Anti-sputtering equipment for wafer cutting

Abstract

The utility model relates to the technical field of wafer cutting equipment, and discloses anti-sputtering equipment for wafer cutting, which comprises a base, the upper side of the base is fixedly connected with a bearing plate, one side of the bearing plate is fixedly connected with a cutting table, the cutting table is provided with an adaptive groove, and an anti-sputtering transparent cover is slidably connected in the adaptive groove. The anti-sputtering transparent cover is located on the periphery of the cutting center area of the cutting table, a sliding rod and sliding sleeve mechanism for limiting and supporting the anti-sputtering transparent cover is arranged below the anti-sputtering transparent cover, the anti-sputtering transparent cover is driven to ascend and descend through a steel wire pull rope mechanism, pure mechanical design is achieved, the structure is reliable, and stability is high; purchase cost of parts used by the anti-sputtering equipment is low, so that enterprise production is facilitated, and operation cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cutting equipment, in particular to a sputtering prevention equipment for wafer cutting. Background Art

[0002] Blade dicing refers to the process of using a diamond blade to cut wafers. This is a purely physical cutting method to split wafers. Generally, wafers with a thickness of more than 100um are suitable for this dicing method. The diamond blade moves along the cutting path while rotating at high speed to completely cut through the wafer. At the same time, water is used to cool the blade and wafer to reduce thermal damage and take away the debris generated by cutting. However, some substances will still sputter outward during the cutting process, which may cause potential adverse effects on both the working production environment and the surrounding staff. Therefore, it is necessary to design a special wafer dicing anti-sputtering device to solve this problem. However, the existing wafer dicing anti-sputtering devices generally have the following technical problems:

[0003] When reinstalling a sputtering prevention device on an existing wafer cutting workbench, the construction is difficult and the original wafer cutting workbench needs to be modified greatly. In addition, the parts used in the installed sputtering prevention device have a high procurement cost, which increases the operating pressure of the enterprise.

[0004] Based on this, an anti-sputtering device for wafer cutting is proposed which can solve the above problems. Utility Model Content

[0005] In order to solve the technical problem of sputtering of wafer cutting equipment, the utility model provides an anti-sputtering equipment for wafer cutting.

[0006] The utility model is implemented by the following technical scheme: a kind of anti-sputtering equipment for wafer cutting, comprising a base, a load-bearing plate fixedly connected to the upper side of the base, a cutting table fixedly connected to one side of the load-bearing plate, an adapting groove opened on the cutting table, an anti-sputtering transparent cover slidably connected in the adapting groove, the anti-sputtering transparent cover is located at the periphery of the cutting center area of ​​the cutting table, a sliding rod and sliding sleeve mechanism for limiting and supporting the anti-sputtering transparent cover is arranged below the anti-sputtering transparent cover, a transparent cover lifting mechanism for reciprocating the anti-sputtering transparent cover up and down is arranged on one side of the load-bearing plate, and a wafer cutting mechanism for spatial multi-angle cutting of the wafer is arranged at the upper end of the load-bearing plate.

[0007] As a further improvement of the above scheme, the sliding rod and sliding sleeve mechanism includes a plurality of sliding rods fixedly connected to the upper side of the base, the upper ends of the plurality of sliding rods are respectively slidably connected to the limiting sliding cylinders, the upper sides of the plurality of limiting sliding cylinders are fixedly connected to the lower side of the anti-sputtering transparent cover, and the plurality of limiting sliding cylinders are distributed in a circular array.

[0008] As a further improvement of the above scheme, the transparent cover lifting mechanism includes a connecting plate fixedly connected to two limiting slides close to one side of the load-bearing plate, and a facing toothed plate mechanism is arranged on the side of the load-bearing plate close to the connecting plate to enable the connecting plate to move up and down reciprocatingly.

[0009] As a further improvement of the above scheme, the opposing tooth plate mechanism includes two slots opened on the lower side of the load-bearing plate, the inner sides of the two slots are respectively slidably connected with a card plate, the outer sides of the two card plates are respectively fixedly connected with a No. 1 tooth plate and a No. 2 tooth plate, one side of the No. 2 tooth plate is fixedly connected to one side of the connecting plate, a gear is meshed between the No. 1 tooth plate and the No. 2 tooth plate, the gear is rotatably connected to one side of the load-bearing plate, and the lower end of the No. 1 tooth plate is provided with a wire rope mechanism that enables the No. 1 tooth plate to slide back and forth up and down along the slot.

