Radiator and energy storage device

By setting a thermal connection between the reinforcement part and the temperature uniform plate in the heat dissipation pipe in the energy storage equipment, the problem of insufficient pressure resistance of the heat dissipation pipe is solved, and a longer service life and a safer heat dissipation effect are achieved.

CN222814729UActive Publication Date: 2025-04-29GD MIDEA HEATING & VENTILATING EQUIP CO LTD +1
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Patent Information

Application Number
CN202421167304.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-24
Publication Date
2025-04-29
Estimated Expiration
2034-05-24

AI Technical Summary

Technical Problem

The heat dissipation pipes in existing energy storage equipment have poor pressure resistance and are prone to damage when the heat exchange medium flows at high speed, which poses safety hazards.

Method used

A reinforcement part is provided in the heat exchange channel of the heat dissipation pipe to enhance the overall pressure resistance of the heat dissipation pipe and achieve uniform heat exchange through the thermally conductive connection of the temperature uniform plate.

Benefits of technology

It effectively extends the service life of the heat dissipation pipe, reduces the risk of damage, improves the uniform heat dissipation effect of energy storage components, and ensures the safety of users using energy storage equipment.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model discloses a radiator and energy storage equipment, the radiator comprises a uniform temperature plate and a radiating pipe, the uniform temperature plate is used for being in heat conduction connection with a to-be-radiated part, the radiating pipe comprises a main pipe body and a reinforcing part, the main pipe body is in heat conduction connection with the uniform temperature plate and is provided with a heat exchange channel, and the heat exchange channel is configured to allow a heat exchange medium to flow; and the reinforcing part is arranged in the heat exchange channel. According to the technical scheme, the pressure resistance of the radiating pipe can be improved, and the uniform radiating effect of the radiator on the part to be radiated can be improved.
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Description

Technical Field

[0001] The present application relates to the technical field of energy storage devices, and in particular to a radiator and an energy storage device using the radiator. Background Art

[0002] Energy storage devices can store energy for use in situations such as when power generation equipment fails. They can be widely used in multiple scenarios such as power generation, transmission and distribution, and power consumption. When energy storage devices are working, energy storage components will generate a certain amount of heat. If the heat of the energy storage components is not discharged in time, it will affect the service life of the energy storage components and may even cause safety accidents.

[0003] Based on this, the energy storage device in the related technology is provided with a radiator, and the heat dissipation pipe in the radiator is used to dissipate the heat of the energy storage element. However, the pressure resistance of the heat dissipation pipe in the current radiator is poor. When the pressure exerted by the heat exchange medium on the heat dissipation pipe is too large, it is easy to cause the heat dissipation pipe to be damaged, posing certain safety hazards. Utility Model Content

[0004] The embodiments of the present application provide a radiator and an energy storage device, which can improve the pressure resistance of a heat pipe and help to improve the uniform heat dissipation effect of the radiator on a heat dissipation element.

[0005] In a first aspect, an embodiment of the present application provides a radiator, which includes a temperature equalizing plate and a heat dissipation pipe, wherein the temperature equalizing plate is used for thermally connecting to a heat dissipation component, and the heat dissipation pipe includes a main body and a reinforcement portion, wherein the main body is thermally connected to the temperature equalizing plate and has a heat exchange channel, wherein the heat exchange channel is configured for allowing a heat exchange medium to flow, and wherein the reinforcement portion is disposed in the heat exchange channel.

[0006] In some embodiments, the heat dissipation pipe has a length direction, the reinforcement portion extends along the length direction, and divides the heat exchange channel into at least two heat exchange microchannels.

[0007] In some embodiments, the heat dissipation pipe also has a width direction, which is perpendicular to the length direction. The reinforcement part includes multiple reinforcement parts, and the multiple reinforcement parts are arranged at intervals along the width direction to divide the heat exchange channel into multiple heat exchange microchannels.

[0008] In some embodiments, the heat dissipation pipe further has a thickness direction and a width direction, the length direction, the thickness direction and the width direction are perpendicular to each other, and the heat dissipation pipe satisfies at least one of the following conditions:

[0009] Along the width direction, the distance between two adjacent reinforcement parts is L1, and satisfies: 0.3mm≤L1≤0.8mm;

[0010] Along the thickness direction, the thickness of the reinforcement portion is T1, and satisfies: 0.7 mm ≤ T1 ≤ 1.5 mm;

[0011] Along the width direction, the width of the main pipe is L2, and satisfies: 16mm≤L2≤32mm;

[0012] Along the thickness direction, the thickness of the main tube is T2, and satisfies: 1.3 mm ≤ T2 ≤ 2.5 mm.

[0013] In some embodiments, the main body and the reinforcement portion are an integral component; and / or,

[0014] The heat dissipation pipe includes at least one of a flat tube, a round tube, an elliptical tube and a square tube.

[0015] In some embodiments, a first header and a second header are further included, wherein the first header and the second header are respectively connected to opposite ends of the whole body formed by the plurality of heat dissipation tubes, and are both communicated with the heat exchange channel;

[0016] The first header or the second header is provided with a heat exchange medium inlet and a heat exchange medium outlet at the same time; or, one of the first header and the second header is provided with a heat exchange medium inlet, and the other is provided with a heat exchange medium outlet.

