Intelligent stockpiling protection device for transportation transfer point

Abstract

The utility model relates to a transport transfer point stockpile protection device, in particular to a transport transfer point intelligent stockpile protection device, which is characterized in that a conductive material protection circuit, a non-conductive material protection circuit and a 485 communication circuit are arranged in a shell; the conductive material protection circuit comprises a triode, a voltage comparator, a photoelectric coupler and a relay, the non-conductive material protection circuit comprises a single-chip microcomputer and a pressure sensor interface, the device utilizes the conduction function of the triode and the gravity change detection function of the pressure sensor, and cooperates with the voltage comparator, the 485 communication circuit, the photoelectric coupler and the relay under the control of the single-chip microcomputer, so that the pressure sensor interface can be used for detecting the gravity change. Relay switching value change and 485 signal communication functions are completed, and an intelligent stockpiling state protection function at a transportation transfer point is realized. When the conductive material is subjected to stockpiling protection, the sensitivity is adjustable, and the protection action is timely; when stacking protection is carried out on non-conductive materials, the single-chip microcomputer collects signals of the pressure sensor, the signals are processed by the single-chip microcomputer, then whether action signals are sent out, and misoperation can be processed.

Description

Technical Field

[0001] The utility model relates to a material pile protection device at a transport transfer point, in particular to an intelligent material pile protection device at a transport transfer point. Background Art

[0002] The existing transport transfer point pile protection commonly uses mercury tilt switch 5, rotation resistance switch 6 or electrode pile switch 7. The protection of mercury pile at the transport transfer point is as follows: Figure 6 As shown, under normal circumstances, the mercury tilt switch 5 is in an inclined state when the materials are piled at the transport transfer point, and is in a vertical state when the transport transfer point is normal. However, the material stacking conditions at the transport transfer point are different from time to time. During the use of this type of sensor, it is easy to cause the probe to be buried by the pile, the probe cannot be touched after the materials are piled, or the probe is accidentally touched by the material ejection. When used, the pile often does not work or malfunctions due to no material stacking. At the same time, there is a lack of data signal communication function, and the sensor status cannot be actively read remotely. The protection situation of the anti-rotation pile at the transport transfer point is as follows: Figure 7 As shown, the rotary resistance switch 6 needs to use a rotating motor as a driving device. The rotating motor needs to be energized at all times during the use of the rotary resistance switch 6. In addition, the installation position of the rotating motor has great restrictions on its use, and there are blind spots for protection. In field use, there are cases of non-action or malfunction. At the same time, there is a lack of data signal communication function, and the sensor status cannot be actively read remotely. The protection of the electrode pile at the transportation transfer point is as follows: Figure 8 As shown, the electrode stacking switch 7 is installed on the top of the silo. During the use of this type of sensor, moist and viscous materials are easy to stick to the sensor probe and cause malfunction, or malfunction is easy to occur due to large vibrations on site. Non-conductive materials are piled up and do not operate. During on-site use, there are cases of non-operation or malfunction. At the same time, there is a lack of data signal communication function, and the sensor status cannot be actively read remotely.

[0003] The above-mentioned material pile protection function at the transport transfer point is relatively simple, and sometimes does not work or malfunctions during on-site use. At the same time, it lacks data signal communication function and cannot actively read the sensor status remotely. Summary of the Invention

[0004] Aiming at the problems that the protection function of material pile at the transport transfer point is relatively simple, sometimes it does not work or malfunctions during on-site use, and there is a lack of data signal communication function, the utility model provides an intelligent material pile protection device for the transport transfer point.

[0005] The utility model is realized by adopting the following technical solutions: an intelligent material pile protection device for a transport transfer point comprises a shell, wherein a conductive material protection circuit, a non-conductive material protection circuit and a power supply circuit are arranged in the shell;