[0010] As a further improvement of the above solution, the wafer cutting mechanism includes a multi-axis driver assembly fixedly connected to the upper end of the load-bearing plate, and a cutting knife assembly is provided at the moving output end of the multi-axis driver assembly.

[0011] As a further improvement of the above scheme, the wire rope mechanism includes a No. 1 baffle plate fixedly connected to one side of the load-bearing plate, a spring is arranged between the upper side of the No. 1 baffle plate and the lower side of the No. 1 tooth plate, a No. 2 baffle plate is fixedly connected to one side of the load-bearing plate, a rubber tube is connected between the No. 2 baffle plate and the No. 1 baffle plate, a wire drawing is arranged through the inside of the rubber tube, one end of the wire drawing passes through the spring and is fixedly connected to the lower side of the No. 1 tooth plate, and the other end of the wire drawing is fixedly connected to the side of the cutting knife assembly.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The utility model sets a transparent cover lifting mechanism. When the cutting knife assembly cuts the wafer, the anti-sputtering transparent cover rises to shield it. When the cutting is completed, the anti-sputtering transparent cover falls and hides. The anti-sputtering transparent cover does not occupy the space above the cutting table, does not affect the original wafer cutting accuracy, and is simple and practical.

[0014] 2. The utility model drives the anti-sputtering transparent cover to rise and fall through a steel wire rope mechanism, which is a purely mechanical design with reliable structure and strong stability. In addition, the overall procurement cost of the parts used in the anti-sputtering equipment is low, which is beneficial to the company's production and reduction of operating costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A front view of a sputtering prevention device for wafer cutting provided by the utility model;

[0016] Figure 2 It is a side view of the utility model;

[0017] Figure 3 It is a top view of the utility model.

[0018] Description of main symbols:

[0019] 1. Base; 2. Slide bar; 3. Limit slide cylinder; 4. Anti-splash transparent cover; 5. Adapter slot; 6. Cutting table; 7. Cutting knife assembly; 8. Multi-axis drive assembly; 9. Load-bearing plate; 10. No. 1 tooth plate; 11. Gear; 12. Rubber tube; 13. Wire drawing; 14. Spring; 15. No. 1 baffle plate; 16. Slot; 17. No. 2 tooth plate; 18. Connecting plate; 19. No. 2 baffle plate. DETAILED DESCRIPTION

[0020] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0021] Example:

[0022] Please combine Figure 1 - Figure 3 The present embodiment of a wafer cutting anti-sputtering device includes a base 1, and a load-bearing plate 9 is fixedly connected to the upper side of the base 1. Figure 1 As shown, the load-bearing plate 9 is composed of a combined plate structure, the upper section is an integral fixed plate structure, and the lower section area is composed of two plates assembled from both sides. A cutting table 6 is fixedly connected to one side of the load-bearing plate 9, and an adapter groove 5 is provided on the cutting table 6. Please combine Figure 1 As shown, the adapting groove 5 is an arc-shaped movement, and the specific circumference needs to be determined in combination with the actual needs of wafer cutting. An anti-sputtering transparent cover 4 is slidably connected in the adapting groove 5. When the anti-sputtering transparent cover 4 is fully lowered, the upper surface and the cutting table 6 are located at the same horizontal plane, and the surfaces are seamlessly connected. In this embodiment, the anti-sputtering transparent cover 4 can be 17 cm higher than the upper surface of the wafer when it is raised for operation. The height in other embodiment scenarios depends on the specific circumstances. In this embodiment, the anti-sputtering transparent cover 4 is made of radiation-proof filter glass, and the anti-sputtering transparent cover 4 is located at the periphery of the cutting center area of ​​the cutting table 6. A sliding rod and sliding sleeve mechanism for limiting and supporting the anti-sputtering transparent cover 4 is arranged below the anti-sputtering transparent cover 4, and a transparent cover lifting mechanism for reciprocating the anti-sputtering transparent cover 4 up and down is arranged on one side of the load-bearing plate 9, and a wafer cutting mechanism for spatial multi-angle cutting of the wafer is arranged on the upper end of the load-bearing plate 9.