[0017] In some embodiments, the heat exchange medium inlet and the heat exchange medium outlet are arranged on the first header, and the plurality of heat dissipation pipes include:

[0018] A first heat dissipation pipe group, comprising a plurality of first pipes, one end of each of the plurality of first pipes being connected to the heat exchange medium inlet; and

[0019] The second heat dissipation tube group includes a plurality of second pipelines, one end of each of the plurality of second pipelines is connected to the heat exchange medium outlet, and the plurality of second pipelines are connected to the plurality of first pipelines through the second header.

[0020] In some embodiments, the number of the first pipelines is less than the number of the second pipelines.

[0021] In some embodiments, the first manifold is provided with the heat exchange medium inlet and the heat exchange medium outlet, and the first manifold has a first manifold cavity and a socket penetrating the first manifold and communicating with the first manifold cavity, and the radiator further includes:

[0022] A partition is inserted into the socket and extends into the first manifold, and divides the first manifold into an inlet tube cavity and an outlet tube cavity, wherein the inlet tube cavity is connected to the heat exchange medium inlet, and the outlet tube cavity is connected to the heat exchange medium outlet.

[0023] In some embodiments, the partition member is detachably connected to the first header.

[0024] In some embodiments, the partition member includes a main baffle and a side baffle. The main baffle is disposed in the first collecting chamber to separate the first collecting chamber into the inlet tube cavity and the outlet tube cavity. The side baffle is connected to the main baffle and is at least partially located in the socket.

[0025] In some embodiments, the temperature homogenizing plate has a heat transfer cavity, and the heat transfer cavity is filled with a phase change heat transfer medium;

[0026] Wherein, along the thickness direction of the temperature homogenizing plate, the heat transfer cavity has two cavity walls arranged opposite to each other, and one of the two cavity walls is used for thermal connection with the heat element to be cooled, and the other is thermally connected with the heat dissipation pipe.

[0027] In a second aspect, an embodiment of the present application provides an energy storage device, which includes a heat sink, an energy storage element and a thermal management system as described above, wherein the energy storage element is thermally connected to the temperature vapor chamber, and the thermal management system cooperates with the heat sink to adjust the temperature of the energy storage element.

[0028] Based on the radiator and energy storage device of the embodiment of the present application, a reinforcement portion is provided in the heat exchange channel, so that the radiator of the present embodiment can utilize the setting of the reinforcement portion to improve the overall pressure resistance of the heat dissipation pipe. Therefore, even if the heat exchange medium flowing through the heat exchange channel exerts a large pressure on the heat dissipation pipe at a high speed, the heat dissipation pipe can avoid damage to itself by virtue of its own better pressure resistance. In this way, while effectively extending the service life of the heat dissipation pipe, it can also reduce the risk of damage to the heat dissipation pipe and the energy storage element, thereby ensuring the safety of users when using the energy storage device.

[0029] In addition, based on the setting of the temperature equalizer, the overall heat of the heat sink to be cooled can flow evenly to each area of ​​the temperature equalizer, achieving uniform heat exchange, which is beneficial to improving the uniform heat dissipation effect of the radiator on the entire heat sink to be cooled, and avoiding the poor heat dissipation effect of part of the heat sink to cause excessively high operating temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0031] Figure 1 A schematic diagram of the structure of an energy storage device according to an embodiment of the present application;

[0032] Figure 2 A schematic structural diagram of a heat sink according to an embodiment of the present application;

[0033] Figure 3 for Figure 2 A structural diagram of the middle radiator from another perspective;

[0034] Figure 4 for Figure 3 Schematic diagram of the structure of the heat dissipation pipe;

[0035] Figure 5 for Figure 2 A schematic diagram of the structure of the middle radiator from another perspective;

[0036] Figure 6 For along Figure 5 Sectional view of the AA section;

[0037] Figure 7 for Figure 2 Schematic diagram of the structural breakdown of the radiator;

[0038] Figure 8 for Figure 7 A partial enlarged view of point B in the middle;

[0039] Fig. 9 2 is a cross-sectional view of a temperature vapor chamber according to an embodiment of the present application.

[0040] Description of Figure Numbers:

[0041] 100, radiator; 10, temperature plate; 11, heat transfer cavity; 20, heat pipe; 21, main body; 211, heat exchange channel; 2111, heat exchange microchannel; 22, reinforcement; 23, first heat pipe group; 231, first pipeline; 24, second heat pipe group; 241, second pipeline; 30, first manifold; 31, heat exchange medium inlet; 32, heat exchange medium outlet; 33, first manifold; 331, inlet Inlet tube cavity; 332, outlet tube cavity; 34, socket; 40, second collecting pipe; 50, partition; 51, main baffle; 52, side baffle; 60, inlet joint; 70, outlet joint; 300, energy storage device; 310, thermal management system; 320, compressor; 330, condenser; 340, heater; 350, plate exchanger; 360, four-way valve; X, length direction; Y, width direction; Z, thickness direction.

[0042] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0043] In order to make the objectives, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0044] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices and methods consistent with some parts of the present application as detailed in the attached claims.

[0045] In the description of the present application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise specified, "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the previously associated objects are in an "or" relationship.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0047] See also Figure 1 On the one hand, the present application proposes an energy storage device 300, which can store energy for use in situations such as when there is a failure in the power generation equipment, and can be widely used in multiple scenarios such as the power generation side, the power transmission and distribution side, and the power consumption side.

