Solder paste detection device for circuit board
By introducing positioning detection and fast heat dissipation mechanisms into the solder paste detection device, the problems of inaccurate positioning of the circuit board and low heat dissipation efficiency are solved, and efficient circuit board detection is achieved.
Patent Information
- Application Number
- CN202422272494.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-09-18
AI Technical Summary
The existing solder paste detection device is not accurate enough when detecting the circuit board positioning, and the camera fails or stutters due to low heat dissipation efficiency after a long period of use, affecting the detection efficiency.
The positioning detection mechanism and the fast heat dissipation mechanism are adopted to realize the precise positioning and clamping of the circuit board through the positioning detection mechanism, and the fast heat dissipation mechanism is used to efficiently dissipate heat to avoid faults caused by excessive temperature.
It realizes accurate positioning and efficient heat dissipation of circuit board detection, improves detection efficiency, and avoids faults or lags caused by excessive temperatures of the camera.
Smart Images

Figure CN223192841U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a solder paste detection device for circuit boards. Background Art
[0002] During the production process of motor controller circuit boards, that is, the production process of PCB boards, the first production process of solder paste printing is completed by a solder paste printer. The existing solder paste printer usually includes a mounting table, a fixing frame fixedly connected to the mounting table, a solder paste scraping assembly slidably connected to the fixing frame, a screen, and a support plate fixedly connected to the fixing frame for supporting the circuit board. The staff applies solder paste on the screen. Now a solder paste detection device for circuit boards is needed.
[0003] The existing detection device still has some shortcomings to a certain extent. In order to make the detection device detect the circuit board more accurately, the circuit board needs to be positioned and clamped. The existing detection device is usually inconvenient to position and detect the circuit board body during use, which makes the detection device not accurate enough when taking pictures and detecting the surface of the circuit board body; when the detection device is used for a long time, the temperature of the surface of the camera and the photo component will continue to rise, causing the camera and the photo component to malfunction and be damaged. The existing detection device is not efficient enough in dissipating heat from the surface of the mobile component and the camera inside the photo component, which easily causes the surface of the camera of the detection device to malfunction or get stuck due to excessive temperature after long-term use, reducing the efficiency of the detection device when taking pictures and detecting the surface of the circuit board body. Utility Model Content
[0004] The purpose of the present utility model is to provide a solder paste detection device for a circuit board, so as to solve the problems proposed in the above-mentioned background technology that it is inconvenient to position and detect the circuit board body when using the detection device, and the heat dissipation efficiency is not high enough when dissipating heat from the surface of the mobile component and the camera inside the camera component.
[0005] To achieve the above-mentioned objectives, the utility model provides the following technical solutions: a solder paste detection device for a circuit board, comprising a device body, a fixing frame is installed on the surface of the device body, a display controller is installed on the surface of the fixing frame, a keyboard body is installed on the surface of the device body, a frame is installed inside the device body, a screw body is provided on the surface of the frame, the screw body and the surface of the frame rotate with each other, a moving component is installed on the surface of the frame, the input end of the moving component is electrically connected to the output end of the display controller, the surface of the frame is provided with a moving component, a conveyor belt is installed inside the device body, a circuit board body is placed on the surface of the conveyor belt, and a positioning detection mechanism is provided on the surface of the conveyor belt and the circuit board body, the interior of the positioning detection mechanism includes a positioning frame, an electric push rod and a positioning detection part, the interior of the moving component is provided with a rapid heat dissipation mechanism, and the interior of the rapid heat dissipation mechanism includes a heat conducting plate, mounting studs and a rapid heat dissipation part.
[0006] Preferably, the surface thread sleeve of the screw body is provided with an adjusting screw barrel, and the adjusting screw barrel and the surface of the screw body are rotationally matched with each other, and the adjusting screw barrel and the surface of the frame body are slidingly matched with each other, the surface of the moving component is fixed to the surface of the adjusting screw barrel, and a photographing component is installed on the surface at the bottom position of the moving component, and three cameras are installed inside the photographing component.
[0007] Preferably, the positioning detection part is arranged on the surface of the conveyor belt and the circuit board body, and the positioning detection part is composed of a fixed frame, an extension spring and a clamping plate. The surface of the conveyor belt is installed with a positioning frame, and the inner wall of the positioning frame is installed with a fixed frame. A clamping plate for limiting and clamping the circuit board body is provided below the fixed frame. One end of the clamping plate extends to the interior of the fixed frame, and the clamping plate and the inner wall of the fixed frame slide with each other. The surface at the bottom of the clamping plate contacts the surface of the circuit board body.
