Heat dissipation device

Abstract

The utility model relates to the technical field of radiators, in particular to a radiating device. The heat dissipation device comprises a bottom plate and a heat dissipation mechanism, a heating part is arranged on the bottom plate, the bottom plate comprises a body and a plurality of limiting blocks which are integrally connected, the limiting blocks are arranged on the end face, away from the heating part, of the body at intervals in the first direction, and the heat dissipation mechanism comprises multiple heat conduction assemblies and multiple heat dissipation assemblies. The multiple heat dissipation assemblies are arranged at intervals, each heat conduction assembly is located between every two adjacent heat dissipation assemblies, and parts of the heat conduction assemblies are located in the interval between every two adjacent limiting blocks. According to the heat dissipation device, the heat conduction assembly is fixed through the body and the limiting blocks which are of an integrated structure, the heat conduction assembly only needs to be placed in the interval between every two adjacent limiting blocks in the assembling process and then is fixed, the limiting blocks do not need to be independently fixed, assembling is convenient, and the assembling efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a heat dissipation device. Background Art

[0002] Currently, commonly used heat dissipation devices include a mounting frame, a heat-conducting assembly, and a heat-dissipating assembly. The heating element is fixed to the mounting frame, and the heat-conducting assembly and the heat-dissipating assembly are fixed to the mounting frame via locking members to achieve assembly and fixation. Because the mounting frame is larger when the heating element is large, and there are multiple sets of heat-conducting assemblies and heat-dissipating assemblies, during assembly, the position of the heat-conducting assembly relative to the mounting frame must be fixed and limited only by locking members, or limit blocks must be assembled one by one to limit the position. This makes it difficult to assemble multiple heat-conducting assemblies simultaneously.

[0003] In order to solve the above problems, it is urgent to provide a heat dissipation device to solve the problem of difficult operation during assembly. Utility Model Content

[0004] The purpose of the utility model is to provide a heat dissipation device to facilitate assembly and improve assembly efficiency.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A heat dissipation device, comprising:

[0007] A bottom plate, on which the heating element is disposed, the bottom plate comprising a body and a plurality of stop blocks connected in an integral manner, wherein the stop blocks are spaced apart along a first direction on an end surface of the body away from the heating element;

[0008] The heat dissipation mechanism includes multiple groups of heat-conducting components and multiple groups of heat dissipating components. Along the first direction, the multiple groups of heat dissipating components are arranged at intervals. Each group of heat-conducting components is located between two adjacent groups of heat dissipating components, and a part of the heat-conducting components is located in the interval between two adjacent limit blocks.

[0009] As an optional solution, the limit block is a U-shaped structure, and the U-shaped limit block is open in a direction away from the main body, forming a weight-reducing space inside the opening.

[0010] As an optional solution, the end surface of the body facing the heating element is provided with an accommodating groove, and the heat dissipation device further includes:

[0011] Multiple uniform temperature heat pipes extend along the first direction and are arranged in parallel in the accommodating groove along the second direction. The end surfaces of the uniform temperature heat pipes facing the heating element are coplanar with the body.

[0012] As an optional solution, the bottom of the accommodating groove is coplanar with the end face of the limit block close to the main body, so that a through hole is formed between two adjacent limit blocks, and the heat conduction component arranged in the gap between two adjacent limit blocks is in contact with the uniform temperature heat pipe.

[0013] As an optional solution, a plurality of weight-reducing grooves are provided on the main body, and the plurality of weight-reducing grooves are symmetrically arranged along the central axis of the main body in the first direction.

[0014] As an optional solution, the heat dissipation component includes:

[0015] a housing; and

[0016] A plurality of fins are arranged in the housing in parallel and at intervals along the second direction, and the fins extend along the third direction.

[0017] As an optional solution, the heat dissipation component is stamped.

[0018] As an optional solution, the heat conducting assembly includes at least one heat conducting member, the end surface of the heat conducting member along the first direction is in contact with the heat dissipation assembly; the heat conducting member includes:

[0019] a heat absorbing tube, the heat absorbing tube extending along the second direction and located in a gap between two adjacent limiting blocks;

[0020] a first heat conducting pipe connected to one end of the heat absorbing pipe in an arc shape, the first heat conducting pipe extending along a third direction; and

[0021] The second heat conducting pipe is connected to the end of the first heat conducting pipe away from the heat absorbing pipe in an arc shape, and the second heat conducting pipe extends along the second direction.

