Semiconductor packaging needle cylinder solder paste sub-packaging equipment

Abstract

The utility model belongs to the technical field of solder paste sub-packaging, and discloses a semiconductor packaging needle cylinder solder paste sub-packaging device. Comprising trundles (1), a trundle plate (2), a main rack (3), an adjusting fixing plate (4), a supporting plate (5), an adjusting seat (6), an adjusting frame (7), a three-way pipe (8), an elbow (9), a main vertical plate (10), a lower quick coupler (11), a silica gel gate valve (12), a middle quick coupler (13), an upper quick coupler (14), a filling head (15), a solder paste needle cylinder (16), an air cylinder fixing plate (17), an air cylinder (18), a pressing head (19) and a connecting pipe (20). According to the tin paste packaging device, the tin paste packaging quality can be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of solder paste dispensing, and particularly relates to a semiconductor packaging syringe solder paste dispensing device. Background Art

[0002] In the prior art, the Chinese patent document application number 202222101590.X discloses a syringe solder paste automatic dispensing device, which cannot be docked with a solder paste stirring pot, has inflexible operation and inconvenient operation; a solder paste syringe filling machine disclosed in the Chinese patent document application number 201721107574.4 has low efficiency, and solder flakes will be formed during the dispensing process. The Chinese patent document 201920901712.9 discloses a syringe solder paste filling machine, which has low efficiency, inconvenient operation, and there is gas in the syringe after dispensing.

[0003] In summary, the solder paste filling machines in the prior art are generally inconvenient to operate, single solder flakes will be formed during the dispensing process, the dispensing amount control is inaccurate, and there is gas in the syringe after dispensing, thus affecting the quality of solder paste dispensing. Summary of the Utility Model

[0004] The purpose of the embodiment of the utility model is to provide a semiconductor packaging syringe solder paste dispensing device, which can improve the quality of solder paste dispensing.

[0005] The embodiment of the utility model is implemented as follows:

[0006] A semiconductor packaging syringe solder paste dispensing device includes:

[0007] Caster wheels, caster wheel plates, main frames, adjusting fixing plates, support plates, adjusting seats, adjusting frames, three-way pipes, elbows, main vertical plates, lower quick-connect joints, silicone gate valves, middle quick-connect joints, upper quick-connect joints, filling heads, solder paste syringes, cylinder fixing plates, cylinders, pressing heads and connecting pipes;

[0008] The caster wheels are installed at the bottom of the main frame through the caster wheel plates; the main vertical plate is fixedly connected with the support plate and the adjusting fixing plate and is fixed on the main frame. The upper end of the main vertical plate is provided with a cylinder fixing plate, the cylinder is fixedly installed on the cylinder fixing plate, and the pressing head is connected with the push rod of the cylinder;

[0009] The adjusting seat is installed on the main frame, the adjusting frame is installed on the adjusting seat, the first end of the three-way pipe is communicated with one end of the elbow pipe, the three-way pipe is erected on the adjusting frame, the other end of the elbow pipe is connected with the lower end of the solder paste syringe device, the second end of the three-way pipe is connected with the lower end of the solder paste syringe device, the third end of the three-way pipe is connected with one end of the connecting pipe, and the other end of the connecting pipe is connected with an external stirring pot for placing solder paste; the pressing head is located directly above the solder paste syringe;

[0010] Among them, the solder paste syringe device includes: a lower quick-connect fitting, a silicone gate valve, a middle quick-connect fitting, an upper quick-connect fitting, a filling head, and a solder paste syringe. The lower quick-connect fitting is the lower end of the solder paste syringe device, and the lower quick-connect fitting is sequentially connected to the silicone gate valve, the middle quick-connect fitting, the upper quick-connect fitting, the filling head, and the solder paste syringe from bottom to top;

[0011] Among them, there are four solder paste syringe devices, and the capacities of the four solder paste syringes are different from each other.

[0012] Among them, there are four solder paste syringe devices, and the capacities of the four solder paste syringes are the same in pairs.

[0013] Among them, the number of adjusting seats and adjusting frames is the same, there are multiple, and they are arranged at intervals between the tee pipe and the main frame.

