Circuit board and electronic equipment

Abstract

The utility model discloses a circuit board and electronic equipment. The circuit board comprises a bottom plate, a plurality of reinforcing plates and a plurality of bonding pad groups, the bottom plate comprises a plurality of welding areas and bending areas for connecting two adjacent welding areas, the bottom plate is provided with a first side and a second side which are opposite to each other, a plurality of reinforcing plates are arranged on the first side of the bottom plate at intervals and are positioned in the welding areas, a plurality of bonding pad groups are arranged on the second side of the bottom plate at intervals and are positioned in the welding areas, and the bonding pad groups are arranged on the first side of the bottom plate at intervals and are positioned in the bonding areas. And the bottom plate is folded by the bending area, so that the plurality of bonding pad groups are arranged in a folded shape. According to the technical scheme, the space occupied by the circuit board can be reduced, and assembling in a miniaturized precise electronic product is facilitated.

Description

Technical Field

[0001] The present application relates to the field of electronic technologies, and particularly to a circuit board and an electronic device applying the circuit board. Background Art

[0002] In an electronic device, based on requirements such as signal control, it is usually necessary to electrically connect some different functional module electronic components to a circuit board through wire cores. In some scenarios, multiple wire cores need to be soldered to corresponding pads on the circuit board.

[0003] In the related art, when multi-core wires are soldered on an FPC (Flexible Printed Circuit), in order to realize the operability of soldering multi-core wires, the FPC needs to be arranged in a row, thus occupying a large space, resulting in the product needing a large size to enclose the FPC, and it is impossible to achieve internal assembly in a small-sized precision electronic product.

[0004] Therefore, for the soldering of such multiple wire cores, a new design solution is urgently needed to achieve internal assembly in a small-sized precision electronic product. Summary of the Utility Model

[0005] The embodiments of the present application provide a circuit board and an electronic device, which can reduce the space occupied by the circuit board and facilitate internal assembly in a small-sized precision electronic product.

[0006] In a first aspect, the embodiments of the present application provide a circuit board, including a bottom plate, a plurality of reinforcing plates, and a plurality of pad groups. The bottom plate includes a plurality of welding areas and a bending area connecting two adjacent welding areas, and the bottom plate has a first side and a second side opposite to each other; a plurality of reinforcing plates are arranged at intervals on the first side of the bottom plate and located in the welding areas; a plurality of pad groups are arranged at intervals on the second side of the bottom plate and located in the welding areas; wherein, the bottom plate is folded along the bending area so that the plurality of pad groups are arranged in a folded state.

[0007] In a second aspect, the embodiments of the present application provide an electronic device, which includes the above-mentioned circuit board.

[0008] Based on the circuit board and the electronic device provided by the embodiments of the present application, by providing a plurality of welding areas on the bottom plate and arranging reinforcing plates in the welding areas, the strength of the area where the welding areas are located can be improved. There is a bending area between two adjacent welding areas, and the bottom plate is folded along the bending area, so that the welding groups are arranged in a folded state, reducing the space occupied by the circuit board and facilitating internal assembly in a small-sized precision electronic product. Description of the Drawings

[0009] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0010] Figure 1 Schematic diagram of the structure of the first side in an embodiment of the circuit board of the present application;

[0011] Figure 2 Schematic diagram of the structure of the second side in an embodiment of the circuit board of the present application;

[0012] Figure 3 Schematic diagram of the structure of the circuit board in a bent state in an embodiment of the present application;

[0013] Figure 4 Schematic diagram of the structure of the circuit board in a bent state in an embodiment of the present application;

[0014] Figure 5 Schematic diagram of the structure of a part of the electronic device of the present application.

[0015] Explanation of the reference numerals in the drawings:

[0016] 100, earphone; 10, circuit board; 11, bottom plate; 11a, bending area; 11b, first welding area; 11c, second welding area; 11d, third welding area; 111, first bottom plate; 112, second bottom plate; 12, reinforcing plate; 13, pad group; 20, housing; 20a, first installation cavity; 20b, second installation cavity.

[0017] The realization of the purpose, functional features and advantages of the present application will be further described with reference to the embodiments and the drawings. Detailed implementation manners

[0018] To make the purpose, technical solutions and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the drawings.