[0048] In the embodiment of the present application, the energy storage device 300 includes an energy storage element (not shown in the figure), a heat sink 100 and a thermal management system 310 .

[0049] The energy storage element may include multiple battery elements. For example, the battery element is a lithium battery, and the battery element has the functions of charging and discharging. It is understandable that the battery element will have a certain operating temperature during operation. If the operating temperature is higher than a preset temperature, such as higher than 50 degrees Celsius, the life of the battery element will decay rapidly, and may even cause safety accidents, such as battery explosion accidents.

[0050] The radiator 100 is heat-transferably connected to the energy storage element to dissipate heat from the energy storage element, so that the operating temperature of the energy storage element is not higher than a preset temperature during operation, thereby effectively extending the service life of the energy storage element and greatly reducing the possibility of safety accidents.

[0051] The radiator 100 may include at least one of a direct cooling radiator, a liquid cooling radiator and an air cooling radiator, wherein the heat exchange medium in the direct cooling radiator is specifically a refrigerant, which dissipates heat from the energy storage element by phase change of the refrigerant, greatly improving the heat dissipation efficiency, and the liquid cooling radiator and the air cooling radiator use liquid and wind flow as heat exchange medium respectively, which is not limited in this embodiment. In order to facilitate the description of the following content, the following embodiment is described in detail in the form of the heat exchange medium of the radiator 100 being a refrigerant.

[0052] The thermal management system 310 cooperates with the radiator 100 to adjust the temperature of the energy storage element, so that when the operating temperature of the energy storage element is too high, the temperature of the energy storage element is adjusted in time to make the temperature of the energy storage element lower than or equal to the preset temperature, thereby avoiding heat accumulation in the energy storage element.

[0053] Taking the example that the thermal management system 310 can deliver refrigerant to the radiator 100, the thermal management system 310 may include a compressor 320, a condenser 330, a four-way valve 360, and a heater 340. It is understandable that the compressor 320 will first compress the refrigerant in a low-temperature and low-pressure state, so that the refrigerant becomes a high-temperature and high-pressure state under the compression of the compressor 320, and then the refrigerant in a high-temperature and high-pressure state will flow to the condenser 330 through the DC port of the four-way valve 360, and then after the operation of the condenser 330, the refrigerant will become a liquid refrigerant, and then the liquid refrigerant will be sent to the radiator 100 to absorb the heat of the energy storage element to achieve the effect of heat dissipation of the energy storage element. After the heat dissipation is completed, the liquid refrigerant will become a refrigerant in a low-temperature and low-pressure state, and then flow to the heater 340 through the ES port of the four-way valve 360. After the heating effect of the heater 340, the liquid originally present in the refrigerant absorbs heat as much as possible and is converted into a gaseous state, and finally flows to the compressor 320 to achieve a complete cycle.

[0054] It is worth mentioning that the thermal management system 310 can further include a plate exchanger 350. The function of the plate exchanger 350 is: in some working scenarios, the liquid refrigerant flowing to the radiator 100 is heat exchanged with the low-temperature and low-pressure refrigerant flowing to the heater 340. For example, the temperature of the refrigerant flowing out of the condenser 330 is lower than the required temperature of the refrigerant in the direct cooling heat exchanger and the energy storage element. In this case, the refrigerant flowing out of the condenser 330 can be used to absorb part of the heat of the low-temperature and low-pressure refrigerant flowing to the heater 340 at the plate exchanger 350, and the temperature of the refrigerant flowing out of the condenser 330 after absorbing the heat is not higher than the preset temperature, thereby saving the heating power consumption of the heater 340, which is beneficial to reducing the operating cost of the energy storage device 300.

[0055] In the related art, the heat pipe in the radiator has poor pressure resistance. When the pressure exerted by the heat exchange medium on the heat pipe is too great, the heat pipe is easily damaged, posing certain safety hazards. Taking the heat exchange medium as refrigerant as an example, when the refrigerant flows through the heat pipe at a high speed, the internal pressure of the heat pipe is relatively large, which is easy to cause damage to the heat pipe. There may even be a risk of damage to the heat pipe and the energy storage element being damaged in conjunction. Therefore, there will be a great safety hazard.

[0056] Therefore, in order to solve this technical problem, please refer to Figures 2 to 4 The present application further proposes a radiator 100, which has a heat exchange channel 211 configured to allow a heat exchange medium to flow. The radiator 100 includes a heat pipe 20 and a temperature averaging plate 10, wherein the heat pipe 20 has a heat exchange channel 211 and is thermally connected to the temperature averaging plate 10, and the temperature averaging plate 10 is thermally connected to the energy storage element.

[0057] The heat dissipation pipe 20 is arranged in a long strip shape, so as to have a length direction X, a thickness direction Z and a width direction Y, and the length direction X, the thickness direction Z and the width direction Y are perpendicular to each other. The heat dissipation pipe 20 can be made of metal materials such as aluminum, copper or steel, so as to have excellent thermal conductivity, thereby improving the heat conduction effect between the heat dissipation pipe 20 and the temperature equalizing plate 10. The heat dissipation pipe 20 can include one or more, and the heat dissipation pipe 20 can include at least one of a flat tube, a round tube, an elliptical tube and a square tube, so that the shape of the heat dissipation pipe 20 is relatively regular and easy to manufacture and produce. When the heat dissipation pipe 20 is a flat tube, the two surfaces of the flat tube along the thickness direction Z are planes. In this way, the surface contact between the plane and the plate surface of the temperature equalizing plate 10 can be used to increase the contact area between the heat dissipation pipe 20 and the temperature equalizing plate 10, thereby effectively improving the heat dissipation efficiency. It is explained here that the shape, material, etc. of the heat dissipation pipe 20 are not specifically limited in this embodiment, and can be adaptively selected according to the actual processing conditions of the heat dissipation pipe 20 and the heat dissipation requirements of the radiator 100.

