Vacuum coating equipment

Abstract

The utility model discloses vacuum coating equipment and relates to the technical field of magnetron sputtering. The vacuum coating equipment comprises a vacuum cavity, a sputtering target source and a bias plate, wherein the sputtering target source and the bias plate are arranged in the vacuum cavity; the two sputtering target sources are connected with the cathode power supply and are vertically and oppositely arranged; each sputtering target source comprises a magnetic assembly and a vertically arranged target material, the target material is used for providing sputtering particles, and the magnetic assembly is used for generating a working magnetic field on the surface of the target material; the bias plate comprises a positive bias plate and a negative bias plate which are horizontally and oppositely arranged; the positive bias plate is arranged on the upper side of the sputtering target source and is connected with a positive power supply; the negative bias plate is arranged on the lower side of the sputtering target source and is connected with the negative power supply; and the sputtering particles are diffracted to a deposition area between the sputtering target source and the negative electrode bias plate under the combined action of the working magnetic field and a bias electric field formed by the bias plate. The vacuum coating equipment provided by the utility model can improve the magnetron sputtering coating quality.

Description

Technical Field

[0001] The utility model relates to the technical field of magnetron sputtering, in particular to vacuum coating equipment. Background Art

[0002] Magnetron sputtering bombards the target material with argon ions, so that the atoms or molecules on the target surface obtain enough energy to overcome the surface binding energy and leave the target surface to form sputtered particles. The sputtered particles are deposited on the surface of the substrate to form a thin film. During the sputtering deposition process, an electric field is applied near the target surface, and the interaction between the magnetic field and the electric field is used to make electrons move in a spiral shape near the target surface, increasing the probability of collision between electrons and argon molecules, thereby increasing the density of argon ions and the sputtering rate.

[0003] At present, magnetron sputtering usually uses sputtering particles to directly bombard the substrate, which makes the substrate easily damaged and generates high temperature, seriously affecting the coating quality; in addition, high-energy particles such as electrons will also bombard the target material, further causing damage to the substrate and reducing the coating quality. Utility Model Content

[0004] The embodiment of the utility model provides a vacuum coating device, which aims to improve the quality of magnetron sputtering coating.

[0005] The vacuum coating equipment provided by the utility model is used for coating a film on the surface of a substrate, and the vacuum coating equipment comprises:

[0006] Vacuum chamber;

[0007] Sputtering target source; two sputtering target sources are provided, the two sputtering target sources are vertically and oppositely arranged in the vacuum chamber, and the sputtering target sources are connected to a negative power supply; each sputtering target source includes a magnetic component and a vertically arranged target material, the target material is used to provide sputtering particles, and the magnetic component is used to generate a working magnetic field on the surface of the target material;

[0008] A bias plate is provided in the vacuum chamber, comprising a positive bias plate and a negative bias plate which are arranged horizontally and opposite to each other; the positive bias plate is provided on the upper side of the sputtering target source and connected to a positive power supply; the negative bias plate is provided on the lower side of the sputtering target source and connected to a negative power supply;

[0009] Under the combined action of the working magnetic field and the bias electric field formed by the bias plate, the sputtered particles are diffracted to a deposition area located between the sputtering target source and the negative bias plate.

[0010] Optionally, the distance between the bottom of the target material and the deposition area is adjustable.

[0011] Optionally, the vacuum coating equipment includes:

[0012] There are two baffles; the two baffles are respectively arranged at the bottom of the two sputtering target sources.

[0013] Optionally, the baffle includes a horizontal portion and a vertical portion that are perpendicular to each other;

[0014] The horizontal portion is located at the bottom of the target and has a preset distance from the bottom of the target; the vertical portion is located at one end of the horizontal portion extending from the sputtering surface of the target and extends upward perpendicular to the horizontal portion.

[0015] Optionally, the position of the horizontal portion extending between the target material and the deposition area is adjustable.

[0016] Optionally, the vacuum chamber is insulated from the sputtering target source, the bias plate, and the baffle, and the sputtering target source is insulated from the baffle.

[0017] Optionally, the vacuum coating equipment further includes a cooling component;

[0018] The cooling component is connected to the sputtering target source and is used to cool the target material.

[0019] Optionally, the vacuum coating equipment further includes a vacuum device;

[0020] The vacuum device is connected to the vacuum cavity and is used to evacuate the vacuum cavity.

