Semiconductor process equipment and wafer transmission state monitoring system thereof

Abstract

The utility model discloses semiconductor process equipment and a wafer transmission state monitoring system thereof, the semiconductor process equipment comprises a mechanical arm, at least one wafer box bearing table and at least one working cavity, the wafer box bearing table is used for bearing a wafer box, and the mechanical arm is used for transmitting a wafer in the wafer box to the working cavity; the wafer transmission state monitoring system comprises a first sensing unit, a second sensing unit, a control module and an indicating lamp, the first sensing unit, the control module and the indicating lamp are arranged on the wafer box bearing table; the second sensing unit is arranged outside the working cavity; the control module is respectively connected with the indicating lamp, the first sensing unit and the second sensing unit; and the control module is configured to determine the wafer transmission state according to the signals output by the first sensing unit and the second sensing unit, and control the state of the indicating lamp according to the wafer transmission state. According to the technical scheme of the utility model, the misoperation risk of operators can be reduced, so that the alarm of semiconductor process equipment is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor preparation, in particular to a semiconductor process equipment and a wafer transmission status monitoring system thereof. Background Art

[0002] During the development of semiconductor technology, different semiconductor products require different manufacturing processes. This has led to a diverse transmission system and the coexistence of old and new equipment throughout the industry. This has led to a variety of equipment transmission status displays and operation indication signals, which has caused great difficulties for production line operators. It is very easy to make mistakes and cause major accidents such as equipment downtime and wafer breakage. For example, if an operator mistakenly removes a wafer cassette during the operation of semiconductor process equipment, it is easy for the completed wafer to fall when it is returned to the wafer cassette, breaking the wafer and requiring equipment downtime for cleaning, which will delay a large amount of production time.

[0003] As production lines expand, the number of devices increases. Many existing devices, due to age and manufacturer factors, cannot achieve unified transmission status display and customized operation indication signals, greatly increasing the risk of operator error. Therefore, the need to simplify operator identification and memory difficulties and reduce the risk of error operation is becoming increasingly urgent. Utility Model Content

[0004] The utility model provides a wafer transmission status monitoring system for semiconductor process equipment to solve the problems existing in the prior art, and can reduce the risk of operator misoperation, thereby reducing semiconductor process equipment alarms.

[0005] In a first aspect, the present invention provides a wafer transfer status monitoring system for semiconductor process equipment, wherein the semiconductor process equipment includes a robotic arm, at least one wafer cassette carrier, and at least one working chamber, wherein the wafer cassette carrier is used to carry a wafer cassette, and the robotic arm is used to transfer wafers in the wafer cassette to the working chamber; the wafer transfer status monitoring system includes: a first sensing unit, a second sensing unit, a control module, and an indicator light;

[0006] The first sensing unit, the control module and the indicator light are arranged on the wafer box carrying platform;

[0007] The second sensing unit is arranged outside the working chamber;

[0008] The control module is connected to the indicator light, the first sensing unit and the second sensing unit respectively; the control module is configured to determine the wafer transmission status based on the signals output by the first sensing unit and the second sensing unit, and control the status of the indicator light based on the wafer transmission status.

[0009] Optionally, the first sensing unit and / or the second sensing unit includes a photoelectric sensor.

[0010] Optionally, the wafer box carrying platform of the semiconductor process equipment includes a wafer box carrying surface;

[0011] The first sensing unit includes a first reflective sensor;

[0012] The first reflective sensor is disposed on the wafer box carrying surface.

[0013] Optionally, the wafer box carrying platform of the semiconductor process equipment includes a wafer box carrying surface and a non-carrying surface located in front of the wafer box carrying surface; the front is the direction in which the wafer is taken out of the wafer box;

[0014] The first sensing unit includes a second reflective sensor;

[0015] The second reflective sensor is disposed on the non-bearing surface.

[0016] Optionally, the working chamber of the semiconductor process equipment includes a wafer entrance and a baffle at least partially surrounding the wafer entrance;

[0017] The second sensing unit includes a third reflective sensor;

[0018] The third reflective sensor is arranged on a side surface of the baffle close to the wafer entrance.