[0022] As an optional solution, the cross-section of the heat absorbing tube is square, and the cross-sections of the first heat conducting tube and the second heat conducting tube are flat, so that the surfaces of the first heat conducting tube and the second heat conducting tube facing the heat dissipation component are flat.

[0023] As an optional solution, when there are multiple heat conducting members, the multiple first heat conducting pipes and the multiple second heat conducting pipes of the multiple heat conducting members are arranged on the same plane.

[0024] The beneficial effects of the utility model are:

[0025] The utility model provides a heat dissipation device, which includes a base plate and a heat dissipation mechanism. The heating element is arranged on the base plate. The base plate includes an integrally connected main body and a plurality of limit blocks. The plurality of limit blocks are spaced apart along a first direction on the end surface of the main body away from the heating element. The heat dissipation mechanism includes a plurality of heat-conducting components and a plurality of heat dissipating components. Along the first direction, the plurality of heat dissipating components are spaced apart. Each heat-conducting component is located between two adjacent heat dissipating components, and a portion of the heat-conducting component is located in the gap between two adjacent limit blocks. The heat dissipation device uses the integrally structured main body and the limit blocks to fix the heat-conducting components. During assembly, the heat-conducting components only need to be placed in the gap between two adjacent limit blocks and then fixed. There is no need to fix the limit blocks separately, which facilitates assembly and helps improve assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0027] Figure 1 This is a schematic diagram of the structure of the heat dissipation device provided by the embodiment of the utility model Figure 1 ;

[0028] Figure 2 This is a schematic diagram of the structure of the heat dissipation device provided by the embodiment of the utility model Figure 2 ;

[0029] Figure 3 This is a schematic structural diagram of a base plate provided by an embodiment of the present utility model;

[0030] Figure 4 It is a structural schematic diagram of the heat dissipation assembly provided by an embodiment of the present utility model.

[0031] The following are marked in the figure:

[0032] 100-base plate; 110-body; 111-weight reduction slot; 120-limiting block; 121-weight reduction space;

[0033] 200-heat dissipation mechanism; 210-heat conduction assembly; 211-heat conduction member; 2111-heat absorption pipe; 2112-first heat conduction pipe; 2113-second heat conduction pipe; 220-heat dissipation assembly; 221-housing; 222-fins;

[0034] 300-Uniform temperature heat pipe. DETAILED DESCRIPTION

[0035] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions of the present invention, not the entire structure.

[0036] In the description of this utility model, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and can refer to the internal structure of two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0037] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0038] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0039] like Figure 1-Figure 3As shown, this embodiment provides a heat dissipation device, which includes a base plate 100 and a heat dissipation mechanism 200. The heating element is arranged on the base plate 100, and the heating element here can be an electronic component, a lamp, etc. The base plate 100 includes a main body 110 and a plurality of limit blocks 120 connected as one body, and the plurality of limit blocks 120 are spaced apart along the X direction (first direction) on the end face of the main body 110 away from the heating element. The heat dissipation mechanism 200 includes a plurality of groups of heat-conducting components 210 and a plurality of groups of heat dissipating components 220. Along the X direction, the plurality of groups of heat dissipating components 220 are spaced apart, and each group of heat-conducting components 210 is located between two adjacent groups of heat dissipating components 220, and a part of the heat-conducting component 210 is located in the gap between two adjacent limit blocks 120. The heat dissipation device utilizes an integrated structure of the main body 110 and the limit block 120 to fix the heat-conducting component 210. During assembly, the heat-conducting component 210 only needs to be placed in the gap between two adjacent limit blocks 120 and then fixed. There is no need to fix the limit block 120 separately, which facilitates assembly and helps improve assembly efficiency.

[0040] Furthermore, the stopper 120 is a U-shaped structure, opening away from the body 110, and forming a weight-reducing space 121 within the opening to reduce the weight of the heat dissipation device. For example, the stopper 120 can be a U-shaped single-arm structure, which is lightweight and easy to manufacture.

[0041] In this embodiment, the main body 110 is a plate-shaped structure.

[0042] like Figure 1-Figure 3 As shown, the body 110 is provided with a plurality of weight-reducing grooves 111, thereby reducing the weight of the body 110 and increasing its strength. Furthermore, the plurality of weight-reducing grooves 111 are symmetrically arranged along the X-axis of the body 110 to facilitate uniform weight distribution. Specifically, the shape of the weight-reducing grooves 111 can be determined based on the shape of the body 110 and the surrounding structure of the weight-reducing grooves 111, and this embodiment does not impose any specific limitations on this.

