Directional arrangement device of chip-type three-terminal multilayer ceramic filter

Abstract

The utility model relates to a directional arrangement device of a chip-type three-terminal multilayer ceramic filter, which is characterized in that a chip CD of the chip-type three-terminal multilayer ceramic filter directly faces a cutting inner electrode surface / EF directly faces a cover surface in a manual / equipment left-right and front-back shaking / vibrating manner, and any one surface directly faces a magnetic plate surface; the CD of the chip-type three-terminal multilayer ceramic filter chip is adsorbed by the magnetic adsorption force of the magnetic plate and is over against the cutting inner electrode surface, and the chip-type three-terminal multilayer ceramic filter chip of which the EF in contact with the ferromagnetic plate surface is over against the cover surface is separated out of the vibration sieve holes of the vibration sieve plate through shaking / vibration; the chip-type three-terminal multilayer ceramic filter chips of which the CDs directly face the cutting inner electrode surface and are in contact with the magnetic plate surface are fully arranged in vibration sieve holes of the vibration sieve plate, so that the CDs of the chip-type three-terminal multilayer ceramic filter chips directly face the cutting inner electrode surface to face up and down, thereby realizing directional arrangement of the chip-type three-terminal multilayer ceramic filter chips with consistent width and thickness; and the arrangement accuracy and the production efficiency are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of slice three-terminal multi-layer ceramic filter slurry, in particular to a directional arrangement device of slice three-terminal multi-layer ceramic filter. BACKGROUND

[0002] With the rapid development of electronic information technology, as one of the three electronic components, slice multi-layer ceramic capacitor (MLCC) is constantly developing towards miniaturization, high capacitance, high frequency, etc. In various electronic circuit applications, various slice multi-layer ceramic filters (MLCF) with three-terminal structure have been rapidly developed, including T-shaped slice multi-layer LC filter, π-shaped slice multi-layer LC filter, and C-shaped slice multi-layer filter (i.e. slice three-terminal capacitor filter). Among them, the slice three-terminal capacitor filter gradually replaces some high-capacity MLCC in some applications due to its superior high-frequency characteristics, lower equivalent series inductance (ESL), and smaller mounting area.

[0003] MLCF and MLCC are both composed of multiple layers of dielectric film interleaved and stacked. In addition to leading out the internal electrode in the length direction of the chip, the internal electrode is also led out in the width direction. By setting the ground electrode, current can flow into the two ends of the MLCF and flow out from the middle ground electrode, thereby shortening the current path by half. At the same time, due to the existence of current flowing out from four electrode directions and self-induction, the equivalent series inductance (ESL) of the MLCF can be greatly reduced.

[0004] The slurry operation of the MLCF ground electrode is usually performed by loading the ceramic body chip of the MLCF in an array arrangement of SUS carrier plate, JIG carrier plate, and thin rubber plate, so that the electrode surface of the waist to be slurry is exposed. After a specific slurry process, the ground electrode is coated on the electrode surface of the chip, and after drying and surface changing, the other side of the ground electrode is slurry-coated with silver and dried, thereby obtaining the MLCF chip coated with the ground external electrode.

[0005] Generally, for some MLCF with inconsistent width and thickness, the ground electrode is usually made by physical method, that is, by processing high-precision tooling, using the size difference of the chip in the width and thickness directions to identify and control the placement direction of the chip. After the chip width and thickness directions are identified and arrayed, it can be ensured that when the chip is loaded by tooling such as SUS carrier plate, JIG carrier plate and thin rubber plate, the electrode surface in the thickness direction is exposed from the waist. For some MLCF with consistent width and thickness, there is no size deviation in the width and thickness directions, and it is impossible to identify and arrange the width and thickness directions by simple physical method. Only manual visual identification and arrangement can ensure that the electrode surface is exposed from the waist when the chip is loaded by tooling, which results in long arrangement time, low efficiency, high production cost and difficulty in batch production. Practical new type content

[0006] Therefore, the application provides a directional arrangement device for chip type three-terminal multilayer ceramic filter, which can arrange the MLCF chips with consistent width and thickness, improve production efficiency and reduce production cost.