[0019] Optionally, the working chamber of the semiconductor process equipment includes a wafer entrance and a baffle at least partially surrounding the wafer entrance; the baffle includes a first baffle and a second baffle; the first baffle is located above the wafer entrance; and the second baffle is located below the wafer entrance;

[0020] The second sensing unit includes a first photoelectric transmitter and a first photoelectric receiver;

[0021] The first photoelectric transmitter is arranged on a side surface of the first baffle close to the wafer entrance, and the first photoelectric receiver is arranged on a side surface of the second baffle close to the wafer entrance; or,

[0022] The first photoelectric transmitter is arranged on a side surface of the second baffle close to the wafer entrance, and the first photoelectric receiver is arranged on a side surface of the first baffle close to the wafer entrance.

[0023] Optionally, the working chamber of the semiconductor process equipment includes a wafer entrance, a baffle at least partially surrounding the wafer entrance, and a working chamber door; the working chamber door moves in a direction perpendicular to the direction of wafer transfer;

[0024] The second sensing unit includes a fourth reflective sensor;

[0025] The fourth reflective sensor is disposed on a side surface of the baffle close to the wafer entrance, and when the working chamber door moves to a position where it does not block the wafer entrance, the working chamber door blocks the fourth reflective sensor.

[0026] Optionally, the control module is a single chip microcomputer.

[0027] Optionally, the indicator light is a multi-color LED light.

[0028] In a second aspect, the utility model provides a semiconductor process equipment, comprising: a robotic arm, at least one wafer box carrier, at least one working chamber and a wafer transmission status monitoring system of any of the above semiconductor process equipment.

[0029] The technical solution of the present invention is to make the wafer transmission status monitoring system of the semiconductor process equipment include a first sensor unit, a second sensor unit, a control module and an indicator light. The first sensor unit is arranged on the wafer box carrier of the semiconductor process equipment, so that the first sensor unit can monitor whether there is a wafer box on the wafer box carrier and the transmission status of the wafer in the wafer box; the second sensor unit is arranged outside the working chamber of the semiconductor process equipment, so that the second sensor unit can monitor the status of the working chamber and the transmission status of the wafer in the working chamber; the control module is respectively connected to the indicator light, the first sensor unit and the second sensor unit, so that the control module can receive signals output by the first sensor unit and the second sensor unit, and determine the wafer transmission status according to the signals output by the first sensor unit and the second sensor unit to control the status of the indicator light, so that the operator can judge the transmission status of the wafer according to the status of the indicator light, thereby preventing the operator from taking away the wafer box during the operation of the wafer semiconductor process equipment, which is beneficial to reducing the risk of operator's misoperation and thus reducing the alarm of the semiconductor process equipment.

[0030] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A structural block diagram of a wafer transfer status monitoring system for semiconductor process equipment provided by an embodiment of the present utility model;

[0033] Figure 2 A schematic structural diagram of a wafer transfer status monitoring system for semiconductor process equipment provided by an embodiment of the present invention;

[0034] Figure 3 A schematic structural diagram of a first sensing unit of a wafer transfer status monitoring system for semiconductor process equipment provided by an embodiment of the present invention;

[0035] Figure 4 This is a timing diagram of each sensor unit and indicator light provided in an embodiment of the present utility model. DETAILED DESCRIPTION

[0036] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0037] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present invention described herein can be implemented in an order other than that illustrated or described herein.

[0038] This embodiment provides a wafer transmission status monitoring system for semiconductor process equipment. Figure 1 This is a structural block diagram of a wafer transmission status monitoring system for semiconductor process equipment provided by an embodiment of the present invention. Figure 2 A schematic diagram of the structure of a wafer transmission status monitoring system for semiconductor process equipment provided by an embodiment of the present invention. Figure 3 The schematic diagram of the structure of the first sensing unit of the wafer transmission status monitoring system of the semiconductor process equipment provided by the embodiment of the present invention is shown in FIG. Figures 1 to 3As shown, the wafer transmission status monitoring system of the semiconductor process equipment includes a first sensor unit 1, a second sensor unit 2, a control module 3 and an indicator light 4; the first sensor unit 1, the control module 3 and the indicator light 4 are arranged on the wafer box carrier 01; the second sensor unit 2 is arranged outside the working chamber 02; the control module 3 is connected to the indicator light 4, the first sensor unit 1 and the second sensor unit 2 respectively; the control module 3 is configured to determine the wafer transmission status according to the signals output by the first sensor unit 1 and the second sensor unit 2, and control the status of the indicator light 4 according to the wafer transmission status.

