Transparent device with built-in IC

Abstract

The utility model relates to a transparent device with a built-in integrated circuit (IC), which comprises an insulated transparent substrate, a driving IC packaged on the front surface of the transparent substrate through an insulated transparent adhesive layer, a transparent conductive circuit electrically connected to the driving IC, and a transparent light-emitting diode (LED) flip chip with three primary colors of red, green and blue (RGB), the conductive circuit comprises a connecting end which is exposed outside the insulating transparent adhesive layer and is connected with a pin of the driving IC and an internal conductive circuit which is packaged in the insulating transparent adhesive layer, and the LED flip chip is electrically connected with the driving IC through the internal conductive circuit. The utility model has the advantages of compact structure, small volume, light weight and the like, and can be used for better manufacturing the transparent display screen.

Description

Technical Field

[0001] This utility model relates to the field of LED devices, and in particular to a transparent device with an embedded IC. Background Technology

[0002] Currently, the LED display application industry is developing steadily, with its overall scale increasing year by year. It has become an important part of the LED industry chain, and LED display products, represented by LED displays, have been widely used in various fields of society and the economy. Driven by the application market, transparent LED displays that can enrich visual content without obstructing the view have become a research hotspot. However, existing LED devices used to make transparent LED displays simply encapsulate the LED light-emitting chips separately on a transparent substrate and then connect them to the driver IC using transparent conductive lines. This results in high packaging costs, and the external driver IC chip is susceptible to external environmental influences, leading to poor reliability. Furthermore, the separate structure requires consideration of the layout of the driver IC chip and the LED light-emitting chips during the manufacturing of transparent LED displays, resulting in a larger spacing between the LED devices and potentially lower pixel density in the finished transparent LED display. Utility Model Content

[0003] To address the shortcomings of existing devices, this invention provides a transparent device with a built-in IC.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a transparent device with an embedded IC, comprising: an insulating transparent substrate, on the front side of the transparent substrate, a driver IC, transparent conductive lines electrically connected to the driver IC, and transparent RGB three-primary-color LED flip chips are encapsulated by an insulating transparent adhesive layer, the conductive lines include connection terminals exposed outside the insulating transparent adhesive layer that are connected to the pins of the driver IC and internal conductive lines encapsulated within the insulating transparent adhesive layer, and the LED flip chips are electrically connected to the driver IC through the internal conductive lines.

[0005] Preferably, the LED flip chips include red LED flip chips, green LED flip chips, and blue LED flip chips.

[0006] Preferably, the connection terminal includes a first connection terminal connected to the VDD pin of the driver IC, a second connection terminal connected to the GND pin of the driver IC, an input connection terminal connected to the input pin of the driver IC, and an output connection terminal connected to the output pin of the driver IC.

[0007] Preferably, the first connection end and the second connection end are arranged diagonally on the back side of the transparent substrate, and each of the input connection end and the output connection end is provided with one of the four vertices that together with the first connection end and the second connection end form a quadrilateral.

[0008] Preferably, the internal conductive circuitry is a transparent flexible circuit board or a transparent ITO film circuit.

[0009] Preferably, the transparent substrate is a transparent glass or a transparent polyimide substrate.

[0010] Preferably, the driver IC has a memory that stores the address information of the driver IC.

[0011] Preferably, the transparent substrate is provided with substrate through holes or substrate slots for setting conductive lines.

[0012] Preferably, the transparent substrate has a substrate groove on its front side for mounting a driver IC.

[0013] Preferably, a transparent Zener diode electrically connected to the driver IC is also encapsulated on the front side of the transparent substrate.

[0014] The beneficial effects of this utility model are as follows: This utility model uses LED flip chips set on a transparent substrate to improve heat dissipation and luminous efficiency. At the same time, the driver IC and LED flip chips are packaged together, simplifying the connection structure between them. When manufacturing LED transparent displays, there is no need to consider the corresponding installation positions of the driver IC and LED flip chips, which can realize the miniaturization of the device and improve the pixel density of the LED transparent display. Moreover, the substrate, conductive lines, LED flip chips and insulating transparent adhesive layer are all transparent structures, thereby realizing the maximum transparency of the LED device and improving the overall light transmittance of the display when the lights are not lit. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the front structure of the transparent substrate according to an embodiment of the present invention;

[0016] Figure 2 This is a schematic diagram of the structure inside the back of the transparent substrate according to an embodiment of the present invention;

[0017] Figure 3 This is a schematic diagram of the cross-sectional structure of an embodiment of the present invention along the LED flip chip;

