Silicon wafer cleaning assembly for PVD cavity

Abstract

The utility model provides a silicon wafer cleaning assembly for a PVD cavity. The silicon wafer cleaning assembly for the PVD cavity is arranged below a target material which is sputtered upwards in the PVD cavity and used for cleaning a silicon wafer which falls off from a carrier plate above the target material and is in lap joint between the target material and an adjacent anode. The silicon wafer cleaning assembly for the PVD cavity comprises a scraper module, a guide rail and a driving module, wherein the guide rail is arranged adjacent to the target material in parallel; the driving module is used for driving the scraper module to move along the guide rail so as to clean a silicon wafer lapped between the target material and an adjacent anode; the scraper blade module comprises a scraper blade matched with the target material in shape and a base used for arranging the scraper blade and moving along the guide rail. According to the utility model, the silicon wafer lapped between the target material and the adjacent anode can be cleaned without breaking vacuum, so that PVD equipment can quickly recover to a normal production state, and the productivity is improved.

Description

Technical Field

[0001] The utility model relates to the field of photovoltaic manufacturing, and particularly to a wafer cleaning component for a PVD chamber. Background Art

[0002] The transparent conductive film (TCO film) of a heterojunction solar cell is formed by physical vapor deposition (PVD) sputtering. In the preparation of the TCO film by PVD magnetron sputtering, the wafer slot bearing area for transporting the wafer carrier plate is relatively narrow. When the wafer is not properly placed in the wafer slot, it is very easy to cause the wafer to fall off during sputtering in the PVD chamber. In addition, after the carrier plate is heated in the heating chamber and the PVD chamber, it will expand to a certain extent. Coupled with the influence of the vacuum pumping airflow and the bumps during the transmission of the carrier plate, the probability of the wafer falling off in the PVD chamber will increase.

[0003] When the wafer falls into other cavities of the PVD, it will not affect the normal operation of the equipment temporarily. However, when the wafer falls into the cathode position where sputtering is upward, since the center distance between the two target materials at the cathode position is relatively close, and there is also an anode placed in the middle with protruding screw heads on it, it is very easy for the wafer to touch the target material after falling into this gap, resulting in a short circuit. It is necessary to stop production, break the vacuum, and open the chamber to handle it.

[0004] Therefore, how to provide a wafer cleaning component for a PVD chamber to clean the wafer lapped between the target material and the adjacent anode without breaking the vacuum, so that the PVD equipment can quickly return to the normal production state and thus improve the production capacity has become an urgent technical problem in the industry. Summary of the Invention

[0005] In view of the above problems of the prior art, the utility model provides a wafer cleaning component for a PVD chamber, which is arranged below the target material for upward sputtering in the PVD chamber and is used to clean the wafer that falls from the carrier plate above the target material and laps between the target material and the adjacent anode. The wafer cleaning component for the PVD chamber includes a scraper module, a guide rail arranged in parallel with the adjacent target material, and a driving module for driving the scraper module to move along the guide rail to clean the wafer lapped between the target material and the adjacent anode. The scraper module includes a scraper matching the shape of the target material and a base for arranging the scraper and moving along the guide rail.

[0006] In one embodiment, the driving module includes a matching ball nut and ball screw, and further includes a motor for driving the ball screw to rotate, driving the ball nut to translate, and driving the scraper module to translate accordingly.

[0007] In one embodiment, the motor is arranged outside the PVD chamber, and the ball screw is arranged on a screw support seat.

[0008] In one embodiment, the base of the scraper module includes a cross bar for arranging the scraper and a support block arranged under the cross bar and connected to the ball nut.

[0009] In one embodiment, the guide rail includes a first guide strip and a second guide strip disposed on both sides of the support block, and the support block moves between the first guide strip and the second guide strip.

[0010] In one embodiment, the support block includes a groove matching the guide rail, and the support block is engaged with the guide rail in a concave-convex manner and moves along the guide rail.

[0011] In one embodiment, the PVD chamber includes a first target and a second target that are disposed on both sides of adjacent anodes and sputter upward, and the squeegee module correspondingly includes a first squeegee and a second squeegee that are disposed on both sides of a cross bar of the base.

[0012] In one embodiment, two of the squeegee modules are correspondingly disposed on each ball screw.

[0013] In one embodiment, the silicon wafer cleaning assembly for the PVD chamber is performed in a vacuum state of the PVD chamber.

[0014] In one embodiment, the top end of the squeegee is higher than the center of the target, and the angle range of the squeegee covering the target is 180 - 270 degrees.