[0039] The semiconductor process equipment includes a robotic arm 03 , at least one wafer box carrier 01 and at least one working chamber 02 . The wafer box carrier 01 is used to carry the wafer box, and the robotic arm 03 is used to transfer the wafers in the wafer box to the working chamber 02 .

[0040] Semiconductor processing equipment may include, but is not limited to, semiconductor fabrication equipment, semiconductor cleaning equipment, and semiconductor measurement equipment. Before processing wafers, the semiconductor processing equipment requires robotic arm 03 to transfer wafers from a wafer cassette on a wafer cassette carrier 01 to a working chamber 02, where processing, cleaning, or measurement operations are performed on the wafers. In an optional embodiment, the semiconductor processing equipment further includes a pre-alignment device 04. After robotic arm 03 removes wafers from the wafer cassette, the pre-alignment device 04 performs pre-alignment on the wafers, ensuring that the wafers are transferred from robotic arm 03 to the working chamber 02 in a specific orientation.

[0041] Multiple wafers are placed in the wafer box. During the operation of the semiconductor process equipment, the robot arm 03 performs the steps of taking out the wafers from the wafer box and transferring them to the working chamber 02, and taking out the wafers that have completed the operation in the working chamber 02 from the working chamber 02 and transferring them back to the wafer box in a certain order. During this process, if the operator takes away the wafer box, it is easy for the wafers to fall into the equipment when they are taken out from the working chamber 02 and transferred back to the wafer box due to the removal of the wafer box, thereby causing the equipment to be shut down for cleaning, seriously affecting the production efficiency of the semiconductor process equipment.

[0042] A first sensing unit 1 is mounted on the wafer cassette platform 01 and is used to monitor the presence of a wafer cassette on the platform 01 and the transfer status of the wafers within the cassette. When a wafer cassette is placed on the platform 01, the first sensing unit 1 outputs a first sensing signal. When no wafer cassette is present on the platform 01, the first sensing unit 1 outputs a second sensing signal. This allows the control module to determine the presence of a wafer cassette on the platform 01 based on the first and second sensing signals. When a wafer cassette is present on the platform 01 and the robotic arm 03 is removing a wafer from the cassette or returning it to the cassette, the first sensing unit 1 outputs a third sensing signal. Furthermore, when the robot arm is not removing or returning a wafer, the first sensing unit 1 outputs a fourth sensing signal. This allows the control module to determine the transfer status of the wafers within the cassette based on the third and fourth sensing signals. The transfer status of the wafers in the wafer box may include, but is not limited to, whether the wafers are being taken out of or returned to the wafer box and the number of wafers in the wafer box.

[0043] The first sensing unit 1 may include, but is not limited to, a piezoresistive sensor or a photoelectric sensor. When the first sensing unit 1 includes a piezoresistive sensor, the piezoresistive sensor may be disposed on the support surface of the wafer cassette support platform 01, so that when the wafer cassette is placed on the wafer cassette support platform 01, the signal output by the piezoresistive sensor changes.

[0044] Optionally, the first sensing unit 1 includes a photoelectric sensor, so that the first sensing unit 1 can determine the in-place status of the wafer box and the transmission status of the wafer without contacting the wafer box or the wafer, thereby causing no damage to the wafer box, the wafer or the first sensing unit 1, which is beneficial to improving the service life of semiconductor process equipment and its wafer transfer status monitoring system.

[0045] The wafer box carrier 01 of the semiconductor process equipment includes a wafer box carrier surface 011 and a non-carrying surface 012 located in front of the wafer box carrier surface 011. When the wafer box is placed on the wafer box carrier 01, the wafer box covers the wafer box carrier surface 011.