[0018] Component names and serial numbers in the diagram: 1-Transparent substrate; 10-Substrate slot; 2-Insulating transparent adhesive layer; 3-Driver IC; 4-Connection terminal; 40-First connection terminal; 41-Second connection terminal; 42-Input connection segment; 43-Output connection terminal; 5-Internal conductive circuit; 6-LED flip chip; 60-Red LED flip chip; 61-Green LED flip chip; 62-Blue LED flip chip; 7-Zener diode. Detailed Implementation

[0019] To more clearly illustrate the purpose, technical solution, and advantages of the embodiments of this utility model, the present utility model will be further described below in conjunction with the accompanying drawings and embodiments. A clear and complete description will be provided. Obviously, the described embodiments are some, but not all, embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the protection scope of this utility model.

[0020] Examples of embodiments of this utility model Figures 1 to 3 As shown, a transparent device with an embedded IC includes: an insulating transparent substrate 1, which is made of a transparent material, such as transparent glass or a transparent polyimide substrate. On the front side of the transparent substrate 1, a driver IC 3, transparent conductive lines electrically connected to the driver IC 3, and transparent RGB three-primary-color LED flip chips 6 are encapsulated by an insulating transparent adhesive layer 2. In other words, the driver IC 3 and LED flip chips 6 are first mounted on the front side of the transparent substrate 1, and then encapsulated using the transparent adhesive layer 2. The lines connecting the driver IC 3 are transparent conductive lines. Thus, the transparent substrate 1, conductive lines, LED flip chips 6, and insulating transparent adhesive layer 2 are all transparent structures, achieving maximum transparency of the LED device and improving the overall light transmittance of the display screen when the lights are off. The flip chips improve heat dissipation and luminous efficiency. The driver IC 3 and LED flip chips 6 are encapsulated together, simplifying the connection structure between them. When manufacturing a transparent LED display screen, it is not necessary to consider the driver IC. The mounting positions corresponding to LED flip chips 6 and 3 enable miniaturization of the device and improve the pixel density of the LED transparent display. In this case, LED flip chips 6 include a red LED flip chip 60, a green LED flip chip 61, and a blue LED flip chip 62. These three chips are connected in parallel to the driver IC 3. The conductive lines include a connection terminal 4 exposed outside the insulating transparent adhesive layer 2, connected to the pins of the driver IC 3, and an internal conductive line 5 encapsulated within the insulating transparent adhesive layer 2. The exposed connection terminal 4 is used for connection in the display circuitry during display fabrication. The LED flip chips 6 are electrically connected to the driver IC 3 through the internal conductive line 5. Here, the internal conductive line is a transparent flexible circuit board or a transparent ITO film circuit. The ITO film circuit is formed by sputtering strip-shaped ITO film onto the transparent substrate 1, creating a connection line between the ITO film and the driver IC 3.

[0021] Further improvements, such as Figure 2As shown, connection terminal 4 includes a first connection terminal 40 connected to the VDD pin of driver IC 3, a second connection terminal 41 connected to the GND pin of driver IC 3, an input connection terminal 42 connected to the input pin of driver IC 3, and an output connection terminal 43 connected to the output pin of driver IC 3. This means that the first connection terminal 40 is the VDD terminal, the second connection terminal 41 is the GND terminal, the input connection terminal 42 is the D1 terminal, and the output connection terminal 43 is the D0 terminal. During display production, multiple devices can be arranged in a matrix. Then, according to different requirements, the D0 terminal of one device in the same row or column can be connected to the D1 terminal of another adjacent device in the same row or column, and so on. At this time, the LED flip chip 6 is placed between the VDD pin and the GND pin of driver IC 3. To facilitate the connection of components in the display circuit, the first connection terminal 40 and the second connection terminal 41 are diagonally arranged on the back of the transparent substrate 1. Each of the input connection terminal 42 and the output connection terminal 43 has one terminal, forming the four vertices of a quadrilateral with the first connection terminal 40 and the second connection terminal 41. In other words, the input connection terminal 42 and the output connection terminal 43 are also located on the back of the transparent substrate 1, forming the four vertices of a quadrilateral with the first connection terminal 40 and the second connection terminal 41. Regarding their connection structure with the driver IC 3, as follows... Figure 1 As shown, a substrate through-hole or substrate slot 10 for setting conductive lines is provided on the transparent substrate 1. That is, a substrate through-hole is provided on the transparent substrate 1 that penetrates the upper and lower surfaces of the transparent substrate 1, and a connection end 4 is provided on the bottom surface of the transparent substrate 1, that is, the back surface of the transparent substrate 1. Then, the driver IC 3 is connected to the connection end 4 by using the internal conductive lines 5 provided in the substrate through-hole; or a substrate slot 10 with upper and lower openings is provided on the side wall of the transparent substrate 1, and the connection end 4 on the bottom surface of the transparent substrate 1 is connected to the driver IC 3 by using the internal conductive lines 5 provided in the substrate slot 10. When a transparent flexible circuit board is used for the conductive circuit, the flexible circuit board is installed in the corresponding substrate through-hole or substrate slot 10. When the transparent adhesive is used to encapsulate and form an insulating transparent adhesive layer 2, part of the transparent adhesive will flow into the substrate through-hole or substrate slot 10, making the structure of the insulating transparent adhesive layer 2 on the transparent substrate 1 more firm. When a transparent ITO film circuit is used for the conductive circuit, a substrate slot 10 is set on the side wall of the transparent substrate 1, and then an ITO film is sputtered on the slot wall of the substrate slot 10 and the front side of the transparent substrate.

