Spray plate assembly and thin film deposition equipment

Abstract

The utility model provides a spray plate assembly and thin film deposition equipment, the spray plate assembly comprises a spray head upper plate, a plurality of mica sheets and a heat insulation piece fixedly arranged on the spray head upper plate, and the plurality of mica sheets are fixedly arranged at the top end of the spray head upper plate at intervals along the radial direction of the spray head upper plate; the heat insulation part comprises a main body and a plurality of isolation parts used for isolating two adjacent mica sheets, the top ends of the isolation parts are fixedly connected with the main body, the main body, the two adjacent isolation parts and the spray head upper plate define a plurality of cooling cavities, and the mica sheets are correspondingly arranged in the cooling cavities respectively; wherein cooling gas is introduced into the plurality of cooling cavities so as to cool the plurality of mica sheets. The multiple mica sheets are used for heating, so that the heat conduction efficiency and stability of the spraying plate are improved; the isolation parts isolate the mica sheets, the isolation parts, the main body and the spray head upper plate define a plurality of cooling cavities, each mica sheet is correspondingly located in the corresponding cooling cavity, and cooling gas is introduced into the cooling cavities to cool the mica sheets, so that the heat dissipation effect of the spray plate assembly is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor production, in particular to a spray plate assembly and thin film deposition equipment. Background Art

[0002] With the development of intelligence, semiconductors are being used more and more. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Most electronic products, such as computers, mobile phones or digital recorders, have core units that are closely related to semiconductors. Among them, semiconductor production technology includes thin film deposition technology, which deposits layers of thin films on the surface of the wafer to create micro devices inside the chip.

[0003] The shower plate assembly is a critical component in thin film deposition equipment. Through its dense, uniform airflow nozzles, it delivers the reactive source gases evenly and stably to the substrate surface, effectively improving film uniformity and process repeatability. To prevent condensation of the liquid chemical source and unnecessary deposition on the shower plate surface, and to ensure process effectiveness, the shower plate must be heated. Currently, heating rods are often used to heat the shower plate, but this method suffers from small contact area, unstable heating effects, or even dry heating. Heat dissipation is also achieved through convection methods such as fans, which can result in poor control accuracy. Utility Model Content

[0004] The embodiments of the present invention provide a shower plate assembly and a thin film deposition device to improve the heating efficiency and stability of the shower plate and improve the heat dissipation effect.

[0005] The utility model provides a spray plate assembly, which includes:

[0006] Sprinkler upper plate;

[0007] A plurality of mica sheets, wherein the plurality of mica sheets are fixedly arranged at a top end of the upper plate of the nozzle at intervals along a radial direction of the upper plate of the nozzle;

[0008] A heat insulating member fixedly mounted on the upper plate of the nozzle, the heat insulating member comprising a main body and a plurality of insulating portions for isolating two adjacent mica sheets, the top of the insulating portion being fixedly connected to the main body, the main body, the two adjacent insulating portions, and the upper plate of the nozzle enclosing a cooling cavity, the cooling cavity being provided with a plurality of mica sheets, each of which corresponds to the mica sheet;

[0009] Wherein, cooling gas is introduced into the plurality of cooling chambers to cool the plurality of mica sheets.

[0010] In the spray plate assembly provided by the present invention, the main body is provided with multiple groups of air inlet holes and air outlet holes, each group of the air inlet holes and the air outlet holes are respectively arranged on two sides of the main body, and each group of the air inlet holes and the air outlet holes respectively form a loop with each of the cooling chambers.

[0011] In the shower plate assembly provided by the present invention, the main body is further provided with a plurality of through holes, and the shower plate assembly further comprises a plurality of temperature controllers, one end of each temperature controller passes through the through hole and is connected to the mica sheet.

[0012] In the shower plate assembly provided by the present invention, the heat insulating member is formed by assembling two semicircular structures.

[0013] In the spray plate assembly provided by the present invention, the upper plate of the nozzle includes an air inlet portion, which is extended upward from the middle part of the upper plate of the nozzle. The air inlet portion is provided with a first mounting groove, which is formed by the downward depression of the top end of the air inlet portion. The spray plate assembly also includes a first sealing ring, which is embedded in the first mounting groove.

[0014] In the spray plate assembly provided by the present invention, the air inlet part is also provided with a first cooling channel, which is located on the side of the first mounting groove close to the edge of the air inlet part, and the first cooling channel is extended along the circumference of the air inlet part; wherein, cooling gas is introduced into the first cooling channel to cool the first sealing ring.

