Radiator module capable of improving heat dissipation effect

Abstract

The utility model discloses a radiator module capable of improving a heat dissipation effect, which comprises a heat dissipation fin group, a heat dissipation pipe penetrating through the heat dissipation fin group and a vapor chamber arranged on one side of the heat dissipation fin group and used for being in contact with an electronic element for heat conduction, and two heat dissipation air guide grooves penetrating through the side edge of a heating source are arranged at the bottom of the vapor chamber. One end of the heat dissipation air guide groove is provided with an air guide cover used for guiding heat dissipation air into the heat dissipation air guide groove. The heat dissipation and air guide grooves penetrating through the two sides of the electronic element are formed in the bottom of the vapor chamber, heat dissipation air blown from the radiator fin set is guided into the heat dissipation and air guide grooves through the air guide cover, and therefore heat generated by the electronic element is directly taken away, the heat dissipation efficiency can be greatly improved, and the heat dissipation effect is improved. The influence of the heat conduction performance of the heat dissipation fin group and the vapor chamber on heat dissipation can be reduced, the high temperature of the electronic component caused by the change of the heat conduction performance of the heat dissipation fin group and the vapor chamber in the long-term use process is avoided, the service life of the electronic component is prolonged, and the operation performance stability of the electronic component is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator technical field especially point to a radiator module that improves the heat dissipation effect. BACKGROUND

[0002] In modern electronic products, especially high-performance graphics cards, the design of the radiator is particularly important. This is because electronic devices generate a large amount of heat when they are working, especially in high-load operations such as graphics processing and complex computing tasks. The main reason for generating heat is the power consumption of the components. When current passes through semiconductor materials, the impedance will cause part of the electrical energy to be converted into heat energy. If the heat cannot be dissipated in time, the temperature rise will cause the performance of the components to decline, and even damage.

[0003] Currently, the traditional cooling methods mainly include air cooling, liquid cooling and heat pipe cooling. Air cooling relies on fans to remove heat from the surface of electronic components, which is a widely used and cost-effective method, but it often has the problem of insufficient cooling efficiency in high-performance products; liquid cooling removes heat through liquid circulation, which is more efficient and has lower noise, but the structure is complex, the cost is high and leakage prevention measures are required; heat pipe cooling uses materials with good thermal conductivity to quickly transfer heat to the heat sink area, but it is limited by the upper limit of heat pipe design. Especially in high-performance graphics cards, as the computing power increases, the heat generated rapidly rises. If the cooling system cannot quickly reduce the temperature, the graphics card will reduce the frequency to protect itself, resulting in performance degradation.

[0004] For example: China patent authorized announcement number CN 101605442B's radiator, in the technical scheme disclosed in this patent, the radiator is mainly used for cooling the circuit board, the radiator includes a base, a radiator, a fan, and a cover. When working, the base and the circuit board are fixed to the circuit board by the fixing member, the bottom surface of the base can contact one or more electronic components, and the heat conduction effect can be enhanced by applying heat-conducting glue between the bottom surface of the base and the top surface of the electronic components. Insulating film can be placed between the radiator and the circuit board to provide insulation and cushioning. Since the heat pipe is a high-efficiency heat-conducting plate-shaped heat pipe, the heat generated by the electronic components can be absorbed by the heat pipe and quickly and evenly distributed throughout the heat pipe. The heat is conducted to the entire radiator, and finally the airflow generated by the fan passes through the airflow channel in the radiator to quickly remove the heat, thereby achieving the effect of quickly cooling the electronic components.

[0005] As described in the above patent, since the heat dissipation devices on the market at present all adopt the airflow generated by the fan to blow through the heat sink or the heat conductor to take away the heat for heat dissipation, the heat dissipation efficiency greatly depends on the heat conductivity of the heat sink or the heat conductor, when the heat conductivity of the heat sink or the heat conductor is reduced due to dust accumulation or other reasons, the electronic element is prone to instantaneous high temperature, which leads to the performance reduction or damage of the electronic element, therefore, the continuous and stable heat dissipation of the electronic element is an important factor for maintaining the performance of the electronic product and improving the service life.

[0006] Therefore, the present inventors propose the following technical solutions. Content of the utility model:

[0007] The utility model discloses a heat dissipation device module that improves heat dissipation effect.