[0007] The above object of the application is achieved by the following technical solutions:

[0008] The application provides a directional arrangement device for chip type three-terminal multilayer ceramic filter, the width and thickness of the chip type three-terminal multilayer ceramic filter are the same, and the two side surfaces in the thickness direction of the chip type three-terminal multilayer ceramic filter expose internal electrodes; the device comprises:

[0009] A vibrating sieve plate has an upper surface, a plurality of vibrating sieve holes penetrating the vibrating sieve plate are arrayed on the upper surface, the transverse size of the vibrating sieve hole is greater than the transverse size of the chip type three-terminal multilayer ceramic filter, so that the chip type three-terminal multilayer ceramic filter can enter the vibrating sieve hole from the upper surface in the transverse direction or be removed from the vibrating sieve hole to the upper surface;

[0010] A magnetic plate is arranged below the vibrating sieve plate, the magnetic plate supports the chip type three-terminal multilayer ceramic filter in the vibrating sieve hole and applies magnetic attraction force to the chip type three-terminal multilayer ceramic filter to keep it in the vibrating sieve hole;

[0011] A loading plate comprises a loading part for loading the chip type three-terminal multilayer ceramic filter in the vibrating sieve hole from above.

[0012] The application has the following beneficial effects:

[0013] The directional arrangement device of the chip type three-terminal multilayer ceramic filter in the embodiment of the application makes the chip CD of the chip type three-terminal multilayer ceramic filter face any one of the cut inner electrode surface / EF facing cover surface by means of artificial / equipment left-right and front-back shaking / vibration, and the CD of the chip type three-terminal multilayer ceramic filter is adsorbed to the cut inner electrode surface by the magnetic adsorption force of the magnetic plate, and the chip type three-terminal multilayer ceramic filter chip with the EF facing cover surface contacting the ferromagnetic plate surface is separated out of the vibration sieve hole by shaking / vibration, and the operation is repeated for multiple times, so that the chip type three-terminal multilayer ceramic filter chips with the CD facing the cut inner electrode surface and the magnetic plate surface are arranged in the vibration sieve hole, and the CD of the chip type three-terminal multilayer ceramic filter chip faces upward and downward, so as to realize the directional arrangement of the chip type three-terminal multilayer ceramic filter chip with uniform width and thickness, and improve the correct arrangement rate and production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 The structural schematic diagram of the chip type three-terminal multilayer ceramic filter with uniform width and thickness in an exemplary embodiment;

[0015] Figure 2 The structural schematic diagram of the vibration sieve plate in an exemplary embodiment;

[0016] Figure 3 The structural schematic diagram of the vibration sieve hole in an exemplary embodiment;

[0017] Figure 4 The structural schematic diagram of the magnetic plate in an exemplary embodiment;

[0018] Figure 5 The structural schematic diagram of the loading plate in an exemplary embodiment;

[0019] Figures 6-9 The working process schematic diagram of the directional arrangement device of the chip type three-terminal multilayer ceramic filter in an exemplary embodiment;

[0020] Figures 10-11 The working process schematic diagram of the directional arrangement device of the chip type three-terminal multilayer ceramic filter in an exemplary embodiment.

[0021] BRIEF DESCRIPTION OF DRAWINGS:

[0022] 100, directional arrangement device of chip type three-terminal multilayer ceramic filter;

[0023] 110, vibration sieve plate; 111, vibration sieve hole; 1111, chamfer; 112, upper surface;

[0024] 120, magnetic plate; 121, thimble hole;

[0025] 130. Loading plate; 131. Loading hole;

[0026] 140. Lifting assembly; 141. Substrate; 142. Ejector pin;

[0027] 200. Chip-type three-terminal multilayer ceramic filter. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0029] Furthermore, the terms "first" and "first" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "first" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] To address the technical problems in the background art, this application provides a directional arrangement device and method for chip three-terminal multilayer ceramic filters, which can arrange chip three-terminal multilayer ceramic filters with consistent width and thickness in batches according to a specified width and thickness direction. This enables the rapid application of paste to the exposed waist grounding electrode after loading the chip three-terminal multilayer ceramic filters (hereinafter referred to as MLCF chips) with consistent width and thickness, thereby improving production efficiency and reducing production costs.

[0032] like Figure 1 The diagram shows the structure of an MLCF chip 200 with uniform width and thickness. Its length, width, and thickness (height) are a1, b1, and c1, respectively, where a1 > b1 = c1. The fabrication process of an MLCF chip typically includes processes such as material preparation, casting, printing, stacking, lamination, cutting, adhesive removal, sintering, and end capping. Figure 1The product form shown is a ceramic semi-finished product formed after sintering and chamfering, the two ends in the length direction are AB opposite the inner electrode surface, and the end electrode is exposed; the two ends in the thickness direction are CD opposite the cut inner electrode surface, and the waist ground electrode is exposed; the two ends in the width direction are EF opposite the cover surface, and the inner electrode is not exposed, and the inner electrode inside is arranged in the height direction. Figure 1

[0033] The end sealing is a process of connecting the electrodes exposed on the same side by dipping slurry on the AB inner electrode surface and the CD cut inner electrode surface of the ceramic semi-finished product after sintering and chamfering, so as to form an external electrode. Before the end sealing process of the waist ground electrode, the MLCF chip 200 needs to be arranged in a uniform arrangement manner, so that the side with the inner electrode exposed on the waist is uniformly oriented, for example, downward.

