Miniature high-precision force transducer

Abstract

The utility model discloses a miniature high-precision force transducer, and relates to the technical field of force transducers. The sensor comprises a sensor body, and the sensor body comprises a main body which is used for packaging the whole sensor body. The memory micro elastic body is fixed with the main body; the embedded piezoelectric element is embedded in the memory micro elastomer; the signal conversion circuit unit is connected with the embedded piezoelectric element through a wire and is used for transmitting an electric signal; the data processing module is connected with the signal conversion circuit unit and is used for data processing and result display; the temperature compensation module is connected with the signal conversion circuit unit; the power management module is used for integrally supplying power to the sensor body; and the wireless communication module is interactively connected with the data processing module. According to the utility model, high-precision detection of micro force change is realized by adopting a mode of combining the memory micro elastic body and the embedded piezoelectric element.

Description

Technical Field

[0001] The utility model belongs to the technical field of force sensors, in particular to a miniature high-precision force sensor. Background Art

[0002] Currently, in many precision measurement fields such as biomechanics, nanotechnology, and precision machining, there are strict requirements for measuring tiny forces. However, when traditional sensors operate under different temperature conditions, differences in the thermal expansion coefficients of materials may lead to deviations in measurement results. Especially in applications that require long-term continuous monitoring, temperature changes can have a significant impact on measurement data. With the increase in data acquisition frequency and the requirements for measurement accuracy, existing data processing technologies may still experience delays or inaccuracies when processing high-frequency data. Traditional sensors, due to their more complex circuit design and larger size, have relatively high power consumption and require frequent battery replacement or other forms of energy replenishment.

[0003] Based on the above problems, this technical solution aims to propose a new miniature high-precision force sensor to solve the shortcomings of the existing technology and improve measurement accuracy, stability and applicability. Utility Model Content

[0004] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0005] The utility model is a miniature high-precision force sensor, comprising a sensor body, wherein the sensor body comprises:

[0006] The main body is used to encapsulate the entire sensor body;

[0007] A memory micro-elastic body fixed to the main body;

[0008] Embedded piezoelectric element, embedded in the memory micro-elastic body;

[0009] a signal conversion circuit unit, connected to the embedded piezoelectric element via a wire, for transmitting electrical signals;

[0010] A data processing module, connected to the signal conversion circuit unit, for data processing and result display;

[0011] A temperature compensation module connected to the signal conversion circuit unit;

[0012] Power management module, used to power the entire sensor body;

[0013] and a wireless communication module, interactively connected to the data processing module.

[0014] The present invention is further configured such that the embedded piezoelectric element is made of piezoelectric ceramic material.

[0015] The present invention is further configured such that the wireless communication module supports multiple wireless communication modes such as Bluetooth and Wi-Fi.

[0016] The utility model is further configured such that the memory micro-elastomer is made of shape memory alloy material.

[0017] The present invention is further configured such that a shell is provided on the outside of the main body for sealing, and a heat sink is integrally provided on the periphery of the shell.

[0018] The present invention is further configured such that a wiring port is provided at the rear of the shell, and the wiring port is adapted to be installed with a protective cover.

[0019] The utility model has the following beneficial effects:

[0020] 1. This utility model achieves high-precision detection of tiny force changes by combining a memory micro-elastomer with an embedded piezoelectric element. The memory characteristics of the shape memory alloy material and the high sensitivity of the piezoelectric ceramic material enable the sensor to produce significant electrical signal changes even under the action of tiny forces, thereby improving measurement accuracy.

[0021] 2. The present invention introduces a temperature compensation module, which enables the sensor to maintain stable measurement performance in different temperature environments. The temperature compensation module monitors ambient temperature changes in real time and automatically adjusts the sensor output signal, reducing the impact of temperature fluctuations on measurement results.

[0022] 3. The utility model adopts an integrated design of the main body and the external sealed shell, which makes the sensor have a high structural stability and protection level. The heat sink on the shell helps to dissipate heat, and the wiring port is equipped with a protective cover to ensure the normal operation of the sensor in harsh environments.

[0023] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 It is a schematic diagram of one end of the overall structure of the utility model.

[0026] Figure 2 It is a schematic diagram of the other end of the overall structure of the utility model.

[0027] Figure 3 This is a principle block diagram of the utility model.