[0015] Compared with the prior art in which it is necessary to break the vacuum to clean the silicon wafer lapped between the target and the adjacent anode, which seriously affects the production capacity, the silicon wafer cleaning assembly for the PVD chamber of the present utility model is disposed below the target that sputters upward in the PVD chamber and includes a squeegee module, a guide rail disposed in parallel with the adjacent target, and a driving module that drives the squeegee module to move along the guide rail to clean the silicon wafer lapped between the target and the adjacent anode. The squeegee module includes a squeegee matching the shape of the target and a base for setting the squeegee and moving along the guide rail. The present utility model can clean the silicon wafer lapped between the target and the adjacent anode without breaking the vacuum, enabling the PVD equipment to quickly return to the normal production state and thus improving the production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] After reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings, the above features and advantages of the present utility model can be better understood. In the drawings, the components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0017] Figure 1 It is a schematic structural diagram of the composition of an embodiment of the silicon wafer cleaning assembly for the PVD chamber of the present utility model;

[0018] Figure 2 For installing Figure 1 A schematic cross-sectional structural diagram of a PVD device with the silicon wafer cleaning assembly embodiment in

[0019] Figure 3 is a schematic three-dimensional composition structure diagram of a PVD device with a silicon wafer cleaning component embodiment for a PVD chamber in Figure 1 . Specific Embodiments

[0020] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention will be introduced in conjunction with preferred embodiments, this does not mean that the features of this invention are limited to this implementation manner. On the contrary, the purpose of introducing the invention in conjunction with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present invention, some specific details will be omitted in the description.

[0021] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0022] In addition, the "upper", "lower", "left", "right", "top", "bottom", "horizontal", and "vertical" used in the following description should be understood as the orientations shown in this section and the related drawings. This relative term is only for convenience of description and does not mean that the device described needs to be manufactured or operated in a specific orientation, so it should not be construed as a limitation to the present invention.

[0023] It can be understood that although the terms "first", "second", "third", etc. can be used here to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first component, region, layer, and / or part discussed below can be referred to as the second component, region, layer, and / or part without departing from some embodiments of the present invention.

[0024] See Figures 1 to 3 , Figure 1 , which is a schematic composition structure diagram of an embodiment of the silicon wafer cleaning component for the PVD chamber of the present invention.Figure 2 , Figure 3 are respectively the schematic cross-sectional composition structure diagram and the three-dimensional composition structure diagram of the PVD device with the silicon wafer cleaning component embodiment for the PVD chamber in Figure 1 . As shown in Figures 1 to 3 , the silicon wafer cleaning component 1 for the PVD chamber of the present utility model is arranged below the target 22 that sputters upward in the PVD chamber 20, and is used to clean the silicon wafers that fall from the carrier above the target 22 and overlap between the target 22 and the adjacent anode 23. The silicon wafer cleaning component 1 for the PVD chamber includes a scraper module 10, a guide rail 12, and a driving module 14. The cathode-position PVD device 21 that sputters upward includes the PVD chamber 20, and the cathode-position PVD device 21 is used to form an ITO film on the back surface, i.e., the cathode surface, of the solar cell wafer.

[0025] The guide rail 12 is arranged in parallel adjacent to the target 22, and the driving module 14 drives the scraper module 10 to move along the guide rail 12 to clean the silicon wafers between the target 22 and the adjacent anode 23. The scraper module 10 includes a scraper 100 that matches the shape of the target 22 and a base for setting the scraper 100 and moving along the guide rail 12. The target 22 is a cylinder, and the scraper 100 is correspondingly a semi-circular arc.

[0026] The base of the scraper module 10 includes a cross bar 102 and a support block 104. The cross bar 102 is used to set the scraper, and the support block 104 is arranged below the cross bar 102 and connected to the ball nut 140. In the PVD chamber 20, there are a first target 22A and a second target 22B that sputter upward and are arranged on both sides of the adjacent anode 23. The scraper module 10 correspondingly includes a first scraper 100A and a second scraper 100B arranged on both sides of the cross bar 102 of the base. The driving module 14 includes a matching ball nut 140, a ball screw 142, and a motor (not shown). The motor is used to drive the ball screw 142 to rotate to drive the ball nut 140 to translate and drive the scraper module 10 to translate accordingly. The motor is arranged outside the PVD chamber 20, and the ball screw 142 is arranged on the screw support seat 1420. The tops of the scrapers 100A and 100B are higher than the centers of the targets 22A and 22B, and the angular ranges of the scrapers 100A and 100B covering the targets 22A and 22B are 180 - 270 degrees. In this way, both the cleaning effect can be ensured and the sputtering of the targets 22A and 22B will not be affected. The guide rail 12 includes a first guide strip 12A and a second guide strip 12B arranged on both sides of the support block 104, and the support block 104 moves between the first guide strip 12A and the second guide strip 12B.

[0027] In other embodiments, the support block 104 may include a groove matching the guide rail 12. The support block 104 is engaged with the guide rail 12 in a concave-convex manner and moves along the guide rail 12. Two of the scraper modules 10 may be correspondingly arranged on each ball screw 142. The silicon wafer cleaning assembly for the PVD chamber is carried out under the vacuum state of the PVD chamber.