[0034] In the conventional technology such as patent No. CN117116676A, the MLCF chip is arranged in the direction of Figure 1 after being loaded into the through hole of the carrier plate by setting the through hole of the carrier plate to load the MLCF chip, so that the CD opposite the cut inner electrode surface faces the outside of the through hole, and the slurry dipping operation on the CD opposite the cut inner electrode surface can be realized.

[0035] The conventional technology adjusts the MLCF chips with inconsistent width and thickness to the arrangement manner of Figure 1 . The width and thickness of the chip can be used to identify and control the placement direction of the chip by using high-precision tooling, and the width and thickness of the chip can be identified and arranged in a direction. However, for MLCF chips with consistent width and thickness, the conventional technology cannot arrange them.

[0036] To solve the technical problem, the embodiment of the present application provides a directional arrangement device 100 and a directional arrangement method for a chip type three-terminal multilayer ceramic filter, as shown in Figures 2-9 In an embodiment, the directional arrangement device 100 for the chip type three-terminal multilayer ceramic filter includes a vibrating sieve plate 110, a magnetic plate 120, and a loading plate 130.

[0037] As shown in Figure 2 The vibrating sieve plate 110 has an upper surface 112, and a plurality of vibrating sieve holes 111 are arranged on the upper surface 112 of the vibrating sieve plate 110. Each vibrating sieve hole 111 can allow one MLCF chip to enter from the surface of the vibrating sieve plate 110 and be placed horizontally in a first state or a second state. In the first state, the two sides of the MLCF chip along the thickness direction are upward and downward, for example Figure 1 , which is the first state of the MLCF chip, and the waist ground electrode is exposed in the upward and downward direction; in the second state, the two sides of the MLCF chip along the width direction are upward and downward, that is Figure 1 ​The MLCF chip has its EF facing the cover plate on the top and bottom sides, and its ground electrode on the waist is exposed on the left and right sides.

[0038] In this embodiment, the vibrating screen hole 111 can be a rectangular hole, a circular hole, or an irregularly shaped hole, with a lateral dimension larger than that of the MLCF chip, so that the MLCF chip can enter laterally from the upper surface 112 into the vibrating screen hole 111, or be moved out from the vibrating screen hole 111 to the upper surface 112. In this embodiment, the cross-sectional area of ​​each point of the vibrating screen hole 111 is larger than the cross-sectional area of ​​the MLCF chip. If the vibrating screen hole 111 is a rectangular hole, then the length and width of the vibrating screen hole 111 are both larger than the length and thickness (width) of the MLCF chip. If the vibrating screen hole 111 is a circular hole, then its diameter is not less than the diagonal length of the lateral dimension of the MLCF chip, so that an MLCF chip can enter from above and be placed laterally in the vibrating screen hole 111.

[0039] The magnetic plate 120 has a magnetic material coating or embedded magnetic elements, capable of attracting magnets or magnetic objects. It can be a permanent magnetic material or an electromagnetic material. The magnetic plate 120 is disposed below the vibrating screen plate 110, and its coverage area is larger than that of the vibrating screen holes 111. This allows it to support the MLCF chips located within the vibrating screen holes 111 from below and apply a magnetic attraction force to the MLCF chips, holding them within the holes 111. Preferably, the magnetic plate 120 is configured to exert approximately the same magnetic attraction force on the MLCF chips within each vibrating screen hole 111 in different regions. Specifically, the area of ​​the magnetic plate 120 can be set to be relatively large, or the magnetic field on the upper surface 112 of the magnetic plate 120 can be set to be relatively uniform.

[0040] In traditional multilayer ceramic chip capacitors, the internal electrodes are typically made of metal, and external magnets exert a relatively weak magnetic attraction on them. In this embodiment, to increase the magnetic attraction, magnetic materials such as iron, nickel, or cobalt can be added to the internal electrodes, making them more magnetic. For ordinary multilayer ceramic chip capacitors, the magnetism on both sides of the width parallel to the internal electrode arrangement direction is greater than the magnetism on both sides of the height, corresponding to... Figure 1 The magnetism of the EF surface is greater than that of the CD surface. However, the applicant discovered that in a chip three-terminal multilayer ceramic capacitor, the magnetism of the CD surface facing the inner electrode is greater than that of the EF surface facing the cover plate, resulting in the magnetic attraction force of the magnetic plate 120 to the CD surface facing the inner electrode being greater than that to the EF surface facing the cover plate.

[0041] The loading plate 130 includes a loading section, which can be moved above the vibrating screen plate 110. The loading section is used to load MLCF chips that are laterally located in the vibrating screen holes 111.