[0006] The conductive material protection circuit includes a transistor Q2 of model S8050, a voltage comparator U2 of model LM393, an optocoupler U1 of model PC817, a chip U6 of model ULN2001 and a relay RL1. The positive-phase input terminal of the voltage comparator U2 is connected to the power supply through the sixth resistor R6 and is also grounded through the eighth resistor R8. The positive-phase input terminal is also connected to the power supply through the nineteenth resistor R19 and the fourth resistor R4. The positive-phase input terminal of the voltage comparator U2 is connected to the 3rd terminal of the second connector P2, and the 4th terminal of the second connector P2 is grounded. The 3rd and 4th terminals of the second connector P2 serve as the input interface of the conductive material protection circuit. The inverting input terminal of the voltage comparator U2 is connected to the sliding end of the sliding rheostat RP1. The two ends of the sliding rheostat RP1 are respectively connected to the power supply and the ground. The output terminal of the voltage comparator U2 is connected to the power supply through the fourth resistor R4. The voltage comparator The output end of U2 is also connected to the base of the transistor Q2 through the seventh resistor R7, the emitter of the transistor Q2 is grounded, the collector is connected to pin 2 of the photocoupler U1, pin 1 of the photocoupler U1 is connected to the power supply through the second resistor R2, pin 4 of the photocoupler U1 is connected to the power supply, pin 3 of the photocoupler U1 is grounded through the first resistor R1, pin 3 of the photocoupler U1 is connected to pins 1 and 2 of the chip U6, pin 4 of the chip U6 is grounded, pin 5 of the chip U6 is connected to the power supply, one end of the coil of the relay RL1 is connected to the power supply +5V, and is also connected to the positive electrode of the light-emitting diode D2 through the third resistor R3, the negative electrode of the light-emitting diode D2 is connected to the other end of the coil of the relay RL1, pins 6 and 7 of the chip U6 are connected to the negative electrode of the light-emitting diode D2, the contacts of the relay RL1 are connected to the main circuit of the external device, and pin 8 of the chip U6 is connected to the power supply through the twenty-first resistor R21;

[0007] The non-conductive material protection circuit includes a single-chip microcomputer U4 (model STC8G1K08-TSSOP20) and an XH2.54-2PIN pressure sensor interface R11. One end of the pressure sensor interface R11 is connected to a power supply via a ninth resistor R9, and the other end of the pressure sensor interface R11 is grounded. A first capacitor C1 is also connected in parallel across the two ends of the pressure sensor interface R11. Pin 14 of the single-chip microcomputer U4 is connected to one end of the pressure sensor interface R11. An external pressure sensor is connected via the pressure sensor interface R11. Pin 18 of the single-chip microcomputer U4 is connected to pin 3 of the chip U6, and pin 13 of the single-chip microcomputer U4 is connected to pin 8 of the chip U6.

[0008] The power supply circuit provides power to the conductive material protection circuit and the non-conductive material protection circuit.

[0009] The conductive material protection circuit is used to detect the stacking condition of conductive materials, and the non-conductive material protection circuit is used to detect the stacking condition of non-conductive materials.

[0010] The above-mentioned intelligent stacking protection device for transport transfer points is also provided with a 485 communication circuit in the shell. The 485 communication circuit includes a chip U3 of model SP485EEN. Pins 1 and 4 of the chip U3 are respectively connected to pins 19 and 20 of the single-chip microcomputer U4. Pins 2 and 3 of the chip U3 are connected to the collector of the transistor Q3. Pins 2 and 3 are also grounded through the fifteenth resistor R15. The base of the transistor Q3 is connected to pin 4 through the tenth resistor R10. The emitter of the transistor Q3 is connected to the power supply. Pin 5 of the chip U3 is grounded. The 485 communication circuit receives the 485 communication signal through the second connector P2. The power supply circuit also provides power for the 485 communication circuit.

[0011] This device utilizes the transistor's comparative amplification and conduction function, and the pressure sensor's ability to detect gravity changes. Under the control of a single-chip microcomputer, it collaborates with a voltage comparator, a 485 communication circuit, a photocoupler, and a relay to achieve relay switching and 485 signal communication, thus realizing intelligent protection for material pile status at transport transfer points. When protecting piles of conductive materials, the circuit sensitivity is adjustable, ensuring timely protection. When protecting piles of non-conductive materials, the single-chip microcomputer collects the pressure sensor signal, processes it, and issues an action signal, effectively preventing false actions. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is the schematic diagram of the conductive material protection circuit.

[0013] Figure 2 This is a schematic diagram of the non-conductive material protection circuit.

[0014] Figure 3 This is the schematic diagram of the 485 communication circuit.

[0015] Figure 4 This is the schematic diagram of the power supply circuit.

[0016] Figure 5 This is a practical application diagram of the device of this utility model.

[0017] Figure 6 Schematic diagram of mercury pile protection at the transport transfer point.

[0018] Figure 7 This is a schematic diagram of the anti-rotation pile material protection at the transport transfer point.

[0019] Figure 8 Schematic diagram of electrode pile protection at the transport transfer point.