[0028] When using the embodiment of the silicon wafer cleaning assembly for the PVD chamber of the present utility model, first, the first scraper 100A and the second scraper 100B are installed on the cross bar 102, then the cross bar 102 is installed on the support block 104, and then the support block 104 is installed on the ball nut 140 connected to the ball screw 142. Then, the ball screw 142 is installed on the screw support seat 1420. Next, the first guide bar 12A and the second guide bar 12B are installed on both sides of the support block 104 and the ball screw 142. After that, the shaft of the motor provided in the PVD chamber 20 is connected to the ball screw 142. When the PVD chamber 20 is evacuated for the PVD process, if a silicon wafer is lapped between the target 22 and the adjacent anode 23, the PVD equipment will report an error. At this time, the motor of the silicon wafer cleaning assembly for the PVD chamber will rotate to drive the ball screw 142 to rotate, thereby driving the ball nut 140 to move, causing the support block 104 to move between the first guide bar 12A and the second guide bar 12B, and then driving the first scraper 100A and the second scraper 100B to clean the silicon wafer lapped between the anode 23 and the first target 22A and / or the second target 22B. After the cleaning is completed, the PVD coating process can be continued.

[0029] In summary, the silicon wafer cleaning assembly for the PVD chamber of the present utility model is arranged below the target that sputters upward in the PVD chamber, and is used to clean the silicon wafer that falls from the carrier plate above the target and is lapped between the target and the adjacent anode. The silicon wafer cleaning assembly for the PVD chamber includes a scraper module, a guide rail arranged in parallel with the adjacent target, and a driving module for driving the scraper module to move along the guide rail to clean the silicon wafer lapped between the target and the adjacent anode. The scraper module includes a scraper matching the shape of the target and a base for arranging the scraper and moving along the guide rail. The present utility model can clean the silicon wafer lapped between the target and the adjacent anode without breaking the vacuum, enabling the PVD equipment to quickly return to the normal production state, thereby improving the production capacity.

[0030] The foregoing description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein. The above embodiments are provided for those familiar with the art to implement or use the present utility model. Those familiar with the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present utility model. Therefore, the protection scope of the present utility model is not limited by the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the claims.

Claims

1. A silicon wafer cleaning component for a PVD chamber, which is arranged below the target that sputters upward in the PVD chamber and is used to clean the silicon wafers that fall from the carrier above the target and overlap between the target and the adjacent anode, and is characterized in that, The silicon wafer cleaning component for the PVD chamber includes a scraper module, a guide rail arranged in parallel with the adjacent target, and a driving module for driving the scraper module to move along the guide rail to clean the silicon wafer lapped between the target and the adjacent anode. The scraper module includes a scraper matching the shape of the target and a base for setting the scraper and moving along the guide rail.

2. The silicon wafer cleaning assembly for a PVD chamber according to claim 1, wherein, The driving module includes a matching ball nut and ball screw, and further includes a motor for driving the ball screw to rotate to drive the ball nut to translate and drive the corresponding translation of the scraper module.

3. The silicon wafer cleaning assembly for a PVD chamber according to claim 2, wherein, The motor is arranged outside the PVD chamber, and the ball screw is arranged on the screw support seat.

4. The silicon wafer cleaning assembly for a PVD chamber according to claim 2, characterized in that, The base of the scraper module includes a cross bar for setting the scraper and a support block arranged under the cross bar and connected to the ball nut.

5. The silicon wafer cleaning assembly for a PVD chamber according to claim 4, wherein, The guide rail includes a first guide bar and a second guide bar arranged on both sides of the support block, and the support block moves between the first guide bar and the second guide bar.

6. The silicon wafer cleaning assembly for a PVD chamber according to claim 4, wherein The support block includes a groove matching the guide rail, and the support block is combined with the guide rail in a concave-convex manner and moves along the guide rail.

7. The silicon wafer cleaning assembly for a PVD chamber according to claim 4, wherein In the PVD chamber, there are a first target and a second target arranged on both sides of the adjacent anode and sputtering upward, and the scraper module correspondingly includes a first scraper and a second scraper arranged on both sides of the cross bar of the base.

8. The silicon wafer cleaning assembly for a PVD chamber according to claim 1, characterized in that, Two scraper modules are correspondingly arranged on each ball screw.

9. The silicon wafer cleaning assembly for a PVD chamber according to claim 1, characterized in that, The silicon wafer cleaning component for the PVD chamber operates under the vacuum state of the PVD chamber.

10. The silicon wafer cleaning assembly for a PVD chamber according to claim 1, wherein The top of the scraper is higher than the center of the target, and the angle range covered by the scraper for the target is 180 - 270 degrees.

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