[0023] Please combine Figure 1As shown, the slide rod and sleeve mechanism includes three slide rods 2 fixedly connected to the upper side of the base 1, the upper ends of the three slide rods 2 are respectively slidably connected to the limiting slide cylinders 3, the upper sides of the three limiting slide cylinders 3 are fixedly connected to the lower side of the anti-splash transparent cover 4, and the multiple limiting slide cylinders 3 are distributed in a circular array. It should be noted that when the anti-splash transparent cover 4 is completely dropped, the uppermost end of the slide rod 2 just touches the uppermost side of the inside of the limiting slide cylinder 3.

[0024] Please combine Figure 1 As shown, the transparent cover lifting mechanism includes a connecting plate 18 fixedly connected to two limiting slide cylinders 3 near one side of the load-bearing plate 9, and a facing toothed plate mechanism is arranged on the side of the load-bearing plate 9 near the connecting plate 18 to enable the connecting plate 18 to reciprocate up and down.

[0025] Please combine Figure 1 As shown, the opposing tooth plate mechanism includes two slots 16 opened on the lower side of the load-bearing plate 9, the inner sides of the two slots 16 are slidably connected with a card plate, and the outer sides of the two card plates are fixedly connected with a No. 1 tooth plate 10 and a No. 2 tooth plate 17, one side of the No. 2 tooth plate 17 is fixedly connected to one side of the connecting plate 18, and a gear 11 is meshed between the No. 1 tooth plate 10 and the No. 2 tooth plate 17, and the gear 11 is rotatably connected to one side of the load-bearing plate 9. The lower end of the No. 1 tooth plate 10 is provided with a wire rope mechanism that enables the No. 1 tooth plate 10 to slide back and forth up and down along the slot 16.

[0026] Please combine Figure 1 and Figure 2 As shown, the wafer cutting mechanism includes a multi-axis drive assembly 8 fixedly connected to the upper end of the load-bearing plate 9. The multi-axis drive assembly 8 is a four-axis mobile robot. The mobile output end of the multi-axis drive assembly 8 is provided with a cutting knife assembly 7. The tool of the cutting knife assembly 7 can be a diamond tool or a high-energy laser cutting tool.

[0027] Please combine Figure 1 and Figure 2 As shown, the wire rope mechanism includes a No. 1 baffle plate fixedly connected to one side of the load-bearing plate, a spring is arranged between the upper side of the No. 1 baffle plate and the lower side of the No. 1 tooth plate, a No. 2 baffle plate is fixedly connected to one side of the load-bearing plate, a rubber tube is arranged between the No. 2 baffle plate and the No. 1 baffle plate, a wire drawing is arranged through the inside of the rubber tube, one end of the wire drawing passes through the spring and is fixedly connected to the lower side of the No. 1 tooth plate, and the other end of the wire drawing is fixedly connected to the side of the cutting knife assembly.

[0028] The implementation principle of a sputtering prevention device for wafer cutting in the embodiment of the present application is as follows: when the wafer is placed on the cutting table 6 and is ready to be cut, the multi-axis drive assembly 8 drives the cutting knife assembly 7 to move downward and close to the wafer. At this time, due to the blocking effect of the second baffle 19 on the rubber tube 12, the wire drawing 13 will be pulled in the rubber tube 12, and the other end of the wire drawing 13 pulls the first gear plate 10 to move downward along the slot 16, the spring 14 is deformed and compressed, and the gear 11 is driven to rotate by meshing, which indirectly drives the second gear plate 17 to move upward along the side of the load-bearing plate 9 in the opposite direction. , and at the same time, the connecting plate 18 is pushed upward, the connecting plate 18 pushes the two limiting slides 3 to move upward, and the limiting slides 3 push the anti-sputtering transparent cover 4 to slide along the inner side of the adapting groove, thereby realizing the lifting of the anti-sputtering transparent cover 4, and fully intercepting the material sputtered by the cutting knife assembly 7 when cutting the wafer. On the contrary, when the cutting is completed, the cutting knife assembly 7 rises and resets upward, the spring 14 rebounds, the No. 1 tooth plate 10 moves up, and the No. 2 tooth plate 17 moves down. At the same time, under the action of the anti-sputtering transparent cover 4's own gravity, the connecting plate 18 and the anti-sputtering transparent cover 4 descend together.

