Laminated optical relay packaging device

Abstract

A stacked optical relay packaging device comprises a first guide pin; the insulating block is arranged on the first guide pin; the photoelectric unit is arranged on the insulating block; the light-transmitting insulating block is arranged on the photoelectric unit; the first transistor crystal grain is arranged on the first guide pin and is electrically connected with the first guide pin and the photoelectric unit; the second guide pin is adjacent to the first guide pin; the second transistor crystal grain is arranged on the second guide pin and is electrically connected with the second guide pin and the photoelectric unit; the third guide pin is adjacent to the second guide pin; the fourth guide pin is arranged adjacent to the third guide pin; and the light-emitting unit is arranged on the light-transmitting insulating block and is electrically connected with the third guide pin and the fourth guide pin.

Description

Technical Field

[0001] The present disclosure relates to an optical relay packaging device, particularly a stacked optical relay packaging device. Background Art

[0002] An optical relay can also be referred to as a photo coupler, an optical coupler, an optical isolator, and an optoelectronic isolator, which is a device that transmits electrical signals through light such as visible light or infrared light. The optical relay has the characteristic of electrical isolation between the input circuit and the output circuit.

[0003] In the existing optical relay, two conductive pins are arranged vertically up and down. The light-emitting unit is arranged on one of the conductive pins, and the optoelectronic unit is arranged on the other conductive pin. The packaging steps are to first package with white glue having a light transmittance of about 20%, and then externally coat with opaque black glue. That is to say, secondary plastic encapsulation is required during packaging, and the complexity of the process is high. Moreover, the light transmittance of the white glue is not good, resulting in a higher driving current and sufficient brightness for the light-emitting unit to drive the optoelectronic unit.

[0004] In view of this, how to simplify the packaging procedure and improve the energy conversion rate between the light-emitting unit and the optoelectronic unit is one of the problems that need to be solved urgently at present. Summary of the Utility Model

[0005] The present disclosure provides a stacked optical relay packaging device, which can complete the packaging through one-time plastic encapsulation, effectively simplifies the process complexity, and improves the energy conversion rate between the light-emitting unit and the optoelectronic unit. Therefore, the driving power supply of the light-emitting unit can be reduced and power can be saved.

[0006] The present disclosure provides a stacked optical relay packaging device including a first lead; an insulating block is arranged on the first lead; an optoelectronic unit is arranged on the insulating block; a light-transmitting insulating block is arranged on the optoelectronic unit; a first transistor die is arranged on the first lead and is electrically connected to the first lead and the optoelectronic unit; a second lead is adjacent to the first lead; a second transistor die is arranged on the second lead and is electrically connected to the second lead and the optoelectronic unit; a third lead is adjacent to the second lead; a fourth lead is adjacent to the third lead; and a light-emitting unit is arranged on the light-transmitting insulating block and is electrically connected to the third lead and the fourth lead.

[0007] In some embodiments, the light-transmitting insulating block is clamped between the optoelectronic unit and the light-emitting unit.

[0008] In some embodiments, the light transmittance of the light-transmitting insulating block is about 90%.

[0009] In some embodiments, the light-emitting unit emits light, the light passes through the light-transmitting insulating block, and the optoelectronic unit receives the light and generates a first electrical signal.

[0010] In some embodiments, the first transistor die receives a first electrical signal and generates a second electrical signal; the second transistor die receives the first electrical signal and generates a third electrical signal.

[0011] In some embodiments, the optoelectronic unit is an optotransistor or a photodiode.

[0012] In some embodiments, the first transistor die and the second transistor die are metal-oxide-semiconductor field-effect transistors.

[0013] In some embodiments, the light-emitting unit is a light-emitting diode.

[0014] In some embodiments, the stacked opto-relay packaging device further includes a first wire electrically connected to the first transistor die and the optoelectronic unit; a second wire, electrically connected to the first transistor die and the optoelectronic unit; a third wire, electrically connected to the second transistor die and the optoelectronic unit; and a fourth wire, electrically connected to the second transistor die and the optoelectronic unit.

[0015] In some embodiments, the stacked opto-relay packaging device further includes a fifth wire electrically connected to the third lead and the light-emitting unit; and a sixth wire, electrically connected to the third lead and the light-emitting unit.