[0019] When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are only examples of the devices and methods that are consistent with some aspects of the present application as detailed in the appended claims.

[0020] In the description of the present application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances. In addition, in the description of the present application, unless otherwise specified, "a plurality of" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this specification are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0022] There are various types of electronic devices. Based on requirements such as signal control, it is usually necessary to electrically connect some different functional module electronic components to a circuit board through wire cores. In some scenarios, multiple wire cores need to be soldered to the corresponding pads on the circuit board. To achieve the operability of multi-core wire welding, the FPCs need to be arranged in a row, thus occupying a relatively large space, resulting in the product requiring a relatively large size to enclose the FPC and making it impossible to achieve internal assembly in small-sized precision electronic products.

[0023] To solve the above problems, please refer to Figures 1 to 2 , a first aspect of the present application provides a circuit board 10. Among them, the circuit board 10 can be a radio frequency (RF) board or an application processor (AP) board. The RF board can be used, but not limited to, for carrying radio frequency integrated circuits (RFICs), radio frequency power amplifiers (RFPA), and wireless fidelity (WIFI) chips, etc. The application processor board can be used, but not limited to, for carrying system on chip (SOC) components, double data rate (DDR) memories, main power management units (PMUs), and auxiliary power management chips, etc.

[0024] The circuit board 10 can also be a single-sided board or a double-sided board. A single-sided board means that components are arranged on one side of the board surface, and a double-sided board means that components are arranged on both sides of the board surface. Among them, the components arranged on the circuit board 10 include components such as chips, resistors, and capacitors.

[0025] In the embodiment of the present application, the circuit board 10 includes a bottom plate 11, a plurality of reinforcing plates 12, and a plurality of pad groups 13. The bottom plate 11 has a first side and a second side opposite to each other. In this embodiment, there is no specific limitation on the specific side. One side of the bottom plate 11 can be the first side or the second side. When one side of the bottom plate 11 is the first side, the side opposite to the first side is the second side.

[0026] To achieve the operability of multi-core wire welding, the bottom plate 11 includes a plurality of welding areas and a bending area 11a connecting adjacent two of the welding areas. The plurality of reinforcing plates 12 are arranged at intervals on the first side of the bottom plate 11 and are located in the welding areas. The plurality of pad groups 13 are arranged at intervals on the second side of the bottom plate 11 and are located in the welding areas.

[0027] The reinforcing plate 12 is made of an insulating material, which can be an epoxy board (FR4), a polyimide board (PI), etc. The reinforcing plate 12 is fixedly connected to the bottom plate 11, and the reinforcing plate 12 can be integrally formed with the bottom plate 11 by hot pressing during the manufacturing process.

[0028] The pad group 13 includes a plurality of pads arranged at intervals. The plurality of pads form a plurality of welding points for connecting and fixing core wires or other electronic components. The number of pads in different pad groups 13 in the present application can be the same or different. For example, the number of pads in one pad group 13 can be 4, and the number of pads in another pad group 13 can be 4 or 5, etc. The pad group 13 is on the second side of the bottom plate 11, and the reinforcing plate 12 is on the first side of the bottom plate 11. That is, the reinforcing plate 12 can improve the strength of the area where the pad group 13 is located, that is, the strength of the welding area, so as to facilitate insertion and further facilitate the assembly of the entire circuit board 10.

[0029] The bottom plate 11 is folded in half along the bending area 11a so that the plurality of pad groups 13 are arranged in a folded shape. In this way, the circuit board 10 is bent from a linearly arranged shape into a folded shape. It should be understood that the height of the folded circuit board 10 is set according to the number of bending areas 11a. And when the number of bending areas 11a is more, the height of the folded circuit board 10 is also higher. Therefore, the specific number of bending areas 11a should be set according to the actual application situation.

[0030] It can be understood that when multiple pad groups 13 are arranged in a folded state, the pads in adjacent two welding groups 13 do not contact each other, which can avoid short circuits. That is to say, the distance between adjacent two welding areas, namely the width of the bending area 11a, should satisfy that when multiple welding groups 13 are arranged in a stacked state, the pads in adjacent two welding groups 13 do not contact each other. It can be understood that the larger the width of the bending area 11a is, the less likely the pads in adjacent two welding components are to contact each other.