[0014] Among them, there are four casters, which are distributed at the bottom of the main frame.

[0015] In the embodiment of the present utility model, the syringe solder paste dispensing equipment makes the operation convenient, the dispensing amount control accurate, the dispensing efficiency high, there is no gas in the syringe after dispensing, and no solder flakes are formed during the dispensing process, thus improving the quality of solder paste dispensing. Description of the Drawings

[0016] Figure 1 is the structural schematic diagram of the semiconductor packaging syringe solder paste dispensing equipment of the present utility model;

[0017] Figure 2 is Figure 1 the sectional view taken along A-A in

[0018] Reference Signs:

[0019] 1, caster; 2, caster plate; 3, main frame; 4, adjusting fixed plate; 5, support plate; 6, adjusting seat; 7, adjusting frame; 8, tee pipe; 9, elbow; 10, main vertical plate; 11, lower quick-connect fitting; 12, silicone gate valve; 13, middle quick-connect fitting; 14, upper quick-connect fitting; 15, filling head; 16, solder paste syringe; 17, cylinder fixed plate; 18, cylinder; 19, pressing head; 20, connecting pipe. Detailed Embodiment

[0020] In order to make the purpose, technical solution and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0021] The following describes the specific implementation of the present utility model in detail with reference to specific embodiments:

[0022] Such as Figure 1 andFigure 2 As shown in the figure, a semiconductor packaging syringe solder paste dispensing device includes:

[0023] casters 1, caster plate 2, main frame 3, adjusting fixed plate 4, support plate 5, adjusting seat 6, adjusting frame 7, tee 8, elbow 9, main vertical plate 10, lower quick-connect fitting 11, silicone gate valve 12, middle quick-connect fitting 13, upper quick-connect fitting 14, filling head 15, solder paste syringe 16, cylinder fixing plate 17, cylinder 18, pressing head 19 and connecting pipe 20;

[0024] The casters are installed at the bottom of the main frame through the caster plate; the main vertical plate is fixedly connected to the support plate and the adjusting fixed plate and is fixed on the main frame. The upper end of the main vertical plate is provided with a cylinder fixing plate, the cylinder is fixedly installed on the cylinder fixing plate, and the pressing head is connected to the push rod of the cylinder;

[0025] The adjusting seat is installed on the main frame, the adjusting frame is installed on the adjusting seat, the first end of the tee is communicated with one end of the elbow, the tee is erected on the adjusting frame, the other end of the elbow is connected to the lower end of the solder paste syringe device, the second end of the tee is connected to the lower end of the solder paste syringe device, the third end of the tee is connected to one end of the connecting pipe, and the other end of the connecting pipe is connected to an external stirring pot for placing solder paste; the pressing head is located directly above the solder paste syringe;

[0026] Among them, the solder paste syringe device includes: a lower quick-connect fitting, a silicone gate valve, a middle quick-connect fitting, an upper quick-connect fitting, a filling head and a solder paste syringe. The lower quick-connect fitting is used as the lower end of the solder paste syringe device, and the lower quick-connect fitting is sequentially connected with the silicone gate valve, the middle quick-connect fitting, the upper quick-connect fitting, the filling head and the solder paste syringe from bottom to top;

[0027] In the figure, there are four solder paste syringe devices, and the capacities of the four solder paste syringes are the same in pairs. The capacity of the solder paste syringe can be determined according to production needs, and the capacities of the four solder paste syringes can be different from each other.

[0028] Among them, the number of adjusting seats and adjusting frames is the same, there are multiple, and they are arranged at intervals between the tee and the main frame. In the figure, the number of adjusting seats and adjusting frames is six.

[0029] In the figure, there are four casters, which are distributed at the bottom of the main frame.

[0030] During encapsulation, the solder paste syringe is installed. The solder paste enters the tee through the connecting pipe and then enters the solder paste syringe device to fill the solder paste syringe. The solder paste enters the tee and the elbow through the connecting pipe and then enters the solder paste syringe device to fill the solder paste syringe. The precise control of the filling volume in the solder paste syringe is achieved through the pressure head 19 and the silicone gate valve 12. When the filling volume exceeds the limit, the pressure head 19 is pressed down by the cylinder to extrude the excess solder paste, so that the amount of solder paste in the solder paste syringe is controlled. When the filling is completed, the solder paste syringe is removed and finally encapsulated, thus completing the entire sub-packaging process.