[0015] In the spray plate assembly provided by the present invention, the air inlet part is also provided with a first groove, which is formed by the outer surface of the air inlet part being recessed inward. The first groove is horizontally extended along the circumference of the air inlet part and is located between the mica sheet and the first sealing ring.

[0016] In the spray plate assembly provided by the present invention, a second mounting groove is provided at the bottom end of the upper plate of the nozzle, and the second mounting groove is extended along the circumference of the upper plate of the nozzle. The spray plate assembly also includes a second sealing ring, and the second sealing ring is embedded in the second mounting groove.

[0017] In the spray plate assembly provided by the present invention, a second cooling channel is also provided at the bottom end of the upper plate of the nozzle, and the second cooling channel is located on the side of the second mounting groove close to the edge of the upper plate of the nozzle, and the second cooling channel is extended along the circumference of the upper plate of the nozzle; wherein, cooling gas is introduced into the second cooling channel to cool the second sealing ring.

[0018] In the spray plate assembly provided by the present invention, a second groove is further provided on the top of the nozzle upper plate. The second groove is formed by the top of the nozzle upper plate being recessed downward. The second groove is located between the edge of the main body and the second sealing ring.

[0019] The utility model also provides a thin film deposition device, which includes the shower plate assembly described in any one of the above items.

[0020] The present application fixes a plurality of mica sheets on the upper plate of the nozzle, and the mica sheets are more closely attached to the upper plate of the nozzle, thereby increasing the heat conduction efficiency and stability of the nozzle plate. At the same time, the mica sheets are small in size, reducing the installation space; and the plurality of mica sheets are isolated by the insulating portion of the thermal insulation component. The main body of the thermal insulation component, the insulating portion and the upper plate of the nozzle are combined to form a plurality of cooling cavities. The plurality of mica sheets are respectively located in the plurality of cooling cavities. When cooling gas is introduced into the plurality of cooling cavities, the cooling gas can cool the plurality of mica sheets to improve the heat dissipation effect of the nozzle plate assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a cross-sectional view of a spray plate assembly in an embodiment of the present utility model;

[0023] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0024] Figure 3 for Figure 1 Enlarged view of point B in the middle;

[0025] Figure 4a-4d It is a structural diagram of the heat insulation component in each direction in the embodiment of the utility model;

[0026] Figure 5a-5c This is a structural diagram of the upper plate of the nozzle in various directions in an embodiment of the utility model.

[0027] The reference numerals in the figures are:

[0028] 1. Spray plate assembly; 10. Nozzle upper plate; 110. Air inlet; 111. First mounting groove; 112. First cooling channel; 113. First groove; 114. First vent; 121. Second mounting groove; 122. Second cooling channel; 123. Second groove; 20. Mica sheet; 30. Thermal insulation; 310. Main body; 311. Air inlet; 312. Air outlet; 313. Through hole; 320. Isolation part; 330. Cooling chamber; 40. Temperature controller; 51. First sealing ring; 52. Second sealing ring; 61. Insulation block; 62. Air inlet block; 63. Spray bottom cover; 64. Insulation ring; 65. Spray plate. DETAILED DESCRIPTION

[0029] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. Now, in conjunction with the accompanying drawings, a detailed description of the preferred embodiments of the present utility model will be given.

[0030] Reference Figures 1 to 5c As shown, it shows an embodiment of the shower plate assembly 1 and thin film deposition equipment of the present invention. The shower plate assembly 1 includes a nozzle upper plate 10, a plurality of mica sheets 20 and a heat insulating member 30 fixed to the nozzle upper plate 10. The plurality of mica sheets 20 are fixed to the top of the nozzle upper plate 10 along the radial direction of the nozzle upper plate 10. The heat insulating member 30 includes a main body 310 and a plurality of isolation portions 320 for isolating two adjacent mica sheets 20. The top of the isolation portion 320 is fixedly connected to the main body 310. The main body 310, the two adjacent isolation portions 320 and the nozzle upper plate 10 enclose a cooling cavity 330. There are multiple cooling cavities 330, and the mica sheets 20 are respectively provided in the multiple cooling cavities 330. Cooling gas is introduced into the multiple cooling cavities 330 to cool the multiple mica sheets 20.