[0042] The loading plate 130 of the embodiment is used to load the MLCF chips horizontally placed in the first state in the vibration sieve hole 111 from above by the loading part, and then perform the slurry coating operation on the outer electrode of the CD positive cutting inner electrode surface. Therefore, the loading part is used to load the MLCF chips in a manner that the CD positive cutting inner electrode surface is exposed. Specifically, the loading part can be a hole or a groove corresponding to the vibration sieve hole 111 formed on the loading plate 130, or an adhesive flat surface provided on the loading plate 130.

[0043] The working process of the directional arrangement device 100 of the chip type three-terminal multilayer ceramic filter of the embodiment is as follows:

[0044] Step 1, place a plurality of MLCF chips with uniform width and thickness on the upper surface 112 of the vibration sieve plate 110. At this time, the MLCF chips are horizontally or vertically placed on the surface of the vibration sieve plate 110. The MLCF chips can be placed horizontally on the upper surface 112 of the vibration sieve plate 110 by horizontally vibrating the vibration sieve plate 110 or sweeping with an external tool; Step 2, horizontally vibrate the vibration sieve plate 110 so that the MLCF chips enter the vibration sieve hole 111 and are horizontally placed in the vibration sieve hole 111. At this time, part of the MLCF chips are horizontally placed in the first state, and part of the MLCF chips are horizontally placed in the second state; Step 3, vibrate the vibration sieve plate 110 and the magnetic plate 120 up and down at a predetermined frequency, so that the MLCF chips horizontally placed in the second state in the vibration sieve hole 111 overcome the magnetic adsorption force of the magnetic plate 120, are removed from above the vibration sieve hole 111 and moved to the upper surface 112 of the vibration sieve plate 110, while the MLCF chips placed in the first state are kept in the vibration sieve hole 111 due to the magnetic adsorption force and gravity greater than the vibration force; repeat Step 3 multiple times so that all the MLCF chips in the vibration sieve hole 111 are horizontally placed in the first state; Step 4, move the loading plate 130 above the vibration sieve plate 110, and load the MLCF chips horizontally placed in the first state in the vibration sieve hole 111 through the loading part.

[0045] In the embodiment, for different specifications and models of chip type three-terminal multilayer ceramic filters with uniform width and thickness, the vibration frequency and / or magnetic force corresponding to the chip type three-terminal multilayer ceramic filters need to be configured in advance. The MLCF chips placed in the second state are vibrated out of the vibration sieve hole 111, and the MLCF chips placed in the first state are not vibrated out of the vibration sieve hole 111. The specific vibration frequency or magnetic force can be obtained by experiment or calculation, and verified by experiment.

[0046] In the embodiment, after the MLCF chips are loaded on the loading part, the chips in the loading plate 130 are leveled, and the ground outer electrode on the CD positive cutting inner electrode surface of the MLCF chips on the loading plate 130 can be prepared.

[0047] The orientation arrangement device for the chip three-terminal multilayer ceramic filter of this application embodiment uses manual / equipment left-right and back-and-forth shaking / vibration to make either the CD facing the inner electrode surface or the EF facing the cover surface of the chip three-terminal multilayer ceramic filter face the magnetic plate surface. The magnetic plate magnetically attracts the CD facing the inner electrode surface of the chip three-terminal multilayer ceramic filter. By shaking / vibrating, the chip three-terminal multilayer ceramic filter with the EF facing the cover surface in contact with the ferromagnetic plate surface is separated from the vibrating screen hole of the vibrating screen plate. Repeating the operation multiple times, the chip three-terminal multilayer ceramic filter with the CD facing the inner electrode surface in contact with the magnetic plate surface is arranged to fill the vibrating screen hole of the vibrating screen plate, with the CD facing the inner electrode surface of the chip three-terminal multilayer ceramic filter facing the vertical direction. This achieves the orientation arrangement of chip three-terminal multilayer ceramic filter chips with consistent width and thickness, and improves the arrangement accuracy and production efficiency.

[0048] In this embodiment of the application, the horizontal vibration screen plate 110 in step 2 and the up-and-down vibration screen plate 110 and magnetic plate 120 at a predetermined frequency in step 3 can be completed manually or automatically by a vibration mechanism.

[0049] In a preferred embodiment, the directional arrangement device 100 of the chip three-terminal multilayer ceramic filter further includes a first vibration mechanism, which is connected to the vibrating screen plate 110 and the magnetic plate 120. The first vibration mechanism drives the vibrating screen plate 110 and the magnetic plate 120 to vibrate up and down together at a set frequency.

[0050] Preferably, it also includes a second vibration mechanism, which is connected to the vibrating screen plate 110 and the magnetic plate 120. The second vibration mechanism drives the vibrating screen plate 110 and the magnetic plate 120 to vibrate horizontally together at a set frequency.