[0058] The heat pipe 20 includes a main body 21 and a reinforcement portion 22. The main body 21 is the main body of the heat pipe 20, defining the outer contour of the entire heat pipe 20, wherein the main body 21 has a heat exchange channel 211, and the embodiment of the present application does not limit the shape of the heat exchange channel 211, which can be circular, square, etc. The main body 21 is thermally connected to the temperature homogenizing plate 10.

[0059] The reinforcement part 22 is disposed in the heat exchange channel 211. It can be understood that the reinforcement part 22 can be fixedly connected to the inner wall surface of the heat exchange channel 211 to be fixed in the heat exchange channel 211. The reinforcement part 22 can be continuously extended along the length direction X, or can be discontinuously extended along the length direction X, which is not limited in this embodiment.

[0060] The main body 21 and the reinforcement part 22 may be an integrated component, such as being made by integrated stamping, etc., which can improve the connection strength between the main body 21 and the reinforcement part 22, thereby facilitating the improvement of the overall structural strength of the heat dissipation pipe 20, so that the heat dissipation pipe 20 has good pressure resistance. In addition, the integrated component can also reduce the assembly steps of the main body and the reinforcement part 22, which helps to improve the manufacturing efficiency of the heat dissipation pipe 20. Of course, the present embodiment is not limited thereto, and the main body 21 and the reinforcement part 22 may also be split components, and connected by welding, bonding, etc.

[0061] The temperature averaging plate 10 is a plate-shaped structure, and the material of the temperature averaging plate 10 can be aluminum, copper or steel and other materials with excellent thermal conductivity, which is not limited in this embodiment. The temperature averaging plate 10 is thermally connected to the heat dissipation element (i.e., the energy storage element) and is thermally connected to the main pipe 21. It can be understood that the temperature averaging plate 10 has a first thermally conductive surface and a second thermally conductive surface that are arranged opposite to each other along its thickness direction Z, the first thermally conductive surface is in thermal contact with the heat dissipation element, and the second thermally conductive surface is in thermal contact with the main pipe 21.

[0062] In summary, by providing a reinforcement portion 22 in the heat exchange channel 211, the radiator 100 of this embodiment can utilize the provision of the reinforcement portion 22 to improve the overall pressure resistance of the heat pipe 20, so that even if the heat exchange medium flowing through the heat exchange channel 211 exerts a large pressure on the heat pipe 20 at a high speed, the heat pipe 20 can avoid damage to itself by virtue of its own better pressure resistance. In this way, while effectively extending the service life of the heat pipe 20, it can also reduce the risk of damage to the heat pipe 20 and the energy storage element, thereby ensuring the safety of the user when using the energy storage device 300.

[0063] In addition, based on the setting of the temperature equalizing plate 10, the overall heat of the heat dissipation component to be cooled can flow evenly to various areas of the temperature equalizing plate 10 to achieve uniform heat exchange, which is beneficial to improving the uniform heat dissipation effect of the radiator 100 on the overall heat dissipation component to be cooled, and avoiding poor heat dissipation of part of the heat dissipation component to be cooled, resulting in excessively high operating temperature. For example, it is beneficial to improving the uniform heat dissipation effect of the radiator 100 on multiple groups of energy storage elements, thereby reducing the temperature difference between the multiple groups of energy storage elements, and avoiding a significant reduction in the service life of some energy storage elements due to excessively high operating temperature.

[0064] It is worth mentioning that if the energy storage element, the temperature equalizer 10 and the heat dissipation pipe 20 are arranged in order from top to bottom along the gravity direction, the heat dissipation pipe 20 needs to withstand not only the internal pressure caused by the heat exchange medium, but also the external pressure caused by the energy storage element. Therefore, in this embodiment, the pressure resistance of the heat dissipation pipe 20 is improved by setting the reinforcement part 22, so that the heat dissipation pipe 20 can not only withstand the large internal pressure caused by the heat exchange medium, but also withstand the large external pressure borne by the energy storage element.

[0065] See also Figure 4In some embodiments, the reinforcement portion 22 extends along the length direction X. It can be understood that the reinforcement portion 22 can be continuously extended from one end of the main body 21 to the other end of the main body 21 along the length direction X. This arrangement can make the reinforcement portion 22 have better structural continuity, thereby providing a more uniform structural reinforcement effect for the main body 21, improving the overall uniform pressure resistance of the main body 21, and, compared with the intermittently extended reinforcement portion 22, the continuously extended reinforcement portion 22 is also easier to process and manufacture, effectively reducing the processing difficulty.