[0046] Optionally, the first sensing unit 1 includes a first reflective sensor 11, which is arranged on the wafer box carrying surface 011. Since the first reflective sensor 11 includes a light source and a light receiving device, when there is a wafer box on the wafer box carrying platform 01, the light emitted by the light source of the first reflective sensor 11 can be reflected by the wafer box and return to the light receiving device, and the first reflective sensor 11 outputs a first sensing signal. When there is no wafer box on the wafer box carrying platform 01, the light emitted by the light source of the first reflector will not be reflected, so that the light receiving device cannot receive the light emitted by the light source, and the first reflective sensor 11 outputs a second sensing signal. In this way, it is possible to determine whether there is a wafer box on the wafer box carrying platform 01 based on the signal output by the first reflective sensor 11.

[0047] The front of the wafer box carrying surface 011 is the direction in which the wafers are taken out of the wafer box.

[0048] Optionally, the first sensing unit 1 includes a second reflective sensor 12, which is arranged on the non-carrying surface 012. Since the non-carrying surface 012 is located in front of the wafer box carrying surface 011, when the wafer is taken out of the wafer box or returned to the wafer box, the light emitted by the light source of the second reflective sensor 12 is reflected by the wafer and returns to the light receiving device of the second reflective sensor 12, and the second reflective sensor 12 outputs a third sensing signal. When the wafer is not taken out or returned, the light emitted by the light source of the second reflective sensor 12 is not reflected back to the light receiving device of the second reflective sensor 12, and the second reflective sensor 12 outputs a fourth sensing signal. In this way, the transmission status of the wafer in the wafer box can be determined based on the signal output by the second reflective sensor 12.

[0049] In other embodiments, the first sensing unit 1 may further include a first through-beam sensor 13, the first through-beam sensor 13 including a transmitter and a receiver, one of which is located above the front of the wafer box, and the other is located on the non-carrying surface 012, so that when the wafer is taken out of the wafer box or returned to the wafer box, the light emitted by the transmitter is blocked by the wafer, and the receiver cannot receive the light emitted by the transmitter, and the through-beam sensor outputs a third sensing signal. On the contrary, in the non-wafer taking-out or returning time period, the light emitted by the transmitter is received by the receiver, and the through-beam sensor outputs a fourth sensing signal. In this way, the transmission status of the wafer in the wafer box can be determined based on the signal output by the first through-beam sensor 13.

[0050] The second sensing unit 2 is disposed outside the working chamber 02 and is used to monitor the status of the working chamber 02 and the transfer status of wafers within the working chamber 02. The working chamber 02 of the semiconductor processing equipment includes a wafer entrance 021, a baffle 022 that at least partially surrounds the wafer entrance 021, and a working chamber door 023 that moves perpendicular to the direction of wafer transfer. During movement, the working chamber door 023 can exist in at least two states: completely blocking the wafer entrance 021 and not blocking the wafer entrance 021. A robotic arm 03 transfers wafers into the working chamber 02 through the wafer entrance 021. When the robotic arm 03 is about to reach the wafer entrance 021 or the wafer is about to be removed from the working chamber 02, the working chamber door 023 moves from a position completely blocking the wafer entrance 021 (i.e., a closed state) to a position not blocking the wafer entrance 021 (i.e., an open state). At other times, the working chamber door 023 completely blocks the wafer entrance 021.

[0051] When the robot arm 03 is transferring a wafer to or from the working chamber 02 through the wafer entrance 021, the second sensing unit 2 outputs a fifth sensing signal. During periods when the wafer is not being transferred to or removed from the working chamber 02, the second sensing unit 2 outputs a sixth sensing signal. This allows the control module to determine the wafer's transfer status within the working chamber 02 based on the fifth and sixth sensing signals. When the working chamber door 023 completely blocks the wafer entrance 021, the second sensing unit 2 outputs a seventh sensing signal. When the working chamber door 023 does not block the wafer entrance 021, the second sensing unit 2 outputs an eighth sensing signal. This allows the control module to determine the status of the working chamber door 023 based on the seventh and eighth sensing signals.

[0052] Optionally, the second sensing unit 2 includes a photoelectric sensor, so that the second sensing unit 2 can determine the transmission status of the wafer in the working chamber 02 and the status of the working chamber door 023 without contacting the wafer or the working chamber door 023, thereby not causing damage to the second sensing unit 2 of the wafer box, which is beneficial to improving the service life of semiconductor process equipment and its wafer transfer status monitoring system.

