Ceramic substrate edge semi-blind hole electroplating structure

Abstract

The utility model discloses a semi-blind hole electroplating structure of a ceramic substrate edge. The semi-blind hole electroplating structure comprises a ceramic substrate, a metal bottom layer, a metal thickening layer, a pattern electroplating layer and an anti-oxidation metal covering layer, a semi-blind hole is formed in the plate edge of the ceramic substrate; the metal bottom layer covers the surface of the ceramic substrate and the inner wall face of the semi-blind hole, and the metal bottom layer comprises a first covering part and a second covering part which are integrally formed and connected. The semi-blind hole is formed in the half side of the ceramic substrate, and the first covering part and the metal thickening layer are arranged in a matched mode, so that solder paste can overflow into the semi-blind hole in the device welding process, an operator can judge whether the device is well welded or not by observing whether the solder paste exists in the semi-blind hole or not, and convenience is brought to welding operation; and moreover, by arranging the anti-oxidation metal covering layer, the metal thickening layer and the pattern electroplating layer are covered by the anti-oxidation metal covering layer, so that the metal thickening layer and the pattern electroplating layer are effectively prevented from being oxidized, and the service life of the product is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of ceramic substrate technology, in particular to a semi-blind hole electroplating structure on the edge of a ceramic substrate. Background Art

[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single or double sides) of an aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The resulting ultra-thin composite substrate has excellent electrical insulation properties, high thermal conductivity, excellent soft solderability and high adhesion strength. It can also be etched with various patterns like a PCB board and has a large current carrying capacity. Therefore, ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology. Ceramic substrates have many advantages: (1) Strong mechanical stress and stable shape; high strength, high thermal conductivity, high insulation; strong bonding force and corrosion resistance. (2) Excellent thermal cycle performance, with a cycle number of up to 50,000 times and high reliability. (3) Like PCB boards (or IMS substrates), various graphic structures can be etched; no pollution and no environmental hazards. (4) Wide operating temperature range of -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.

[0003] During the production of ceramic substrates, a metal base layer and a patterned electroplated layer (i.e., surface circuitry, used for soldering components) are typically electroplated onto the surface of the ceramic substrate. During soldering, solder paste often overflows onto the surface of the ceramic substrate and is obscured by the components, making it impossible to determine whether the components have been properly soldered, thus causing inconvenience in the soldering process. Therefore, it is necessary to develop a solution to this problem. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies in the prior art, and its main purpose is to provide a semi-blind hole electroplating structure on the edge of a ceramic substrate, which can effectively solve the problem of being unable to determine whether the device is welded properly during device welding on the existing ceramic substrate.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A ceramic substrate edge semi-blind hole electroplating structure includes a ceramic substrate, a metal base layer, a metal thickening layer, a patterned electroplating layer, and an anti-oxidation metal covering layer; a semi-blind hole is formed on the edge of the ceramic substrate; the metal base layer is molded to cover the surface of the ceramic substrate and the inner wall surface of the semi-blind hole, and the metal base layer includes a first covering portion and a second covering portion integrally formed and connected, the first covering portion is located on the surface edge of the ceramic substrate and the inner wall surface of the semi-blind hole, and the first covering portion completely covers the inner wall surface of the semi-blind hole, and the second covering portion is located on the surface of the ceramic substrate; the metal thickening layer is molded and overlapped on the outer surface of the first covering portion; the patterned electroplating layer is molded and overlapped on the outer surface of the second covering portion; and the anti-oxidation metal covering layer completely covers the outer surface of the metal thickening layer and the outer surface of the patterned electroplating layer.

[0007] As a preferred solution, the semi-blind hole is formed by laser drilling in the early stage and water jet cutting in the later stage.

[0008] As a preferred solution, the semi-blind hole is a semicircular hole.

[0009] As a preferred solution, there are multiple half-blind holes, which are arranged at intervals on the edge of the ceramic substrate. A first covering portion is provided in each half-blind hole, and the aforementioned metal thickening layer is provided on each first covering portion.

