TO packaging structure

Abstract

The utility model provides a TO packaging structure, which comprises a tube socket, a tube cap, a welding body and a pin, and is characterized in that the tube socket is provided with a tube socket upper surface, a tube socket lower surface and a vent hole penetrating through the tube socket upper surface and the tube socket lower surface; the tube cap is connected with the upper surface of the tube seat, and a cavity is formed between the tube seat and the tube cap; after the welding body vacuumizes the cavity through the vent hole, the vent hole is filled with the welding body; a cavity is formed in the tube base, the pin is arranged on the tube base in a penetrating mode, the upper end of the pin protrudes out of the upper surface of the tube base and is located in the cavity, the lower end of the pin protrudes out of the lower surface of the tube base, and the vent hole is formed in the tube base so that air can be guided to the outside through the cavity between the tube base and the tube cap through the vent hole; and therefore, a sealed vacuum environment is formed in the cavity.

Description

Technical Field

[0001] The utility model relates to the technical field of optoelectronic communication, in particular to a TO package structure. Background Art

[0002] TO package, abbreviated as "Transistor Outline package" and called "transistor outline package" in Chinese, is a common form of electronic component package and is widely used in transistors and other semiconductor devices. This package form is favored for its standardization, easy installation and heat dissipation characteristics. The advantages of TO package include standardized design, which enables transistors from different manufacturers to be used in the same package, improving the interchangeability and substitutability of components. In addition, its simple pin structure makes installation easy.

[0003] For example, a TO package structure disclosed in the patent with publication number CN113270788A includes a header and a cap adapted to the header. Among them, the header and the cap are subjected to sealed energy storage welding operation, that is, the capping machine performs the sealing operation in a nitrogen environment, and the cavities inside the header and the cap cannot form a vacuum environment. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a TO package structure for the deficiencies in the prior art. By opening a ventilation hole in the header, the cavity between the header and the cap is vented to the outside through the ventilation hole, so as to form a sealed vacuum environment in the cavity between the header and the cap.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A TO package structure includes:

[0007] A header having a header upper surface and a header lower surface, and a ventilation hole penetrating the header upper surface and the header lower surface;

[0008] A cap connected to the header upper surface of the header and forming a cavity between the header and the cap;

[0009] A welding body filled in the ventilation hole after evacuating the cavity through the ventilation hole;

[0010] Pins passing through the header, with the upper ends of the pins protruding above the header upper surface and located in the cavity, and the lower ends of the pins protruding below the header lower surface.

[0011] As a preferred embodiment, the ventilation hole includes:

[0012] A hole part, the hole part penetrating through the upper surface and the lower surface of the socket;

[0013] Two recesses, the two recesses being recessed and formed on the lower surface of the socket, and located on both sides of the hole part, the two recesses being respectively communicated with the hole part.

[0014] As a preferred embodiment, the diameter of the hole part is 0.5 - 1.5 mm.

[0015] As a preferred embodiment, the length of the recess is 1 mm, the width of the recess is 0.5 mm, and the depth of the recess is 0.1 mm.

[0016] As a preferred embodiment, the welding body has a pre - welding state. In the pre - welding state, the welding body is square, the side length of the welding body is 0.1 mm larger than the diameter of the hole part, and the thickness of the welding body is 0.1 mm larger than the depth of the recess.

[0017] The welding body has a post - welding state. In the post - welding state, the welding body fills the vent hole.

[0018] As a preferred embodiment, in the pre - welding state, the welding body is opposite to the hole part and placed on the lower surface of the socket, and the recess is exposed.

[0019] As a preferred embodiment, it further includes:

[0020] A chip, the chip being located in the cavity, the chip being connected to the upper surface of the socket, and the chip being connected to the upper end of the pin, and the chip and the vent hole being arranged in an avoidance manner.

[0021] As a preferred embodiment, a step is provided on the outer edge of the upper surface of the socket, and the tube cap is snap - fitted with the step.

[0022] As a preferred embodiment, the step includes:

[0023] A horizontal surface, the horizontal surface being located between the upper surface and the lower surface of the socket;

[0024] A vertical surface, the vertical surface being connected between the upper surface of the socket and the horizontal surface;

[0025] The side wall of the tube cap of the tube cap is sleeved on the vertical surface and abuts against the horizontal surface.

[0026] Compared with the prior art, the technical solution has the following advantages:

[0027] After the socket and the cap are connected, a cavity is formed between them. At this time, the inside of the cavity can be evacuated through the vent hole. After the evacuation operation is completed, the welded body is melted to fill the vent hole, so that the cavity reaches a vacuum environment.

[0028] The present invention will be further described below in conjunction with the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic structural view of the TO package structure of the present invention;

[0030] Figure 2 is a top view of the socket of the present invention;

[0031] Figure 3 is a bottom view of the socket of the present invention;

[0032] Figure 4 is a schematic structural view of the vent hole of the present invention;

[0033] Figure 5 is a schematic structural view of the welded body in the post-welding state of the present invention.