[0016] In some embodiments, the stacked opto-relay packaging device further includes a packaging colloid covering a part of the first lead, a part of the second lead, a part of the third lead, a part of the fourth lead, an insulating block, the optoelectronic unit, a light-transmitting insulating block, the light-emitting unit, the first transistor die, and the second transistor die.

[0017] In some embodiments, the stacked opto-relay packaging device further includes a packaging colloid covering a part of the first lead, a part of the second lead, a part of the third lead, a part of the fourth lead, an insulating block, the optoelectronic unit, a light-transmitting insulating block, the light-emitting unit, the first transistor die, the second transistor die, the first wire, the second wire, the third wire, the fourth wire, the fifth wire, and the sixth wire.

[0018] As described above, the stacked photorelays packaging device of the present disclosure converts an input electrical signal source into an optical signal and then back into an electrical signal while maintaining electrical isolation, thus having good electrical insulation ability and anti-interference ability. Adding the stacked photorelays packaging device of the present disclosure to a circuit can prevent the subsequent circuit components from being damaged by imperfect input electrical signal sources, lightning, electrostatic discharge, electromagnetic interference, and switching pulses. Moreover, the stacked photorelays packaging device of the present disclosure is different from existing photorelays devices in that it can be encapsulated through a single plastic encapsulation, effectively simplifying the process complexity. In addition, the light transmittance of the light-transmitting insulating block is about 90%, which can improve the light transmission effect. Therefore, the driving power supply of the light-emitting unit can be reduced, saving power. It is worth mentioning that the first lead can support the optoelectronic unit through the insulating block, and the insulating block can prevent the bottom of the optoelectronic component from being electrically connected to the bottom of the first lead and the first transistor chip. Therefore, the optoelectronic unit does not need to be disposed on other support structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Details of one or more embodiments of the subject matter described in this specification are set forth in the following drawings and description. Other features, aspects, and advantages of the subject matter of this specification will become apparent from the description, drawings, and claims, in which:

[0020] Figure 1 is a schematic top cross-sectional view of the stacked photorelays packaging device of the present disclosure;

[0021] Figure 2 is a schematic side cross-sectional view of the stacked photorelays packaging device of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The detailed description and technical content of the present disclosure are described below in conjunction with the drawings. However, the attached drawings are only for reference and illustration purposes and are not intended to limit the present disclosure.

[0023] As used herein, terms such as "first", "second", "third", "fourth", "fifth", and "sixth" describe various components, assemblies, regions, layers, and / or parts, and these components, assemblies, regions, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another. Unless the context clearly indicates otherwise, the terms "first", "second", "third", "fourth", "fifth", and "sixth" used herein do not imply an order or sequence.

[0024] Figure 1 is a schematic top cross-sectional view of the stacked photorelays packaging device of the present disclosure, Figure 2 is a schematic side cross-sectional view of the stacked photorelays packaging device of the present disclosure. Please refer to Figure 1 andFigure 2 As shown in the figure, the stacked photorelays packaging device 1 of this embodiment includes a first lead 21, an insulating block 31, a photoelectric unit 32, a light-transmitting insulating block 33, a first transistor chip 41, a second lead 22, a second transistor chip 42, a third lead 23, a fourth lead 24, and a light-emitting unit 34.

[0025] The material of the first lead 21 can be, for example, a conductive material such as silver, copper, gold, or aluminum. The first lead 21 can support other components and enable the stacked photorelays packaging device 1 to be electrically connected to an external circuit.

[0026] The insulating block 31 is disposed on the first lead 21. The insulating block 31 can be, for example, located between other components and the first lead 21 to support other components and electrically isolate other components from the first lead 21. The material of the insulating block 31 can be, for example, a non-conductive material such as rubber, plastic, and insulating glue.

[0027] The photoelectric unit 32 is disposed on the insulating block 31, so the photoelectric unit 32 and the first lead 21 can be electrically isolated. The photoelectric unit 32 can be, for example, a phototransistor, a photodiode, a photoresistor, a charge-coupled device (CCD), a complementary metal-oxide-semiconductor (CMOS), an avalanche photodiode (APD), or other units that can convert an optical signal into an electrical signal.