[0010] As a preferred solution, the metal base layer is formed by electroplating.

[0011] As a preferred solution, the metal thickening layer is made of copper and is formed by electroplating.

[0012] As a preferred solution, the patterned electroplating layer is made of copper and is formed by electroplating.

[0013] As a preferred solution, the anti-oxidation metal covering layer is formed by electroplating.

[0014] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0015] By providing a semi-blind hole on half of the ceramic substrate, and cooperating with a first covering portion and a metal thickening layer, solder paste can overflow into the semi-blind hole during the device soldering process. The operator can judge whether the device is soldered properly by observing whether there is solder paste in the semi-blind hole, which brings convenience to the soldering operation; and by providing an anti-oxidation metal covering layer, the metal thickening layer and the pattern electroplating layer are covered with the anti-oxidation metal covering layer, effectively preventing the metal thickening layer and the pattern electroplating layer from being oxidized, which is conducive to extending the service life of the product.

[0016] In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a top view of the first state of the manufacturing process of the preferred embodiment of the present invention;

[0018] Figure 2 This is a top view of the second state of the manufacturing process of the preferred embodiment of the utility model;

[0019] Figure 3 This is a cross-sectional view of the first state of the manufacturing process of the preferred embodiment of the present utility model;

[0020] Figure 4 This is a cross-sectional view of the second state of the manufacturing process of the preferred embodiment of the present invention;

[0021] Figure 5 This is a cross-sectional view of the third state of the manufacturing process of the preferred embodiment of the present utility model;

[0022] Figure 6 This is a cross-sectional view of the fourth state of the manufacturing process of the preferred embodiment of the present utility model;

[0023] Figure 7 This is a cross-sectional view of the fifth state of the manufacturing process of the preferred embodiment of the present utility model;

[0024] Figure 8 This is a cross-sectional view of the sixth state of the manufacturing process of the preferred embodiment of the present utility model;

[0025] Figure 9 This is a cross-sectional view of the seventh state of the manufacturing process of the preferred embodiment of the present utility model;

[0026] Figure 10 This is a cross-sectional view of the eighth state of the manufacturing process of the preferred embodiment of the present utility model;

[0027] Figure 11 This is a cross-sectional view of the ninth state of the manufacturing process of the preferred embodiment of the present utility model;

[0028] Figure 12 This is a cross-sectional view of the tenth state of the manufacturing process of the preferred embodiment of the present utility model;

[0029] Figure 13 This is a cross-sectional view of the eleventh state of the manufacturing process of the preferred embodiment of the present utility model;

[0030] Figure 14 This is a cross-sectional view of the twelfth state of the manufacturing process of the preferred embodiment of the present utility model;

[0031] Figure 15This is a cross-sectional view of the thirteenth state of the manufacturing process of the preferred embodiment of the present utility model;

[0032] Figure 16 This is a cross-sectional view of the fourteenth state of the manufacturing process of the preferred embodiment of the present utility model;

[0033] Figure 17 This is a cross-sectional view of the fifteenth state of the manufacturing process of the preferred embodiment of the present utility model;

[0034] Figure 18 This is a cross-sectional view of the sixteenth state of the manufacturing process of the preferred embodiment of the present utility model;

[0035] Figure 19 This is a cross-sectional view of the seventeenth state of the manufacturing process of the preferred embodiment of the present utility model;

[0036] Figure 20 It is a cross-sectional view of the eighteenth state of the manufacturing process of the preferred embodiment of the present invention.

[0037] Description of the accompanying drawings:

[0038] 10. Ceramic substrate 11. Semi-blind via

[0039] 101, whole blind hole 20, metal bottom layer

[0040] 21. First covering part 22. Second covering part

[0041] 30. Metal thickening layer 40. Graphic electroplating layer

[0042] 50. Anti-oxidation metal covering layer 61. First photosensitive film

[0043] 611, first slot 62, second photosensitive film

[0044] 621, second slot 63, ink layer

[0045] 631. The third slot. DETAILED DESCRIPTION

[0046] Please refer to Figures 1 to 20 As shown, it shows the specific structure of a preferred embodiment of the present invention, including a ceramic substrate 10, a metal bottom layer 20, a metal thickening layer 30, a patterned electroplating layer 40 and an anti-oxidation metal covering layer 50.

