Low-cost high-heat-dissipation semiconductor laser shell and semiconductor laser

Abstract

The utility model relates to the technical field of semiconductor lasers, in particular to a low-cost high-heat-dissipation semiconductor laser shell and a semiconductor laser, and the low-cost high-heat-dissipation semiconductor laser shell comprises an aluminum frame and a sealing cover which is detachably arranged at the top end of the aluminum frame, the copper bottom plate and the aluminum frame are sealed and fixed, so that a closed space is formed in the aluminum frame, and the copper bottom plate is consistent in thickness in the length direction; the semiconductor laser comprises the low-cost high-heat-dissipation semiconductor laser shell, an electrode, a semiconductor light-emitting unit, an optical lens, an end cap, an output head and an end cap seat. The shell is arranged to be the combination of the aluminum frame and the copper bottom plate, the part with high heat productivity is arranged to be copper, and the part with low heat productivity is arranged to be aluminum, so that heat can be quickly conducted out, the weight and the cost of equipment can be reduced, and production and assembly are facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor laser technical field, concretely is a low cost high heat dissipation's semiconductor laser shell and semiconductor laser. BACKGROUND

[0002] The existing semiconductor laser, the shell is basically purple copper material, the weight is relatively heavy, and the production cost is relatively high, therefore, it is urgent to provide a semiconductor laser shell and semiconductor laser, which are light in weight and low in production cost. INVENTION CONTENTS

[0003] The utility model discloses a low cost high heat dissipation's semiconductor laser shell and semiconductor laser to solve the problem in the background art.

[0004] To achieve the above object, the utility model provides the following technical scheme: a low cost high heat dissipation's semiconductor laser shell, including aluminium frame, detachable installation in the sealing cover of aluminium frame top, the copper bottom plate is fixed to the aluminium frame bottom end and inclines downward, and the copper bottom plate is sealed and fixed with the aluminium frame, forms the airtight space in the aluminium frame interior, the thickness of copper bottom plate length direction is consistent.

[0005] Further, the aluminium frame and copper bottom plate are fixed through welding.

[0006] Further, the copper bottom plate top end is provided with a plurality of step portions along its length direction at equal intervals, and the step portion includes a first area, a second area and a third area along the width direction of the copper bottom plate, and the top end of the first area, the second area and the third area are parallel to the top end of the aluminium frame.

[0007] Further, a plurality of first mounting holes are arranged at the edge of the aluminium frame for external connection.

[0008] Further, the bottom end of the copper bottom plate extends to the lower side of the aluminium frame, and the edge of the copper bottom plate extends to the outer side of the aluminium frame and is provided with a second mounting hole for external connection.

[0009] Further, a plurality of weight-reducing blind holes are arranged along the length direction of the copper bottom plate.

[0010] A semiconductor laser includes the low cost high heat dissipation's semiconductor laser shell, electrode, semiconductor light emitting unit, optical lens, end cap, output head and end cap seat.

[0011] Compared with the prior art, the semiconductor laser shell with low cost and high heat dissipation and the semiconductor laser have the advantages that the shell is combined by an aluminum frame and a copper bottom plate, the semiconductor light emitting unit is installed on the copper bottom plate, heat can be quickly conducted out, the weight and cost of the equipment can be reduced while the heat dissipation effect of the semiconductor light emitting unit is ensured, and meanwhile, production and assembly are facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is an exploded view of the semiconductor laser shell of the utility model;

[0013] Figure 2 It is a sectional view of the semiconductor laser shell of the utility model;

[0014] Figure 3 It is a three-dimensional structure diagram of the semiconductor laser of the utility model.

[0015] Figure 4 It is an exploded view of the semiconductor laser shell of the utility model embodiment 2.