[0051] The first vibration mechanism and the second vibration mechanism can be implemented by the same mechanism or by different vibration mechanisms.

[0052] In one embodiment, such as Figures 2-3 As shown, in order to facilitate loading onto the loading plate 130, the upper end of the MLCF chip needs to be exposed through the vibrating screen hole 111 during loading. However, this requires the thickness of the vibrating screen plate 110 to be relatively shallow and smaller than the width or thickness of the MLCF chip. This results in the horizontal vibration of the vibrating screen plate 110, making it easier for the MLCF chip to detach from the vibrating screen hole 111 when it enters the vibrating screen hole 111. Furthermore, the MLCF chip placed in the first state is also easily vibrated out of the vibrating screen hole 111. This also requires higher precision in vibration frequency and magnetic adsorption force.

[0053] To address this issue, in this embodiment, as follows: Figures 6-8As shown, the thickness of the vibration sieve plate 110 is less than the thickness of the chip type three-terminal multilayer ceramic filter, and the magnetic plate 120 has a first position close to the vibration sieve plate 110 and a second position away from the vibration sieve plate 110. As shown in Figures 6-7 As shown, corresponding to the above-mentioned step 2-3, when the magnetic plate 120 is at the second position, the magnetic plate 120 has a spacing distance with the vibration sieve plate 110, and the spacing distance is less than the width or thickness of the MLCF chip, so that the MLCF chip located in the vibration sieve hole 111 will not be separated from the vibration sieve hole 111 from below. As shown in Figure 8 As shown, in the above-mentioned step 4, the magnetic plate 120 is at the first position close to the bottom of the vibration sieve plate 110, and the MLCF chip is lifted up by the loading plate 130. Figure 8 In the above-mentioned step 5, the magnetic plate 120 is moved upward to be close to the bottom of the vibration sieve plate 110, and the MLCF chip is lifted up to expose the upper end of the MLCF chip outside the vibration sieve hole 111, so as to be loaded by the loading plate 130.

[0054] In the above-mentioned step 5, the magnetic plate 120 is moved upward to be close to the bottom of the vibration sieve plate 110, and the MLCF chip is lifted up to expose the upper end of the MLCF chip outside the vibration sieve hole 111, so as to be loaded by the loading plate 130.

[0055] In the preferred embodiment, the thickness of the vibration sieve plate 110 is 2 / 3-3 / 4 of the width (thickness) of the chip type three-terminal multilayer ceramic filter, and the spacing distance is 1 / 4-1 / 3 of the width (thickness) of the chip type three-terminal multilayer ceramic filter.

[0056] In other embodiments, the thickness of the vibration sieve plate 110 can also be close to or even slightly greater than the thickness of the chip type three-terminal multilayer ceramic filter, and the magnetic plate 120 is arranged close to the bottom of the vibration sieve plate 110, and the MLCF chip is lifted up by other lifting members outside to expose the vibration sieve hole 111.

[0057] As shown, specifically, a plurality of thimble holes 121 are arranged on the magnetic plate 120, and the thimble holes 121 correspond one-to-one to the vibration sieve holes 111. Figures 10-11

[0058] The directional arrangement device 100 of the chip type three-terminal multilayer ceramic filter of the embodiment further comprises a lifting assembly 140, and the lifting assembly 140 comprises a base plate 141 and a plurality of thimbles 142 arranged on the base plate 141. The thimbles 142 correspond one-to-one to the thimble holes 121. The base plate 141 is movably arranged below the magnetic plate 120, and the base plate 141 can be moved to have a spacing distance with the magnetic plate 120 or be close to the magnetic plate 120. After the thimbles 142 pass through the thimble holes 121, the base plate 141 drives the thimbles 142 to lift up the MLCF chip located in the vibration sieve hole 111 upward.

[0059] In the above-mentioned step 2-3, the thimbles 142 do not pass through the thimble holes 121, and the MLCF chip is not lifted up. Figure 10 In the above-mentioned step 5, the thimbles 142 pass through the thimble holes 121, and the MLCF chip is lifted up by the thimbles 142.​Figure 11 Corresponding to the above-mentioned step 4, the loading plate 130 is moved above the vibrating sieve plate 110, the substrate 141 is moved upward, and the MLCF chip is lifted upward to expose the upper part of the MLCF chip from the vibrating sieve hole 111.

[0060] Preferably, the thickness of the vibrating sieve plate 110 is 9 / 10-11 / 10 of the width (thickness) of the MLCF chip.

[0061] In the embodiment, the magnetic plate 120 is fixedly arranged at the bottom of the vibrating sieve plate 110, and the lifting assembly 140 is additionally arranged, so that the wide and thick uniform chip type three-terminal multilayer ceramic filter chip can be conveniently loaded and efficiently arranged.