[0008] In order to solve the above technical problem, the utility model adopts the following technical scheme: a heat dissipation device module that improves heat dissipation effect, comprising: at least one heat dissipation fin group for heat conduction, at least one heat dissipation pipe penetrating through the heat dissipation fin group and a heat spreader arranged on one side of the heat dissipation fin group and used for contacting and conducting heat with the electronic element, the bottom of the heat spreader is provided with at least two heat dissipation air guide grooves penetrating from the side of the heat source, and one end of the heat dissipation air guide groove is provided with an air guide cover used for guiding the heat dissipation air into the heat dissipation air guide groove.

[0009] Further in the above technical scheme, the air guide cover comprises a square frame part mounted on the heat spreader and a cover body part arranged on the side of the square frame part and extending out of the heat spreader, wherein the cover body part is provided with two cover body parts arranged side by side and located below the heat dissipation air guide groove.

[0010] Further in the above technical scheme, the heat spreader comprises a flat plate part used for contacting the heat dissipation fin group and the heat dissipation pipe and a convex plate part used for contacting the heat source in the electronic element, wherein the heat dissipation air guide groove is located on the convex plate part, and a plurality of first positioning columns capable of penetrating through the flat plate part are arranged on the flat plate part.

[0011] Further in the above technical scheme, the first positioning columns are located on the periphery of the convex plate part, and a plurality of first positioning holes corresponding to the first positioning columns are arranged on the square frame part.

[0012] Further in the above technical scheme, the heat spreader is a copper plate, and a heat conduction part is further arranged on the side of the heat spreader, the heat conduction part is a stamping folded plate, and at least two second positioning columns used for fixing the PCB of the electronic element are arranged on the heat conduction part.

[0013] Further in the above technical scheme, the heat dissipation pipe is arranged in plurality, and the heat dissipation pipe is located between the heat dissipation fin group and the heat spreader and is flush and in contact with the end face of the heat spreader.

[0014] Further, in the technical scheme, the two heat dissipation fin groups are connected and fixed by the connecting plate, and the heat dissipation pipe penetrates the two heat dissipation fin groups.

[0015] Further, in the technical scheme, the heat dissipation fin group is provided with a first heat conduction surface in the contact area with the vapor chamber, the fins in the heat dissipation fin group are perpendicular to the first heat conduction surface, the heat dissipation pipe penetrates the first heat conduction surface, and the heat dissipation fin group is provided with a plurality of U-shaped grooves penetrating the first heat conduction surface and used for positioning the heat dissipation pipe.

[0016] Further, in the technical scheme, the two heat dissipation fin groups are connected and fixed by the connecting plate, and the heat dissipation pipe penetrates the two heat dissipation fin groups.

[0017] Further, in the technical scheme, the heat dissipation fin group is provided with a first heat conduction surface in the contact area with the vapor chamber, the fins in the heat dissipation fin group are perpendicular to the first heat conduction surface, the heat dissipation pipe penetrates the first heat conduction surface, and the heat dissipation fin group is provided with a plurality of U-shaped grooves penetrating the first heat conduction surface and used for positioning the heat dissipation pipe.

[0018] After the technical scheme is adopted, the utility model has the following beneficial effects compared with the prior art: in the utility model, the heat dissipation air guide groove penetrating the two sides of the electronic element is arranged at the bottom of the vapor chamber, the heat dissipation air from the heat dissipation fin group is guided into the heat dissipation air guide groove through the air baffle, so that the heat generated by the electronic element is directly taken away, which not only can greatly improve the heat dissipation efficiency, but also can reduce the influence of the heat conduction performance of the heat dissipation fin group and the vapor chamber on the heat dissipation, avoid the high temperature of the electronic element caused by the change of the heat conduction performance of the heat dissipation fin group and the vapor chamber in the long-term use process, and improve the service life and operation performance stability of the electronic element. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is the perspective view of the utility model;

[0020] Figure 2 is the exploded view of the utility model Figure One ;

[0021] Figure 3 is the exploded view of the utility model Figure Two . DETAILED DESCRIPTION

[0022] The utility model will be further described in combination with specific embodiments and drawings.

[0023] In the embodiment, the fan A is arranged on one side of the heat dissipation fin group 1 and is fixed with the heat dissipation fin group 1 through a support 9. When the heat dissipation fin group 1 is long, multiple fans A can be arranged on the support 9.