[0008] Preferably, the interior of the fixed frame is equipped with equally spaced extension springs, one end of each extension spring is fixed to the surface of the abutment plate, and the interior of the fixed frame is equipped with an electric push rod, the input end of each electric push rod is electrically connected to the output end of the display controller, and the output end of each electric push rod is fixed to the surface of the abutment plate.
[0009] Preferably, the rapid heat dissipation part is arranged inside the mobile component, and the rapid heat dissipation part is composed of a positioning card, a heat dissipation through hole and a heat dissipation fin. The interior of the mobile component is provided with a heat dissipation fin for dissipating the heat inside the mobile component, and the surface of the heat dissipation fin is installed with a positioning card, and the positioning card is engaged with the inner wall of the mobile component.
[0010] Preferably, the surfaces of the heat sink fins are threadedly connected with mounting studs, one end of the mounting studs passes through the heat sink fins and is threadedly fastened to the inner wall of the movable component, the inner wall of the movable component is provided with heat dissipation holes at equal intervals, the heat dissipation holes are connected to the interior of the movable component, and the interior of the movable component is installed with a heat conducting plate for heat conduction and heat dissipation.
[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: the circuit board solder paste detection device not only enables the detection device to accurately clamp the circuit board body at a specified position when in use, making the detection device more accurate when photographing and detecting the surface of the circuit board body, but also avoids the phenomenon of the surface of the camera of the detection device malfunctioning or freezing due to excessive temperature after long-term use, making the detection device more efficient when photographing and detecting the surface of the circuit board body;
[0012] 1. By providing a positioning detection mechanism, the display controller automatically controls the operation of the electric push rod inside the fixed frame. Under the joint action of the electric push rod and the extension spring inside the fixed frame, the pressing plate is driven to move, so that the pressing plate slides on the inner wall of the fixed frame. At this time, the surface at the bottom position of the pressing plate moves to contact the surface of the circuit board body. Under the action of the pressing plate, the circuit board body is pressed against the surface of the conveyor belt, and the circuit board body is positioned and photographed for detection, realizing the function of the detection device to detect the positioning of the circuit board body, so that the detection device can accurately clamp the circuit board body at the specified position when in use, making the detection device more accurate when taking pictures of the surface of the circuit board body;
[0013] 2. By providing a rapid heat dissipation mechanism, the heat dissipation fins drive the positioning card to the inner wall of the mobile component, the user tightens the mounting studs on the surface of the heat dissipation fins, and installs the heat dissipation fins on the inner wall of the mobile component under the action of the mounting studs. Under the action of the heat dissipation fins, the heat inside the mobile component and the camera component is dissipated through the heat dissipation holes. Under the action of the heat conduction plate, the heat inside the mobile component and the camera component is conducted and dissipated, thereby quickly dissipating the heat of the surface of the camera inside the mobile component and the camera component, realizing the function of the detection device to quickly dissipate the heat of the surface of the mobile component and the camera component, thereby avoiding the phenomenon that the surface of the camera of the detection device fails or jams due to excessive temperature after long-term use, and making the detection device more efficient in performing photo detection on the surface of the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;
[0015] Figure 2 This is a schematic diagram of the main cross-sectional structure of the utility model;
[0016] Figure 3 For the utility model Figure 2 A schematic diagram of the enlarged structure of the positioning detection mechanism;
[0017] Figure 4 For the utility model Figure 2 Schematic diagram of the enlarged structure of the rapid heat dissipation mechanism.