[0022] A further improvement is the inclusion of a memory within the driver IC 3, which stores the address information of the driver IC 3. In this way, in the manufactured display screen, the controller assigns corresponding address information to each device and stores that address information in the memory. This means that each LED in the display screen has a unique address, enabling the controller to individually control each LED. Therefore, regardless of whether any LEDs on the board fail, it will not affect the display of other normally functioning LEDs.

[0023] As a further improvement, a substrate groove (not shown in the figure) for mounting the driver IC 3 is provided on the front side of the transparent substrate 1. After the driver IC 3 is placed in the substrate groove, the driver IC 3 is lower than the LED flip chip 6 on the front side of the transparent substrate 1, so as not to block the light output of the LED flip chip 6.

[0024] Further improvements, such as Figure 1 As shown, a transparent Zener diode 7 electrically connected to the driver IC 3 is also encapsulated on the front side of the transparent substrate 1. The transparent Zener diode 7 is also electrically connected to the driver IC 3 through the internal conductive line 5. By utilizing the high voltage withstand capability of the Zener diode 7 in the reverse bias state, a large amount of current can be allowed to flow in reverse when a specific reverse voltage (Zener voltage) is reached, thereby keeping the voltage through the device in a stable state and increasing the device's anti-static capability.

[0025] Although the present invention has been described in detail above with general description and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A transparent IC-in-package device, characterized by, The application relates to a transparent display panel, which comprises the following parts: an insulating transparent substrate, a driving IC encapsulated on the front surface of the transparent substrate through an insulating transparent adhesive layer, transparent conductive lines electrically connected to the driving IC, and transparent RGB three-primary-color LED flip-chip, wherein the conductive lines comprise connecting ends connected to the pins of the driving IC and internal conductive lines encapsulated in the insulating transparent adhesive layer, and the LED flip-chip is electrically connected to the driving IC through the internal conductive lines. The LED flip-chip comprises red LED flip-chip, green LED flip-chip and blue LED flip-chip.

2. The transparent IC-in-package device of claim 1, wherein, The connecting ends comprise a first connecting end connected to the VDD pin of the driving IC, a second connecting end connected to the GND pin of the driving IC, an input connecting end connected to the input pin of the driving IC and an output connecting end connected to the output pin of the driving IC.

3. The transparent IC-in-package device of claim 1, wherein, The first connecting end and the second connecting end are arranged in a diagonal line on the back surface of the transparent substrate, and the input connecting end and the output connecting end are arranged in one each and form four vertices of a quadrangle with the first connecting end and the second connecting end.

4. The transparent IC-in-package device of claim 3, wherein, The internal conductive lines are transparent flexible line boards or transparent ITO film lines.

5. The device of claim 1, wherein the transparent IC is a flip-chip IC. The transparent substrate is transparent glass or transparent polyimide substrate.

6. The transparent IC-in-package device of claim 1, wherein, The driving IC is internally provided with a memory for storing the address information of the driving IC.

7. The device of claim 1, wherein the IC is transparent. The transparent substrate is provided with substrate through holes or substrate clamping grooves for arranging the conductive lines.

8. The device of claim 1, wherein the transparent IC is a flip-chip IC. The front surface of the transparent substrate is provided with a substrate recess for mounting the driving IC.

9. The device of claim 1, wherein the transparent IC is a flip-chip IC. The front surface of the transparent substrate is further encapsulated with a transparent Zener diode electrically connected to the driving IC.

10. The device of claim 1, wherein the transparent IC is a flip-chip IC. ​

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