[0031] Specifically, current semiconductor thin film deposition equipment, including PECVD, ALD, etc., often needs to heat the shower plate 65 to prevent the liquid chemical source from condensing or to prevent unnecessary deposition on the surface of the shower plate 65, thereby ensuring the process effect; therefore, the shower plate assembly 1 of the present application includes a shower head upper plate 10 and a mica sheet 20, and the shower head upper plate 10 is used to support and fix the mica sheet 20, and the shower head upper plate 10 and the shower plate 65 are jointly enclosed to form a accommodating space, so that the gas flows into the accommodating space and is sprayed onto the wafer through the shower plate 65; the mica sheet 20 has a heating function, thereby heating the shower plate 65, and there are multiple mica sheets 20, and the multiple mica sheets 20 are fixed on the top of the shower head upper plate 10 at radial intervals along the shower head upper plate 10, thereby evenly heating the shower head upper plate 10 to heat the shower plate 65.

[0032] The shower plate assembly 1 also includes a heat insulating member 30, which is fixedly connected to the upper plate 10 of the nozzle, and is used to isolate the heat generated by the mica sheet 20 to avoid affecting the operation of other structural parts; the heat insulating member 30 includes a main body 310 and a plurality of insulating parts 320, and the main body 310 is covered on the outside of the mica sheet 20, and the main body 310 is fixedly connected to the upper plate 10 of the nozzle, and is enclosed with the upper plate 10 of the nozzle to form an installation cavity, and the plurality of mica sheets 20 are all installed in the installation cavity; the top of the insulating part 320 is fixedly connected to the main body 310, that is, the insulating part 320 is extended in a vertical downward direction from the end connected to the main body 310 to abut against the upper plate 10 of the nozzle, and the insulating part 320 is used to isolate two adjacent mica sheets 20, and the plurality of insulating parts 320 are arranged along The radial spacing of the main body 310 is set at the bottom end of the main body 310, and the extension direction of the isolation part 320 is consistent with the extension direction of the mica sheet 20; the main body 310 and the two adjacent isolation parts 320 and the nozzle upper plate 10 enclose a cooling cavity 330. Since there are multiple isolation parts 320, the main body 310 and the multiple isolation parts 320 and the nozzle upper plate 10 enclose multiple cooling cavities 330, that is, the multiple isolation parts 320 divide the installation cavity into multiple cooling cavities 330, and each of the cooling cavities 330 is correspondingly provided with a mica sheet 20; when the mica sheet 20 is heated, cooling gas is introduced into the multiple cooling cavities 330, so that the cooling cavity 330 absorbs heat and cools the multiple mica sheets 20, so as to improve the heat dissipation effect of the spray plate assembly 1.

[0033] In the present application, a plurality of mica sheets 20 are fixed on the nozzle upper plate 10, and the mica sheets 20 are more closely fitted to the nozzle upper plate 10, thereby increasing the thermal conductivity and stability of the spray plate 65. At the same time, the mica sheets 20 are small in size, which reduces the installation space. The plurality of mica sheets 20 are isolated by the insulating portion 320 of the thermal insulation member 30. The main body 310 of the thermal insulation member 30, the insulating portion 320 and the nozzle upper plate 10 are combined to form a plurality of cooling cavities 330. The plurality of mica sheets 20 are respectively located in the plurality of cooling cavities 330. When cooling gas is introduced into the plurality of cooling cavities 330, the cooling gas can cool the plurality of mica sheets 20 to improve the heat dissipation effect of the spray plate assembly 1.

[0034] More specifically, the mica sheet 20 is a circular structure, and the mica sheet 20 is arranged on the nozzle upper plate 10 along the middle part of the nozzle upper plate 10, and the multiple mica sheets 20 are arranged in sequence along the radial direction of the nozzle upper plate 10 around the middle part of the nozzle upper plate 10; the thermal insulation component 30 is made of engineering plastic or ceramic material with low thermal conductivity.

[0035] For example, in this embodiment, the shower plate assembly 1 includes two mica sheets 20 and two cooling cavities 330. The two mica sheets 20 are respectively located in the two cooling cavities 330. The two mica sheets 20 are separated by the insulating portion 320. The cooling cavity 330 body is introduced into the two cooling cavities 330 to dissipate heat from the two mica sheets 20. At the same time, the heating areas of the two mica sheets 20 are separated, and cooling gas is introduced to improve the thermal insulation effect and ensure a low surface temperature.