[0021] Optionally, the vacuum coating equipment further includes a control device;

[0022] The control device is used to control the operating voltages of the sputtering target source and the bias plate.

[0023] Optionally, the vacuum coating equipment further includes a film quality detection device;

[0024] The film quality detection device is used to detect the thickness and uniformity of the coating on the surface of the substrate.

[0025] It can be seen from the above technical solutions that the present invention has the following beneficial effects:

[0026] The two sputtering target sources of the vacuum coating equipment provided by the utility model are arranged opposite to each other, and the substrate is arranged vertically on the lower side of the two sputtering target sources, which transforms the traditional sputtering that directly acts on the substrate into diffraction along the magnetic lines of force, thereby avoiding the direct bombardment of the substrate by the sputtering particles, reducing the damage to the substrate, and making the surface of the substrate smoother, which helps to improve the uniformity and adhesion of the coating; in addition, by adding a positive bias plate above the sputtering target source and a negative bias plate below the substrate, a bias electric field is formed, which can attract and deflect high-energy sputtering particles, and sputtering particles with too high energy have a large deflection angle in the bias electric field. , will be captured and absorbed by the baffle on the opposite side, thereby reducing the bombardment of high-energy particles on the substrate, reducing substrate damage, and improving the quality of the coating on the substrate surface; at the same time, the deposition rate of the sputtered particles on the substrate surface can be controlled by bias voltage, and the distribution of plasma in space can be regulated to improve the uniformity and stability of the magnetron sputtering coating; since low-energy particles are also splashed out during the sputtering process, they will accumulate on the substrate below the target source in an almost free-falling manner. The two baffles provided in the utility model can prevent the low-energy particles on the same side from freely falling onto the substrate, reducing coating impurities and improving the purity of the coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 This is a schematic structural diagram of an embodiment of the vacuum coating equipment of the present utility model;

[0029] Figure 2 This is a structural schematic diagram of an embodiment of a sputtering target source of the utility model;

[0030] Figure 3 This is a structural schematic diagram of another embodiment of the vacuum coating equipment of the present utility model.

[0031] Description of Figure Numbers:

[0032] 1. Vacuum chamber; 2. Sputtering target source; 21. Magnetic component; 22. Target material; 31. Positive bias plate; 32. Negative bias plate; 4. Baffle; 5. Substrate; 6. Vacuum device; 7. Control device. DETAILED DESCRIPTION

[0033] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0034] The terms "first," "second," "third," "fourth," and the like (if any) in the specification and drawings of the present application are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product, or apparatus.

[0035] When magnetron sputtering is used for large-area coating in a vacuum environment, the sputtered particles generated by the target material are generally deposited on the substrate surface to form a thin film by directly bombarding the substrate. This method will cause the substrate to quickly generate high temperature, causing serious damage to the substrate and thus affecting the coating quality.

[0036] The utility model provides a vacuum coating device, aiming to solve the above problems.

[0037] See Figure 1 In one embodiment, the vacuum coating equipment proposed by the present invention includes:

[0038] Vacuum chamber 1;

[0039] Sputtering target source 2; There are two sputtering target sources 2, and the two sputtering target sources 2 are vertically and oppositely arranged in the vacuum chamber 1; The sputtering target source 2 is connected to a negative power supply;

[0040] The bias plate is arranged in the vacuum chamber 1, and includes a positive bias plate 31 and a negative bias plate 32 arranged horizontally and oppositely; the positive bias plate 31 is located on the upper side of the sputtering target source 2 and is connected to the positive power supply; the negative bias plate 32 is arranged on the lower side of the sputtering target source 2 and is connected to the negative power supply.

[0041] The positive bias plate and the negative bias plate that are arranged opposite to each other form a bias electric field when energized.

[0042] Specifically, each sputtering target source 2 includes a magnetic component 21 and a vertically arranged target material 22. The target material 22 produces sputtered particles under the bombardment of argon ions. The magnetic component 21 is used to generate a working magnetic field on the surface of the target material 22; the sputtered particles generated by the target material 22 are diffracted along the direction of the magnetic lines of force to the deposition area located between the negative bias plates 32 of the sputtering target source 2 under the combined action of the working magnetic field and the bias electric field formed by the bias plate.