[0020] In the figure: 1-housing, 2-electrode, 3-pressure sensor, 4-material, 5-mercury tilt switch, 6-rotation resistance switch, 7-electrode stacking switch. DETAILED DESCRIPTION

[0021] The intelligent material pile protection device for a transport transfer point comprises a shell 1, wherein a conductive material protection circuit, a non-conductive material protection circuit, a 485 communication circuit and a power supply circuit are arranged in the shell 1.

[0022] The conductive material protection circuit includes a transistor Q2 of model S8050, a voltage comparator U2 of model LM393, an optocoupler U1 of model PC817, a chip U6 of model ULN2001 and a relay RL1. The non-inverting input terminal (pin 3) of the voltage comparator U2 is connected to the power supply VIN through the sixth resistor R6 and is also grounded through the eighth resistor R8. The non-inverting input terminal is also connected to the power supply VIN through the nineteenth resistor R19 and the fourth resistor R4. The non-inverting input terminal of the voltage comparator U2 is connected to the 3rd terminal of the second connector P2, and the 4th terminal of the second connector P2 is grounded. The 3rd and 4th terminals of the second connector P2 serve as the input interface of the conductive material protection circuit. The inverting input terminal (pin 2) of the voltage comparator U2 is connected to the sliding end of the sliding rheostat RP1. The two ends of the sliding rheostat RP1 are respectively connected to the power supply VIN and the ground. The output terminal (pin 1) of the voltage comparator U2 is connected to the power supply VI through the fourth resistor R4. N, the output end of the voltage comparator U2 is also connected to the base of the transistor Q2 through the seventh resistor R7, the emitter of the transistor Q2 is grounded, and the collector is connected to pin 2 of the photoelectric coupler U1. Pin 1 of the photoelectric coupler U1 is connected to the power supply VIN through the second resistor R2, pin 4 of the photoelectric coupler U1 is connected to the power supply +5V, pin 3 of the photoelectric coupler U1 is grounded through the first resistor R1, pin 3 of the photoelectric coupler U1 is connected to pins 1 and 2 of the chip U6, pin 4 of the chip U6 is grounded, pin 5 of the chip U6 is connected to the power supply +5V, one end of the coil of the relay RL1 is connected to the power supply +5V, and is also connected to the positive electrode of the light-emitting diode D2 through the third resistor R3, the negative electrode of the light-emitting diode D2 is connected to the other end of the coil of the relay RL1, pins 6 and 7 of the chip U6 are connected to the negative electrode of the light-emitting diode D2, the contacts of the relay RL1 are connected to the main circuit of the external device, and pin 8 of the chip U6 is connected to the power supply +5V through the twenty-first resistor R21.

[0023] The non-conductive material protection circuit includes a single-chip microcomputer U4 with the model number STC8G1K08-TSSOP20 and an XH2.54-2PIN pressure sensor interface R11. One end of the pressure sensor interface R11 is connected to the power supply +5V through the ninth resistor R9, and the other end of the pressure sensor interface R11 is grounded. A first capacitor C1 is also connected in parallel to both ends of the pressure sensor interface R11. Pin 14 of the single-chip microcomputer U4 is connected to one end of the pressure sensor interface R11. An external pressure sensor is connected through the pressure sensor interface R11. Pin 18 of the single-chip microcomputer U4 is connected to pin 3 of the chip U6, and pin 13 of the single-chip microcomputer U4 is connected to pin 8 of the chip U6.

[0024] In actual application, the device is hung on the top of the silo above the accumulated material through the pressure sensor, the 3-terminal of the second connector P2 is connected to the electrode, and the 4-terminal of the second connector P2 is connected to the housing of the device. The electrode is in a natural hanging state below the device. The electrode is equivalent to one contact of the switch S1, and the accumulated material is equivalent to the other contact of the switch S1.

[0025] As the material piles up and contacts the electrode as it rises, switch S1 closes. The input signal at the non-inverting input of voltage comparator U2 changes, turning on transistor Q2 and optocoupler U1. Pins 1 and 2 of chip U6 input a trigger signal, while pin 7 of chip U6 outputs a low signal. The coil of relay RL1 energizes, its contacts actuate, and the main circuit of the external device loses power, stopping the stacking of materials and triggering the stacking protection. Terminals 3 and 4 of the second connector P2 in the conductive material protection circuit serve as the input interface for the stacking protection circuit, detecting changes in external resistance. Adjustable by the sliding rheostat RP1, the external resistance can be measured from 1Ω to ∞. Pin 8 of chip U6 outputs a signal to microcontroller U4, which then detects the relay's current state.