[0028] The light-transmitting insulating block 33 is disposed on the photoelectric unit 32. In some embodiments, the light-transmitting insulating block 33 can be clamped between the photoelectric unit 32 and the light-emitting unit 34 as a medium for light conduction and electrically isolate the photoelectric unit 32 from the light-emitting unit 34. The material of the light-transmitting insulating block 33 can be, for example, a light-transmitting and insulating material such as an acrylic plate, glass, polycarbonate, resin, or plastic. In some embodiments, the light transmittance of the light-transmitting insulating block 33 can be about 90%, in other words, the penetration rate of light through the light-transmitting insulating block 33 is 90%.

[0029] The first transistor chip 41 is disposed on the first lead 21 and is electrically connected to the first lead 21 and the photoelectric unit 32. The first transistor chip 41 can be electrically connected to the first lead 21 through direct contact, conductive glue, a wire, or solder. In other words, the first lead 21 can support the first transistor chip 41 and lead out the electrical signal of the first transistor chip 41. The first transistor chip 41 can be electrically connected to the photoelectric unit 32 through direct contact, conductive glue, a wire, or solder.

[0030] The first transistor die 41 can be a bipolar junction transistor (BJT) or a field effect transistor (FET). In some embodiments, the first transistor die 41 is a metal oxide semiconductor field effect transistor (MOSFET).

[0031] The second lead 22 is adjacent to the first lead 21. The material of the second lead 22 can be a conductive material such as silver, copper, gold, aluminum, etc. The second lead 22 can support other components and enable the stacked optical relay packaging device 1 to be electrically connected to an external circuit.

[0032] The second transistor die 42 is disposed on the second lead 22 and is electrically connected to the second lead 22 and the optoelectronic unit 32. The second transistor die 42 can be electrically connected to the second lead 22 through direct contact, conductive adhesive, wire, or solder. In other words, the second lead 22 can support the second transistor die 42 and lead out the electrical signal of the second transistor die 42. The second transistor die 42 can be electrically connected to the optoelectronic unit 32 through direct contact, conductive adhesive, wire, or solder.

[0033] The second transistor die 42 can be a bipolar junction transistor (BJT) or a field effect transistor (FET). In some embodiments, the second transistor die 42 is a metal oxide semiconductor field effect transistor (MOSFET).

[0034] The third lead 23 is adjacent to the second lead 22; the fourth lead 24 is adjacent to the third lead 23. The materials of the third lead 23 and the fourth lead 24 can be conductive materials such as silver, copper, gold, aluminum, etc., enabling the stacked optical relay packaging device 1 to be electrically connected to an external circuit.

[0035] The light emitting unit 34 is disposed on the light transmissive insulating block 33 and is electrically connected to the third lead 23 and the fourth lead 24. The light transmissive insulating block 33 can transmit the light emitted by the light emitting unit 34. When appropriate input signal sources are connected to the third lead 23 and the fourth lead 24, the input signal sources cause the light emitted by the light emitting unit 34 to change. The light emitting unit 34 can be a light emitting diode, a light bulb, or a fluorescent tube.

[0036] In some embodiments, the light emitting unit 34 is a light emitting diode, such as a red light emitting diode, a yellow light emitting diode, a green light emitting diode, a blue light emitting diode, a purple light emitting diode, an infrared light emitting diode, or an ultraviolet light diode, but it is not limited thereto. The light emitting diode can be an inorganic light emitting diode or an organic light emitting diode (OLED), but it is not limited thereto.

[0037] In some embodiments, the stacked photorelays packaging device 1 may further include a first wire 51, a second wire 52, a third wire 53, a fourth wire 54, a fifth wire 55, a sixth wire 56, and a packaging colloid 60.