[0043] It can be understood that when the vacuum coating process is carried out, a fixed seat is provided in the deposition area, which is used to support the substrate 5 to be coated; the sputtered particles provided by the target material 22 are diffracted onto the substrate 5 under the combined action of the working magnetic field and the bias electric field, and are deposited on the surface of the substrate 5 to form a target film layer.

[0044] In this embodiment, the magnetic component 21 provides a working magnetic field, and the magnetic field component of the working magnetic field parallel to the sputtering surface of the target interacts with the perpendicular electric field to form a drift field that has a trapping effect on electrons, thereby increasing the electron density in the area near the sputtering surface of the target 22 and increasing the probability of collision between electrons and argon molecules; the magnetic component 21 is usually arranged on the back of the target 22, and a specific magnetic field distribution is formed on the surface of the target 22 by adjusting the polarity of the working magnetic field, so that the sputtered particles are diffracted to the surface of the substrate 5 under the combined action of the bias electric field and the working magnetic field.

[0045] In this embodiment, the vacuum coating equipment also includes a vacuum device 6 connected to the vacuum chamber 1, which is used to evacuate the vacuum chamber 1; in specific implementation, the vacuum device 6 further includes vacuum pumps such as mechanical pumps and molecular pumps, as well as auxiliary devices such as exhaust pipes and vacuum gauges. These parts can be implemented by those skilled in the art in combination with existing technologies.

[0046] In addition, the vacuum coating equipment further includes an air intake system; the air intake system is used to introduce argon or other working gases into the vacuum chamber 1 .

[0047] In this embodiment, the vacuum coating equipment further includes a control device 7 ; the control device 7 is used to control the operating voltages of the sputtering target source and the bias plate.

[0048] Specifically, the equipment operator can adjust the working voltage of the sputtering target source 2 through the control device 7 to control the intensity of the argon ions bombarding the target material 22, and further adjust the deposition rate of the sputtered particles on the surface of the substrate 5; the equipment operator can also adjust the working voltage of the bias plate through the control device 7 to control the intensity of the bias electric field, further adjust the deposition rate of the sputtered particles on the surface of the substrate, or adjust the distribution of plasma (positive ions, electrons, charged atomic groups, charged molecular groups, etc.) in space to reduce fluctuations and instabilities in the plasma.

[0049] The embodiment of the present utility model adopts a facing target position design, that is, two sputtering target sources are arranged opposite to each other and perpendicular to the substrate. The sputtering particles (usually positive ions) generated by the bombardment of the sputtering target source by argon ions are diffracted along the direction of the magnetic lines of force under the action of the working magnetic field and the bias electric field and deposited on the substrate below; compared with the existing scheme in which the sputtering particles directly bombard the opposite substrate, the embodiment of the present utility model can reduce the bombardment intensity of the sputtering particles on the substrate, thereby reducing the damage to the substrate; at the same time, it avoids the high temperature generated when the substrate is bombarded by the sputtering particles, and avoids the long-term and high-frequency high temperature in the coating process that affects the stability of the coating; the substrate is coated with the vacuum coating equipment provided by this embodiment, and the flatness, uniformity and adhesion of the surface film can be improved compared with the existing scheme.

[0050] In addition, since a large number of electrons are generated during the magnetron sputtering process, the high-energy electrons in the existing scheme will also bombard the substrate, causing damage to the substrate and generating high temperature. The embodiment of the utility model constructs a bias electric field by setting positive and negative bias plates to attract electrons to the positive bias plate, avoiding the bombardment of the substrate by high-energy electrons, further reducing damage to the substrate, and at the same time avoiding the high temperature of the substrate affecting the stability of long-term coating.

[0051] In addition, the negative bias plate attracts the sputtered particles generated by the sputtering target source to deposit on the substrate. By controlling the bias electric field strength, the deposition rate of the sputtered particles on the substrate surface can be regulated. By controlling the bias electric field strength, the distribution of plasma (positive ions, electrons, charged atomic groups, charged molecular groups, etc.) in space can also be regulated, reducing fluctuations and instabilities in the plasma, improving the coating efficiency, and ensuring the stability of the coating quality.

[0052] Based on the above embodiments, in some embodiments, the distance between the bottom of the target and the substrate is adjustable. By adjusting the distance between the target and the substrate, the deposition rate of the sputtered particles and the density of the thin film can be controlled.