[0053] Optionally, the second sensing unit 2 includes a third reflective sensor 21, which is arranged on a side surface of the baffle 022 close to the wafer entrance 021. Since the third reflective sensor 21 includes a light source and a light receiving device, when the wafer is taken out of the wafer box or returned to the wafer box, the light emitted by the light source of the third reflective sensor 21 is reflected by the wafer and returns to the light receiving device of the third reflective sensor 21, and the third reflective sensor 21 outputs a fifth sensing signal. In the non-wafer taking-out or returning time period, the light emitted by the light source of the second reflective sensor 12 is not reflected back to the light receiving device of the second sensor, and the second reflective sensor 12 outputs a sixth sensing signal. In this way, the transmission status of the wafer in the working chamber 02 can be determined based on the fifth sensing signal and the sixth sensing signal output by the second reflective sensor 12.

[0054] Optionally, the baffle 022 includes a first baffle and a second baffle, the first baffle is located above the wafer entrance 021 , and the second baffle is located below the wafer entrance 021 . The second photoelectric sensing unit includes a second opposing-type sensor, which includes a first photoelectric emitter and a first photoelectric receiver. The first photoelectric emitter is arranged on a side surface of the first baffle close to the wafer entrance 021, and the first photoelectric receiver is arranged on a side surface of the second baffle close to the wafer entrance 021, or the first photoelectric emitter is arranged on a side surface of the second baffle close to the wafer entrance, and the first photoelectric receiver is arranged on a side surface of the first baffle close to the wafer entrance 021. Therefore, when the wafer is taken out of the wafer box or returned to the wafer box, the light emitted by the first photoelectric emitter is blocked by the wafer, and the first photoelectric receiver cannot receive the light emitted by the first photoelectric emitter. The second opposing-type sensor outputs a fifth sensing signal. On the contrary, in the non-wafer taking-out or returning time period, the light emitted by the first photoelectric emitter is received by the first photoelectric receiver, and the second opposing-type sensor outputs a sixth sensing signal. In this way, the transmission status of the wafer in the working chamber 02 can be determined based on the signal output by the second opposing-type sensor.

[0055] Optionally, the second photoelectric sensing unit 2 includes a fourth reflective sensor 22, which is arranged on a side surface of the baffle 022 close to the wafer entrance 021, and when the working chamber door 023 moves to a position where it does not block the wafer entrance 021, the working chamber door 023 blocks the fourth reflective sensor 22, so that when the working chamber door 023 is in a closed state, the working chamber door 023 does not block the fourth reflective sensor 22, and the light emitted by the light source of the fourth reflective sensor 22 will not be reflected, so that the reception of the fourth reflective sensor 22 is not affected. The receiving device cannot receive the light emitted by the light source, and the fourth reflective sensor 22 sends out the seventh sensor signal. On the contrary, when the working chamber door 023 is in the open state, the working chamber door 023 blocks the fourth reflective sensor 22. At this time, the light emitted by the light source of the fourth reflective sensor 22 is reflected by the working chamber door 023 and returns to the light receiving device of the fourth reflective sensor 22. The fourth reflective sensor 22 outputs the eighth sensor signal. In this way, the state of the working chamber door 023 can be determined according to the signal output by the second reflective sensor 12.

[0056] The indicator light 4 is provided on the wafer cassette carrier 01 and is at least used to indicate the transfer status of the wafer. In an optional embodiment, the indicator light 4 can emit light of different colors, such as yellow, blue and green, to indicate different transfer statuses of the wafer.

[0057] Optionally, the indicator light 4 is a multi-color LED light, which can increase the service life of the indicator light 4 and is conducive to energy saving and consumption reduction.

[0058] The control module 3 is connected to the indicator light 4, the first sensor unit 1 and the second sensor unit 2 respectively, so that the control module 3 can receive the signals output by the first sensor unit 1 and the second sensor unit 2, determine the wafer transmission status according to the signals output by the first sensor unit 1 and the second sensor unit 2, and control the status of the indicator light 4 according to the wafer transmission status.