[0062] In order to make the arrangement direction of the MLCF chip horizontally placed in each positioning hole in the first state be the same, in a preferred example, as shown in Figures 2-3 , the vibrating sieve hole 111 is a rectangular hole, and the arrangement direction of each vibrating sieve hole 111 is the same.

[0063] Meanwhile, in consideration of the condition of loading in order, in order to facilitate the MLCF chip to enter or be moved out of the vibrating sieve hole 111, the length and width of the vibrating sieve hole 111 are respectively greater than the length and width of the chip type three-terminal multilayer ceramic filter by 0.01-0.1 mm.

[0064] In a preferred embodiment, as shown in Figure 8 , 9 , 11, the loading part includes a plurality of loading holes 131 corresponding to the vibrating sieve holes 111, the loading holes 131 are also rectangular holes corresponding to the vibrating sieve holes 111, and the arrangement direction is the same, and the size of the loading hole 131 is smaller than the size of the MLCF chip, and the loading hole 131 is used to load the MLCF chip horizontally placed in the vibrating sieve hole 111 from above and partially exposed from above. In the embodiment, the size of the vibrating sieve hole 111 is greater than the size of the MLCF chip, and the size of the loading hole 131 is slightly smaller than the size of the MLCF chip, so that the MLCF chip will not fall off. In other examples, the loading hole 131 is not limited to a square shape, and it can be a circular or irregular hole corresponding to the vibrating sieve hole 111.

[0065] Preferably, the length and width of the loading hole 131 are smaller than the length and width of the MLCF chip by 0.01-0.08 mm.

[0066] In order to facilitate the MLCF chip to fall into the vibrating sieve hole 111, as shown in Figure 3 , the upper edge of the vibrating sieve hole 111 is provided with a chamfer 1111. Preferably, the chamfer 1111 is a 30-45 degree bevel chamfer 1111.

[0067] In Figure 8 and Figure 11In the example of FIG. 1, because the size of the loading hole 131 is smaller than the size of the MLCF chip, in step 4, the loading plate 130 is first moved above the vibration sieve plate 110 so that the loading hole 131 corresponds to the vibration sieve hole 111, at this time, the magnetic plate 120 is moved upward, or the substrate 141 is moved upward, so that the bottom of the MLCF chip is pressed upward from below into the loading hole 131 which is smaller than the size of the MLCF chip, thereby achieving loading.

[0068] In one specific embodiment, referring to Figures 6-9 , the chip-type three-terminal multilayer ceramic filter chip orientation arrangement device achieves automatic arrangement of the MLCF chip by the following steps:

[0069] Step 1: The vibration sieve plate 110 and the magnetic plate 120 are combined together with a 1 / 4-1 / 3 interval of the width / thickness size of the MLCF chip, and the chamfered 1111 of the vibration sieve hole 111 faces upward.

[0070] Step 2: The MLCF chip is placed on the surface of the vibration sieve plate 110, and any end surface of the MLCF chip randomly faces the upper surface 112 of the vibration sieve plate 110.

[0071] Step 3: The MLCF chip is shaken / vibrated left and right and forward and backward by artificial / vibration mechanism to fall into the vibration sieve hole 111, and any of the CD facing the cut inner electrode surface / EF facing the cover surface faces the surface of the magnetic plate 120, the CD facing the cut inner electrode surface of the MLCF chip is adsorbed by the magnetic adsorption force of the magnetic plate 120, and the MLCF chip with the EF facing the cover surface in contact with the surface of the magnetic plate 120 is separated out of the vibration sieve hole 111 of the vibration sieve plate 110 by shaking / vibration, and the operation is repeated N times or more, so that the MLCF chip with the CD facing the cut inner electrode surface in contact with the surface of the magnetic plate 120 is arranged in the vibration sieve hole 111 of the vibration sieve plate 110, and all the CD facing the cut inner electrode surface of the MLCF chip faces upward.

[0072] Step 4: The loading plate 130 is combined with the vibration sieve plate 110 arranged with the MLCF chip, so that the MLCF chip is aligned with the center line of the loading hole 131 of the loading plate 130 or is in contact with the adhesive surface of the loading plate 130.

[0073] Step 5: The magnetic plate 120 is pushed towards the vibration sieve plate 110 to press, so that the MLCF chip in the vibration sieve hole 111 of the vibration sieve plate 110 is pushed out of the vibration sieve hole 111 of the vibration sieve plate 110, and the MLCF chip in the vibration sieve hole 111 of the vibration sieve plate 110 is pushed into the loading hole 131 of the loading plate 130 / adhered firmly to the adhesive surface of the loading plate 130.

