Anti-scour-off PCB (Printed Circuit Board) and inverter

Abstract

The utility model provides an anti-scour-off PCB (Printed Circuit Board). The anti-scour-off PCB comprises a board body, a patch element, a pin element and an anti-scour-off red glue layer, the board body is provided with a first bonding pad and a pin mounting part, the periphery of the first bonding pad is provided with a welding area, the welding area is coated with a solder paste layer, the pin mounting part is located on the other side of the board body, and the pin mounting part is provided with a pin hole; and the distance between the pin hole and the adjacent welding area is less than 3mm. The surface-mounted components are installed on the corresponding first bonding pads and welded to the corresponding welding areas. The pin elements are installed on the corresponding pin installation parts, and pins of the pin elements are located in the pin holes. And the anti-drop red glue layer is coated on the first bonding pad and is connected with the patch element. The anti-falling red glue layer ensures that the patch element is kept stable in the welding process, and poor welding caused by movement or inclination is avoided.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to an anti-shock PCB board and an inverter. Background Art

[0002] In the manufacturing of modern electronic products, the design of printed circuit boards (PCBs) is becoming increasingly complex in order to enhance product integration and functional diversity. During the design process, it is often necessary to integrate both surface mount components (SMDs) and pin components to meet various electrical connection requirements. However, such printed circuit boards containing surface mount components and pin components are prone to design defects during the R&D and design stages. Figure 1 For example, the printed circuit board (PCB) shown here failed to adequately consider the distance between the plug-in holes and adjacent surface-mount components during layout. This extremely narrow spacing resulted in the unprotected surface-mount components being directly exposed to the high-temperature solder wave during the wave soldering process, causing them to fall off and compromising the overall quality and reliability of the product. Utility Model Content

[0003] The purpose of the present disclosure is to overcome the deficiencies in the prior art and to provide an anti-slip PCB board and inverter that prevent chip components from being damaged or falling off during wave soldering.

[0004] The purpose of this disclosure is achieved through the following technical solutions:

[0005] An anti-slip PCB board includes:

[0006] A board body, the board body being provided with a first solder pad and a pin mounting portion, the first solder pad being provided with a soldering area around its periphery, the soldering area being coated with a layer of solder paste, the pin mounting portion being located on the other side of the board body, the pin mounting portion being provided with a pin hole, wherein the distance between the pin hole and the adjacent soldering area is less than 3 mm;

[0007] a patch component, the patch component being mounted on the corresponding first pad and soldered to the corresponding soldering area;

[0008] a pin element, the pin element being mounted on the corresponding pin mounting portion, the pin of the pin element being located in the pin hole; and

[0009] An anti-debonding red glue layer is applied to the first solder pad and is connected to the patch component.

[0010] In one embodiment, there are multiple first solder pads and multiple pin mounting portions.

[0011] In one embodiment, the thickness of the anti-debonding red glue layer is 0.1 mm to 0.5 mm.

[0012] In one embodiment, the anti-red glue layer includes a plurality of coating areas, and the coating areas are circular or long strips.

[0013] In one embodiment, the plurality of coating zones are independent of each other.

[0014] In one embodiment, the plate body includes at least a base material layer, a conductive layer and a protective layer, the welding area is located on the conductive layer, and the anti-debonding red glue is coated on the protective layer.

[0015] In one embodiment, the board body is provided with a connection hole, and the connection hole is used to connect a wave soldering fixture.

[0016] An inverter includes the anti-shock PCB board described in any one of the above embodiments.

[0017] Compared with the prior art, the present disclosure has at least the following advantages:

[0018] 1. The anti-off red glue layer can fill the gap between the patch component and the PCB board, enhance the adhesion between the component and the PCB, prevent the patch component from moving or falling off due to the impact of vibration or high-temperature solder waves of wave soldering, ensure that the patch component remains stable during the soldering process, and avoid poor soldering due to movement or tilting.