[0066] The reinforcement part 22 divides the heat exchange channel 211 into at least two heat exchange microchannels 2111, and the heat exchange microchannel 2111 is configured to allow heat exchange medium to flow. The number of the reinforcement part 22 can be one or more. When the number of the reinforcement part 22 is one, one reinforcement part 22 divides the heat exchange channel 211 into two heat exchange microchannels 2111, and when the number of the reinforcement part 22 is multiple, multiple reinforcement parts 22 divide the heat exchange channel 211 into at least three heat exchange microchannels 2111, and this embodiment does not limit this.

[0067] In this way, on the basis of improving the pressure resistance of the heat pipe 20 through the reinforcement part 22, the reinforcement part 22 can also be used to construct the wall of the heat exchange microchannel 2111 to increase the total heat exchange area between the heat exchange medium and the heat pipe 20, thereby increasing the heat carried away by the heat exchange medium to the temperature equalizing plate 10, which is beneficial to improve the heat dissipation effect of the radiator 100 on the energy storage element.

[0068] Please continue reading Figure 4 Optionally, the reinforcing part 22 includes a plurality of reinforcing parts 22, which are arranged at intervals along the width direction Y to divide the heat exchange channel 211 into a plurality of heat exchange microchannels 2111. In this way, on the one hand, the provision of a plurality of reinforcing parts 22 can further improve the overall pressure resistance of the heat pipe 20; on the other hand, on the basis of the plurality of reinforcing parts 22 being arranged at intervals along the width direction Y, the plurality of heat exchange microchannels 2111 divided by the reinforcing parts 22 will be arranged at intervals along the width direction Y, so that the gravity of all heat exchange media flowing through the plurality of heat exchange microchannels 2111 can be evenly dispersed on various areas of the bottom surface of the main pipe 21 along the width direction Y, which helps to reduce the risk of damage to the main pipe 21.

[0069] Please continue reading Figure 4 In some embodiments, the heat pipe 20 satisfies at least one of the following conditions:

[0070] Along the width direction Y, the distance between two adjacent reinforcement parts 22 is L1, and satisfies: 0.3mm≤L1≤0.8mm. In this way, while ensuring that the plurality of reinforcement parts 22 can have a good effect on improving the overall durability of the heat pipe 20, the heat exchange effect of the heat exchange medium flowing through the heat exchange microchannel 2111 is guaranteed.

[0071] It is understandable that if L1 is greater than 0.8 mm, the number of reinforcements 22 will be too small based on the size of the heat pipe 20, thereby affecting the effect of multiple reinforcements 22 on improving the overall durability of the heat pipe 20. If L1 is less than 0.3 mm, on the one hand, the flow area of ​​the heat exchange microchannel 2111 for the heat exchange medium will be reduced, resulting in poor heat exchange effect. On the other hand, the distance between two adjacent reinforcements 22 is too small, which makes it difficult to form multiple reinforcements 22, and the processing precision is too high and the manufacturing difficulty is too great, which makes it inconvenient to process and manufacture multiple reinforcements 22.

[0072] For example, the specific value of L1 may be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm or 0.8 mm, etc., which is not limited in this embodiment.

[0073] Along the thickness direction Z, the thickness of the reinforcement part 22 is T1, and satisfies: 0.7mm≤T1≤1.5mm. In this way, while ensuring that the multiple reinforcement parts 22 can have a good improvement effect on the overall durability of the heat pipe 20, it is ensured that the main body 21 has good pressure resistance. It can be understood that if T1 is less than 0.7mm, the thickness of the reinforcement part 22 will be too small, thereby affecting the improvement effect of the reinforcement part 22 on the durability of the heat pipe 20. Not only that, it will also reduce the flow area of ​​the heat exchange microchannel 2111 for the heat exchange medium, resulting in poor heat exchange effect. If T1 is greater than 1.5mm, then when the size of the heat pipe 20 is certain, the excessive thickness of the reinforcement part 22 will also cause the wall thickness of the main body 21 to be thinner, thereby resulting in poor pressure resistance of the main body 21.

[0074] For example, the specific value of T1 may be 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm or 1.5 mm, etc., which is not limited in this embodiment.

[0075] Along the width direction Y, the width of the main body 21 is L2, and satisfies: 16mm≤L2≤32mm. In this way, while ensuring the good durability of the heat pipe 20 as a whole, the heat exchange effect between the heat pipe 20 and the temperature equalizing plate 10 is guaranteed. It can be understood that if L2 is greater than 32mm, the width of the main body 21 will be too large, which will cause the structural strength of the main body 21 to be poor, resulting in poor overall pressure resistance of the heat pipe 20. If L2 is less than 16mm, the overall width of the main body 21 will be too small, which will cause the contact area between the heat pipe 20 and the temperature equalizing plate 10 to be small, affecting the heat exchange efficiency.

[0076] For example, the specific value of L2 may be 16 mm, 20 mm, 24 mm, 28 mm or 32 mm, etc., which is not limited in this embodiment.

[0077] Along the thickness direction Z, the thickness of the main body 21 is T2, and satisfies: 1.3mm≤T2≤2.5mm. In this way, while ensuring the good durability of the main body 21, the heat exchange effect between the heat pipe 20 and the temperature equalizing plate 10 is guaranteed. It can be understood that if T2 is greater than 2.5mm, the wall thickness of the main body 21 will be too large on the basis of the unchanged size of the reinforcement part 22, so that the resistance of the heat exchange medium from the main body 21 to the temperature equalizing plate 10 is too large, resulting in poor heat exchange effect. If T2 is less than 1.3mm, the wall thickness of the main body 21 will be too small, which will cause the pressure resistance of the main body 21 to be poor.