[0053] In some embodiments, the vacuum coating equipment further includes two baffles 4 .

[0054] The two baffles 4 are respectively disposed between the two sputtering target sources 2 and the substrate 5 .

[0055] Argon ions bombarding the target material usually also produce uncharged low-energy atoms, atomic clusters, molecular clusters, etc. These uncharged particles will fall directly onto the substrate during free fall and become impurities in the deposited film layer, causing the coating quality to deteriorate.

[0056] Wherein, the baffle 4 includes a horizontal portion and a vertical portion perpendicular to each other;

[0057] The horizontal portion is located at the bottom of the target material and has a preset distance from the bottom of the target material; the vertical portion is located at one end of the horizontal portion extending out of the sputtering surface of the target material and extends upward perpendicular to the horizontal portion.

[0058] In this embodiment, a baffle is set between the sputtering target source and the substrate. The baffle can prevent low-energy particles on the same side from freely falling onto the substrate, thereby reducing impurities in the coating. At the same time, sputtering particles with too high energy have a large deflection angle in the bias electric field and will be captured by the baffle on the opposite side to avoid bombarding the substrate, thereby reducing damage to the substrate and improving the coating quality on the substrate surface. In addition, high-energy particles such as electrons may produce secondary bombardment after colliding with argon molecules or other high-energy particles. The baffle can block the secondary bombardment of high-energy electrons on the surface area of ​​the target material on the substrate, reducing damage to the substrate, making the substrate surface smoother, and helping to improve the uniformity and adhesion of the coating.

[0059] In some embodiments, the position at which the horizontal portion of the baffle 4 extends between the target material and the substrate 5 is adjustable; on the one hand, it can adapt to the falling area of ​​uncharged particles under different sputtering intensities; on the other hand, it can also serve as a shielding component to control the amount of sputtered particles deposited on the substrate, thereby controlling the film forming area and local thickness on the substrate; in addition, the energy range of the sputtered particles that can be deposited on the substrate can also be controlled to further improve the film forming quality.

[0060] In some embodiments, the vacuum chamber 1 is insulated from the sputtering target source 2, the bias plates (31 and 32), and the baffle 4, and the sputtering target source 2 is insulated from the baffle 4 to ensure electrical safety of the vacuum coating equipment.

[0061] The insulating material may be ceramic, and the connecting parts may be ceramic pads, ceramic bolts, etc.

[0062] In some embodiments, the vacuum coating equipment further includes a cooling component; the cooling component is connected to the sputtering target source for cooling the target material.

[0063] The cooling components can adopt related components of one or more cooling forms such as air cooling, water cooling, heat pipe, semiconductor refrigeration, etc.

[0064] In some embodiments, the vacuum coating equipment further includes a film quality detection device for detecting the thickness and uniformity of the coating on the surface of the substrate.

[0065] Specifically, process parameters such as magnetic field intensity, sputtering electric field intensity, and bias electric field intensity can be adjusted in a timely manner according to the thickness and uniformity of the coating on the substrate surface detected by the film quality detection device.

[0066] The film quality detection device can use optical or electrical monitoring instruments such as spectroscopic ellipsometer, interferometer, quartz crystal microbalance to measure the thickness and uniformity of the film on the surface of the substrate.

[0067] The vacuum coating equipment provided by the utility model can be used to prepare various coating processes that can be achieved by magnetron sputtering, such as metal / alloy films, metal oxide films, and metal nitride films.

[0068] In a specific embodiment, the vacuum coating equipment provided by the present invention is used to deposit high-quality ITO thin films on the surface of a substrate.

[0069] This embodiment is used to further illustrate in detail the process of depositing an ITO thin film on a substrate surface using the vacuum coating equipment provided by the present invention in combination with the solutions of any of the above embodiments, so as to illustrate the technical effects of the equipment. The following embodiments are not limitations on the application of the equipment, and those skilled in the art can make adjustments in actual applications according to the actual production process.

[0070] Example 1

[0071] The two ITO targets are respectively mounted on the back plates of the two sputtering target sources, and the two ITO targets are arranged opposite to each other.

[0072] Adjust the magnetic field strength of the sputtering target source. The longitudinal distribution of the magnetic field strength is S (1400gs) -N (2300gs) -S (1400gs). Adjust the target spacing (100-300mm) and the bias plate voltage (0-400V).