[0024] See Figures 1 to 3 As shown in the figure, the heat dissipation module for improving heat dissipation effect comprises at least one heat dissipation fin group 1 for heat conduction, at least one heat dissipation pipe 2 penetrating through the heat dissipation fin group 1, and a heat spreading plate 4 arranged on one side of the heat dissipation fin group 1 and used for contacting and conducting heat with the electronic component 3. The bottom of the heat spreading plate 4 is provided with at least two heat dissipation air guide grooves 41 penetrating through the sides of the heat source. One end of the heat dissipation air guide groove 41 is provided with an air guide cover 7 for guiding the heat dissipation air into the heat dissipation air guide groove 41. The heat dissipation air guide groove 41 penetrating through the two sides of the electronic component 3 is arranged on the bottom of the heat spreading plate 4. The heat dissipation air blown from the heat dissipation fin group 1 is guided into the heat dissipation air guide groove 41 through the air guide cover 7, so as to directly take away the heat generated by the electronic component 3. In this way, the heat dissipation efficiency can be greatly improved, and the influence of the heat conduction performance of the heat dissipation fin group 1 and the heat spreading plate 4 on heat dissipation can be reduced, so as to avoid high temperature of the electronic component 3 due to the change of the heat conduction performance of the heat dissipation fin group 1 and the heat spreading plate 4 during long-term use, and improve the service life and operation performance stability of the electronic component 3.

[0025] The air guide cover 7 comprises a square box part 71 arranged on the heat spreading plate 4 and a cover body part 72 arranged on the side of the square box part 71 and extending out of the heat spreading plate 4. The cover body part 72 is arranged in parallel with two air guide grooves 41 located below the heat dissipation air guide groove 41. The heat spreading plate 4 comprises a flat plate part 42 for contacting the heat dissipation fin group 1 and the heat dissipation pipe 2 and a convex plate part 43 for contacting the heat source in the electronic component 3. The heat dissipation air guide groove 41 is located on the convex plate part 43, and a plurality of first positioning columns 44 capable of penetrating through the flat plate part 42 are arranged on the flat plate part 42. The first positioning columns 44 are located on the periphery of the convex plate part 43, and a plurality of first positioning holes 73 corresponding to the first positioning columns 44 are arranged on the square box part 71. The air guide cover 7 is arranged as the square box part 71 and the cover body part 72. The square box part 71 is arranged on the convex plate part 43 of the heat spreading plate 4, and is fixed with the PCB 30 through the first positioning columns 44 penetrating through the first positioning holes 73, so that the cover body part 72 is located at one end of the heat dissipation air guide groove 41, and the opening of the cover body part 72 faces the heat dissipation fin group 1. When the heat dissipation air generated by the fan A passes through the heat dissipation fin group 1, the heat dissipation air is blown into the heat dissipation air guide groove 41 through the guide of the cover body part 72, so that the heat dissipation air directly blows to the electronic component 3 and takes away the heat generated by the electronic component 3.

[0026] The heat equalizing plate 4 is a copper plate, and a heat conducting member 5 is arranged beside the heat equalizing plate 4, the heat conducting member 5 is a stamping folded plate, and at least two second positioning columns 51 for fixing the PCB 30 of the electronic component 3 are arranged.

[0027] The heat radiating pipes 2 are arranged in an array, and the heat radiating pipes 2 are located between the heat radiating fin groups 1 and the heat equalizing plate 4 and are flush with the end surface of the heat equalizing plate 4. The heat radiating fin groups 1 are arranged in parallel, and the two heat radiating fin groups 1 are connected and fixed by a connecting plate 6, and the heat radiating pipes 2 penetrate the two heat radiating fin groups 1. The contact area between the heat radiating fin group 1 and the heat equalizing plate 4 is provided with a first heat conducting surface 11, the fins in the heat radiating fin group 1 are perpendicular to the first heat conducting surface 11, the heat radiating pipes 2 all penetrate the first heat conducting surface 11, and a plurality of U-shaped grooves 12 for positioning the heat radiating pipes 2 are arranged on the heat radiating fin group 1 and penetrate the first heat conducting surface 11. The connecting plate 6 is arranged in parallel and connects the two heat radiating fin groups 1 by welding, and the two connecting plates 6 are located on the two sides of the heat radiating fin group 1.

[0028] The heat equalizing plate 4 and the heat conducting member 5 are stamping parts, and the two side surfaces are uneven; the fins on the bottom surface of the heat radiating fin group 1 are uneven, so as to match the different contact surfaces on the heat equalizing plate 4 and the heat conducting member 5, and the contact area between the fins and the heat equalizing plate 4 and the heat conducting member 5 is provided with a heat conducting surface; the fins on the top surface of the heat radiating fin group 1 are flat and are fixed to the connecting plate 6 by welding.