[0047] The ceramic substrate 10 has a semi-blind hole 11 formed along its edge. In this embodiment, the semi-blind hole 11 is formed by laser drilling in the early stage and water jet cutting in the later stage. The semi-blind hole 11 is a semicircular hole. There are multiple semi-blind holes 11, which are spaced apart along the edge of the ceramic substrate 10.

[0048] The metal base layer 20 is formed to cover the surface of the ceramic substrate 10 and the inner wall of the semi-blind hole 11. The metal base layer 20 includes a first covering portion 21 and a second covering portion 22 that are integrally formed and connected. The first covering portion 21 is located at the surface edge of the ceramic substrate 10 and the inner wall of the semi-blind hole 11, and the first covering portion 21 completely covers the inner wall of the semi-blind hole 11. The second covering portion 22 is located on the surface of the ceramic substrate 10. In this embodiment, the metal base layer 20 is formed by electroplating. A first covering portion 21 is provided in each half of the blind hole 11.

[0049] The metal thickening layer 30 is formed and overlapped on the outer surface of the first covering portion 21. In this embodiment, the metal thickening layer 30 is provided on each first covering portion 21. The metal thickening layer 30 is made of copper and is formed by electroplating.

[0050] The patterned electroplating layer 40 is formed and overlapped on the outer surface of the second covering portion 22. In this embodiment, the patterned electroplating layer 40 is made of copper and formed by electroplating. The surface of the patterned electroplating layer 40 is higher than the surface of the metal thickening layer 30.

[0051] The anti-oxidation metal covering layer 50 completely covers the outer surface of the metal thickening layer 30 and the outer surface of the pattern electroplated layer 40. The anti-oxidation metal covering layer 50 is made of an oxidation-resistant metal and can effectively prevent oxidation of the metal thickening layer 30 and the pattern electroplated layer 40. In this embodiment, the anti-oxidation metal covering layer 50 is formed by electroplating.

[0052] The production process of this embodiment is described in detail as follows:

[0053] First, if Figure 1 and Figure 3 As shown, the ceramic substrate 10 is supplied, and then, as shown Figure 2 and Figure 4 As shown, the edge of the ceramic substrate 10 is laser drilled to form a full blind hole 101, and then, as shown in FIG. Figure 5 As shown, a metal bottom layer 20 is formed on a ceramic substrate 10 by electroplating, and then, as shown in FIG. Figure 6 As shown, a first photosensitive film 61 is attached to the metal bottom layer 20, and the metal bottom layer 20 is completely covered by the first photosensitive film 61. Then, as shown in FIG. Figure 7 As shown, the first photosensitive film 61 is exposed and developed to form a first slot 611, which is located directly above the entire blind hole 101. Figure 8 As shown, the first slot 611 is electroplated and thickened, so that a metal thickening layer 30 is formed on the first covering portion 21, and then, as shown in FIG. Figure 9 As shown, the first photosensitive film 61 is removed, and then, as shown Figure 10As shown, a second photosensitive film 62 is attached, and the metal thickening layer 30 is covered by the second luminous film 62; then, as shown in FIG. Figure 11 As shown, the second light emitting film 62 is exposed and developed to form a second slot 621, and the second covering portion 22 is exposed in the second slot 621. Then, as shown in FIG. Figure 12 As shown, the second slot 621 is electroplated and thickened so that a patterned electroplating layer 40 is formed on the second covering portion 22. Then, as shown in FIG. Figure 13 As shown, the second photosensitive film 62 is removed, and then, as shown Figure 14 As shown, an ink layer 63 is applied to the metal thickening layer 30 and the pattern plating layer 40 for shielding, and then, as shown in FIG. Figure 15 As shown, the ink layer 63 is ablated by laser to form a third slot 631 in the ink layer 63. Then, as shown in FIG. Figure 16 As shown, the metal thickening layer 30 exposed in the third slot 631 and the corresponding first covering portion 21 are etched, and then, as shown in FIG. Figure 17 As shown, the ink layer 63 is removed; then, as shown Figure 18 As shown, an anti-oxidation metal covering layer 50 is formed by electroplating outside the metal thickening layer 30 and the pattern electroplating layer 40, and then, as shown in FIG. Figure 19 As shown, a water jet is used to cut the edge of the ceramic substrate 10 to form a semi-blind hole 11, and the excess waste outside the edge of the plate is removed to obtain a finished product (such as Figure 20 shown).