[0074] Step six: separate the loading plate 130 clamped with the MLCF chip, flatten the MLCF chip in the loading plate 130, and prepare the ground external electrode on the CD of the MLCF chip opposite the cutting internal electrode surface. The punch needle pushes the MLCF chip to the other direction of the loading plate 130 through the loading hole 131 of the loading plate 130, and prepares the ground external electrode on the CD of the MLCF chip opposite the cutting internal electrode surface.

[0075] In this embodiment, when the vibration sieve plate 110 is combined with the magnetic plate 120, the MLCF chip can be easily guided into the vibration sieve hole 111 through horizontal vibration; because the chip has an internal electrode exposed surface in the thickness direction to form a ground electrode, the magnetic properties of the chip in the width direction and the thickness direction are different, and the magnetic properties of the exposed electrode surface in the thickness direction are larger than those in the width direction. By adjusting the vibration frequency of the device and adjusting the magnetic size of the magnetic plate 120, the chip with the internal electrode exposed surface is downwardly attracted by the magnetic plate 120, and the width surface without the internal electrode exposed surface is vibrated out due to the small magnetic attraction. The vibration and magnetic attraction are matched to achieve the downward directional arrangement of all the internal electrode exposed surfaces. When the loading plate 130 is combined with the vibration sieve plate 110, the chip in the vibration sieve hole 111 of the vibration sieve plate 110 can be transferred to the vibration sieve hole 111 of the loading plate 130 or adhered to the adhesive surface of the loading plate 130 through reverse punching.

[0076] The application also provides a directional arrangement method of the chip type three-terminal multilayer ceramic filter, which is arranged by using the directional arrangement device of the chip type three-terminal multilayer ceramic filter. In an embodiment, the method comprises the following steps:

[0077] S01: obtaining a chip type three-terminal multilayer ceramic filter, the length, width and thickness of the chip type three-terminal multilayer ceramic filter are a1, b1 and c1 respectively, wherein a1>b1=c1, and the two sides of the chip type three-terminal multilayer ceramic filter in the thickness direction expose internal electrodes;

[0078] S02: placing the chip type three-terminal multilayer ceramic filter on the upper surface of the vibration sieve plate;

[0079] S03: making the chip type three-terminal multilayer ceramic filter enter the vibration sieve hole from the upper surface of the vibration sieve plate, so that the chip type three-terminal multilayer ceramic filter is placed in the vibration sieve hole in a manner comprising a first state or a second state, wherein the first state is that the two sides of the chip type three-terminal multilayer ceramic filter in the thickness direction are upward and downward, and the second state is that the two sides of the chip type three-terminal multilayer ceramic filter in the width direction are upward and downward;

[0080] S04: vibrating the sieve plate and the magnetic plate upwardly, so that the chip multilayer ceramic filter in the second state horizontally placed is removed from the sieve hole to the upper surface of the sieve plate from above;

[0081] S05: repeating steps S03-S04 multiple times;

[0082] S06: moving the loading plate above the sieve plate, so that the loading part loads the chip multilayer ceramic filter in the first state horizontally located in the sieve hole from above.

[0083] In a preferred embodiment, the thickness of the sieve plate is less than the thickness of the chip multilayer ceramic filter;

[0084] The magnetic plate has a first position close to the bottom of the sieve plate and a second position away from the bottom of the sieve plate, and the second position has a spacing distance between the magnetic plate and the sieve plate, which is less than the thickness of the chip multilayer ceramic filter;

[0085] After step S06, the loading plate is moved above the sieve plate, and the following steps are further included:

[0086] The magnetic plate is moved from the second position to the first position.

[0087] In a preferred embodiment, the magnetic plate is arranged close to the bottom of the sieve plate;

[0088] The magnetic plate is provided with a plurality of ejector pin holes, which correspond one-to-one to the sieve holes;

[0089] The device further includes a jacking assembly, which includes a base plate and a plurality of ejector pins arranged on the base plate, the ejector pins corresponding one-to-one to the ejector pin holes; the base plate is used to drive the ejector pins to pass through the ejector pin holes and upwardly jack up the chip multilayer ceramic filter located in the sieve hole;

[0090] After step S06, the loading plate is moved above the sieve plate, and the following steps are further included:

[0091] The base plate is driven to move upwardly, the ejector pins pass through the ejector pin holes to upwardly jack up the chip multilayer ceramic filter located in the sieve hole, so that the chip multilayer ceramic filter is exposed on the upper surface of the sieve plate, or the part of the chip multilayer ceramic filter exposed on the upper surface of the sieve plate is increased.

[0092] In this embodiment, the sequence of steps described does not constitute a limitation on the execution sequence of the steps, and within the feasible range, the sequence can be changed, which is still within the protection scope of the present application.