[0031] In this embodiment, the circuit board 10 is a flexible printed circuit (FPC, also known as a flexible circuit board or a flexible printed circuit board), that is, the base plate 11 is made of polyimide (PI) or polyester film (PET) as the substrate, and has the characteristics of high reliability, excellent flexibility, high wiring density, light weight, thin thickness and good bendability.

[0032] In some embodiments, when multiple pad groups 13 are arranged in a folded state, the reinforcing plate 12 and the pad group 13 are in a parallel state, such as Figures 3 - 4 , the entire base plate 11 has multiple bending methods, Figure 3 and Figure 4 respectively correspond to two bending methods of the base plate 11. After bending, each reinforcing plate 12 and each pad group 13 are in a parallel state, and are spaced apart and parallel in the same direction. In this way, the space occupied by the entire circuit board 10 is the smallest, and it is more suitable for internal assembly in miniaturized precision electronic products.

[0033] Specifically, the welding area includes a first welding area 11b, a second welding area 11c and a third welding area 11d. When the base plate 11 is not folded along the bending area 11a, the first welding area 11b and the third welding area 11d are respectively located on both sides of the second welding area 11c. The first welding area 11b and the third welding area 11d are respectively opposite to and spaced from the second welding area 11c. The first welding area 11b, the second welding area 11c and the third welding area 11d are arranged in a straight line on the base plate 11, which is convenient for welding multi-core wires.

[0034] The base plate 11 is folded along the bending area 11a. The first welding area 11b and the third welding area 11d are respectively opposite to and spaced from the second welding area 11c. Different folding methods make the relative positions of the first welding area 11b, the second welding area 11c and the third welding area 11d different.

[0035] In this embodiment, there are at least two folding methods for this folding:

[0036] See Figure 3, for the first folding method, the first welding area 11b and the third welding area 11d are located on the same side of the second welding area 11c, that is, the first welding area 11b and the third welding area 11d are folded towards the second side of the bottom plate 11. In this way, the first welding area 11b, the third welding area 11d, and the second welding area 11c are sequentially arranged in a folded manner.

[0037] See Figure 4 , for the second folding method, the first welding area 11b and the third welding area 11d are respectively located on both sides of the second welding area 11c, that is, the first welding area 11b is folded towards the second side of the bottom plate 11, and the third welding area 11d is folded towards the first side of the bottom plate 11. In this way, the first welding area 11b, the second welding area 11c, and the third welding area 11d are sequentially arranged in a folded manner.

[0038] It should be understood that in some embodiments, in the first folding method, after the first welding area 11b and the third welding area 11d are folded towards the second side of the bottom plate 11, it can also be that the third welding area 11d, the first welding area 11b, and the second welding area 11c are sequentially arranged in a folded manner.

[0039] It can also be that the first welding area 11b is folded towards the first side of the bottom plate 11, and the third welding area 11d is folded towards the second side of the bottom plate 11.

[0040] In this way, users can select different folding methods according to actual assembly requirements.

[0041] In some embodiments, please refer to Figure 2 , multiple pad groups 13 are arranged along the edge of the bottom plate 11. The pad groups 13 arranged along the edge can effectively utilize the space of the circuit board 10, especially in the edge area of the circuit board 10, avoiding the problem of wiring congestion that may be caused by arranging pads in the central area. This can make the wiring more concise and orderly, and improve the overall aesthetics of the circuit board 10.

[0042] In addition, setting the pad groups 13 at the edge of the circuit board 10 makes it more convenient to connect with other components or connectors. During the assembly process, rapid and stable connection can be achieved with other parts through the pad groups 13 at the edge, improving production efficiency.

[0043] Furthermore, the distances between multiple pad groups 13 and the edge of the bottom plate 11 are equal. When the pad groups 13 are arranged at equal distances along the edge of the bottom plate 11, this helps to achieve the standardized and modular design of the circuit board 10, ensuring that the force distribution on each pad on the circuit board 10 is more uniform, reducing the risk of damage or detachment of the pad groups 13 caused by uneven force, and contributing to improving the reliability and durability of the circuit board 10.