[0028] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0029] 1. Sensor body; 11. Main body; 12. Memory micro-elastomer; 13. Embedded piezoelectric element; 14. Signal conversion circuit unit; 15. Data processing module; 16. Temperature compensation module; 17. Power management module; 18. Wireless communication module; 19. Housing; 110. Heat sink; 111. Wiring port; 112. Protective cover. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Example

[0032] See also Figure 1-3 The utility model is a miniature high-precision force sensor, including a sensor body 1, wherein the sensor body 1 includes a main body 11 for encapsulating the entire sensor body 1; a memory micro-elastic body 12, fixed to the main body 11; an embedded piezoelectric element 13, embedded in the memory micro-elastic body 12; a signal conversion circuit unit 14, connected to the embedded piezoelectric element 13 via a wire, for transmitting electrical signals; a data processing module 15, connected to the signal conversion circuit unit 14, for data processing and result display; a temperature compensation module 16, connected to the signal conversion circuit unit 14; a power management module 17, for powering the entire sensor body 1; and a wireless communication module 18, interactively connected to the data processing module 15.

[0033] Specifically, the embedded piezoelectric element 13 is made of piezoelectric ceramic material; the wireless communication module 18 supports multiple wireless communication modes such as Bluetooth and Wi-Fi; and the memory micro-elastomer 12 is made of shape memory alloy material.

[0034] Furthermore, the main body 11 is sealed with a shell 19 on the outside, and a heat sink 110 is integrally provided on the periphery of the shell 19 ; a wiring port 111 is provided at the rear of the shell 19 , and a protective cover 112 is adapted to be installed on the wiring port 111 .

[0035] The detailed description of this technical solution is as follows:

[0036] The main body 11 protects internal components from external environmental influences and provides a stable platform for securing other components. The memory micro-elastomer 12 is one of the sensor's core sensitive elements, capable of deforming in response to external forces and returning to its original shape after the force is removed. Common materials include nickel-titanium alloys. The embedded piezoelectric element 13 uses the piezoelectric effect to convert mechanical stress into an electrical signal. Piezoelectric ceramic materials such as PZT (lead zirconate titanate) are commonly chosen due to their excellent piezoelectric properties.

[0037] The signal conversion circuit unit 14 is responsible for amplifying the weak electrical signal generated by the piezoelectric element to a processable level and converting it into a digital signal for subsequent processing; the data processing module 15 receives the signal from the signal conversion circuit, executes data processing algorithms such as filtering, calibration, data analysis, etc., and then outputs the final result; the temperature compensation module 16 is used to compensate for the measurement error caused by changes in ambient temperature. It is achieved through a built-in temperature sensor and corresponding software algorithm. Certain components can be made of materials with a lower temperature coefficient, or a temperature compensation circuit can be used; the power management module 17 is responsible for powering the entire system; the wireless communication module 18 supports multiple wireless communication protocols such as Bluetooth and Wi-Fi, enabling the sensor to transmit data remotely.

[0038] In addition, the housing 19 provides additional physical protection to prevent the sensor from being physically damaged or affected by environmental factors; the heat sink 110 helps internal components dissipate heat to prevent overheating, and the heat sink 110 can increase the surface area, thereby improving heat exchange efficiency; the wiring port 111 is used to connect to an external device, such as a power supply or a computer, for data transmission or charging; the protective cover 112 is used to protect the wiring port 111 to prevent dust, moisture, etc. from entering and affecting the sensor function.

[0039] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0040] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments do not describe all details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A miniature high-precision force sensor, comprising a sensor body (1), characterized in that: The sensor body (1) comprises: A main body (11), used for encapsulating the entire sensor body (1); A memory micro-elastic body (12) is fixed to the main body (11); An embedded piezoelectric element (13) is embedded in the memory micro-elastic body (12); A signal conversion circuit unit (14) is connected to the embedded piezoelectric element (13) via a wire and is used for transmitting electrical signals; A data processing module (15), connected to the signal conversion circuit unit (14), for data processing and result display; A temperature compensation module (16) connected to the signal conversion circuit unit (14); A power management module (17) is used to supply power to the entire sensor body (1); and a wireless communication module (18) interactively connected to the data processing module (15).

2. The miniature high-precision force sensor according to claim 1, characterized in that: The embedded piezoelectric element (13) is made of piezoelectric ceramic material.

3. The miniature high-precision force sensor according to claim 1, characterized in that: The wireless communication module (18) supports multiple wireless communication modes including Bluetooth and Wi-Fi.

4. The miniature high-precision force sensor according to claim 1, characterized in that: The memory micro-elastic body (12) is made of shape memory alloy material.

5. The miniature high-precision force sensor according to claim 1, characterized in that: The main body (11) is externally sealed with a housing (19), and a heat sink (110) is integrally provided on the circumference of the housing (19).

6. The miniature high-precision force sensor according to claim 5, characterized in that: The rear portion of the housing (19) is provided with a wiring port (111), and the wiring port (111) is adapted to be installed with a protective cover (112).

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