[0026] When the stacked material is non-conductive, after the material is stacked and contacts the device as the height increases, the signal on the pressure sensor changes, and the 18-pin of the single-chip computer U4 outputs a trigger signal to the 3-pin of the chip U6. The 6-pin of the chip U6 outputs a low level, the coil of the relay RL1 is energized, its contacts are activated, the main circuit of the external device is powered off, the material stops stacking, and the stacking protection occurs.

[0027] The 485 communication circuit includes a chip U3 of model SP485EEN. Pins 1 and 4 of the chip U3 are connected to pins 19 and 20 of the microcontroller U4 respectively. Pins 2 and 3 of the chip U3 are connected to the collector of the transistor Q3. Pins 2 and 3 are also grounded through a fifteenth resistor R15. The base of the transistor Q3 is connected to pin 4 through a tenth resistor R10. The emitter of the transistor Q3 is connected to the power supply +5V. Pin 5 of the chip U3 is grounded and is also connected to the collector of the transistor Q3 through a fourteenth resistor R15. R14 is connected to pin 7, pin 7 is grounded through the fifth voltage-stabilizing diode D5, pin 6 of chip U3 is connected to pin 8 through the twelfth resistor R12, pin 6 is also grounded through the fourth voltage-stabilizing diode D4, pin 8 is also connected to the power supply +5V, and a thirteenth resistor R13 is connected between the fourth voltage-stabilizing diode D4 and the fifth voltage-stabilizing diode D5. Pins 6 and 7 of chip U3 are connected to terminals 5 and 6 of the second connector P2, and the 485 communication circuit receives the 485 communication signal through the second connector P2.

[0028] The power supply circuit includes a chip U5 of model JW5026. Pin 5 of chip U5 is connected to the cathode of diode D6, and the anode of diode D6 is connected to terminal 1 of the second connector P2. Pin 5 is also grounded through a fifth capacitor C5. A sixth capacitor C6 is connected in parallel at both ends of the fifth capacitor C5. Pin 5 is also connected to pin 4 through a sixteenth resistor R16. Pin 5 provides power supply VIN. Pin 2 of chip U5 is grounded. Pin 1 is connected to pin 6 through a second capacitor C2. Pin 6 is connected to one end of the first inductor L1. Pin 3 is grounded through an eighteenth resistor R18 and is also connected to the other end of the first inductor L1 through a seventeenth resistor R17. The other end of the first inductor L1 is grounded through a seventh capacitor C7. A fourth capacitor C4 is connected in parallel at both ends of the seventh capacitor C7. The other end of the first inductor L1 provides power supply +5V.

[0029] Terminals 5 and 6 of the second connector P2 are used to connect to the communication 485 signal, terminals 3 and 4 are used to connect to the external trigger signal (conductive material trigger), and terminals 1 and 2 are used to connect to the external power supply (12V).

[0030] The fourth connector P4 is used to debug the microcontroller 485 communication. Terminals 1 and 4 are connected to the power supply +5V and ground respectively, and terminals 2 and 3 are connected to pins 11 and 12 of the microcontroller U4 on the circuit board.

[0031] Pin 1 of the microcontroller U4 is connected to the cathode of the light-emitting diode D7, and the anode of the light-emitting diode D7 is connected to the power supply +5V through the twentieth resistor R20. The light-emitting diode D7 serves as a working indicator light.

[0032] The utility model has the following technical features:

[0033] 1) The comparison amplification and conduction function of the transistor Q2 is used to detect the accumulation of conductive materials. At the same time, the sliding rheostat RP1 is configured on the detection circuit to adjust the sensitivity of the detection circuit. The detection circuit is sensitive and can act promptly within 1-3 seconds.

[0034] 2) The pressure sensor is used, which has the ability to detect changes in sensor gravity. When non-conductive materials accumulate on the pressure sensor, the pressure sensor detects the change in gravity and sends a signal.

[0035] 3) It is equipped with a single-chip microcomputer, which can collect the pressure sensor signal, and send out an action signal after processing by the single-chip microcomputer. It can handle false actions and collect the signal after comparison and amplification by the transistor Q2.

[0036] 4) Equipped with 485 signal circuit, it can realize the remote transmission function of pressure sensor signal and transistor Q2 amplified signal, making the use function more powerful and flexible.

[0037] 5) Equipped with photoelectric isolation and relays to achieve isolation between internal weak current and external strong current.