[0036] In a specific embodiment, referring to Figures 4a to 4d As shown, the main body 310 is provided with multiple groups of air inlet holes 311 and air outlet holes 312, each group of the air inlet holes 311 and the air outlet holes 312 are respectively arranged on both sides of the main body 310, and each group of the air inlet holes 311 and the air outlet holes 312 form a loop with each of the cooling chambers 330. Specifically, the main body 310 is provided with a plurality of groups of air inlet holes 311 and air outlet holes 312, the air inlet holes 311 and the air outlet holes 312 are connected to the cooling cavity 330 and the outside of the heat insulation member 30, the air inlet holes 311 are used to pass the cooling gas into the cooling cavity 330, and the air outlet holes 312 are used to discharge the cooling gas in the cooling cavity 330 to the outside of the heat insulation member 30; each group of the air inlet holes 311 and the air outlet holes 312 are respectively arranged on both sides of the heat insulation member 30, that is, the air inlet holes 311 and the air outlet holes 312 are arranged on the main body along the radial direction of the upper plate 10 of the nozzle relative to each other. On both sides of the body 310, and each group of the air inlet holes 311 and the air outlet holes 312 are correspondingly arranged on each of the cooling cavities 330, so that the air inlet holes 311, the cooling cavities 330 and the air outlet holes 312 form a flow circuit for cooling gas, wherein the cooling gas enters the cooling cavity 330 from the air inlet holes 311, and flows along the circumference of the cooling cavity 330 toward the air outlet holes 312. At this time, the cooling gas absorbs heat from the entire mica sheet 20, and finally the cooling gas flows out of the cooling cavity 330 through the air outlet holes 312 and is discharged by the exhaust pipe set at the factory end.

[0037] Among them, each of the cooling chambers 330 is respectively provided with a group of the air inlet holes 311 and the air outlet holes 312, so as to independently dissipate heat for each of the mica sheets 20, thereby improving the heat dissipation effect of the mica sheets 20, and one of the cooling chambers 330 is corresponding to a group of the air inlet holes 311 and the air outlet holes 312, thereby improving the structural stability of the spray plate assembly 1; at the same time, the cooling gas flow rates of different heating zones can be adjusted separately by flow meters, and the cooling gas is extracted through the exhaust duct, thereby further improving the heat dissipation effect of the spray plate assembly 1.

[0038] In one embodiment, referring to Figures 1 to 4d As shown, the main body 310 is further provided with a plurality of through holes 313 , and the shower plate assembly 1 further includes a plurality of temperature controllers 40 , one end of each temperature controller 40 passes through the through hole 313 and is connected to the mica sheet 20 . Specifically, the main body 310 is also provided with a plurality of through holes 313, which connect the outside of the main body 310 and the cooling cavity 330. The plurality of through holes 313 are respectively arranged on the main body 310 corresponding to the plurality of cooling cavities 330, that is, each of the through holes 313 corresponds to one cooling cavity 330; the spray plate assembly 1 also includes a plurality of temperature controllers 40, which can control the temperature of the mica sheet 20. One end of the temperature controller 40 is passed through the through hole 313 to be electrically connected to the mica sheet 20, so that the temperature of the mica sheet 20 is adjusted by adjusting the temperature controller 40, and the adjustment method is simple; and each mica sheet 20 is controlled by a corresponding temperature controller 40, so that the temperature of each mica sheet 20 can be independently adjusted, thereby increasing the temperature control accuracy of each mica sheet 20, and the heating control accuracy of the spray plate assembly 1 is high.

[0039] More specifically, one end of the temperature controller 40 passes through the via 313 to be electrically connected to the mica sheet 20, and one end of the temperature controller 40 also passes through the mica sheet 20 to be fixedly connected to the nozzle upper plate 10, thereby fixing the temperature controller 40 to the nozzle upper plate 10, thereby improving the fixing stability of the temperature controller 40.

[0040] In this embodiment, the temperatures of the multiple mica sheets 20 can be independently controlled and connected to the temperature control system through AC filters respectively. At the same time, independent internal and external temperature controllers 40 are configured to feedback the actual temperatures of the inner and outer zones. The temperature controller 40 needs to be connected to a TC filter to prevent signal interference. The temperature control system can set the multiple mica sheets 20 to different heating temperatures, and the heat is transferred to the nozzle upper plate 10, and then transferred to the entire spray plate 65 through the spray plate flange.