[0034] In the figure: 100 socket, 110 upper surface of the socket, 111 step, 111a horizontal surface, 111b vertical surface, 120 lower surface of the socket, 130 vent hole, 131 hole part, 132 concave part, 200 cap, 210 side wall of the cap, 300 welded body, 400 pin. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description can be applied to other embodiments, variations, improvements, equivalent solutions, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0036] As Figure 1 and Figure 2 shown, the TO package structure includes:

[0037] A socket 100 having an upper surface 110 of the socket and a lower surface 120 of the socket, and a vent hole 130 penetrating through the upper surface 110 of the socket and the lower surface 120 of the socket;

[0038] A cap 200 connected to the upper surface 110 of the socket of the socket 100 and forming a cavity between the socket 100 and the cap 200;

[0039] A welded body 300, which is filled in the vent hole 130 after evacuating the cavity through the vent hole 130;

[0040] A pin 400, which penetrates through the socket 100, and the upper end of the pin 400 protrudes from the upper surface 110 of the socket and is located inside the cavity, and the lower end of the pin 400 protrudes from the lower surface 120 of the socket.

[0041] After the socket 100 and the tube cap 200 are connected, a cavity is formed therebetween. At this time, the inside of the cavity can be evacuated through the vent hole 130. After the evacuation operation is completed, the welded body 300 is melted thermally to fill the vent hole 130, so that the cavity reaches a vacuum environment.

[0042] As Figures 2 to 4 shown, the vent hole 130 includes:

[0043] A hole portion 131 that penetrates through the upper surface 110 and the lower surface 120 of the socket;

[0044] The hole portion 131 may be circular, and the diameter of the hole portion 131 is 0.5 - 1.5 mm. Since the hole portion 131 penetrates through the upper surface 110 and the lower surface 120 of the socket, when the tube cap 200 is connected to the upper surface 110 of the socket and a cavity is formed between the socket 100 and the tube cap 200, the cavity communicates with the outside through the hole portion 131.

[0045] As Figure 4 and Figure 5 shown, the welded body 300 has a pre - welding state and a post - welding state. In the pre - welding state, the welded body 300 can cover the hole portion 131. The welded body 300 is square, preferably a regular square. When the diameter of the hole portion 131 is 1 mm, the side length of the square of the welded body 300 is 1.1 mm, that is, the side length of the square of the welded body 300 is 0.1 mm longer than the diameter of the hole portion 131. This ensures that in the post - welding state of the welded body 300, the welded body 300 is melted thermally and filled in the vent hole 130, that is, in the post - welding state, the shape of the welded body 300 is substantially the same as that of the vent hole 130.

[0046] Continuing to refer to Figure 4 , the vent hole 130 further includes:

[0047] Two recessed portions 132 that are recessed on the lower surface 120 of the socket and are located on both sides of the hole portion 131, and the two recessed portions 132 communicate with the hole portion 131 respectively.

[0048] In such a pre-welding state, when the welding body 300 faces the hole portion 131 and is placed on the lower surface 120 of the header, the recess 132 is exposed. The welding body 300 facing the hole portion 131 means that the centers of the two are aligned, and the welding body 300 completely blocks the hole portion 131. Since the recess 132 communicates with the hole portion 131, the cavity can be evacuated through the hole portion 131 and the exposed recess 132.

[0049] The recess 132 is rectangular, the length of the recess 132 is 1 mm, the width of the recess 132 is 0.5 mm, and the depth of the recess 132 is 0.1 mm. The two recesses 132 can be arranged at equal or unequal intervals along the center of the hole portion 131.

[0050] The thickness of the welding body 300 is 0.1 mm greater than the depth of the recess 132, so as to ensure that the welding body 300 has sufficient weight and volume to fill the hole portion 131 and the two recesses 132 in the post-welding state.

[0051] Reference Figure 2 , the TO package structure further includes:

[0052] A chip, the chip is located in the cavity, the chip is connected to the upper surface 110 of the header, and the chip is connected to the upper end of the lead 400. The chip and the vent hole 130 are arranged in an avoidance manner.

[0053] As Figure 1 and 2 shown, a step 111 is provided on the outer edge of the upper surface 110 of the header, and the tube cap 200 is snap-fitted with the step 111 to ensure the stability of their connection.

[0054] Specifically, the step 111 includes:

[0055] A horizontal surface 111a, the horizontal surface 111a is located between the upper surface 110 of the header and the lower surface 120 of the header;

[0056] A vertical surface 111b, the vertical surface 111b is connected between the upper surface 110 of the header and the horizontal surface 111a;

[0057] Both the horizontal surface 111a and the vertical surface 111b are annular. The side wall 210 of the tube cap of the tube cap 200 is sleeved on the vertical surface 111b and abuts against the horizontal surface 111a.

[0058] The assembly method of the TO package structure is as follows:

[0059] Make a hole in the socket 100 to form a vent hole 130 that penetrates the upper surface 110 and the lower surface 120 of the socket.