[0038] The first wire 51 can be electrically connected to, for example, an electrode of the first transistor die 41 and an electrode of the optoelectronic unit 32; the second wire 52 can be electrically connected to, for example, another electrode of the first transistor die 41 and another electrode of the optoelectronic unit 32; the third wire 53 can be electrically connected to, for example, an electrode of the second transistor die 42 and the said electrode of the optoelectronic unit 32; and the fourth wire 54 can be electrically connected to, for example, another electrode of the second transistor die 42 and the said another electrode of the optoelectronic unit 32. The materials of the first wire 51, the second wire 52, the third wire 53, and the fourth wire 54 can be conductive materials such as silver, copper, gold, and aluminum.

[0039] The fifth wire 55 can be electrically connected to, for example, the third lead pin 23 and an electrode of the light-emitting unit 34; and

[0040] The sixth wire 56 can be electrically connected to, for example, the third lead pin 23 and another electrode of the light-emitting unit 34. The materials of the fifth wire 55 and the sixth wire 56 can be conductive materials such as silver, copper, gold, and aluminum.

[0041] In some embodiments, the packaging colloid 60 can cover a part of the first lead pin 21, a part of the second lead pin 22, a part of the third lead pin 23, a part of the fourth lead pin 24, the insulating block 31, the optoelectronic unit 32, the light-transmissive insulating block 33, the light-emitting unit 34, the first transistor die 41, and the second transistor die 42. The packaging colloid 60 can be, for example, epoxy resin or hot melt adhesive. The packaging colloid 60 can protect the internal electronic components from being damaged by mechanical force, corrosive substances, oxygen, moisture, or electricity. The packaging colloid 60 only covers a part of the first lead pin 21, a part of the second lead pin 22, a part of the third lead pin 23, and a part of the fourth lead pin 24, so that the other parts of the first lead pin 21, the second lead pin 22, the third lead pin 23, and the fourth lead pin 24 can be used as pins for connecting to an external circuit.

[0042] Therefore, when the third lead 23 and the fourth lead 24 of the stacked photorelays packaging device 1 are connected to an input electrical signal source, the light-emitting unit 34 can emit light, the light can pass through the light-transmissive insulating block 33, and the optoelectronic unit 32 can receive the light and generate a first electrical signal. In other words, the input electrical signal source causes the light emitted by the light-emitting unit 34 to change, and the change in the light causes the optoelectronic unit 32 to generate a first electrical signal. The first electrical signal can be, for example, a voltage signal or a current signal. The first transistor die 41 can receive the first electrical signal and generate a second electrical signal. The second electrical signal can be, for example, a voltage signal or a current signal. The magnitude of the second electrical signal can be greater than, less than, or equal to the first electrical signal. The second transistor die 42 can receive the first electrical signal and generate a third electrical signal. The third electrical signal can be, for example, a voltage signal or a current signal. The magnitude of the third electrical signal can be greater than, less than, or equal to the first electrical signal. The output signals of the stacked photorelays packaging device 1 can be, for example, the second electrical signal and the third electrical signal, thereby achieving the function of a relay.

[0043] In summary, the stacked photorelays packaging device of the present disclosure converts the input electrical signal source into an optical signal and then into an electrical signal, and maintains electrical isolation, thus having good electrical insulation ability and anti-interference ability. Adding the stacked photorelays packaging device of the present disclosure to a circuit can prevent the backend circuit components from being damaged by imperfect input electrical signal sources, lightning, electrostatic discharge, electromagnetic interference, and switching pulses. Furthermore, the stacked photorelays packaging device of the present disclosure is different from existing photorelays devices in that it can be encapsulated by a single plastic encapsulation, effectively simplifying the process complexity. Moreover, the light transmittance of the light-transmissive insulating block is about 90%, which can improve the light transmission effect. Therefore, the driving power supply of the light-emitting unit can be reduced, saving power. It is worth mentioning that the first lead can support the optoelectronic unit through the insulating block, and the insulating block can prevent the bottom of the optoelectronic component from being electrically connected to the bottom of the first lead and the first transistor die. Therefore, the optoelectronic unit does not need to be disposed on other support structures.