[0078] For example, the specific value of T2 may be 1.3 mm, 1.5 mm, 1.7 mm, 1.9 mm, 2.1 mm, 2.3 mm or 2.5 mm, etc., which is not limited in this embodiment.

[0079] Please refer to Figure 5 to Figure 6 In some embodiments, the heat sink 100 further includes a first header 30 and a second header 40. The first header 30 and the second header 40 can be arranged in a long strip shape, and can be made of materials with good strength and high thermal conductivity such as aluminum and copper, which is not limited in this embodiment.

[0080] The first manifold 30 and the second manifold 40 are respectively connected to opposite ends of the whole formed by the plurality of heat dissipation tubes 20, and are both connected to the heat exchange channel 211. It can be understood that the first manifold 30 has a first manifold cavity 33, the second manifold 40 has a second manifold cavity, and the first manifold cavity 33 and the second manifold cavity are both connected to the heat exchange microchannel 2111 of the heat exchange channel 211.

[0081] The first manifold 30 or the second manifold 40 is provided with a heat exchange medium inlet 31 and a heat exchange medium outlet 32. Taking the case where the first manifold 30 is provided with a heat exchange medium inlet 31 and a heat exchange medium outlet 32, for example, the heat exchange medium will first flow into the first manifold 33 from the heat exchange medium inlet 31, and then flow from the first manifold 33 to the heat exchange microchannels 2111 of the heat exchange channels 211 of some heat dissipation pipes 20 for heat exchange, and after the heat exchange is completed, the heat exchange medium will flow to the second manifold, and then flow from the second manifold to the heat exchange microchannels 2111 of the remaining heat dissipation channels for heat exchange, and after the heat exchange is completed, the heat exchange medium will then flow to the first manifold 33, and finally flow out from the heat exchange medium outlet 32.

[0082] Alternatively, one of the first manifold 30 and the second manifold 40 is provided with a heat exchange medium inlet 31, and the other is provided with a heat exchange medium outlet 32. Taking the case where the first manifold 30 is provided with a heat exchange medium inlet 31, and the second manifold 40 is provided with a heat exchange medium inlet 31 as an example, the heat exchange medium will first flow into the first manifold 33 from the heat exchange medium inlet 31, and then flow from the first manifold 33 to the heat exchange microchannels 2111 of all the heat exchange channels 211 of the heat exchange tubes for heat exchange, and after the heat exchange is completed, the heat exchange medium flows to the second manifold, and finally flows out from the heat exchange medium outlet 32.

[0083] In this way, the first header 30 and the second header 40 can be provided to collectively control the inflow and outflow of the heat exchange medium on the radiator 100 , which is convenient to control and operate, and has a relatively simple structure, thereby simplifying the number of structures of the radiator 100 .

[0084] Please refer to Figure 5 to Figure 6 In some exemplary structural forms, the radiator 100 also includes an inlet joint 60 and an outlet joint 70, wherein the inlet joint 60 and the outlet joint 70 are both connected to the first manifold 30, and the inlet joint 60 is connected to the heat exchange medium inlet 31, and the outlet joint 70 is connected to the heat exchange medium outlet 32. In this way, when the pipeline for transmitting the heat exchange medium in the thermal management system 310 is connected to the heat exchange medium inlet 31 and the heat exchange medium outlet 32, the inlet joint 60 and the outlet joint 70 can be connected to each other, which is convenient for operation.

[0085] Please refer to Figure 5 to Figure 6 In some embodiments, the heat exchange medium inlet 31 and the heat exchange medium outlet 32 ​​are disposed on the first header 30 , and the plurality of heat dissipation tubes 20 include a first heat dissipation tube group 23 and a second heat dissipation tube group 24 .

[0086] The first heat dissipation pipe group 23 includes a plurality of first pipes 231, each of which includes a main pipe body 21 and a reinforcement portion 22. One end of each of the plurality of first pipes 231 is connected to the heat exchange medium inlet 31, that is, the heat exchange microchannels 2111 of the heat exchange channels 211 of the plurality of first pipes 231 are connected to the heat exchange medium inlet 31.

[0087] The second heat dissipation pipe group 24 includes a plurality of second pipes 241, each of which includes a main pipe body 21 and a reinforcement portion 22. One end of each of the plurality of second pipes 241 is connected to the heat exchange medium outlet 32, that is, the heat exchange microchannels 2111 of each of the plurality of second pipes 241 are connected to the heat exchange medium outlet 32. The number of first pipes 231 may be less than or equal to the number of second pipes 241. The plurality of second pipes 241 are connected to the plurality of first pipes 231 through the second header 40.

[0088] It can be understood that the heat exchange medium will first flow into the first collecting chamber 33 from the heat exchange medium inlet 31, and then flow from the first collecting chamber 33 to the heat exchange microchannels 2111 of all the heat exchange channels 211 of the first pipelines 231 for heat exchange, and after the heat exchange is completed, it will flow into the second collecting chamber, and then flow from the second collecting chamber to the heat exchange microchannels 2111 of all the heat exchange channels 211 of the second pipelines 241 for heat exchange, and after the heat exchange is completed, it will flow to the first collecting chamber 33, and finally flow out from the heat exchange medium outlet 32.

