or The speed control valve of the rotating cylinder, the speed control valve of the clamping cylinder and the speed control valve of the centering cylinder are integrated in the same area of ​​the mounting mechanism.

11. A single-chip cleaning machine, characterized in that: It comprises a wafer flipping and centering device as described in any one of claims 1-10.

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