[0018] In the figure: 1. Device body; 101. Fixing frame; 102. Display controller; 103. Keyboard body; 104. Conveyor belt; 105. Frame; 106. Screw body; 107. Moving assembly; 108. Photographing assembly; 109. Circuit board body; 2. Positioning detection mechanism; 201. Positioning frame; 202. Electric push rod; 203. Positioning detection unit; 2031. Fixing frame; 2032. Extension spring; 2033. Clamping plate; 3. Rapid heat dissipation mechanism; 301. Heat conducting plate; 302. Mounting studs; 303. Rapid heat dissipation unit; 3031. Positioning card; 3032. Heat dissipation through hole; 3033. Heat dissipation fin. DETAILED DESCRIPTION
[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly stipulated and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0020] The structure of the solder paste detection device for circuit boards provided by the utility model is as follows Figure 1 and Figure 2As shown, it includes a device body 1, a fixing frame 101 is installed on the surface of the device body 1, a display controller 102 is installed on the surface of the fixing frame 101, and the model of the display controller 102 can be selected from the LA series. A keyboard body 103 is installed on the surface of the device body 1, and a frame 105 is installed inside the device body 1. A screw body 106 is provided on the surface of the frame 105. The screw body 106 and the surface of the frame 105 rotate with each other. A moving component 107 is installed on the surface of the frame 105. The input end of the moving component 107 is electrically connected to the output end of the display controller 102. The surface of the screw body 106 is threadedly sleeved with an adjusting screw, and the adjusting screw and the surface of the screw body 106 rotate in cooperation with each other, and the adjusting screw and the surface of the frame 105 slide in cooperation with each other, and the surface of the frame 105 is provided with a moving component 107, and the surface of the moving component 107 is fixed to the surface of the adjusting screw, and a photographing component 108 is installed on the surface at the bottom position of the moving component 107, and three cameras are installed inside the photographing component 108, and a conveyor belt 104 is installed inside the device body 1, and a circuit board body 109 is placed on the surface of the conveyor belt 104.
[0021] Further, if Figure 2 and Figure 3 As shown, the surfaces of the conveyor belt 104 and the circuit board body 109 are both provided with a positioning detection mechanism 2, the interior of the positioning detection mechanism 2 includes a positioning frame 201, an electric push rod 202 and a positioning detection part 203, the positioning detection part 203 is provided on the surfaces of the conveyor belt 104 and the circuit board body 109, the positioning detection part 203 is composed of a fixed frame 2031, an extension spring 2032 and a tightening plate 2033, the surface of the conveyor belt 104 is both installed with a positioning frame 201, the inner wall of the positioning frame 201 is installed with a fixing frame 2031, and a tightening plate 2033 for limiting and tightening the circuit board body 109 is provided below the fixing frame 2031, and the tightening plate 2033 is provided. One end extends to the interior of the fixed frame 2031, and the clamping plate 2033 and the inner wall of the fixed frame 2031 slide with each other. The surface at the bottom of the clamping plate 2033 contacts the surface of the circuit board body 109. The interior of the fixed frame 2031 is installed with equally spaced extension springs 2032, and one end of the extension spring 2032 is fixed to the surface of the clamping plate 2033. The interior of the fixed frame 2031 is installed with an electric push rod 202. The model of the electric push rod 202 can be selected from the DG series. The input end of the electric push rod 202 is electrically connected to the output end of the display controller 102, and the output end of the electric push rod 202 is fixed to the surface of the clamping plate 2033.
[0022] During implementation, the display controller 102 automatically controls the operation of the electric push rod 202 inside the fixed frame 2031, and the electric push rod 202 inside the fixed frame 2031 and the extension spring 2032 drive the clamping plate 2033 to move under the joint action of the electric push rod 202 and the extension spring 2032, so that the clamping plate 2033 slides on the inner wall of the fixed frame 2031. At this time, the surface at the bottom position of the clamping plate 2033 moves to contact the surface of the circuit board body 109. Under the action of the clamping plate 2033, the circuit board body 109 is pressed against the surface of the conveyor belt 104, and the circuit board body 109 is positioned and photographed for detection, so as to realize the function of the detection device to detect the positioning of the circuit board body 109.
[0023] Further, if Figure 2 and Figure 4 As shown, the interior of the mobile component 107 is provided with a rapid heat dissipation mechanism 3, the interior of the rapid heat dissipation mechanism 3 includes a heat conducting plate 301, a mounting stud 302 and a rapid heat dissipation portion 303, the rapid heat dissipation portion 303 is provided inside the mobile component 107, the rapid heat dissipation portion 303 is composed of a positioning card 3031, a heat dissipation through hole 3032 and a heat dissipation fin 3033, the interior of the mobile component 107 is provided with a heat dissipation fin 3033 for dissipating heat inside the mobile component 107, and the surface of the heat dissipation fin 3033 is installed. There is a positioning card 3031, which is engaged with the inner wall of the mobile component 107. The surface of the heat dissipation fin 3033 is threadedly connected with the mounting stud 302. One end of the mounting stud 302 passes through the heat dissipation fin 3033 and is threadedly fastened to the inner wall of the mobile component 107. The inner wall of the mobile component 107 is provided with heat dissipation holes 3032 at equal intervals. The heat dissipation holes 3032 are connected to the interior of the mobile component 107. The interior of the mobile component 107 is installed with a heat conducting plate 301 for heat conduction and heat dissipation.