[0093] Each of the technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not contradict each other, they should be considered within the scope of the present disclosure.

[0094] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the utility model patent. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims, and the description can be used to explain the content of the claims.

Claims

1. An alignment device for a chip-type three-terminal multilayer ceramic filter, the chip-type three-terminal multilayer ceramic filter having the same width and thickness, and both side surfaces in the thickness direction thereof exposing internal electrodes; characterized by, It comprises: a vibrating sieve plate, which has an upper surface provided with a plurality of vibrating sieve holes penetrating through the vibrating sieve plate, the transverse size of the vibrating sieve holes being greater than the transverse size of the chip three-terminal multilayer ceramic filter, so that the chip three-terminal multilayer ceramic filter can enter the vibrating sieve hole transversely from the upper surface or be removed from the vibrating sieve hole to the upper surface; a magnetic plate arranged below the vibrating sieve plate, which supports the chip three-terminal multilayer ceramic filter in the vibrating sieve hole and applies a magnetic adsorption force to the chip three-terminal multilayer ceramic filter to keep it in the vibrating sieve hole; a loading plate comprising a loading part for loading the chip three-terminal multilayer ceramic filter transversely in the vibrating sieve hole from above.

2. The directional alignment device for a chip-type three-terminal multilayer ceramic filter according to claim 1, characterized by It also comprises: a first vibrating mechanism connected with the vibrating sieve plate and the magnetic plate, which drives the vibrating sieve plate and the magnetic plate to vibrate up and down together at a set frequency.

3. The chip three-terminal multilayer ceramic filter orientation arrangement device according to claim 1 or 2, characterized in that: the thickness of the vibrating sieve plate is less than the thickness of the chip three-terminal multilayer ceramic filter; the magnetic plate has a first position close to the bottom of the vibrating sieve plate and a second position away from the bottom of the vibrating sieve plate, and the second position has a spacing distance between the magnetic plate and the vibrating sieve plate, which is less than the thickness of the chip three-terminal multilayer ceramic filter.

4. The chip three-terminal multilayer ceramic filter orientation arrangement device according to claim 3, characterized in that: the thickness of the vibrating sieve plate is 2 / 3-3 / 4 of the thickness of the chip three-terminal multilayer ceramic filter, and the spacing distance is 1 / 4-1 / 3 of the thickness of the chip three-terminal multilayer ceramic filter.

5. The chip three-terminal multilayer ceramic filter orientation arrangement device according to claim 1 or 2, characterized in that: the magnetic plate is arranged close to the bottom of the vibrating sieve plate; a plurality of ejector pin holes are arranged on the magnetic plate, which correspond one-to-one to the vibrating sieve holes; the device further comprises an ejector assembly, which comprises a base plate and a plurality of ejector pins arranged on the base plate, the ejector pins corresponding one-to-one to the ejector pin holes; the base plate is used to drive the ejector pins to pass through the ejector pin holes and upwardly eject the chip three-terminal multilayer ceramic filter in the vibrating sieve hole, so that the chip three-terminal multilayer ceramic filter is exposed on the upper surface of the vibrating sieve plate or the part of the chip three-terminal multilayer ceramic filter exposed on the upper surface of the vibrating sieve plate is increased.

6. The chip three-terminal multilayer ceramic filter orientation arrangement device according to claim 5, characterized in that: the thickness of the vibrating sieve plate is 9 / 10-11 / 10 of the thickness of the chip three-terminal multilayer ceramic filter.

7. The chip three-terminal multilayer ceramic filter orientation arrangement device according to claim 1 or 2, characterized in that: The vibration sieve hole is a rectangular hole, the arrangement direction of each vibration sieve hole is the same, and the length and width of the vibration sieve hole are respectively 0.01-0.1 mm larger than the length and width of the chip type three-terminal multilayer ceramic filter.

8. The directional arrangement device of the chip type three-terminal multilayer ceramic filter according to claim 7, characterized in that: The loading part comprises a plurality of loading holes corresponding to the vibration sieve holes one by one, the loading hole is a rectangular hole, and the length and width of the loading hole are 0.01-0.08 mm smaller than the length and width of the chip type three-terminal multilayer ceramic filter.

9. The directional arrangement device of the chip type three-terminal multilayer ceramic filter according to claim 7, characterized in that: The upper edge of the vibration sieve hole is provided with a chamfer.

10. The directional alignment device for a chip-type three-terminal multilayer ceramic filter according to claim 1, characterized by Further comprising: A second vibration mechanism connected with the vibration sieve plate and the magnetic plate, the second vibration mechanism drives the vibration sieve plate and the magnetic plate to horizontally vibrate together at a set frequency.

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