[0016] In the drawing: 1, aluminum frame; 101, first mounting hole; 2, copper bottom plate; 201, weight-reducing blind hole; 202, first area; 203, second area; 204, third area; 205, second mounting hole; 3, electrode; 4, semiconductor light emitting unit; 5, optical lens; 6, end cap; 7, output head; 8, end cap seat. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, and it should be noted that, in the description of the utility model, the description of terms "first", "second" and the like is only for the purpose of description, and does not mean to particularly indicate the order or sequence, nor to limit the utility model, and it is only for the purpose of distinguishing components or operations described by the same technical terms, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implying the number of the indicated technical features, therefore, the features with "first", "second" can be explicitly or implicitly included at least one of the features. In order to make the description of the utility model, the claims and the above-mentioned drawings, the term "include" and any change thereof, is intended to cover non-exclusive inclusion.

[0018] In the description of the utility model, it is necessary to explain that, unless there is definite stipulation and limitation, the term "installation", "connection", "connect", "arrangement" should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, can be mechanical connection, also can be electrical connection, can be direct connection, also can be indirect connection through intermediate medium, can be two element internal communication, for ordinary skilled in the art, the specific meaning of the above-mentioned term in the utility model can be understood according to specific circumstances.In addition, in the description of the utility model, it is necessary to understand that, the orientation or position relation indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "internal", "external" and the like is the orientation or position relation based on the orientation or position relation shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0019] Embodiment 1, please refer to Figures 1-3 The utility model provides a kind of low-cost high heat dissipation semiconductor laser shell: including aluminum frame 1, detachably installed in the sealing cover (not shown in the drawing) of aluminum frame 1 top, the material of sealing cover can also be aluminum specifically, copper bottom plate 2 is fixed with the inclination downward in the bottom end of aluminum frame 1, the thickness of copper bottom plate 2 length direction is consistent, in the embodiment, the bottom end of copper bottom plate 2 is flush with the bottom end of aluminum frame 1, copper bottom plate 2 is tightly attached on the inner side wall of aluminum frame 1 to form airtight space in aluminum frame 1.

[0020] In the embodiment, the edge of aluminum frame 1 is provided with a plurality of mounting holes 101, which can be fixed by bolts and water-cooled plates or heat dissipation fins and other heat dissipation devices, to facilitate heat dissipation of the semiconductor laser.

[0021] The top of copper bottom plate 2 is provided with a plurality of step portions at equal intervals along its length direction, since the whole copper bottom plate 2 is inclinedly arranged at the bottom end of aluminum frame 1 and the thickness of copper bottom plate 2 length direction is consistent, the height of a plurality of step portions decreases step by step along the length direction of aluminum frame 1, and the top of the first area 202, the second area 203 and the third area 204 are parallel to the top of aluminum frame 1, the existing semiconductor laser shell is generally parallel up and down, but in order to decrease the height of each step portion along the length direction of the shell, the thickness of the bottom end of the shell is thick on one side and thin on the other side, in the embodiment, the copper bottom plate 2 is inclinedly arranged and the thickness is consistent, which can reduce the amount of copper used, the copper bottom plate 2 passes through the lowest end of the pump shell, which can quickly conduct heat to the heat dissipation device, and at the same time, the contact area between the bottom end and the heat dissipation device is increased, so that the heat exchange effect is better.

[0022] In this embodiment, the aluminum frame 1 and the copper bottom plate 2 are fixed by welding, the connection is more firm, and the heat conduction effect is good. Further, the aluminum frame 1 and the copper bottom plate 2 can also be fixed by screws or adhesion.

[0023] In this embodiment, the copper bottom plate 2 is provided with a plurality of weight-reducing blind holes 201 along the length direction thereof, and the weight-reducing blind holes 201 are specifically arranged on the second regions 203 of the respective stepped portions, thereby further reducing the weight and production cost of the semiconductor laser.