[0024] During implementation, the heat dissipation fins 3033 drive the positioning clamp 3031 to the inner wall of the mobile component 107, and the user tightens the mounting studs 302 on the surface of the heat dissipation fins 3033. Under the action of the mounting studs 302, the heat dissipation fins 3033 are installed on the inner wall of the mobile component 107. Under the action of the heat dissipation fins 3033, the heat inside the mobile component 107 and the photographic component 108 is dissipated through the heat dissipation holes 3032. Under the action of the heat conduction plate 301, the heat inside the mobile component 107 and the photographic component 108 is dissipated by heat conduction. Thus, the surface of the camera inside the mobile component 107 and the photographic component 108 is quickly cooled, so as to realize the function of the detection device to quickly cool the surface of the camera inside the mobile component 107 and the photographic component 108.
[0025] Working principle: When in use, first place the device body 1 at the specified position, and the circuit board body 109 to be inspected moves to the surface of the conveyor belt 104, and the circuit board body 109 is conveyed under the action of the conveyor belt 104. The user controls the screw body 106 by operating the display controller 102. Under the joint action of the screw body 106 and the adjusting screw, the moving component 107 is driven to slide on the surface of the frame 105, so that the moving component 107 drives the photographing component 108 to move to the required position. When the circuit board body 109 moves to the bottom of the photographing component 108, the surface of the circuit board body 109 is photographed and inspected under the action of the three cameras inside the photographing component 108, and the photographic results are displayed on the surface of the display controller 102. When the photographic results show that the circuit board body 109 meets the inspection requirements, the circuit board body 109 that meets the standards is conveyed under the action of the conveyor belt 104, and the circuit board body 109 is conveyed out of the interior of the device body 1.
[0026] Subsequently, when the circuit board body 109 moves to the desired position, the display controller 102 automatically controls the electric push rod 202 inside the fixed frame 2031 to work, and the electric push rod 202 inside the fixed frame 2031 and the extension spring 2032 drive the clamping plate 2033 to move under the joint action of the electric push rod 202 and the extension spring 2032, so that the clamping plate 2033 slides on the inner wall of the fixed frame 2031. At this time, the surface at the bottom position of the clamping plate 2033 moves to contact the surface of the circuit board body 109. Under the action of the clamping plate 2033, the circuit board body 109 is pressed against the surface of the conveyor belt 104, and the circuit board body 109 is positioned and photographed for detection, so as to realize the function of the detection device to position and detect the circuit board body 109, so that the detection device can accurately clamp the circuit board body 109 at the specified position when in use, so that the detection device can be more accurate when photographing and detecting the surface of the circuit board body 109.
[0027] Subsequently, when the cameras inside the mobile component 107 and the camera component 108 work for a long time, the temperature inside the mobile component 107 and the camera component 108 will continue to rise. At this time, the heat dissipation fins 3033 drive the positioning clamps 3031 to be clamped to the inner wall of the mobile component 107. The user tightens the mounting studs 302 on the surface of the heat dissipation fins 3033, and installs the heat dissipation fins 3033 on the inner wall of the mobile component 107 under the action of the mounting studs 302. Under the action of the heat dissipation fins 3033, the heat inside the mobile component 107 and the camera component 108 is dissipated through the heat dissipation holes 3032. Under the action of the hot plate 301, the heat inside the moving component 107 and the photographing component 108 is conducted and dissipated, thereby quickly dissipating the heat of the surface of the camera inside the moving component 107 and the photographing component 108, so as to realize the function of the detection device to quickly dissipate the heat of the surface of the camera inside the moving component 107 and the photographing component 108, thereby avoiding the phenomenon that the surface of the camera of the detection device fails or jams due to excessive temperature after long-term use, making the detection device more efficient in photographing and detecting the surface of the circuit board body 109, and finally completing the use of the detection device.