[0060] Mount and wire the chip on the upper surface 110 of the socket. Specifically, mount the chip on the upper surface 110 of the socket and use a gold wire to weld the chip to the upper end of the pin 400, with the chip being arranged to avoid the vent hole 130.

[0061] Use a capping machine to connect the tube cap 200 to the upper surface 110 of the socket 100 to obtain a combination of the socket 100 and the tube cap 200.

[0062] Move the combination into a vacuum welding machine. The vacuum welding machine includes a heating fixture and a door. Place the tube cap 200 of the combination downward on the heating fixture so that the lower surface 120 of the socket 100 faces upward. Then align the square welding body 300 with the hole portion 131 and place it on the lower surface 120 of the socket. At this time, press the upper fixture on the welding body 300, and at the same time, the concave portion 132 of the hole portion 131 needs to be exposed. Then close the door. The heating fixture can be a graphite fixture.

[0063] Use the vacuum welding machine to perform a vacuum pumping operation on its interior. Since the cavities of the socket 100 and the tube cap 200 are connected to the interior of the vacuum welding machine through the vent hole 130, the air inside the cavities can be pumped out along the vent hole 130, creating a vacuum environment inside the cavities.

[0064] Heat the heating fixture. When the melting temperature of the solder body 300 is reached, it will turn into a liquid, and under the action of gravity and capillary action, it will flow back into the vent hole 130. Here, current passes through the heating fixture to form electro-thermal conversion, and there is contact heat conduction between the combination and the fixture.

[0065] Finally, stop heating so that the solder body 300 solidifies and blocks the vent hole 130 to obtain a TO package structure with a vacuum cavity.

[0066] It should be noted that the time for heat conduction of the combination using the heating fixture needs to be controlled to prevent the solder body 300 from melting and entering the cavity. Further, the diameter of the vent hole 130 is small and the heating time is controlled, so the solder body 300 can be prevented from melting and entering the cavity.

[0067] The embodiments described above are only used to illustrate the technical idea and characteristics of the present utility model. The purpose is to enable those skilled in the art to understand the content of the present utility model and implement it accordingly. The scope of the patent adoption of the present utility model cannot be limited only by these embodiments. That is, any equivalent changes or modifications made according to the spirit disclosed by the present utility model still fall within the scope of the patent of the present utility model.

Claims

1. A TO package structure, characterized in that, Comprising: A header (100) having a header upper surface (110) and a header lower surface (120), and a vent hole (130) passing through the header upper surface (110) and the header lower surface (120); A cap (200) connected to the header upper surface (110) of the header (100) and forming a cavity between the header (100) and the cap (200); A welding body (300) filled in the vent hole (130) after evacuating the cavity through the vent hole (130); Leads (400) passing through the header (100), with the upper ends of the leads (400) protruding above the header upper surface (110) and located within the cavity, and the lower ends of the leads (400) protruding below the header lower surface (120).

2. The TO package structure according to claim 1, wherein, The vent hole (130) includes: A hole portion (131) passing through the header upper surface (110) and the header lower surface (120); Two recesses (132) recessed on the header lower surface (120) and located on both sides of the hole portion (131), and the two recesses (132) are respectively communicated with the hole portion (131).

3. The TO package structure according to claim 2, wherein The diameter of the hole portion (131) is 0.5 - 1.5 mm.

4. The TO package structure according to claim 2, wherein The length of the recess (132) is 1 mm, the width of the recess (132) is 0.5 mm, and the depth of the recess (132) is 0.1 mm.

5. The TO package structure according to claim 2, characterized in that, The welding body (300) has a pre - welding state. In the pre - welding state, the welding body (300) is square, the side length of the welding body (300) is 0.1 mm larger than the diameter of the hole portion, and the thickness of the welding body (300) is 0.1 mm larger than the depth of the recess (132); The welding body (300) has a post - welding state. In the post - welding state, the welding body (300) is filled in the vent hole (130).

6. The TO package structure according to claim 5, characterized in that, In the pre - welding state, the welding body (300) is opposite to the hole portion (131) and placed on the header lower surface (120), and the recess (132) is exposed.

7. The TO package structure according to claim 1, characterized in that, Further comprising: A chip located within the cavity, connected to the header upper surface (110), and connected to the upper ends of the leads (400), with the chip and the vent hole (130) arranged in an avoiding manner.

8. The TO package structure according to claim 1, characterized in that, A step (111) is provided at the outer edge of the header upper surface (110), and the cap (200) is snap - fitted with the step (111).

9. The TO package structure according to claim 8, characterized in that, The step (111) includes: A horizontal surface (111a) located between the header upper surface (110) and the header lower surface (120); A vertical surface (111b) connected between the header upper surface (110) and the horizontal surface (111a); The cap side wall (210) of the cap (200) is sleeved on the vertical surface (111b) and abuts against the horizontal surface (111a).

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