[0044] In addition, the equidistant layout of the pad groups 13 makes the wiring more uniform, helps reduce crossovers and overlaps during wiring, and reduces the risk of signal interference.

[0045] Please refer to Figures 1 - 2 , the bottom plate 11 in the above includes a first bottom plate 111 and a second bottom plate 112 that are interconnected. In this embodiment, the first bottom plate 111 and the second bottom plate 112 are of an integral structure. The first bottom plate 111 includes two relatively arranged edges. Generally speaking, they are two longer edges of the first bottom plate 111. Specifically, the two relatively arranged edges are Figure 1 and Figure 2 respectively the upper edge and the lower edge of the first bottom plate 111 in

[0046] Among them, multiple pad groups 13 are arranged along the upper edge of the first bottom plate 111, and the second bottom plate 112 is connected to the lower edge of the first bottom plate 111 and extends along the width direction of the first bottom plate 111.

[0047] After bending, the dimension of the first bottom plate 111 in the length direction is slightly larger than the dimension of the reinforcing plate 12 in the length direction. Compared with the space occupied by the one - word expansion of the circuit board 10 required for the operability of multi - core wire welding in the related art, the overall dimension of the circuit board 10 in the length direction is finally reduced by about two - thirds, showing a significant reduction, which greatly reduces the space occupied by the circuit board 10 and is convenient for assembly inside miniaturized precision electronic products.

[0048] Furthermore, the projection of the second bottom plate 112 on the first bottom plate 111 is located between two adjacent bending areas 11a in the middle. The bending areas 11a are located on the first bottom plate 111. When the first bottom plate 111 is bent, it can avoid driving the second bottom plate 112 to bend. In this embodiment, along the width direction of the first bottom plate 111, the length of the second bottom plate 112 is greater than the length of the first bottom plate 111. Therefore, if the projection of the second bottom plate 112 on the first bottom plate 111 partially overlaps or completely overlaps with two adjacent bending areas 11a, when the first bottom plate 111 is bent, it will drive the second bottom plate 112 to bend together. The bending area of the second bottom plate 112 is large and the operation is difficult. On the other hand, the included angle between the bending part of the second bottom plate 112 and the wire core on the second bottom plate 112 is small, which is likely to cause the wire core on the second bottom plate 112 to break.

[0049] In this embodiment, due to the presence of the second bottom plate 112, in order to ensure that the circuit board 10 is uniformly stressed as a whole after being bent, that is, along the width direction of the first bottom plate 111, the second bottom plate 112 partially overlaps with the reinforcing plate 12 in the middle of the first bottom plate 111, so the number of reinforcing plates 12 is generally an odd number, when the bending area 11a is deformed under the action of external force, it can ensure that the entire circuit board 10 is uniformly stressed, avoiding stress concentration and causing the wire core on the circuit board 10 to break.

[0050] When the number of reinforcing plates 12 is an odd number, such as 3, 5, and 7, the corresponding number of bending areas 11a is 2, 4, and 6. Therefore, when the projection of the second bottom plate 112 on the first bottom plate 111 is located between two adjacent bending areas 11a, the overall force uniformity can be effectively ensured.

[0051] See also Figure 4 , along the thickness direction of the second bottom plate 112, the number of welding areas on both sides of the second bottom plate 112 is the same. Specifically, when there are three reinforcing plates 12, the bending area 11a is located on both sides of the middle reinforcing plate 12. When bending, the welding areas on both sides bend toward the middle. When the side where the reinforcing plate 12 is located is the first side and the side where the pad group 13 is located is the second side, Figure 4 In the embodiment, the welding area on one side is bent toward the first side, and the welding area on the other side is bent toward the second side.

[0052] In some embodiments, along the thickness direction of the second bottom plate 112, a plurality of welding groups are arranged in a folded shape on one side of the second bottom plate 112. Figure 3 , the welding areas on both sides are bent toward the second side. It can be understood that the welding areas on both sides can also be bent toward the first side.

[0053] The number of welding areas and the folding method can be determined according to the actual assembly and usage conditions. No further explanation or limitation will be given here.

[0054] This embodiment also provides an electronic device, including the circuit board 10 as described above. The specific structure of the circuit board 10 refers to the above embodiment. Since this electronic device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0055] Among them, the electronic equipment of this application includes but is not limited to voice equipment (such as headphones), sweepers, security equipment, automotive electronic equipment, etc.