[0041] In a specific embodiment, referring to Figures 4a to 4dAs shown, the thermal insulation member 30 is formed by assembling two semicircular structures. Specifically, the thermal insulation member 30 is assembled from two semicircular structures to form a full circular structure. The two semicircular structures are spliced ​​together to form the entire thermal insulation member 30, thereby improving the assembly efficiency of the thermal insulation member 30. The thermal insulation member 30 is installed in a butt-jointed manner and then fixed to the nozzle upper plate 10 with screws evenly distributed around the circumference to improve the firmness of the fixation between the thermal insulation member 30 and the nozzle upper plate 10.

[0042] More specifically, the air inlet 311 and the air outlet 312 are both located on the same semicircular structure, and the through hole 313 is located on two semicircular structures, that is, the through hole 313 is assembled from two semicircular structures to form a whole through hole 313, and the through hole 313 is located at the joint of the two semicircular structures, thereby improving the structural stability of the thermal insulation component 30.

[0043] In one embodiment, referring to Figure 1 and Figure 2 、 Figure 5a and Figure 5b As shown, the nozzle upper plate 10 includes an air inlet portion 110, which is extended upward from the middle part of the nozzle upper plate 10. The air inlet portion 110 is provided with a first mounting groove 111, and the first mounting groove 111 is formed by the downward depression of the top end of the air inlet portion 110. The spray plate assembly 1 also includes a first sealing ring 51, which is embedded in the first mounting groove 111. Specifically, the nozzle upper plate 10 includes an air inlet portion 110, the air inlet portion 110 is located in the middle of the nozzle upper plate 10, and the air inlet portion 110 is formed by extending upward from the middle of the nozzle upper plate 10, and the air inlet portion 110 is used to guide the gas into the spray plate 65, and the multiple mica sheets 20 are fixed on the nozzle upper plate 10 around the air inlet portion 110; the top of the air inlet portion 110 is fixedly connected to other structural members, and the other structural members guide the gas to the air inlet portion 110 so that it finally enters the spray plate 65, and a first mounting groove 111 is provided at the top of the air inlet portion 110, the first The mounting groove 111 is formed by a downward depression at the top end of the air inlet portion 110. The first mounting groove 111 is extended along the circumference of the air inlet portion 110, that is, the first mounting groove 111 is a circular ring structure. The spray plate assembly 1 also includes a first sealing ring 51. The first sealing ring 51 is embedded in the first mounting groove 111 along the circumference of the first mounting groove 111. The first sealing ring 51 improves the tightness of the fixation of the air inlet portion 110 and other structural parts, ensures the vacuum sealing when the gas flows from other structural parts to the air inlet portion 110 to enter the interior of the spray plate 65, and avoids air leakage.

[0044] More specifically, the spray plate assembly 1 also includes an insulating block 61, which is located between the upper plate 10 of the nozzle and the air intake block 62. The bottom end of the insulating block 61 extends upward to form a receiving groove, and the air intake portion 110 is embedded in the receiving groove, so that the insulating block 61 is sleeved on the outside of the air intake portion 110, and the top of the air intake portion 110 abuts against the receiving groove wall of the insulating block 61, that is, the first sealing ring 51 is located between the insulating block 61 and the air intake portion 110 to seal the connection between the insulating block 61 and the air intake portion 110; the insulating block 61, the air intake portion 110 and the air intake block 62 are all provided with a gas channel to allow the gas to enter the interior of the spray plate 65 along the gas channel, thereby improving The structural stability of the spray plate assembly 1 is improved, and the safety of the spray plate assembly 1 is improved; at the same time, the bottom end of the insulating block 61 is abutted against one side of the thermal insulation member 30, that is, the bottom end of the insulating block 61 is extended in a direction parallel to the upper plate 10 of the nozzle, and one side of the thermal insulation member 30 extends downward and abuts against the bottom end of the insulating block 61, and the insulating block 61 is completely sleeved on the outside of the air inlet portion 110, thereby improving the firmness of the fixation of the insulating block 61 to the air inlet portion 110 and further avoiding gas leakage; one side of the thermal insulation member 30 is abutted against the bottom end of the insulating block 61, so that one side of the mica sheet 20 is the insulating block 61, thereby avoiding leakage of the mica sheet 20 and improving the safety of the spray plate assembly 1.

