Wafer blue film chip laser marking jig

By designing a laser marking fixture for Wafer blue film chips, a rotating module and a side-pushing mechanism are used to achieve precise positioning and stability of the blue film carrier, solving the problems of complex clamping and chip height difference in traditional fixtures, and improving the efficiency and quality of laser marking.

CN223748810UActive Publication Date: 2026-01-02SUZHOU ZANDER AUTOMATION CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202520190541.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-07
Publication Date
2026-01-02
Estimated Expiration
2035-02-07

AI Technical Summary

Technical Problem

The existing Wafer blue film chip fixture is relatively complex in the clamping process, making it difficult to guarantee the height difference of the chips, resulting in unsatisfactory laser marking efficiency and effect.

Method used

A Wafer blue film chip laser marking fixture was designed, including a fixture base plate, a fixture disk and a blue film carrier disk. A rotary module drives the blue film carrier disk to rotate, and a side push mechanism and a vacuum adsorption hole are used for positioning and clamping. The precise positioning and stability of the blue film carrier disk are achieved through the connection of positioning pins and bushings.

Benefits of technology

It improves the marking efficiency and quality of blue film chips and enhances the positioning accuracy and stability of the blue film carrier.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223748810U_ABST
    Figure CN223748810U_ABST
Patent Text Reader

Abstract

The utility model relates to a Wafer blue film chip laser marking jig. The Wafer blue film chip laser marking jig sequentially comprises a jig bottom plate, a jig disc and a blue film carrying disc from bottom to top. A rotating module is installed in the middle of the bottom of the jig bottom plate and drives the blue film carrying disc above the rotating module to rotate. A middle boss used for containing the blue film carrying disc is arranged in the middle of the top of the jig disc, the side pushing mechanism is used for clamping the blue film carrying disc at the rear end, and slope blocks are arranged on the two sides of the arc-shaped contact edge at the rear end of the middle boss. According to the utility model, the positioning precision and stability of the blue film carrying disc are greatly improved, and the marking efficiency and quality of the blue film chip are improved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to the related technical field of laser marking, especially to a Wafer blue film chip laser marking jig. BACKGROUND

[0002] Laser marking is one of the biggest fields of laser technology application, which uses high-energy density laser to irradiate the surface of the material, so that the surface layer material is gasified or chemically reacts to change color, and finally leaves a permanent mark. In the semiconductor field, wafer is divided into many equally spaced crystal grains under the corresponding splitting process, and gradually forms a powerful chip after subsequent patching and wire bonding processes, and the marking process which plays a tracing role is essential.

[0003] After a large amount of retrieval, it is found that the existing Chinese patent No. CN218802393U discloses a jig for assisting cutting, which comprises a base, an iron ring groove is formed in the base, a support table is formed in the iron ring groove, a cutting groove is formed in the support table, and a taking and placing groove is formed in the base and communicates with the iron ring groove. The depth of the taking and placing groove is greater than the depth of the iron ring groove. The jig for assisting cutting places the iron ring in the iron ring groove, the blue film on the iron ring is supported by the upper surface of the support table, and the blue film is tightened due to the arrangement of the iron ring groove. Then the blue film at the cutting groove is cut by an art knife, and the excess blue film is cut off along the outer wall of the iron ring groove. After cutting, the iron ring together with the blue film can be easily taken out through the taking and placing groove which is deeper than the iron ring groove. The support is stable, the cutting accuracy is improved, and the taking and placing are convenient, thereby improving the efficiency.

[0004] In summary, the traditional Wafer blue film chip jig is complex, inconvenient to clamp, and difficult to ensure the height difference of the chips in the entire blue film width, resulting in unsatisfactory laser marking efficiency and effect.

[0005] In view of the above-mentioned defects, the present inventor actively researches and innovates to create a Wafer blue film chip laser marking jig, which has more industrial utilization value. CONTENT OF THE UTILITY MODEL

[0006] To solve any of the above technical problems, the purpose of the utility model is to provide a Wafer blue film chip laser marking jig.