[0019] 2. The anti-stripping red glue layer raises the patch components, which can improve the geometry of the solder joints, make the welding area more uniform, and thus improve the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a structural diagram of a PCB board that prevents it from falling off from one perspective according to an embodiment;

[0022] Figure 2 for Figure 1 A cross-sectional view of the anti-slip PCB board shown;

[0023] Figure 3 for Figure 1 A partial cross-sectional view of the anti-stripping PCB board is shown. DETAILED DESCRIPTION

[0024] To facilitate understanding of the present disclosure, a more comprehensive description of the present disclosure will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. The terms used herein in the specification of this disclosure are intended only to describe specific embodiments and are not intended to limit this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] In order to better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure is further described in detail below with reference to specific embodiments:

[0028] See also Figures 1 to 3 As shown, it is an anti-stripping PCB board 10 of an embodiment of the present invention, including a board body 100, a patch component 200, a pin component 300 and an anti-stripping red glue layer 400. The board body 100 is provided with a first soldering pad (not shown) and a pin mounting portion (not shown). The periphery of the first soldering pad is provided with a welding area (not shown), and the welding area is coated with a solder paste layer 111. The pin component 300 mounting portion is located on the other side of the board body 100, and the pin mounting portion is provided with a pin hole; wherein, the distance between the pin hole and the adjacent welding area is less than 3mm. The patch component 200 is mounted on the corresponding first soldering pad, and the patch component 200 is soldered to the corresponding welding area. The pin component 300 is mounted on the corresponding pin mounting portion, and the pin 310 of the pin component 300 is located in the pin hole. The anti-stripping red glue layer 400 is coated on the first soldering pad, and the anti-stripping red glue layer 400 is connected to the patch component 200.

[0029] In this embodiment, the anti-detachment red glue layer 400 can fill the gap between the patch component 200 and the PCB board, enhance the adhesion between the component and the PCB, prevent the patch component 200 from moving or falling off due to the impact of vibration or high-temperature solder waves of wave soldering, ensure that the patch component 200 remains stable during the soldering process, and avoid poor soldering due to movement or tilting.

[0030] Furthermore, the anti-stripping red glue layer 400 raises the patch component 200, which can improve the geometry of the solder joint, make the soldering area more uniform, and thus improve the soldering quality.

[0031] like Figures 1 to 3 As shown, in one embodiment, there are multiple first pads and pin mounting portions. It is understandable that the multiple first pads and pin mounting portions enable the PCB to carry multiple components of different types and sizes, thereby improving the practicality and flexibility of the PCB board.

[0032] like Figures 1 to 3 As shown, in one embodiment, the thickness of the anti-stripping red glue layer 400 is 0.1mm to 0.5mm. Specifically, in this embodiment, the thickness of the anti-stripping red glue layer 400 depends on the thickness of the solder paste and the specifications of the corresponding patch component 200, ensuring that the anti-stripping red glue layer 400 can fully fill the gap without adversely affecting the soldering of the component, thereby preventing the patch component 200 from being displaced due to vibration or high temperature during the wave soldering process of the PCB board.

[0033] like Figures 1 to 3 As shown, in one embodiment, the anti-detachment red glue layer 400 includes a plurality of coating areas, each of which is circular or elongated. Specifically, in this embodiment, the coating area is located within the area enclosed by the soldering area of ​​the first solder pad. The diverse shapes of the coating area can provide a more uniform bonding surface between different patch components 200 and the first solder pad, thereby improving the bonding strength and effectively preventing the patch components 200 from falling off.

[0034] like Figures 1 to 3 As shown, in this embodiment, the multiple coating areas are independent of each other. Specifically, in this embodiment, the anti-debonding red glue layer 400 of the multiple first pads is independent of each other, and the coating area within each first pad is also independently distributed. The independence of the patch component 200 is ensured and the stability of the overall structure is enhanced, thereby reducing the risk of overall performance degradation caused by poor local bonding, avoiding cross-interference between the patch components 200, and preventing the detachment of one patch component 200 from causing the detachment of other patch components 200.