[0059] In an optional embodiment, the wafer transfer status monitoring system further includes an alarm (not shown in the figure), which is connected to the control module 3. The control module 3 is also used to determine whether all the wafers are transferred back to the wafer box according to the signal output by the first sensor unit 1. When all the wafers are transferred back to the wafer box, the control module 3 controls the alarm to emit a short beep. When not all the wafers are transferred back to the wafer box, but the wafer box is removed from the wafer box carrier 01 or the wafer is not transferred back to the wafer box for a long time after the operation is completed, the alarm emits a long beep.

[0060] In this embodiment, the wafer transmission status monitoring system of the semiconductor process equipment includes a first sensor unit, a second sensor unit, a control module and an indicator light. The first sensor unit is arranged on the wafer box carrier of the semiconductor process equipment, so that the first sensor unit can monitor whether there is a wafer box on the wafer box carrier and the transmission status of the wafer in the wafer box; the second sensor unit is arranged outside the working chamber of the semiconductor process equipment, so that the second sensor unit can monitor the status of the working chamber and the transmission status of the wafer in the working chamber; the control module is connected to the indicator light, the first sensor unit and the second sensor unit respectively, so that the control module can receive signals output by the first sensor unit and the second sensor unit, and determine the wafer transmission status according to the signals output by the first sensor unit and the second sensor unit to control the status of the indicator light, so that the operator can judge the transmission status of the wafer according to the status of the indicator light, thereby preventing the operator from taking away the wafer box during the operation of the wafer semiconductor process equipment, which is beneficial to reducing the risk of operator misoperation and thus reducing semiconductor process equipment alarms.

[0061] The following explains the working process of the wafer transfer status monitoring system of the semiconductor process equipment in conjunction with the working process of the semiconductor process equipment. Figure 4 This is a timing diagram of each sensor unit and indicator light provided in the embodiment of the present utility model. Figure 4As shown, when the wafer transfer status monitoring system is in standby mode, indicator light 4 is off. When a wafer cassette is placed on wafer cassette carrier 01, first reflective sensor 13 outputs a first sensor signal, entering the wafer cassette in-position state, at which point indicator light 4 continuously emits yellow light. Then, when robotic arm 03 begins to remove the first wafer from the cassette, second reflective sensor 12 outputs a third sensor signal, entering the wafer transfer state, at which point indicator light 4 continuously emits green light. During wafer transfer by robotic arm 03, second reflective sensor 12 monitors the transfer status of wafers in and out of the cassette in real time. Based on the sensor signal output by second reflective sensor 12, control module 3 determines whether the number of wafers removed from and returned to the cassette is consistent. Third reflective sensor 21 monitors the transfer status of wafers in and out of working chamber 02 in real time. Based on the sensor signal output by third reflective sensor 21, control module 3 determines whether the number of wafers transferred into and out of working chamber 02 is consistent. The fourth reflective sensor 22 detects the opening and closing status of the working chamber door 023 in real time. When the working chamber door 023 is closed, if there are wafers in the working chamber 02, the chamber door is closed for the equipment operation. When the working chamber door 023 is closed, if all the wafers in the working chamber 02 have been transferred out, the chamber door is closed for the equipment operation. When the operation is completed, the control module determines whether all the wafers in the wafer box are transferred back to the box based on the sensor signal output by the second reflective sensor 12. If there are wafers that have not been transferred back, it is necessary to wait for the wafers to be transferred back. When all the wafers are returned to the wafer box, the operation is completed, and the indicator light 4 continues to emit blue light. When the wafer box is removed from the wafer box carrier 01, the first reflective sensor 11 outputs a second sensor signal and returns to the standby state. At this time, the indicator light 4 goes out. If the wafer box is removed from the wafer box carrier 01 during the transfer state or the wafer is not returned to the wafer box for a long time after the operation is completed, the error state is entered. At this time, the indicator light 4 emits red light and the alarm emits a long beep.

[0062] It should be noted that Figure 4 The case where there are three wafers in the wafer box is shown as an example only and is not limiting.

[0063] Based on the same concept, this embodiment further provides a semiconductor process equipment. The semiconductor process equipment includes a robotic arm, at least one wafer cassette carrier, at least one working chamber, and the wafer transfer status monitoring system for the semiconductor process equipment provided in any of the above embodiments. Therefore, the semiconductor process equipment provided in this embodiment has the corresponding structure and features of the wafer transfer status monitoring system for the semiconductor process equipment provided in any of the above embodiments, and can achieve the beneficial effects of the wafer transfer status monitoring system for the semiconductor process equipment provided in any of the above embodiments. For similarities, please refer to the above description.