[0029] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A sputtering prevention device for wafer cutting, comprising a base (1), characterized in that: A load-bearing plate (9) is fixedly connected to the upper side of the base (1), a cutting table (6) is fixedly connected to one side of the load-bearing plate (9), an adapting groove (5) is provided on the cutting table (6), an anti-splashing transparent cover (4) is slidably connected in the adapting groove (5), the anti-splashing transparent cover (4) is located at the periphery of the cutting center area of ​​the cutting table (6), a sliding rod and sliding sleeve mechanism for limiting and supporting the anti-splashing transparent cover (4) is arranged below the anti-splashing transparent cover (4), a transparent cover lifting mechanism for reciprocating the anti-splashing transparent cover (4) up and down is arranged on one side of the load-bearing plate (9), and a wafer cutting mechanism for spatial multi-angle cutting of wafers is arranged at the upper end of the load-bearing plate (9).

2. The wafer dicing anti-sputtering device according to claim 1, characterized in that: The slide rod and sleeve mechanism comprises a plurality of slide rods (2) fixedly connected to the upper side of the base (1); the upper ends of the plurality of slide rods (2) are respectively slidably connected to limit slide cylinders (3); the upper sides of the plurality of limit slide cylinders (3) are fixedly connected to the lower side of the anti-sputtering transparent cover (4); and the plurality of limit slide cylinders (3) are distributed in a circular array.

3. The wafer dicing sputtering prevention device according to claim 1, characterized in that: The transparent cover lifting mechanism comprises a connecting plate (18) fixedly connected to two limiting slide cylinders (3) on one side close to the load-bearing plate (9), and a toothed plate mechanism facing each other is arranged on the side of the load-bearing plate (9) close to the connecting plate (18) to enable the connecting plate (18) to move up and down reciprocatingly.

4. The wafer dicing sputtering prevention device according to claim 3, characterized in that: The opposed toothed plate mechanism comprises two clamping grooves (16) provided on the lower side of the load-bearing plate (9), the inner sides of the two clamping grooves (16) are respectively slidably connected with clamping plates, the outer sides of the two clamping plates are respectively fixedly connected with a first toothed plate (10) and a second toothed plate (17), one side of the second toothed plate (17) is fixedly connected with one side of the connecting plate (18), a gear (11) is meshed between the first toothed plate (10) and the second toothed plate (17), the gear (11) is rotatably connected with one side of the load-bearing plate (9), and a wire rope mechanism is provided at the lower end of the first toothed plate (10) for enabling the first toothed plate (10) to slide reciprocatingly up and down along the clamping groove (16).

5. The wafer dicing anti-sputtering device according to claim 4, characterized in that: The wafer cutting mechanism comprises a multi-axis driver assembly (8) fixedly connected to the upper end of a load-bearing plate (9), and a cutting knife assembly (7) is provided at the movable output end of the multi-axis driver assembly (8).

6. The sputtering prevention device for wafer cutting as claimed in claim 5, characterized in that: The steel wire rope mechanism comprises a No. 1 baffle (15) fixedly connected to one side of the load-bearing plate (9), a spring (14) is arranged between the upper side of the No. 1 baffle (15) and the lower side of the No. 1 tooth plate (10), a No. 2 baffle (19) is fixedly connected to one side of the load-bearing plate (9), a rubber tube (12) is arranged in communication between the No. 2 baffle (19) and the No. 1 baffle (15), a wire drawing (13) is arranged through the inside of the rubber tube (12), one end of the wire drawing (13) passes through the spring (14) and is fixedly connected to the lower side of the No. 1 tooth plate (10), and the other end of the wire drawing (13) is fixedly connected to the side of the cutting knife assembly (7).

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