[0045] In one embodiment, referring to Figure 1 and Figure 2 、 Figure 5a and Figure 5bAs shown, the air inlet portion 110 is also provided with a first cooling channel 112, which is located on one side of the first mounting groove 111 close to the edge of the air inlet portion 110, and the first cooling channel 112 is extended along the circumference of the air inlet portion 110; wherein, cooling gas is introduced into the first cooling channel 112 to cool the first sealing ring 51. Specifically, the air inlet portion 110 is further provided with a first cooling channel 112, which is located on a side of the first mounting groove 111 close to the edge of the air inlet portion 110, and the first cooling channel 112 is formed by a downward depression at the top end of the air inlet portion 110, and the first cooling channel 112 and the first mounting groove 111 are adjacent to each other, and the first cooling channel 112 is extended along the circumference of the air inlet portion 110, that is, the first cooling channel 112 is arranged around the first mounting groove 111; when the spray plate assembly 1 is working, cooling gas is introduced into the first cooling channel 112 so that the cooling gas flows along the first cooling channel 112, and the cooling gas can conduct heat in the first mounting groove 111, thereby cooling the first sealing ring 51 in the first mounting groove 111, so as to ensure that the actual use temperature of the first sealing ring 51 is lower than the tolerance temperature of the first sealing ring 51, thereby protecting the first sealing ring 51 and increasing the service life of the first sealing ring 51.

[0046] More specifically, refer to Figure 5b As shown, a first air vent 114 is provided on the side of the air inlet portion 110, and the first air vent 114 connects the outside of the air inlet portion 110 and the first cooling channel 112. The cooling gas enters the first cooling channel 112 through the first air vent 114 and flows along the first cooling channel 112 to extract the heat of the air inlet portion 110, especially the heat in the first mounting groove 111, so as to cool the first sealing ring 51 and improve the service life of the first sealing ring 51.

[0047] In a specific embodiment, referring to Figure 1 and Figure 2 、 Figure 5a and Figure 5bAs shown, the air inlet portion 110 is further provided with a first groove 113 , which is formed by an inward depression of the outer surface of the air inlet portion 110 . The first groove 113 is horizontally extended along the circumference of the air inlet portion 110 and is located between the mica sheet 20 and the first sealing ring 51 . Specifically, the air intake portion 110 is further provided with a first groove 113, which is located on the side surface of the air intake portion 110, that is, the first groove 113 is provided on the side of the air intake portion 110 close to the mica sheet 20, and the first groove 113 is horizontally extended along the circumference of the air intake portion 110, and the plane where the first groove 113 is located is parallel to the plane where the mica sheet 20 is located, and the first groove 113 is formed by the inward depression of the outer surface of the air intake portion 110, and the first groove 113 is located between the mica sheet 20 and the first sealing ring 51. Therefore, by providing the first groove 113 between the first sealing ring 51 and the mica sheet 20, that is, providing the first groove 113 between the first sealing ring 51 and the mica sheet 20, that is, providing the first groove 113 between the first sealing ring 51 and the heat source, heat conduction to the position of the first sealing ring 51 is reduced. Since heat is conducted through a medium, the cross-sectional area of ​​the conduction medium is small, and the conduction capacity will become poor, so as to ensure the low temperature near the first sealing ring 51 and further improve the service life of the first sealing ring 51.

[0048] In one embodiment, referring to Figure 1 and Figure 3 、 Figure 5a and Figure 5c As shown, a second mounting groove 121 is provided at the bottom end of the nozzle upper plate 10 , and the second mounting groove 121 is extended along the circumference of the nozzle upper plate 10 . The spray plate assembly 1 also includes a second sealing ring 52 , and the second sealing ring 52 is embedded in the second mounting groove 121 . Specifically, the bottom end of the nozzle upper plate 10 is fixedly connected to other structural parts, and the nozzle upper plate 10 and other structural parts enclose a gas space, and the gas is guided into the gas space through the air inlet 110 and ejected downward; a second mounting groove 121 is provided at the bottom end of the nozzle upper plate 10, and the second mounting groove 121 is formed by the upward depression of the bottom end of the nozzle upper plate 10, and the second mounting groove 121 is extended along the circumference of the nozzle upper plate 10, that is, the second mounting groove 121 is a circular ring structure, and the spray plate assembly 1 also includes a second sealing ring 52, and the second sealing ring 52 is embedded in the second mounting groove 121 along the circumference of the second mounting groove 121, and the second sealing ring 52 improves the tightness of the fixation of the nozzle upper plate 10 and other structural parts, ensures the vacuum sealing of the gas inside the spray plate 65, and avoids air leakage.