[0043] The end surface of the main body 110 facing the heating element is provided with a receiving groove. The heat dissipation device also includes a plurality of uniform temperature heat pipes 300. The plurality of uniform temperature heat pipes 300 extend along the X direction and are arranged parallel to the receiving groove along the Y direction (the second direction). The end surface of the uniform temperature heat pipe 300 facing the heating element is arranged coplanar with the main body 110, so that the uniform temperature heat pipe 300 directly contacts the heating element and absorbs the heat of the heating element to quickly remove heat and dissipate heat. At the same time, adjacent uniform temperature heat pipes 300 can conduct heat to each other, avoiding local high temperatures of the uniform temperature heat pipe 300 due to high local heat of the heating element, thereby improving the temperature uniformity of the base plate 100 and further improving the overall uniform heat dissipation effect of the heat dissipation device.

[0044] During processing, after the temperature-averaging heat pipe is set on the main body 110, the surface is leveled using automated equipment to ensure the flatness of the contact surface.

[0045] Optionally, in order to increase the contact area between the uniform temperature heat pipe 300 and the heating element, the cross-section of the uniform temperature heat pipe is square.

[0046] The bottom of the accommodating groove is coplanar with the end face of the limit block 120 close to the main body 110, so that a through hole is formed between the two adjacent limit blocks 120. The heat-conducting component 210 arranged in the gap between the two adjacent limit blocks 120 is in contact with the uniform temperature heat pipe 300, so that the uniform temperature heat pipe directly conducts heat to the heat-conducting component 210, which is conducive to rapid heat conduction and thus improves the heat dissipation efficiency of the heat dissipation device.

[0047] See Figure 4 The heat dissipation assembly 220 includes a shell 221 and a plurality of fins 222. The plurality of fins 222 are arranged in the shell 221 in parallel and at intervals along the Y direction. The fins 222 extend along the Z direction (the third direction) so that the gaps between the plurality of fins 222 are perpendicular to the surface of the base plate 100. The gaps can dissipate heat quickly, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0048] Optionally, the heat dissipation assembly 220 is stamped, which is conducive to forming a thin-walled heat dissipation assembly 220 structure. Exemplarily, the thickness of the housing 221 and the heat sink is 0.2mm-0.5mm, which is conducive to reducing the weight of the heat dissipation device while ensuring heat dissipation.

[0049] like Figure 2 As shown, the heat-conducting assembly 210 further includes at least one heat-conducting member 211, the end surface of the heat-conducting member 211 along the X direction contacts the heat dissipation assembly 220; the heat-conducting member 211 includes a heat-absorbing pipe 2111, a first heat-conducting pipe 2112, and a second heat-conducting pipe 2113. The heat-absorbing pipe 2111 extends along the Y direction and is located between two adjacent limit blocks 120, capable of absorbing heat from the base plate 100 at a close distance. The first heat-conducting pipe 2112 is connected to one end of the heat-absorbing pipe 2111 in an arc shape, and the first heat-conducting pipe 2112 extends along the Z direction. The second heat-conducting pipe 2113 is connected to one end of the first heat-conducting pipe 2112 away from the heat-absorbing pipe 2111 in an arc shape, and the second heat-conducting pipe 2113 extends along the Y direction, thereby conducting heat away from the heat-absorbing pipe 2111. The bending arrangement of the first heat pipe 2112 and the second heat pipe 2113 can increase the length of the heat conducting member 211 when the Z-direction dimension is small, thereby increasing the contact area between the heat conducting member 211 and the heat dissipation assembly 220, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0050] Optionally, each heat conducting member 211 has two first heat conducting tubes 2112 and two second heat conducting tubes 2113 , and the two first heat conducting tubes 2112 and the two second heat conducting tubes 2113 are sequentially arranged at both ends of the heat absorbing tube 2111 .

[0051] Optionally, when there are multiple heat conducting members 211, the multiple first heat conducting tubes 2112 and the multiple majority second heat conducting tubes 2113 of the multiple heat conducting members 211 are arranged on the same plane, so that the sides of the first heat conducting tubes 2112 and the second heat conducting tubes 2113 of the multiple heat conducting members 211 can all contact the heat dissipation assembly 220, which is beneficial to improving the heat conduction efficiency.