[0064] The above specific embodiments do not limit the scope of protection of this utility model. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model shall be included within the scope of protection of this utility model.

Claims

1. A wafer transfer status monitoring system for semiconductor process equipment, characterized in that: The semiconductor process equipment includes a robot arm, at least one wafer box carrying platform and at least one working chamber, wherein the wafer box carrying platform is used to carry a wafer box, and the robot arm is used to transfer the wafers in the wafer box to the working chamber; The wafer transmission status monitoring system includes: a first sensing unit, a second sensing unit, a control module and an indicator light; The first sensing unit, the control module and the indicator light are arranged on the wafer box carrying platform; The second sensing unit is arranged outside the working chamber; The control module is connected to the indicator light, the first sensing unit and the second sensing unit respectively; the control module is configured to determine the wafer transmission status based on the signals output by the first sensing unit and the second sensing unit, and control the status of the indicator light based on the wafer transmission status.

2. The wafer transfer status monitoring system for semiconductor process equipment according to claim 1, characterized in that: The first sensing unit and / or the second sensing unit includes a photosensor.

3. The wafer transfer status monitoring system for semiconductor process equipment according to claim 2, wherein: The wafer box carrier of the semiconductor process equipment includes a wafer box carrier surface; The first sensing unit includes a first reflective sensor; The first reflective sensor is disposed on the wafer box carrying surface.

4. The wafer transfer status monitoring system for semiconductor process equipment according to claim 2, wherein: The wafer box carrier of the semiconductor process equipment includes a wafer box carrying surface and a non-carrying surface located in front of the wafer box carrying surface; the front is the direction in which the wafer is taken out of the wafer box; The first sensing unit includes a second reflective sensor; The second reflective sensor is disposed on the non-bearing surface.

5. The wafer transfer status monitoring system for semiconductor process equipment according to claim 2, wherein: The working chamber of the semiconductor process equipment includes a wafer entrance and a baffle at least partially surrounding the wafer entrance; The second sensing unit includes a third reflective sensor; The third reflective sensor is arranged on a side surface of the baffle close to the wafer entrance.

6. The wafer transfer status monitoring system for semiconductor process equipment according to claim 2, wherein: The working chamber of the semiconductor process equipment includes a wafer entrance and a baffle at least partially surrounding the wafer entrance; the baffle includes a first baffle and a second baffle; the first baffle is located above the wafer entrance; The second baffle is located below the wafer entrance; The second sensing unit includes a first photoelectric transmitter and a first photoelectric receiver; The first photoelectric transmitter is arranged on a side surface of the first baffle close to the wafer entrance, and the first photoelectric receiver is arranged on a side surface of the second baffle close to the wafer entrance; or, The first photoelectric transmitter is arranged on a side surface of the second baffle close to the wafer entrance, and the first photoelectric receiver is arranged on a side surface of the first baffle close to the wafer entrance.

7. The wafer transfer status monitoring system for semiconductor process equipment according to claim 2, wherein: The working chamber of the semiconductor process equipment includes a wafer entrance, a baffle at least partially surrounding the wafer entrance, and a working chamber door; the working chamber door moves along a direction perpendicular to the direction of wafer conveyance; The second sensing unit includes a fourth reflective sensor; The fourth reflective sensor is disposed on a side surface of the baffle close to the wafer entrance, and when the working chamber door moves to a position where it does not block the wafer entrance, the working chamber door blocks the fourth reflective sensor.

8. The wafer transfer status monitoring system for semiconductor process equipment according to claim 1, wherein: The control module is a single chip microcomputer.

9. The wafer transfer status monitoring system for semiconductor process equipment according to claim 1, wherein: The indicator light is a multi-color LED light.

10. A semiconductor process equipment, characterized in that: include: A robotic arm, at least one wafer box carrier, at least one working chamber, and a wafer transfer status monitoring system for semiconductor process equipment as described in any one of claims 1 to 9.

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