Claims

1. Intelligent pile protection device at transport transfer point, characterized by: It comprises a housing (1), wherein a conductive material protection circuit, a non-conductive material protection circuit and a power supply circuit are arranged in the housing (1); The conductive material protection circuit includes a transistor Q2 of model S8050, a voltage comparator U2 of model LM393, an optocoupler U1 of model PC817, a chip U6 of model ULN2001 and a relay RL1. The positive-phase input terminal of the voltage comparator U2 is connected to the power supply through the sixth resistor R6 and is also grounded through the eighth resistor R8. The positive-phase input terminal is also connected to the power supply through the nineteenth resistor R19 and the fourth resistor R4. The positive-phase input terminal of the voltage comparator U2 is connected to the 3rd terminal of the second connector P2, and the 4th terminal of the second connector P2 is grounded. The 3rd and 4th terminals of the second connector P2 serve as the input interface of the conductive material protection circuit. The inverting input terminal of the voltage comparator U2 is connected to the sliding end of the sliding rheostat RP1. The two ends of the sliding rheostat RP1 are respectively connected to the power supply and the ground. The output terminal of the voltage comparator U2 is connected to the power supply through the fourth resistor R4. The voltage comparator The output end of U2 is also connected to the base of the transistor Q2 through the seventh resistor R7, the emitter of the transistor Q2 is grounded, the collector is connected to pin 2 of the photocoupler U1, pin 1 of the photocoupler U1 is connected to the power supply through the second resistor R2, pin 4 of the photocoupler U1 is connected to the power supply, pin 3 of the photocoupler U1 is grounded through the first resistor R1, pin 3 of the photocoupler U1 is connected to pins 1 and 2 of the chip U6, pin 4 of the chip U6 is grounded, pin 5 of the chip U6 is connected to the power supply, one end of the coil of the relay RL1 is connected to the power supply +5V, and is also connected to the positive electrode of the light-emitting diode D2 through the third resistor R3, the negative electrode of the light-emitting diode D2 is connected to the other end of the coil of the relay RL1, pins 6 and 7 of the chip U6 are connected to the negative electrode of the light-emitting diode D2, the contacts of the relay RL1 are connected to the main circuit of the external device, and pin 8 of the chip U6 is connected to the power supply through the twenty-first resistor R21; The non-conductive material protection circuit includes a single-chip microcomputer U4 (model STC8G1K08-TSSOP20) and an XH2.54-2PIN pressure sensor interface R11. One end of the pressure sensor interface R11 is connected to a power supply via a ninth resistor R9, and the other end of the pressure sensor interface R11 is grounded. A first capacitor C1 is also connected in parallel across the two ends of the pressure sensor interface R11. Pin 14 of the single-chip microcomputer U4 is connected to one end of the pressure sensor interface R11. An external pressure sensor is connected via the pressure sensor interface R11. Pin 18 of the single-chip microcomputer U4 is connected to pin 3 of the chip U6, and pin 13 of the single-chip microcomputer U4 is connected to pin 8 of the chip U6. The power supply circuit provides power to the conductive material protection circuit and the non-conductive material protection circuit.

2. The intelligent material pile protection device for transport transfer points according to claim 1 is characterized by: A 485 communication circuit is also provided in the housing. The 485 communication circuit includes a chip U3 of model SP485EEN. Pins 1 and 4 of the chip U3 are connected to pins 19 and 20 of the microcontroller U4 respectively. Pins 2 and 3 of the chip U3 are connected to the collector of the transistor Q3. Pins 2 and 3 are also grounded through a fifteenth resistor R15. The base of the transistor Q3 is connected to pin 4 through a tenth resistor R10. The emitter of the transistor Q3 is connected to the power supply. Pin 5 of the chip U3 is grounded and is also connected to the power supply through a fourteenth resistor R14. Pin 6 of the chip U3 is connected to pin 7, which is grounded through the fifth voltage-stabilizing diode D5. Pin 6 of the chip U3 is connected to pin 8 through the twelfth resistor R12, and pin 6 is also grounded through the fourth voltage-stabilizing diode D4. Pin 8 is also connected to the power supply +5V. A thirteenth resistor R13 is also connected between the fourth voltage-stabilizing diode D4 and the fifth voltage-stabilizing diode D5. Pins 6 and 7 of the chip U3 are connected to the 5th and 6th terminals of the second connector P2. The 485 communication circuit receives the 485 communication signal through the second connector P2, and the power supply circuit also provides power for the 485 communication circuit.

Images