[0044] As used herein and unless otherwise defined, terms such as "substantially" and "about" are used to describe and account for small variations. When associated with an event or circumstance, the term can include the exact instance in which the event or circumstance occurs, as well as an approximation to the point nearest in which the event or circumstance occurs. For example, when associated with a numerical value, the term can include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0045] The components of several embodiments are outlined above, so that those with ordinary knowledge in the technical field to which the present disclosure pertains can better understand the concepts of the embodiments of the present disclosure. Those with ordinary knowledge in the technical field to which the present disclosure pertains should understand that the embodiments of the present disclosure can be used as a basis to design or modify other processes and devices to achieve the same purposes and / or obtain the same benefits as those introduced in the embodiments herein. Those with ordinary knowledge in the technical field to which the present disclosure pertains should also understand that these equivalent devices do not depart from the spirit and scope of the present disclosure, and various changes, substitutions, and other options can be made without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be defined by the appended patent application scope.

[0046]

Symbol Explanation

[0047] 1: Stacked Die Optical Relay Packaging Device

[0048] 21: First Lead

[0049] 22: Second Lead

[0050] 23: Third Lead

[0051] 24: Fourth Lead

[0052] 31: Insulating Block

[0053] 32: Optoelectronic Unit

[0054] 33: Translucent Insulating Block

[0055] 34: Light Emitting Unit

[0056] 41: First Transistor Die

[0057] 42: Second Transistor Die

[0058] 51: First Wire

[0059] 52: Second Wire

[0060] 53: Third Wire

[0061] 54: Fourth Wire

[0062] 55: Fifth Wire

[0063] 56: Sixth Wire

[0064] 60: Encapsulation Colloid

Claims

1. A stacked crystal type optical relay packaging device, characterized in that, Comprising: A first lead pin; An insulating block disposed on the first lead pin; An optoelectronic unit disposed on the insulating block; A light-transmitting insulating block disposed on the optoelectronic unit; A first transistor die disposed on the first lead pin and electrically connected to the first lead pin and the optoelectronic unit; A second lead pin adjacent to the first lead pin; A second transistor die disposed on the second lead pin and electrically connected to the second lead pin and the optoelectronic unit; A third lead pin adjacent to the second lead pin; A fourth lead pin adjacent to the third lead pin; and A light-emitting unit disposed on the light-transmitting insulating block and electrically connected to the third lead pin and the fourth lead pin.

2. The stacked crystal type optical relay packaging device according to claim 1, wherein The light-transmitting insulating block is sandwiched between the optoelectronic unit and the light-emitting unit.

3. The stacked crystal type optical relay packaging device according to claim 1, wherein, A light transmittance of the light-transmitting insulating block is about 90%.

4. The stacked crystal optical relay packaging device according to claim 1, wherein The optoelectronic unit is a phototransistor or a photodiode.

5. The stacked crystal type optical relay packaging device according to claim 4, characterized in that, The first transistor die and the second transistor die are metal-oxide-semiconductor field-effect transistors.

6. The stacked crystal type optical relay packaging device according to claim 5, characterized in that, The light-emitting unit is a light-emitting diode.

7. The stacked crystal optical relay packaging device according to claim 1, wherein Further comprising: A first wire electrically connected to the first transistor die and the optoelectronic unit; A second wire electrically connected to the first transistor die and the optoelectronic unit; A third wire electrically connected to the second transistor die and the optoelectronic unit; And A fourth wire electrically connected to the second transistor die and the optoelectronic unit.

8. The stacked crystal type optical relay packaging device according to claim 7, characterized in that, Further comprising: A fifth wire electrically connected to the third lead pin and the light-emitting unit; And A sixth wire electrically connected to the third lead pin and the light-emitting unit.

9. The stacked crystal type optical relay packaging device according to claim 1, wherein, Further comprising: A packaging colloid covering a part of the first lead pin, a part of the second lead pin, a part of the third lead pin, a part of the fourth lead pin, the insulating block, the optoelectronic unit, the light-transmitting insulating block, the light-emitting unit, the first transistor die and the second transistor die.

10. The stacked crystal optical relay packaging device according to claim 8, wherein, Further comprising: A packaging colloid covering a part of the first lead pin, a part of the second lead pin, a part of the third lead pin, a part of the fourth lead pin, the insulating block, the optoelectronic unit, the light-transmitting insulating block, the light-emitting unit, the first transistor die, the second transistor die, the first wire, the second wire, the third wire, the fourth wire, the fifth wire and the sixth wire.

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