[0035] like Figures 1 to 3As shown, in one embodiment, the board body 100 includes at least a substrate layer 101, a conductive layer 102, and a protective layer 103. The soldering area is located on the conductive layer 102, and the anti-stripping red glue layer 400 is applied to the protective layer 103. It is understood that the anti-stripping red glue layer 400 is not conductive and only serves a fixing function. The anti-stripping red glue layer 400 is applied on the protective layer 103 of the anti-stripping PCB board 10, which does not affect the conductive performance of the anti-stripping PCB board 10 while effectively resisting the impact of high temperature on the patch components 200 during the wave soldering process.

[0036] like Figures 1 to 3 As shown, in one embodiment, the board body 100 is provided with a connection hole for connecting to a wave soldering fixture. Specifically, in this embodiment, the connection hole is a through hole, through which the fixing member of the wave soldering fixture can be fastened, ensuring that the anti-slip PCB board 10 remains flat during the soldering process, thereby ensuring the position stability during the soldering process and preventing the chip component 200 exposed outside the protection area of ​​the wave soldering fixture from being damaged or falling due to positional deviation.

[0037] The present disclosure also provides an inverter including the anti-slip PCB board 10 according to any of the above embodiments. By utilizing this anti-slip technology, the inverter effectively solves the problem of chip components 200 easily falling off during wave soldering on traditional PCB boards, thereby improving production efficiency and product quality.

[0038] Compared with the prior art, the present disclosure has at least the following advantages:

[0039] 1. The anti-off red glue layer can fill the gap between the patch component and the PCB board, enhance the adhesion between the component and the PCB, prevent the patch component from moving or falling off due to the impact of vibration or high-temperature solder waves of wave soldering, ensure that the patch component remains stable during the soldering process, and avoid poor soldering due to movement or tilting.

[0040] 2. The anti-stripping red glue layer raises the patch components, which can improve the geometry of the solder joints, make the welding area more uniform, and thus improve the welding quality.

[0041] The above-described embodiments merely represent several implementation methods of the present disclosure. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the scope of the present disclosure, all of which fall within the scope of protection of the present disclosure. Therefore, the scope of protection of the disclosed patent shall be determined by the appended claims.

Claims

1. A PCB board with an anti-slip feature, characterized in that: include: A board body, the board body being provided with a first solder pad and a pin mounting portion, the first solder pad being provided with a soldering area around its periphery, the soldering area being coated with a layer of solder paste, the pin mounting portion being located on the other side of the board body, the pin mounting portion being provided with a pin hole, wherein the distance between the pin hole and the adjacent soldering area is less than 3 mm; a patch component, the patch component being mounted on the corresponding first pad and soldered to the corresponding soldering area; a pin element, the pin element being mounted on the corresponding pin mounting portion, the pin of the pin element being located in the pin hole; and An anti-debonding red glue layer is applied to the first solder pad and is connected to the patch component.

2. The anti-slip PCB board according to claim 1, characterized in that: There are multiple first pads and multiple pin mounting portions.

3. The anti-slip PCB board according to claim 1, characterized in that: The thickness of the anti-shedding red rubber layer is 0.1 mm to 0.5 mm.

4. The anti-slip PCB board according to claim 1, characterized in that: The anti-shedding red glue layer includes a plurality of coating areas, and the coating areas are circular or long strips.

5. The anti-slip PCB board according to claim 4, characterized in that: The multiple coating zones are independent of each other.

6. The anti-slip PCB board according to claim 1, characterized in that: The plate body at least includes a base material layer, a conductive layer and a protective layer. The welding area is located on the conductive layer, and the anti-debonding red glue is coated on the protective layer.

7. The anti-slip PCB board according to claim 1, characterized in that: The plate body is provided with a connection hole, and the connection hole is used for connecting a wave soldering fixture.

8. An inverter, characterized in that: The inverter includes the anti-shock PCB board according to any one of claims 1 to 7.

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