[0089] In this way, the total contact area between the plurality of heat pipes 20 and the temperature equalizing plate 10 can be increased by setting the plurality of first pipes 231 and the plurality of second pipes 241, thereby improving the heat exchange efficiency between the plurality of heat exchangers and the temperature equalizing plate 10, and further improving the heat dissipation effect of the radiator 100 on the energy storage element. In addition, after the heat exchange in the first pipe 231, the heat exchange medium can flow to the second pipe 241 to continue the heat exchange, thereby improving the utilization rate of the heat exchange medium, thereby reducing the power consumption of the compressor 320 and reducing the operating cost.

[0090] Please refer to Figure 5 to Figure 6 , further, the number of the first pipelines 231 is less than the number of the second pipelines 241. This arrangement will make the total flow area of ​​the heat exchange channel 211 of the first heat dissipation tube group 23 smaller than the total flow area of ​​the heat exchange channel 211 of the second heat dissipation tube group 24, so the flow rate of the heat exchange medium flowing through the first heat dissipation tube group 23 will be faster than the flow rate through the second heat dissipation tube group 24. In this way, when the heat exchange medium flows through the first heat dissipation tube group 23, when the cold amount is large and the flow rate is fast, it will not absorb too much heat, and when it flows through the second heat dissipation tube group 24, although the cold amount has been reduced at this time, it can absorb more heat on the basis of a slower flow rate, so that the first heat dissipation tube group 23 and the second heat dissipation tube group 24 finally achieve uniform heat exchange effects on the temperature equalizing plate 10, which is conducive to improving the temperature uniformity of multiple groups of energy storage elements.

[0091] Please refer to Figure 6 to Figure 7 In some embodiments, a heat exchange medium inlet 31 and a heat exchange medium outlet 32 ​​are provided on the first manifold 30 , and the first manifold 30 has a socket 34 , which passes through the first manifold 30 and is connected to the first manifold cavity 33 .

[0092] The radiator 100 further includes a partition 50, which may be a plate structure, and the outline may be roughly circular. The partition 50 may be made of plastic or metal, which is not limited in this embodiment. The partition 50 is plugged into the socket 34 and extends into the first manifold 33, and divides the first manifold 33 into an inlet tube cavity 331 and an outlet tube cavity 332. The inlet tube cavity 331 is connected to the heat exchange medium inlet 31, and the outlet tube cavity 332 is connected to the heat exchange medium outlet 32. The connection between the partition 50 and the first manifold 30 may be a detachable connection or a non-detachable connection such as welding or bonding, which is not limited in this embodiment.

[0093] In this way, in the actual manufacturing and assembly process, the first collecting tube 30 and the partition piece 50 can be manufactured separately first, and then the partition piece 50 can be extended into the first collecting cavity 33 through the socket 34, so as to achieve the partition of the first collecting cavity 33, and a single first collecting tube 30 can be used to connect with multiple heat dissipation tubes 20, which effectively reduces the connection difficulty and facilitates subsequent assembly.

[0094] Of course, in other embodiments, the first collecting pipe 30 includes two pipe sections, one pipe section has a heat exchange medium inlet 31 and an inlet tube cavity 331, and the other pipe section has a heat exchange medium outlet 32 ​​and an outlet tube cavity 332. The two pipe sections are interconnected, and the inlet tube cavity 331 and the outlet tube cavity 332 are not connected to each other. The present application does not impose any restrictions on this.

[0095] Please refer to Figure 6 to Figure 7 Furthermore, the partition member 50 is detachably connected to the first manifold 30, for example, in the form of interference fit, snap-fit, etc. Thus, for example, when the partition member 50 is damaged, it is only necessary to remove the damaged partition member 50 from the first manifold 30 and replace it with a new partition member 50, without replacing the first manifold 30, which is convenient for disassembly and assembly. Moreover, after long-term use, when it is necessary to clean the first manifold 33, the partition member 50 can be removed from the first manifold 30 and then the first manifold 33 can be cleaned.

[0096] See also Figure 8In some embodiments, the partition 50 includes a main baffle 51 and a side baffle 52. The main baffle 51 is the main body of the partition 50 and can be circular to match the shape of the tube cavity. The main baffle 51 is disposed in the first manifold 33 and divides the first manifold 33 into an inlet tube cavity 331 and an outlet tube cavity 332.

[0097] The side baffle 52 is connected to the main baffle 51, for example, connected to the outside of the main baffle 51. At least part of the side baffle 52 is located in the socket 34. In this way, the socket 34 can be shielded by the side baffle 52 to reduce the risk of heat exchange medium leaking outward from the socket 34. In addition, on the basis of shielding the socket 34 by the side baffle 52, the external aesthetic effect of the first header 30 can be improved, and the overall outer surface formed by the first header 30 and the partition 50 can be made smoother.

[0098] See also Fig. 9 In some embodiments, the temperature homogenizing plate 10 has a heat transfer cavity 11 filled with a phase-changing heat medium. In particular, along the thickness direction Z of the temperature homogenizing plate 10, the heat transfer cavity 11 has two cavity walls arranged opposite to each other, one of the two cavity walls is used for thermal connection with the heat dissipation element to be cooled, and the other is thermally connected with the heat dissipation pipe 20. It can be understood that the cavity wall thermally connected with the heat dissipation element to be cooled has a first thermal conductive surface, and the cavity wall thermally connected with the heat dissipation pipe 20 has a second thermal conductive surface.

