Assembly and device suitable for salient point type Clip positioning and viscosity improvement

Abstract

The utility model relates to the technical field of chip assembly, in particular to an assembly and device suitable for salient point type Clip positioning and improving viscosity, a convex grabbing part and a pressing part are formed on a body of the assembly, the shape of the grabbing part is matched with the flat part of the convex part of a salient point type Clip, and the pressing part is matched with the flat part of the convex part of the salient point type Clip. The grabbing part is provided with a vacuum adsorption hole to grab the bump type Clip, the pressing part presses the edge, away from the flat part, of the bump type Clip, and after pressing, an isolation space allowing solder paste to overflow when the bump type Clip is pressed downwards is reserved between the pressing part and a through hole in the center of the bump type Clip. The technical problems of inaccurate positioning and insufficient viscosity of a salient point type Clip product after a manufacturing process in the prior art are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip assembly, and specifically relates to a component and a device suitable for bump-type Clip positioning and improving viscosity. Background Art

[0002] The Clip soldering process is to connect the chip and the pin by means of a copper sheet. Due to its large contact area, the lowest impedance and the best heat conduction performance can be obtained, and it can be used in different fields such as vehicle-mounted products and power supplies. This process does not require silver plating on the frame pins, which can fully save costs. Therefore, the current power devices have widely promoted the production of the Clip soldering process.

[0003] In the structural design of the Clip, the bump-type Clip structure can significantly observe the welding condition of the Clip without affecting the overall impedance performance. Therefore, it has been widely used. However, the bump-type Clip has problems of inaccurate positioning and insufficient viscosity due to process reasons during the manufacturing process. Summary of the Utility Model

[0004] In order to solve the technical problems that the bump-type Clip in the prior art has inaccurate positioning and insufficient viscosity in the manufactured products, the present application proposes a component and a device suitable for bump-type Clip positioning and improving viscosity, and solves the above technical problems.

[0005] The technical solution adopted by the utility model to solve its technical problems is as follows:

[0006] The utility model provides a component suitable for bump-type Clip positioning and improving viscosity. A raised grasping part and a pressing part are formed on the body of the component. The shape of the grasping part is adapted to the flat part of the raised part of the bump-type Clip, and vacuum adsorption holes are arranged on the grasping part to grasp the bump-type Clip. The pressing part presses on the edge of the bump-type Clip far from the flat part, and an isolation space for the solder paste to overflow when pressing down the bump-type Clip is left between the pressing part and the through hole in the center of the bump-type Clip after pressing.

[0007] Further, the pressing part is formed with a bent foot area to press on the edges of two adjacent sides of the bump-type Clip.

[0008] Further, a bent area is formed on the edge of the pressing part to press other Clips.

[0009] Further, there are two vacuum adsorption holes on the grasping part.

[0010] Another aspect of the present utility model also provides a device suitable for bump - type Clip positioning and improving viscosity, including a connecting and assembling bottom plate, and a plurality of the above - mentioned components suitable for bump - type Clip positioning and improving viscosity are arranged on the assembling bottom plate.

[0011] Further, there are eight components suitable for bump - type Clip positioning and improving viscosity, which are arranged in an array on the assembling bottom plate.

[0012] Based on the above technical solutions, the technical effects that the present utility model can achieve are as follows:

[0013] In the component of the present utility model suitable for bump - type Clip positioning and improving viscosity, a raised grasping part and a pressing part are formed on the body of the component. The vacuum adsorption holes on the grasping part are used to grasp the bump - type Clip. After grasping, the bump - type Clip is pressed on the chip already assembled on the frame. Since the flat part of the raised part of the bump - type Clip is pressed, the edge far from the flat part will warp upwards, resulting in insufficient contact area between the whole Clip and the chip, causing electrical abnormalities. The pressing part of the component in this application presses on the edge of the bump - type Clip far from the flat part, which can prevent the warping of the edge of the bump - type Clip far from the flat part, making the positioning more accurate. At the same time, during the process of pressing the bump - type Clip on the chip by the grasping part and the pressing part, the solder paste is also more sufficiently infiltrated with the Clip contacts, having sufficient viscosity, thus solving the technical problems of inaccurate positioning and insufficient viscosity existing in the products with bump - type Clips in the prior art. Description of the Drawings

[0014] Figure 1 It is a schematic diagram of the component of the present utility model suitable for bump - type Clip positioning and improving viscosity;

[0015] Figure 2 It is a schematic diagram of the bump - type Clip;

[0016] Figure 3 It is a schematic diagram of the bump - type Clip assembled on the frame;

[0017] Figure 4 It is a partial schematic diagram when the bump - type Clip is pressed by the component of the present utility model suitable for bump - type Clip positioning and improving viscosity;

[0018] Figure 5 It is a schematic diagram of the device of the present utility model for bump - type Clip positioning and improving viscosity.

[0019] Wherein: 100 - bump - type Clip, 101 - flat part, 102 - through - hole, 103 - Clip contact; 200 - frame; 300 - chip; 400 - solder paste.