[0049] More specifically, the bottom end of the nozzle upper plate 10 is fixedly connected to the spray bottom cover 63. In order to improve the insulation of the spray plate assembly 1, an insulating ring 64 is added at the connection between the nozzle upper plate 10 and the spray bottom cover 63. The insulating ring 64 is fixed at the edge of the nozzle upper plate 10 along the circumference of the nozzle upper plate 10, and the top of the insulating ring 64 is tightly fitted with the bottom end of the nozzle upper plate 10. The bottom end of the nozzle upper plate 10 is provided with a second mounting groove 121. The second mounting groove 121 is located between the nozzle upper plate 10 and the insulating ring 64. The second mounting groove 121 is formed by the upward depression of the bottom end of the nozzle upper plate 10, and the second mounting groove 121 is extended along the circumference of the nozzle upper plate 10; the second sealing ring 52 is embedded in the second mounting groove 121. The second sealing ring 52 improves the tightness of the fixation of the insulating ring 64 and the nozzle upper plate 10, ensures the vacuum sealing of the gas inside the spray plate 65, and avoids air leakage.

[0050] In a specific embodiment, referring to Figure 1 and Figure 3 、 Figure 5a and Figure 5c As shown, a second cooling channel 122 is also provided at the bottom end of the nozzle upper plate 10. The second cooling channel 122 is located on the side of the second mounting groove 121 close to the edge of the nozzle upper plate 10. The second cooling channel 122 is extended along the circumference of the nozzle upper plate 10; wherein, cooling gas is introduced into the second cooling channel 122 to cool the second sealing ring 52. Specifically, a second cooling channel 122 is further provided at the bottom end of the nozzle upper plate 10, and the second cooling channel 122 is located on one side of the second mounting groove 121 close to the edge of the nozzle upper plate 10. The second cooling channel 122 is formed by the upward depression of the bottom end of the nozzle upper plate 10, and the second cooling channel 122 and the second mounting groove 121 are adjacent to each other, and the second cooling channel 122 is extended along the circumference of the nozzle upper plate 10, that is, the second cooling channel 122 is arranged around the second mounting groove 121; when the spray plate assembly 1 is working, cooling gas is introduced into the second cooling channel 122 so that the cooling gas flows along the second cooling channel 122, and the cooling gas can extract the heat in the second mounting groove 121, thereby cooling the second sealing ring 52 in the second mounting groove 121 to ensure that the actual use temperature of the second sealing ring 52 is lower than the tolerance temperature of the second sealing ring 52, thereby protecting the second sealing ring 52 and increasing the service life of the second sealing ring 52.

[0051] More specifically, a second air vent is provided on the side of the nozzle upper plate 10, and the second air vent connects the outside of the nozzle upper plate 10 and the first cooling channel 112. The cooling gas enters the second cooling channel 122 from the second air vent and flows along the second cooling channel 122 to discharge the heat from the nozzle upper plate 10, especially the heat in the second mounting groove 121, so as to cool the second sealing ring 52 and increase the service life of the second sealing ring 52.

[0052] In one embodiment, referring to Figure 1 and Figure 3 、 Figure 5a and Figure 5b As shown, the top of the nozzle upper plate 10 is further provided with a second groove 123, and the second groove 123 is formed by the top of the nozzle upper plate 10 being recessed downward, and the second groove 123 is located between the edge of the main body 310 and the second sealing ring 52. Specifically, the top of the nozzle upper plate 10 is further provided with a second groove 123, and the second groove 123 is located on a position of the nozzle upper plate 10 close to its edge, that is, the second groove 123 is provided on a side of the edge of the mica sheet 20 at the outermost edge close to the edge of the nozzle upper plate 10, and the second groove 123 extends vertically downward along the circumference of the nozzle upper plate 10, and the second groove 123 is located between the outermost mica sheet 20 and the second sealing ring 52, and the second groove 123 is located between the edge of the main body 310 and the second sealing ring 52, that is, the vertical plane where the second groove 123 is located is located on the second sealing ring. The second groove 123 is provided between the second sealing ring 52 and the edge of the main body 310, and the mica sheet 20 is provided on the side of the edge of the main body 310 facing the air inlet 110, that is, the second groove 123 is provided between the second sealing ring 52 and the heat source, thereby reducing the heat conduction to the position of the second sealing ring 52. Since the heat is conducted through the medium, the cross-sectional area of ​​the conduction medium is small, and the conduction capacity will become worse, so as to ensure the low temperature near the second sealing ring 52 and further improve the service life of the second sealing ring 52.