[0056] Furthermore, in this embodiment, the electronic device is a headset 100, which includes but is not limited to over-ear headsets, on-ear headsets, in-ear headsets, neck-hanging headsets, and head-mounted headsets.

[0057] See also​Figure 5 , the earphone 100 includes a housing 20, a speaker unit (not shown in the figure), and a circuit board 10.

[0058] The housing 20 defines a first mounting cavity 20a and a second mounting cavity 20b. The speaker unit is located in the second mounting cavity 20b and divides the second mounting cavity 20b into a front cavity and a rear cavity. The circuit board 10 is located in the first mounting cavity 20a and is electrically connected to the speaker unit.

[0059] The housing 20 provides protection for various components inside the earphone 100. The second mounting cavity 20b is used to mount the speaker unit, providing a stable working environment for it, which helps to reduce the interference of external noise and ensure the purity of audio output. The first mounting cavity 20a is used to accommodate electronic components such as the circuit board 10, realizing the separation of electrical components from the speaker unit, making the internal structure of the earphone 100 neater and more orderly, and also helping to reduce the potential impact of electrical components on audio quality.

[0060] The circuit board 10 is located in the first mounting cavity 20a and is the control center of the earphone 100. It is responsible for receiving and processing audio signals from external devices (such as mobile phones, computers, etc.), and through the electrical connection with the speaker unit, transmits the processed audio signals to the speaker unit to drive it to emit sound.

[0061] The entire circuit board 10 can also be installed in the first mounting cavity 20a by gluing, or slots can be opened in the housing 20, and the circuit board 10 can be clamped through the slots, which can achieve a high fixing strength and effectively prevent the vibration and loosening of the circuit board 10.

[0062] In the attached drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of this application, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the attached drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the attached drawings are only for illustrative purposes and cannot be understood as a limitation to this application. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0063] The above is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of this application should be included in the protection scope of this application.

Claims

1. A circuit board, characterized in that: include: A bottom plate, the bottom plate comprising a plurality of welding areas and a bending area connecting two adjacent welding areas, the bottom plate having a first side and a second side opposite to each other; as well as A plurality of reinforcing plates are arranged at intervals on the first side of the bottom plate and located in the welding area; A plurality of pad groups are arranged at intervals on the second side of the base plate and located in the welding area; Wherein, the bottom plate is folded at the bending area so that the plurality of pad groups are arranged in a folded shape.

2. The circuit board according to claim 1, characterized in that The welding area includes a first welding area, a second welding area and a third welding area. The first welding area and the third welding area are respectively located on both sides of the second welding area. The first welding area and the third welding area are respectively opposite to the second welding area and are spaced apart.

3. The circuit board according to claim 2, characterized in that: The bottom plate is folded at the bending area so that the first welding area and the third welding area are located on the same side of the second welding area.

4. The circuit board according to claim 2, characterized in that: The bottom plate is folded at the bending area so that the first welding area and the third welding area are respectively located on both sides of the second welding area.

5. The circuit board according to claim 1, wherein: A plurality of pad groups are arranged along the edge of the base plate.

6. The circuit board according to claim 1, wherein: The base plate includes a first base plate and a second base plate connected to each other, the first base plate includes two oppositely arranged edges, wherein a plurality of pad groups are arranged along one of the edges, and the second base plate is connected to the other edge and extends along the width direction of the first base plate.

7. The circuit board according to claim 6, characterized in that: The number of the bending areas is two, and the projection of the second bottom plate on the first bottom plate is located between the two bending areas.

8. The circuit board according to claim 7, characterized in that: Along the thickness direction of the second bottom plate, the numbers of the welding areas on both sides of the second bottom plate are the same; or Along the thickness direction of the second bottom plate, a plurality of the welding areas are arranged in a folded shape on one side of the second bottom plate.

9. An electronic device, characterized in that: Comprising a circuit board as claimed in any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that: The electronic device is a headset, and the headset comprises: The housing comprises a first mounting cavity and a second mounting cavity; A speaker unit is located in the second installation cavity; The circuit board is located in the first installation cavity and is electrically connected to the speaker unit.

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