[0020] 1-grabbing part, 11-vacuum adsorption hole; 2-pressing part, 21-bending foot area, 22-bending area; 3-assembly base plate. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0022] like Figures 1-4 As shown, the utility model provides a component suitable for positioning a bump type Clip and improving viscosity, a raised grabbing portion 1 and a pressing portion 2 are formed on the body of the component, the grabbing portion 1 is adapted in shape to the flat portion 101 of the raised portion of the bump type Clip 100, and the grabbing portion 1 is provided with a vacuum adsorption hole 11 for grabbing the bump type Clip 100, the pressing portion 2 is pressed on the edge of the bump type Clip 100 away from the flat portion 101, and after pressing, an isolation space is left between the pressing portion 2 and the through hole 102 in the center of the bump type Clip 100 for the solder paste 400 to overflow when the bump type Clip 100 is pressed down.

[0023] The utility model is suitable for positioning and improving the viscosity of a bump-type Clip. A raised grabbing portion 1 and a pressing portion 2 are formed on the body of the component. The vacuum adsorption hole 11 on the grabbing portion 1 is used to grab the bump-type Cl ip 100. After grabbing, the bump-type Cl ip 100 is pressed on the chip 300 that has been assembled on the frame 200. Since the flat portion 101 of the raised portion of the bump-type Cl ip 100 is pressed, the edge away from the flat portion 101 will be warped, resulting in insufficient contact area between the Clip as a whole and the chip 300, causing electrical abnormality. The pressing portion 2 of the component of the present application is pressed on the bump-type Cl ip The edge of ip100 away from the flat portion 101 can prevent the edge of the bump type Clip 100 away from the flat portion 101 from warping up, making the positioning more accurate. At the same time, when the grasping part 1 and the pressing part 2 press the bump type Clip 100 on the chip 300, the wetting between the solder paste 400 and the Clip contact 103 is more sufficient and has sufficient viscosity, thereby solving the technical problems of inaccurate positioning and insufficient viscosity of the bump type Cl ip100 in the prior art after the process.

[0024] In order to make the convex - point Clip100 fit better with the chip 300 during pressing, the pressing part 2 is formed with a bent - leg area 21 to press on the edges of two adjacent sides of the convex - point Clip100.

[0025] In order to facilitate the entire assembly process, the edge of the pressing part 2 is formed with a bending area 22 to press other Clips.

[0026] In a specific embodiment of the present invention, the vacuum - adsorption holes 11 of the grasping part 1 are two.

[0027] As Figure 5 shown, on the other hand, the present invention also provides a device for positioning the convex - point Clip and improving the viscosity, including a connecting assembly bottom plate 3, and a plurality of the above - mentioned components for positioning the convex - point Clip and improving the viscosity are arranged on the assembly bottom plate 3.

[0028] In a preferred embodiment of the present invention, there are a total of eight components for positioning the convex - point Clip and improving the viscosity, which are arranged in an array on the assembly bottom plate 3 to facilitate docking with the entire production line.

[0029] It should be understood that the above - described specific embodiments are only used to explain the present invention and are not used to limit the present invention. Obvious changes or variations derived from the spirit of the present invention are still within the protection scope of the present invention.

Claims

1. A component suitable for positioning a convex point Clip and improving viscosity, characterized in that: A raised grabbing portion (1) and a pressing portion (2) are formed on the body of the component. The shape of the grabbing portion (1) is adapted to the flat portion (101) of the raised part of the bump type Clip (100), and the grabbing portion (1) is provided with a vacuum adsorption hole (11) for grabbing the bump type Clip (100). The pressing portion (2) presses on the edge of the bump type Clip (100) away from the flat portion (101), and after pressing, an isolation space is left between the pressing portion (2) and the through hole (102) in the center of the bump type Clip (100) for the solder paste (400) to overflow when the bump type Clip (100) is pressed down.

2. The component suitable for positioning and improving viscosity of a convex point clip according to claim 1, characterized in that: The pressing portion (2) is formed with a bent foot area (21) for pressing on the edges of two adjacent sides of the convex point type Clip (100).

3. The component suitable for convex point type Clip positioning and improving viscosity according to claim 1 or 2, characterized in that: The edge of the pressing portion (2) is formed with a bending area (22) for pressing other Clips.

4. The component suitable for positioning and improving viscosity of a convex point clip according to claim 1, characterized in that: The gripping portion (1) has two vacuum adsorption holes (11).

5. A device suitable for positioning and improving viscosity of convex point clips, characterized in that: It comprises a connecting assembly base plate (3), on which a plurality of components suitable for positioning the convex point Clip and improving the viscosity as described in any one of claims 1 to 4 are arranged.

6. The device for positioning and improving viscosity of a convex point Clip according to claim 5, characterized in that: There are eight components suitable for positioning the convex point clip and improving the viscosity, which are distributed in an array on the assembly base plate (3).

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