[0053] This embodiment also provides a thin film deposition device (not shown in the figure), which includes a spray plate assembly 1. The spray plate assembly 1 can adopt any one of the spray plate assemblies 1 provided by the present invention. Since the previous description has already made a detailed introduction to the specific structure and working principle of the spray plate assembly 1, for the sake of conciseness of the description, it will not be repeated here.

[0054] The thin film deposition equipment in this embodiment adopts the spray plate assembly 1 provided by the utility model. The spray plate assembly 1 has high heating efficiency and strong stability, good heat dissipation effect, and long service life, thereby improving the working efficiency and structural stability of the thin film deposition equipment. The heating temperature control accuracy of the thin film deposition equipment is high, the heat dissipation effect is good, the product quality produced is better, and the service life of the thin film deposition equipment is increased.

[0055] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A shower plate assembly, characterized in that: include: Sprinkler upper plate; A plurality of mica sheets, wherein the plurality of mica sheets are fixedly arranged at a top end of the upper plate of the nozzle at intervals along a radial direction of the upper plate of the nozzle; A heat insulating member fixedly mounted on the upper plate of the nozzle, the heat insulating member comprising a main body and a plurality of insulating portions for isolating two adjacent mica sheets, the top of the insulating portion being fixedly connected to the main body, the main body, the two adjacent insulating portions, and the upper plate of the nozzle enclosing a cooling cavity, the cooling cavity being provided with a plurality of mica sheets, each of which corresponds to the mica sheet; Wherein, cooling gas is introduced into the plurality of cooling chambers to cool the plurality of mica sheets.

2. The shower plate assembly according to claim 1, wherein: The main body is provided with a plurality of groups of air inlet holes and air outlet holes, each group of the air inlet holes and the air outlet holes are respectively arranged on two sides of the main body, and each group of the air inlet holes and the air outlet holes respectively forms a loop with each of the cooling cavities.

3. The shower plate assembly according to claim 1, wherein: The main body is further provided with a plurality of through holes, and the shower plate assembly further comprises a plurality of temperature controllers, one end of each temperature controller passes through the through hole and is connected to the mica sheet.

4. The shower plate assembly according to any one of claims 1 to 3, characterized in that: The heat insulating element is formed by assembling two semicircular structures.

5. The shower plate assembly according to claim 1, wherein: The upper plate of the nozzle includes an air inlet portion, which is extended upward from the middle part of the upper plate of the nozzle. The air inlet portion is provided with a first mounting groove, which is formed by the top of the air inlet portion being recessed downward. The spray plate assembly also includes a first sealing ring, which is embedded in the first mounting groove.

6. The shower plate assembly according to claim 5, characterized in that: The air inlet portion is also provided with a first cooling channel, which is located on a side of the first mounting groove close to the edge of the air inlet portion and extends along the circumference of the air inlet portion; wherein cooling gas is introduced into the first cooling channel to cool the first sealing ring.

7. The shower plate assembly according to claim 5, wherein: The air inlet portion is further provided with a first groove, which is formed by an inward depression of the outer surface of the air inlet portion. The first groove extends horizontally along the circumference of the air inlet portion and is located between the mica sheet and the first sealing ring.

8. The shower plate assembly according to claim 1, wherein: A second mounting groove is provided at the bottom end of the upper plate of the nozzle, and the second mounting groove is extended along the circumference of the upper plate of the nozzle. The spray plate assembly also includes a second sealing ring, and the second sealing ring is embedded in the second mounting groove.

9. The shower plate assembly according to claim 8, wherein: A second cooling channel is also provided at the bottom end of the upper plate of the nozzle. The second cooling channel is located on the side of the second mounting groove close to the edge of the upper plate of the nozzle. The second cooling channel extends along the circumference of the upper plate of the nozzle; wherein cooling gas is introduced into the second cooling channel to cool the second sealing ring.

10. The shower plate assembly according to claim 8, wherein: The top of the upper plate of the nozzle is further provided with a second groove, which is formed by the top of the upper plate of the nozzle being recessed downwards, and the second groove is located between the edge of the main body and the second sealing ring.

11. A thin film deposition device, characterized in that: The invention comprises the shower plate assembly according to any one of claims 1 to 10.

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