[0052] The cross-section of the heat absorbing tube 2111 is square, thereby increasing the contact area between the heat absorbing tube 2111 and the uniform temperature heat pipe 300 and improving the heat conduction effect.

[0053] The cross-section of the first heat pipe 2112 and the second heat pipe 2113 is flat, so that the surfaces of the first heat pipe 2112 and the second heat pipe 2113 facing the heat dissipation component 220 are flat, thereby increasing the contact area between the first heat pipe 2112 and the second heat pipe 2113 and the heat dissipation component 220.

[0054] Note that the above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above-mentioned embodiments. The above-mentioned embodiments and descriptions are only for illustrative purposes. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements shall fall within the scope of the present invention as claimed, and the scope of protection of the present invention shall be defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device, characterized in that: include: A bottom plate (100), a heating element is arranged on the bottom plate (100), the bottom plate (100) comprising a body (110) and a plurality of limit blocks (120) connected in an integral manner, the plurality of limit blocks (120) being arranged at intervals along a first direction on an end surface of the body (110) facing away from the heating element; The heat dissipation mechanism (200) comprises a plurality of groups of heat-conducting components (210) and a plurality of groups of heat-dissipating components (220). Along the first direction, the plurality of groups of heat-dissipating components (220) are arranged at intervals, each group of heat-conducting components (210) is located between two adjacent groups of heat-dissipating components (220), and a portion of the heat-conducting components (210) is located in the interval between two adjacent limiting blocks (120).

2. The heat dissipation device according to claim 1, characterized in that: The limiting block (120) is a U-shaped structure. The U-shaped limiting block (120) is open in a direction away from the main body (110), and a weight-reducing space (121) is formed inside the opening.

3. The heat dissipation device according to claim 1, wherein: The end surface of the body (110) facing the heating element is provided with an accommodating groove, and the heat dissipation device further comprises: A plurality of uniform temperature heat pipes (300) are provided, the plurality of uniform temperature heat pipes (300) extending along the first direction and arranged in parallel in the accommodating groove along the second direction, and the end faces of the uniform temperature heat pipes (300) facing the heating element are arranged coplanar with the body (110).

4. The heat dissipation device according to claim 3, characterized in that: The bottom of the accommodating groove is coplanar with the end face of the limiting block (120) close to the main body (110), so that a through hole is formed between two adjacent limiting blocks (120), and the heat conducting component (210) arranged in the gap between two adjacent limiting blocks (120) is in contact with the uniform temperature heat pipe (300).

5. The heat dissipation device according to claim 1, characterized in that: The body (110) is provided with a plurality of weight-reducing grooves (111), and the plurality of weight-reducing grooves (111) are symmetrically arranged along a first direction central axis of the body (110).

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The heat dissipation component (220) includes: a housing (221); and A plurality of fins (222) are provided in the housing (221) in parallel and at intervals along the second direction, and the fins (222) extend along the third direction.

7. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The heat dissipation component (220) is formed by stamping.

8. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The heat-conducting assembly (210) comprises at least one heat-conducting member (211), wherein the end surface of the heat-conducting member (211) along the first direction contacts the heat-dissipating assembly (220); the heat-conducting member (211) comprises: a heat absorption tube (2111), the heat absorption tube (2111) extending along the second direction, and the heat absorption tube (2111) being located in the interval between two adjacent limiting blocks (120); a first heat conducting pipe (2112) connected to one end of the heat absorbing pipe (2111) in an arc shape, wherein the first heat conducting pipe (2112) extends along a third direction; and The second heat conducting pipe (2113) is connected to the end of the first heat conducting pipe (2112) away from the heat absorbing pipe (2111) in an arc shape, and the second heat conducting pipe (2113) extends along the second direction.

9. The heat dissipation device according to claim 8, characterized in that: The cross-sectional shape of the heat absorbing tube (2111) is square, and the cross-sectional shapes of the first heat conducting tube (2112) and the second heat conducting tube (2113) are flat, so that the surfaces of the first heat conducting tube (2112) and the second heat conducting tube (2113) facing the heat dissipation component (220) are flat.

10. The heat dissipation device according to claim 8, characterized in that: When there are multiple heat-conducting members (211), the multiple first heat-conducting pipes (2112) and the multiple second heat-conducting pipes (2113) of the multiple heat-conducting members (211) are arranged on the same plane.

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