[0073] Check whether the connection insulation of the vacuum chamber, target material, baffle and bias plate meets the requirements.

[0074] Connect the target to the negative power supply and the vacuum chamber to the positive power supply; connect the positive bias plate to the positive power supply and the negative bias plate to the negative power supply.

[0075] The substrate is placed into the vacuum chamber, and the vacuum chamber is evacuated to a preset vacuum degree that meets the coating requirements;

[0076] Perform magnetron sputtering coating. When the coating reaches the preset thickness, turn off the relevant power supply and the coating is completed.

[0077] It can be seen from the above embodiments that the vacuum coating equipment proposed by the present invention adopts a facing target position design, and the two sputtering target sources are relatively arranged above the substrate and perpendicular to the substrate. The sputtering particles generated by the target material are diffracted and deposited on the surface of the substrate along the direction of the magnetic flux lines, avoiding the sputtering particles from directly bombarding the substrate, reducing substrate damage, and improving the coating quality; at the same time, the bias electric field is used to attract high-energy electrons to the positive bias plate to avoid high-energy electrons from bombarding the substrate, which also reduces substrate damage and further improves the coating quality; at the same time, the bias voltage can also be used to control the deposition rate of sputtering particles on the substrate surface and regulate the distribution of plasma in space to improve the uniformity and stability of magnetron sputtering coating; in addition, the present invention effectively blocks the free fall of uncharged particles onto the substrate by arranging a baffle between the target material and the substrate, and blocks the secondary bombardment of the substrate by high-energy electrons near the target surface, thereby reducing coating impurities and improving the film layer bonding strength.

[0078] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A vacuum coating device, characterized in that: include: Vacuum chamber; Sputtering target source; two sputtering target sources are provided, the two sputtering target sources are vertically and oppositely arranged in the vacuum chamber, and the sputtering target sources are connected to a negative power supply; each sputtering target source includes a magnetic component and a vertically arranged target material, the target material is used to provide sputtering particles, and the magnetic component is used to generate a working magnetic field on the surface of the target material; A bias plate is provided in the vacuum chamber, comprising a positive bias plate and a negative bias plate which are arranged horizontally and opposite to each other; the positive bias plate is provided on the upper side of the sputtering target source and connected to a positive power supply; the negative bias plate is provided on the lower side of the sputtering target source and connected to a negative power supply; The sputtered particles can be diffracted to a deposition area between the sputtering target source and the negative bias plate under the combined action of the working magnetic field and the bias electric field formed by the bias plate.

2. The vacuum coating equipment according to claim 1, characterized in that: The distance between the bottom of the target material and the deposition area is adjustable.

3. The vacuum coating equipment according to claim 1, characterized in that: include: There are two baffles; the two baffles are respectively arranged at the bottom of the two sputtering target sources.

4. The vacuum coating equipment according to claim 3, characterized in that: The baffle includes a horizontal portion and a vertical portion that are perpendicular to each other; The horizontal portion is located at the bottom of the target and has a preset distance from the bottom of the target; the vertical portion is located at one end of the horizontal portion extending from the sputtering surface of the target and extends upward perpendicular to the horizontal portion.

5. The vacuum coating equipment according to claim 4, characterized in that: The position of the horizontal portion extending between the target material and the deposition area is adjustable.

6. The vacuum coating equipment according to claim 3, characterized in that: The vacuum chamber is insulated from the sputtering target source, the bias plate, and the baffle, and the sputtering target source is insulated from the baffle.

7. The vacuum coating equipment according to claim 1, characterized in that: Also included is a cooling assembly; The cooling component is connected to the sputtering target source and is used to cool the target material.

8. The vacuum coating equipment according to any one of claims 1 to 7, characterized in that: Also included is a vacuum device; The vacuum device is connected to the vacuum cavity and is used to evacuate the vacuum cavity.

9. The vacuum coating equipment according to claim 8, characterized in that: Also included are controls; The control device is used to control the operating voltages of the sputtering target source and the bias plate.

10. The vacuum coating equipment according to claim 8, characterized in that: Also included is a film quality detection device; The film quality detection device is used to detect the thickness and uniformity of the coating on the surface of the substrate.

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