[0028] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
Claims
1. A solder paste detection device for a circuit board, comprising a device body (1), characterized in that: The surface of the device body (1) is mounted with a fixing frame (101), the surface of the fixing frame (101) is mounted with a display controller (102), the surface of the device body (1) is mounted with a keyboard body (103), the interior of the device body (1) is mounted with a frame (105), the surface of the frame (105) is provided with a lead screw body (106), the lead screw body (106) and the surface of the frame (105) are rotatably matched with each other, the surface of the frame (105) is mounted with a moving component (107), the input end of the moving component (107) is electrically connected to the output end of the display controller (102), and the surface of the frame (105) is provided with a lead screw body (106). A moving component (107) is provided on the surface of the device body (1); a conveyor belt (104) is installed inside the device body (1); a circuit board body (109) is placed on the surface of the conveyor belt (104); a positioning detection mechanism (2) is provided on the surface of the conveyor belt (104) and the circuit board body (109); the interior of the positioning detection mechanism (2) includes a positioning frame (201), an electric push rod (202) and a positioning detection part (203); a rapid heat dissipation mechanism (3) is provided inside the moving component (107); the interior of the rapid heat dissipation mechanism (3) includes a heat conducting plate (301), a mounting stud (302) and a rapid heat dissipation part (303).
2. The solder paste detection device for a circuit board according to claim 1, characterized in that: The surface of the lead screw body (106) is threadedly sleeved with an adjusting screw barrel, and the adjusting screw barrel and the surface of the lead screw body (106) are rotationally matched with each other, and the adjusting screw barrel and the surface of the frame (105) are slidingly matched with each other. The surface of the moving component (107) is fixed to the surface of the adjusting screw barrel, and a photographing component (108) is installed on the surface at the bottom position of the moving component (107), and three cameras are installed inside the photographing component (108).
3. The solder paste detection device for a circuit board according to claim 1, characterized in that: The positioning detection part (203) is arranged on the surface of the conveyor belt (104) and the circuit board body (109), and the positioning detection part (203) is composed of a fixed frame (2031), an extension spring (2032) and a clamping plate (2033). The surface of the conveyor belt (104) is installed with a positioning frame (201), the inner wall of the positioning frame (201) is installed with a fixed frame (2031), and a clamping plate (2033) for limiting and clamping the circuit board body (109) is provided below the fixed frame (2031). One end of the clamping plate (2033) extends to the inside of the fixed frame (2031), and the clamping plate (2033) and the inner wall of the fixed frame (2031) are slidably matched with each other. The surface at the bottom position of the clamping plate (2033) contacts the surface of the circuit board body (109).
4. The solder paste detection device for a circuit board according to claim 3, characterized in that: The interior of the fixed frame (2031) is equipped with equally spaced extension springs (2032), one end of each extension spring (2032) is fixed to the surface of the pressing plate (2033), and the interior of the fixed frame (2031) is equipped with an electric push rod (202), the input end of each electric push rod (202) is electrically connected to the output end of the display controller (102), and the output end of each electric push rod (202) is fixed to the surface of the pressing plate (2033).
5. The solder paste detection device for a circuit board according to claim 1, characterized in that: The rapid heat dissipation portion (303) is arranged inside the moving component (107), and the rapid heat dissipation portion (303) is composed of a positioning clamp (3031), a heat dissipation through hole (3032) and a heat dissipation fin (3033). The interior of the moving component (107) is provided with a heat dissipation fin (3033) for dissipating heat inside the moving component (107). The surfaces of the heat dissipation fins (3033) are installed with positioning clamps (3031), and the positioning clamps (3031) and the inner wall of the moving component (107) are mutually engaged.
6. The solder paste detection device for a circuit board according to claim 5, characterized in that: The surfaces of the heat dissipation fins (3033) are all threadedly connected with mounting studs (302), one end of the mounting studs (302) passes through the heat dissipation fins (3033) and is threadedly fastened to the inner wall of the movable assembly (107), the inner wall of the movable assembly (107) is provided with heat dissipation holes (3032) at equal intervals, the heat dissipation holes (3032) are connected to the interior of the movable assembly (107), and the interior of the movable assembly (107) is installed with a heat conduction plate (301) for heat conduction and heat dissipation.