[0099] In the actual heat dissipation process, the phase change heat medium distributed on the cavity wall thermally connected to the heat dissipation element will evaporate into steam and absorb the heat of the energy storage element. Then the steam will be condensed into liquid by cooling on the cavity wall thermally connected to the heat dissipation pipe 20 and return to the cavity wall thermally connected to the heat dissipation element under gravity or capillary action to achieve circulation.

[0100] It is understandable that the phase change heat medium will be evenly distributed in the heat transfer cavity 11, which can help improve the uniformity of heat dissipation for the energy storage elements, reduce the temperature difference between multiple groups of energy storage elements, and further avoid a significant reduction in the service life of some energy storage elements due to excessively high operating temperatures.

[0101] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0102] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A radiator for an energy storage device, characterized in that: include: A temperature homogenizing plate, used for thermally connecting with the heat dissipation component; as well as The heat dissipation pipe comprises a main pipe body and a reinforcement part. The main pipe body is thermally connected to the temperature homogenizing plate and has a heat exchange channel. The heat exchange channel is configured for heat exchange medium to flow. The reinforcement part is arranged in the heat exchange channel.

2. The heat sink according to claim 1, characterized in that The heat dissipation pipe has a length direction, the reinforcement portion extends along the length direction and divides the heat exchange channel into at least two heat exchange microchannels.

3. The heat sink according to claim 2, characterized in that The heat dissipation pipe also has a width direction, and the width direction is perpendicular to the length direction. The reinforcement part includes a plurality of reinforcement parts, and the plurality of reinforcement parts are arranged at intervals along the width direction to divide the heat exchange channel into a plurality of heat exchange microchannels.

4. The heat sink according to claim 2, characterized in that The heat dissipation pipe also has a thickness direction and a width direction, and the length direction, the thickness direction and the width direction are perpendicular to each other, and the heat dissipation pipe satisfies at least one of the following conditions: Along the width direction, the distance between two adjacent reinforcement parts is L1, and satisfies: 0.3mm≤L1≤0.8mm; Along the thickness direction, the thickness of the reinforcement portion is T1, and satisfies: 0.7 mm ≤ T1 ≤ 1.5 mm; Along the width direction, the width of the main pipe is L2, and satisfies: 16mm≤L2≤32mm; Along the thickness direction, the thickness of the main tube is T2, and satisfies: 1.3 mm ≤ T2 ≤ 2.5 mm.

5. The heat sink according to claim 1, characterized in that The main pipe body and the reinforcement portion are an integral component; and / or, The heat dissipation pipe includes at least one of a flat tube, a round tube, an elliptical tube and a square tube.

6. The heat sink according to claim 1, characterized in that Also includes: The first header and the second header are respectively connected to opposite ends of the whole formed by the plurality of heat dissipation tubes, and are both communicated with the heat exchange channel; The first header or the second header is provided with a heat exchange medium inlet and a heat exchange medium outlet at the same time; or, one of the first header and the second header is provided with a heat exchange medium inlet, and the other is provided with a heat exchange medium outlet.

7. The heat sink according to claim 6, characterized in that The heat exchange medium inlet and the heat exchange medium outlet are arranged on the first header, and the plurality of heat dissipation pipes include: A first heat dissipation pipe group, comprising a plurality of first pipes, one end of each of the plurality of first pipes being connected to the heat exchange medium inlet; and The second heat dissipation tube group includes a plurality of second pipelines, one end of each of the plurality of second pipelines is connected to the heat exchange medium outlet, and the plurality of second pipelines are connected to the plurality of first pipelines through the second header.

8. The heat sink according to claim 7, characterized in that The number of the first pipelines is smaller than the number of the second pipelines.

9. The heat sink according to claim 6, characterized in that: The first manifold is provided with the heat exchange medium inlet and the heat exchange medium outlet, and the first manifold has a first manifold cavity and a socket penetrating the first manifold and communicating with the first manifold cavity, and the radiator further includes: A partition is inserted into the socket and extends into the first manifold, and divides the first manifold into an inlet tube cavity and an outlet tube cavity, wherein the inlet tube cavity is connected to the heat exchange medium inlet, and the outlet tube cavity is connected to the heat exchange medium outlet.

10. The heat sink according to claim 9, characterized in that The partition member is detachably connected to the first header.

11. The heat sink according to claim 9, characterized in that The partition member comprises: a main baffle, disposed in the first manifold, to separate the first manifold into the inlet tube cavity and the outlet tube cavity; and The side baffle is connected to the main baffle and is at least partially located in the socket.

12. The radiator according to any one of claims 1 to 11, characterized in that: The temperature homogenizing plate has a heat transfer cavity, and the heat transfer cavity is filled with a phase change heat medium; Wherein, along the thickness direction of the temperature homogenizing plate, the heat transfer cavity has two cavity walls arranged opposite to each other, and one of the two cavity walls is used for thermal connection with the heat element to be cooled, and the other is thermally connected with the heat dissipation pipe.

13. An energy storage device, characterized in that: include: The radiator according to any one of claims 1 to 12; An energy storage element, thermally connected to the temperature homogenizing plate; as well as A thermal management system cooperates with the heat sink to adjust the temperature of the energy storage element.