Tray sealing element applied to semiconductor electroplating equipment
By employing a double-arc lip design and a tray seal filled with sulfate in semiconductor electroplating equipment, the corrosion problem of the seal in copper sulfate solution was solved, achieving a high sealing performance and long service life.
Patent Information
- Application Number
- CN202520395255.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-03-07
AI Technical Summary
The tray seals in existing semiconductor electroplating equipment are inadequate in terms of high cleanliness and long-term sealing performance. In particular, they are prone to corrosion in 10% copper sulfate electroplating solution, which causes contaminants to precipitate from the sealing lip, affecting the sealing effect and lifespan.
The tray seal, featuring a double-arc lip design, improves the sealing lip structure to a Y-type sealing lip and uses sulfate-based fillers instead of traditional carbon black fillers, enhancing sealing stress concentration and reliability.
It improves sealing performance and lifespan, reduces seal leakage, lowers maintenance costs, and enhances production efficiency and economic benefits.
Smart Images
Figure CN223725404U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of sealing element, concretely relates to a tray sealing element applied to semiconductor electroplating equipment. BACKGROUND
[0002] The tray sealing element in the existing semiconductor electroplating equipment generally adopts annular customized sealing products produced by fluorine rubber material through high-temperature vulcanization setting.
[0003] The existing technology has certain defects in actual application and production process, and the electroplating equipment in the semiconductor industry has the demand of high cleanliness and low precipitation, and also has the extremely high demand of long-term sealing performance of the product.
[0004] The demand of low precipitation, the product is in contact with 10% copper sulfate electroplating liquid for a long time, the medium has strong corrosiveness, can destroy the rubber chain structure from inside, therefore the plasticizer, carbon black filler etc. in the rubber interior can gradually precipitate, pollute the electroplating liquid, and can bring huge economic loss.
[0005] The demand of sealing performance, the sealing lip in the original design contacts wafer and is rectangular lip, and this design makes the sealing lip contact surface not have concentrated sealing stress, therefore the sealing effect is relatively poor, after repeatedly disassembling wafer, the fit degree of the lip is affected to a certain extent, leads to the sealing leakage. INNOVATION CONTENT
[0006] The utility model discloses a tray sealing element applied to semiconductor electroplating equipment, utilizes double circular arc lip design, and the original rectangular lip surface sealing is optimized to two line sealing surfaces, the sealing stress is more concentrated, and the double circular arc lip design can form step-by-step sealing, and the design of double lip enhances the reliability of sealing.
[0007] In order to achieve the above object, the utility model adopts the following technical scheme.
[0008] A tray sealing element applied to semiconductor electroplating equipment, including the body, the cross section of the body is the folding, be provided with first recess and second recess on the body, be provided with the raised sealing lip to one side close to the first recess, the sealing lip is Y type sealing lip, the Y type sealing lip is provided with two arc-shaped lip, one side of the second recess is the sharp angle convex.
[0009] Further, the body is tray-shaped.
[0010] Further, the lip of the Y type sealing lip is polished.
[0011] Further, a plane of the body close to the first groove is a contact surface, and the contact surface is away from the second groove.
[0012] Further, the contact surface is polished.
[0013] Further, an angle between the Y-shaped sealing lip and the contact surface is 100-110 degrees.
[0014] Further, the angle between the Y-shaped sealing lip and the contact surface is 105 degrees.
[0015] The positive effect of the tray sealing element applied to the semiconductor electroplating equipment is:
[0016] The utility model discloses a double circular arc lip design, the original rectangular lip surface sealing is optimized to two line sealing surfaces, and the sealing stress is more concentrated, and the double circular arc lip design can form step-by-step sealing, and the design of double lip mouth enhances the reliability of sealing, and the sealing lip can be completely attached with wafer through good deformation in the environment of repeated disassembly and assembly, and the sealing performance and sealing life are greatly improved. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 is the schematic diagram provided by the utility model embodiment.
[0018] Figure 2 is the lateral schematic diagram provided by the utility model embodiment.
[0019] Figure 3 is the sectional view provided by the utility model embodiment.
[0020] Figure 4 is the detail view provided by the utility model embodiment.
[0021] The labels in the drawing are as follows:
[0022] 1, the body is 2, the first groove is 3, the second groove is 4, the sealing lip is 5, the sharp angle convex is 6, the contact surface. DETAILED DESCRIPTION
[0023] The following detailed description of the application is presented in connection with the accompanying drawings, which are intended to illustrate specific embodiments of the application. It is to be understood that the detailed description and specific examples, while indicating the preferred embodiments of the application, are intended for purposes of illustration only and are not intended to limit the scope of the application. The description is presented in the order of appearance of the figures.
[0024] Referring to Figure 1 A tray seal applied to a semiconductor electroplating equipment, comprising a body 1, the cross section of the body 1 is zigzag, the body 1 is provided with a first groove 2 and a second groove 3, in the figure, the first groove 2 is on the lower left, and the second groove 3 is on the upper right. A raised sealing lip 4 is arranged on one side close to the first groove 2, that is, in the figure, the raised sealing lip 4 is arranged on the left side of the first groove 2. The sealing lip 4 is a Y-shaped sealing lip, which is provided with two arc-shaped lip openings. The side of the second groove 3 is a sharp corner protrusion 5, that is, in the figure, the left side of the second groove 3 is a sharp corner protrusion 5.