[0024] Please refer to Figure 3 , the embodiment also provides a semiconductor laser, which comprises a low-cost and high-heat-dissipation semiconductor laser shell, the copper bottom plate 2 is provided with a semiconductor light-emitting unit 4 and an optical lens 5, the aluminum frame 1 is provided with an electrode 3, an end cap 6, an output head 7 and an end cap seat 8, and the semiconductor light-emitting unit 4 and the optical lens 5 are specifically existing technologies, and reference is made to the drawings Figure 4 , the semiconductor light-emitting unit 4 corresponds to the stepped portion one by one and is arranged on the first region 202 of each stepped portion, the optical lens 5 comprises a collimator mirror arranged on the second region 203 of each stepped portion, a reflector mirror arranged on the third region 204, and a reflector mirror and a focusing mirror arranged on one side inside the aluminum frame 1, and the end cap 6, the end cap seat 8 and the output head 7 are located at the lower end of the copper bottom plate 2. In this embodiment, the end cap seat 8 is specifically arranged on one side inside the aluminum frame 1. In operation, the rays emitted by each semiconductor light-emitting unit 4 converge at the end cap 6 after collimation by the collimator mirror and reflection by the reflector mirror, and are finally output through the output head 7. The semiconductor light-emitting unit 4 is directly arranged on the copper bottom plate 2, so that the heat can be quickly dissipated, and the heat dissipation effect is good. Since the weight and cost of aluminum are lower than those of copper, the material of the place where the heat is relatively small at the edge is set to aluminum, so that the overall weight and production cost can be reduced, and the production and assembly are also relatively convenient, that is, the copper bottom plate 2 and the aluminum frame 1 are directly welded, screwed or adhesively fixed.

[0025] Embodiment 2, reference is made to Figure 4 The difference between this embodiment and embodiment 1 is that the bottom end of the copper bottom plate 2 extends below the aluminum frame 1, and the edge of the copper bottom plate 2 extends to the outside of the aluminum frame 1 and is provided with a second mounting hole 205, which is used for external connection.

[0026] The embodiment also provides a semiconductor laser, and the difference between this embodiment and embodiment 1 is that the end cap seat 8 is arranged on one side at the top end of the copper bottom plate 2.

[0027] It is apparent for a person skilled in the art that the present application is not restricted to the details of the above exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary only, and not limiting, the scope of the present application being defined by the appended claims rather than the above description, and all changes coming within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims concerned.

Claims

1. A low-cost high-heat-dissipation semiconductor laser package, characterized by: The application relates to a low-cost high-heat-dissipation semiconductor laser shell, which comprises an aluminum frame (1), a sealing cover detachably mounted at the top end of the aluminum frame (1), a copper bottom plate (2) fixedly arranged at the bottom end of the aluminum frame (1) and inclined downward, and the copper bottom plate (2) is sealingly fixed with the aluminum frame (1) to form a closed space in the aluminum frame (1), and the thickness of the copper bottom plate (2) is consistent along the length direction.

2. The low cost high heat dissipating semiconductor laser package of claim 1, wherein: The aluminum frame (1) and the copper bottom plate (2) are fixed by welding.

3. The low cost high heat dissipating semiconductor laser package of claim 1, wherein: The top end of the copper bottom plate (2) is provided with a plurality of step portions at equal intervals along the length direction, and the step portions comprise a first area (202), a second area (203) and a third area (204) along the width direction of the copper bottom plate (2), and the top ends of the first area (202), the second area (203) and the third area (204) are parallel to the top end of the aluminum frame (1).

4. The low cost high heat dissipating semiconductor laser package of claim 1, wherein: A plurality of first mounting holes (101) are arranged at the edges of the aluminum frame (1) and used for external connection.

5. The low cost high heat dissipating semiconductor laser package of claim 1, wherein: The bottom end of the copper bottom plate (2) extends to the lower side of the aluminum frame (1), and the edges of the copper bottom plate (2) extend to the outer side of the aluminum frame (1) and are provided with second mounting holes (205) used for external connection.

6. The low cost high heat dissipation semiconductor laser package of claim 1, wherein: A plurality of weight-reducing blind holes (201) are arranged along the length direction of the copper bottom plate (2).

7. A semiconductor laser, characterized by: The low-cost high-heat-dissipation semiconductor laser shell, an electrode (3), a semiconductor light-emitting unit (4), an optical lens (5), an end cap (6), an output head (7) and an end cap seat (8) are arranged.

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