[0031] In the present utility model, the device is connected to the stirring pot for placing solder paste through the connecting pipe 20. The solder paste is extruded to the material valve port by compressed air. The 30CC and 55CC syringes are installed on this device through the filling head 15. The silicone gate valve 12 is automatically opened, and the solder paste is pressed into the syringe. When the solder paste reaches the set height, the dosing valve is closed, realizing precise automatic quantitative control.

[0032] In the embodiment of the present utility model, it has casters 1 and a connecting pipe 20, which are easy to move, dock and operate the machine. It has a pressure head 19 and a silicone gate valve 12, and the sub-packaging quantity can be accurately controlled within 0.2 g (for example, controlled by a position sensor). Multiple syringes can be sub-packaged on the device, resulting in high sub-packaging efficiency. After sub-packaging with this device, no gas is introduced, and there is no gas in the solder paste filled in the syringe, that is: a plug (pressure head) is pre-placed in the syringe and pushed to the bottom to evacuate the gas in the vacuum. The solder paste that has been evacuated of air is pressed into the syringe from the bottom, so there is no gas. The device uses a tee 8, an elbow 9 and a silicone gate valve 12, and no solder flakes are generated during the sub-packaging process. The silicone gate valve 12 is made of silicone material, avoiding the formation of solder flakes due to the extrusion between metals.

[0033] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A semiconductor packaging syringe solder paste dispensing equipment, characterized in that: include: Casters, caster plates, main frame, adjustment fixing plate, support plate, adjustment seat, adjustment frame, tee pipe, elbow, main vertical plate, lower quick-release joint, silicone gate valve, middle quick-release joint, upper quick-release joint, filling head, solder paste syringe, cylinder fixing plate, cylinder, pressure head and connecting pipe; The caster is installed at the bottom of the main frame through the caster plate; the main vertical plate is fixedly connected with the support plate and the adjustment fixing plate, and fixed on the main frame, a cylinder fixing plate is installed on the upper end of the main vertical plate, the cylinder is fixedly installed on the cylinder fixing plate, and the pressure head is connected with the push rod of the cylinder; The adjustment seat is installed on the main frame, the adjustment frame is installed on the adjustment seat, the first end of the three-way pipe is connected with one end of the bent pipe, the three-way pipe is mounted on the adjustment frame, the other end of the bent pipe is connected with the lower end of the solder paste syringe device, the second end of the three-way pipe is connected with the lower end of the solder paste syringe device, the third end of the three-way pipe is connected with one end of the connecting pipe, and the other end of the connecting pipe is connected to the stirring pot for placing the solder paste outside; the pressure head is located directly above the solder paste syringe; Among them, the solder paste syringe device includes: a lower quick-release joint, a silicone gate valve, a middle quick-release joint, an upper quick-release joint, a filling head and a solder paste syringe. The lower quick-release joint serves as the lower end of the solder paste syringe device, and the lower quick-release joint is connected to the silicone gate valve, the middle quick-release joint, the upper quick-release joint, the filling head and the solder paste syringe from bottom to top.

2. The semiconductor packaging syringe solder paste dispensing equipment according to claim 1, characterized in that: The solder paste syringe device has four solder paste syringes, and the capacities of the four solder paste syringes are different.

3. The semiconductor packaging syringe solder paste dispensing equipment according to claim 1, characterized in that: The solder paste syringe device has four solder paste syringes, and the capacities of the four solder paste syringes are the same in pairs.

4. The semiconductor packaging syringe solder paste dispensing equipment according to claim 1, characterized in that: The number of the adjusting seats and the adjusting frames is the same, and the adjusting seats are provided in plurality and are arranged at intervals and distributed between the three-way pipe and the main frame.

5. The semiconductor packaging syringe solder paste dispensing equipment according to claim 1, characterized in that: There are four casters distributed at the bottom of the main frame.

Images