[0054] During use, components are soldered on the anti-oxidation metal covering layer 50 corresponding to the patterned electroplating layer 40. During the soldering process, the solder paste overflows into the semi-blind via 11. By observing the solder paste flowing into the semi-blind via 11, it can be determined whether the component is soldered.

[0055] The design focus of the utility model is as follows: by providing a semi-blind hole on half of the ceramic substrate, and coordinating the provision of a first covering portion and a metal thickening layer, solder paste can overflow into the semi-blind hole during the device soldering process. The operator can judge whether the device is soldered properly by observing whether there is solder paste in the semi-blind hole, which brings convenience to the soldering operation; and by providing an anti-oxidation metal covering layer, the anti-oxidation metal covering layer is used to cover the metal thickening layer and the pattern electroplating layer, effectively preventing the metal thickening layer and the pattern electroplating layer from being oxidized, which is conducive to extending the service life of the product.

[0056] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A ceramic substrate edge semi-blind hole electroplating structure, characterized by: The invention comprises a ceramic substrate, a metal base layer, a metal thickening layer, a patterned electroplating layer and an anti-oxidation metal covering layer; a semi-blind hole is formed on the edge of the ceramic substrate; the metal base layer is formed to cover the surface of the ceramic substrate and the inner wall of the semi-blind hole, and the metal base layer comprises a first covering portion and a second covering portion integrally formed and connected, the first covering portion is located on the surface edge of the ceramic substrate and the inner wall of the semi-blind hole, and the first covering portion completely covers the inner wall of the semi-blind hole, and the second covering portion is located on the surface of the ceramic substrate; the metal thickening layer is formed and overlapped on the outer surface of the first covering portion; the patterned electroplating layer is formed and overlapped on the outer surface of the second covering portion; the anti-oxidation metal covering layer completely covers the outer surface of the metal thickening layer and the outer surface of the patterned electroplating layer.

2. The ceramic substrate edge semi-blind hole electroplating structure according to claim 1, characterized in that: The semi-blind hole is formed by laser drilling in the early stage and water jet cutting in the later stage.

3. The ceramic substrate edge semi-blind hole electroplating structure according to claim 1, characterized in that: The semi-blind hole is a semicircular hole.

4. The ceramic substrate edge semi-blind hole electroplating structure according to claim 1, characterized in that: There are a plurality of half blind holes, which are arranged at intervals on the edge of the ceramic substrate. A first covering portion is provided in each half blind hole, and the aforementioned metal thickening layer is provided on each first covering portion.

5. The ceramic substrate edge semi-blind hole electroplating structure according to claim 1, characterized in that: The metal base layer is formed by electroplating.

6. The ceramic substrate edge semi-blind hole electroplating structure according to claim 1, characterized in that: The metal thickening layer is made of copper and is formed by electroplating.

7. The ceramic substrate edge semi-blind hole electroplating structure according to claim 1, characterized in that: The patterned electroplating layer is made of copper and is formed by electroplating.

8. The ceramic substrate edge semi-blind hole electroplating structure according to claim 1, characterized in that: The anti-oxidation metal covering layer is formed by electroplating.

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