[0029] In summary, in the utility model, two heat radiating air guide grooves 41 are formed on the bottom of the heat equalizing plate 4 by stamping, and the heat radiating air generated by the fan A is guided to the heat radiating air guide grooves 41 through the air guide cover 7 on the heat equalizing plate 4, so that the heat radiating air can directly blow to the two sides of the electronic component 3 and take away the heat generated by the electronic component 3, thereby realizing direct heat dissipation of the electronic component 3 and improving the heat dissipation efficiency of the electronic component 3.

[0030] Of course, the above only describes specific embodiments of the utility model, and does not limit the utility model implementation range, and equivalent changes or modifications made according to the structure, features and principles described in the utility model patent application scope should be included in the utility model patent application scope.

Claims

1. A heat sink module with improved heat dissipation effect, comprising at least one heat dissipation fin group (1) for heat conduction, at least one heat dissipation pipe (2) penetrating through the heat dissipation fin group (1), and a heat spreading plate (4) arranged on one side of the heat dissipation fin group (1) and used for contacting and conducting heat with an electronic component (3), characterized in that: the bottom of the heat spreading plate (4) is provided with at least two heat dissipation air guide grooves (41) penetrating from the side of the heat source, and one end of the heat dissipation air guide groove (41) is provided with an air guide cover (7) for guiding heat dissipation air into the heat dissipation air guide groove (41). The air guide cover (7) comprises a square box portion (71) mounted on the heat spreading plate (4) and a cover body portion (72) arranged on the side of the square box portion (71) and extending out of the heat spreading plate (4), wherein the cover body portion (72) is arranged in parallel with two and is located below the heat dissipation air guide groove (41) respectively.

2. The heat sink module of claim 1, wherein: The heat spreading plate (4) comprises a flat plate portion (42) for contacting the heat dissipation fin group (1) and the heat dissipation pipe (2) and a convex plate portion (43) for contacting the heat source in the electronic component (3), wherein the heat dissipation air guide groove (41) is located on the convex plate portion (43), and a plurality of first positioning columns (44) capable of penetrating through the flat plate portion (42) are arranged on the flat plate portion (42).

3. The heat spreader module of claim 2, wherein: The first positioning column (44) is located on the periphery of the convex plate portion (43), and a plurality of first positioning holes (73) corresponding to the first positioning column (44) are arranged on the square box portion (71).

4. The heat spreader module of claim 3, wherein: The heat spreading plate (4) is a copper plate, and a heat conduction member (5) is further arranged on the side of the heat spreading plate (4), the heat conduction member (5) is a stamping folded plate, and at least two second positioning columns (51) for fixing a PCB (30) of the electronic component (3) are arranged on the heat conduction member (5).

5. The heat spreader module of any one of claims 1-4, wherein: The heat dissipation pipe (2) is arranged in an array of a plurality of heat dissipation pipes (2), and the heat dissipation pipe (2) is located between the heat dissipation fin group (1) and the heat spreading plate (4) and is flush with the end surface of the heat spreading plate (4) for contact.

6. The heat spreader module of claim 5, wherein: The heat dissipation fin group (1) is arranged in parallel with two heat dissipation fin groups (1), a connecting plate (6) is arranged between the two heat dissipation fin groups (1) for connection and fixation, and the heat dissipation pipe (2) penetrates through the two heat dissipation fin groups (1).

7. The heat spreader module of claim 6, wherein: A first heat conduction surface (11) is arranged in the contact area between the heat dissipation fin group (1) and the heat spreading plate (4), the fins in the heat dissipation fin group (1) are perpendicular to the first heat conduction surface (11), the heat dissipation pipe (2) penetrates through the first heat conduction surface (11), and a plurality of U-shaped grooves (12) penetrating through the first heat conduction surface (11) and used for positioning the heat dissipation pipe (2) are arranged on the heat dissipation fin group (1).

8. The heat spreader module of claim 7, wherein: The connecting plate (6) is arranged in parallel with two connecting plates (6) and connects the two heat dissipation fin groups (1) by welding, and the two connecting plates (6) are respectively located on the two sides of the heat spreading plate (4) and the heat dissipation fin group (1).

9. The heat spreader module of claim 8, wherein: The heat spreading plate (4) and the heat conduction member (5) are both stamping parts, and the two side surfaces are uneven; the fins on the bottom surface of the heat dissipation fin group (1) are uneven for matching the different contact surfaces on the heat spreading plate (4) and the heat conduction member (5), and the contact areas between the fins and the heat spreading plate (4) and the heat conduction member (5) are provided with heat conduction surfaces; the fins on the top surface of the heat dissipation fin group (1) are flat and fixed with the connecting plate (6) by welding.

10. The heat spreader module of claim 9, wherein: ​

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