[0025] The body 1 is a tray, the lip openings of the Y-shaped sealing lip are polished, and the contact surface 6 is polished. The plane close to the first groove 2 on the body 1 is the contact surface 6, that is, the lowermost plane in the figure, and the contact surface 6 is away from the second groove 3.
[0026] The angle between the Y-shaped sealing lip 4 and the contact surface 6 is 100 to 110 degrees, specifically, the angle between the left side of the Y-shaped sealing lip 4 and the contact surface 6 is 100 to 110 degrees. In one embodiment, the angle between the Y-shaped sealing lip 4 and the contact surface 6 is 105 degrees. In one embodiment, the angle between the Y-shaped sealing lip and the contact surface 6 is 103 degrees. In one embodiment, the angle between the Y-shaped sealing lip and the contact surface 6 is 108 degrees.
[0027] The existing seal is in contact with 10% copper sulfate electroplating solution for a long time, which has strong corrosive property and can destroy the rubber chain structure from the inside, so that the plasticizer, carbon black filler and the like in the rubber will gradually precipitate, pollute the electroplating solution, and cause huge economic losses. The sealing lip 4 of the existing seal and wafer contact is a rectangular lip opening, which makes the sealing lip 4 contact surface 6 not have concentrated sealing stress, so the sealing effect is relatively poor, and after repeatedly disassembling and assembling the wafer, the fit of the lip opening will be affected to a certain extent, resulting in sealing leakage.
[0028] To solve the above problems:
[0029] 1. First, the stress distribution of the original design is analyzed by FEA software. It is found that the original lip design cannot form effective sealing stress, and the sealing of the product is completely realized by the overall deformation of the sealing root. After the material is corroded and damaged, the material will not be able to rebound effectively after deformation, so the original sealing cannot meet the various requirements of sealing performance and sealing life. In terms of sealing lip 4 structure, the original rectangular lip design is abandoned, and a double-arc Y-shaped lip design is adopted, which forms two concentrated stress areas on the sealing surface, improving the sealing performance.
[0030] 2. Through immersion test in 10% copper sulfate solution, gradually improve the material formula, and compare the original material. The performance of the material formula is modified, the use of the original carbon black filler is abandoned, and the sulfate filler is used instead, which reduces the precipitation of the product in the electroplating solution, i.e. the tray seal used in semiconductor electroplating equipment is made of rubber parts with sulfate fillers.
[0031] 3. Provide samples to the final customer, and pass the physical property certification and actual machine test. The test results prove that the product can fully meet the use requirements and life requirements of the actual user.
[0032] The prototype is tested for life and sealing performance, and the specific test conditions are as follows:
[0033] 1. Pressure: medium pressure is about 2 kg, wafer pressure is about 10 kg
[0034] 2. Temperature: room temperature
[0035] 3. Medium: 10% copper sulfate solution
[0036] 4. Sealing method: static sealing
[0037] 5. Life requirement: 3000 wafer electroplating life
[0038] After repeated verification, the sealing scheme finally passed the actual machine test and met the sealing and life requirements. The tray seal used in semiconductor electroplating equipment accelerates the localization process of key components, greatly saves maintenance costs and increases the production efficiency of actual users, and achieves high economic benefits.
[0039] The utility model discloses changed the original material formula, utilized the novel filler selection, changed the precipitation performance of rubber material under the corrosion of 10% copper sulfate solution, and can be done without precipitation, no deformation, no mass change and volume change etc. in 10% copper sulfate solution corrosion currently. Utilize double circular arc lip design, the face sealing of original rectangle lip is optimized to two line sealing faces, and the double circular arc lip design can form step-by-step sealing while the sealing stress is more concentrated, and the design of double lip mouth enhances the reliability of sealing, and the sealing lip can be completely attached with wafer through good deformation in the environment of repeated dismounting, and the sealing performance and sealing life are greatly improved.
Claims
1. A tray seal for use in a semiconductor electroplating apparatus, characterized by, The utility model provides a sealing device, including the body, the cross section of body is the zigzag, be provided with first recess and second recess on body, be provided with the raised sealing lip near the side of first recess, the sealing lip is Y type sealing lip, Y type sealing lip is provided with two circular arc lip mouth, second recess side is sharp angle convex.
2. A tray seal for use in a semiconductor electroplating apparatus as defined in claim 1, wherein, The body is a tray.
3. A tray seal for use in a semiconductor electroplating apparatus as defined in claim 1, wherein, The lip mouth of the Y type sealing lip is polished.
4. A tray seal for use in a semiconductor electroplating apparatus as defined in claim 1, wherein, The plane near the first recess of the body is a contact surface, and the contact surface is away from the second recess.
5. A tray seal for use in a semiconductor electroplating apparatus as defined in claim 4, wherein, The contact surface is polished.
6. A tray seal for use in a semiconductor electroplating apparatus as defined in claim 5, wherein, The angle between the Y type sealing lip and the contact surface is 100 to 110 degrees.
7. A tray seal for use in a semiconductor electroplating apparatus as defined in claim 6, wherein, The angle between the Y type sealing lip and the contact surface is 105 degrees.