[0007] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0008] The Wafer blue film chip laser marking jig comprises a jig bottom plate, a jig disc and a blue film loading disc from bottom to top.

[0009] A rotating module is installed at the middle of the bottom of the jig base plate, and the rotating module drives the blue film carrier plate above to rotate.

[0010] An intermediate boss for placing the blue film carrier plate is arranged at the middle of the top of the jig plate, and arc-shaped contact edges are arranged on the jig plate on both sides of the intermediate boss, a side pushing installation slot for installing a side pushing mechanism is arranged at the middle of the arc-shaped contact edge at the front end of the intermediate boss, the side pushing mechanism is used for clamping the blue film carrier plate at the rear end, and slope blocks are arranged on both sides of the arc-shaped contact edge at the rear end of the intermediate boss.

[0011] As a further improvement of the utility model, positioning pins are installed on the four sides of the jig base plate through first screw holes, and bushings matched with the positioning pins are installed on the jig plate above the positioning pins through pin holes; a plurality of second screw holes are further arranged on the four sides of the jig base plate, and second countersunk holes matched with the second screw holes are arranged on the jig plate above the second screw holes.

[0012] As a further improvement of the utility model, notches are arranged on the left and right sides of the jig base plate, and slots matched with the notches are arranged on the left and right sides of the jig plate.

[0013] As a further improvement of the utility model, a square groove is arranged at the top of the jig base plate close to the outer side, a threaded hole is arranged at the middle position in the square groove, a rotating air pipe joint is installed at the bottom in the threaded hole, a plurality of round holes are arranged at the edge in the square groove, a through hole is arranged on the jig base plate on one side, and a plurality of vacuum suction holes are uniformly arranged on the intermediate boss.

[0014] As a further improvement of the utility model, a sealing ring is installed in the square groove.

[0015] As a further improvement of the utility model, the rotating module is installed at the bottom of the jig base plate through a plurality of first countersunk holes.

[0016] As a further improvement of the utility model, a notched corner is arranged at one diagonal corner of the jig plate.

[0017] As a further improvement of the utility model, the side pushing mechanism comprises a base, a pin shaft and a pressing block, the base is installed at the front end on the side pushing installation slot, the pin shaft is freely movable in the base along the front and rear directions, the pressing block is installed at the rear end of the pin shaft, a stepped slot opening along the front and rear directions is arranged at the top of the base, a screw in the stepped slot opening is connected with the pin shaft below, a cap is installed at the position close to the top of the screw, and the cap can be embedded in the stepped slot opening below in the process of rotating downward.

[0018] As further improvement of the present application, a first spring is installed on the pin shaft between the pressing block and the rear end of the base, and a check ring is installed on the pin shaft at the front end of the base.

[0019] As further improvement of the present application, a second spring is installed between the screw and the cap.

[0020] By the above scheme, the present application has at least the following advantages:

[0021] The present application greatly improves the positioning accuracy and stability of the blue film carrier, and improves the marking efficiency and quality of the blue film chip.

[0022] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, and can be implemented according to the content of the specification, the following will be described in detail with the preferred embodiment of the present application and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme of the embodiment of the present application, the following will briefly introduce the drawings needed to be used in the embodiment, it should be understood that the following drawings only show some embodiments of the present application, therefore should not be regarded as the limitation of the scope, for the ordinary skilled in the art, without creative labor, other related drawings can also be obtained according to these drawings.

[0024] Figure 1 is a structural schematic view of a Wafer blue film chip laser marking jig of the present application;

[0025] Figure 2 is Figure 1 a structural schematic view of the jig base plate in the present application;

[0026] Figure 3 is Figure 2 a top view of the present application;

[0027] Figure 4 is Figure 1 a structural schematic view of the jig disc in the present application;

[0028] Figure 5 is Figure 1 a structural schematic view of the side pushing mechanism in the present application;

[0029] Figure 6 is Figure 5 a structural schematic view of the inside.

[0030] Among them, the meaning of each sign in the drawing is as follows.

[0031] Jig base plate 1, jig tray 2, bushing 3, positioning pin 4, blue film tray 5, rotary module 6, side push mechanism 7, rotary air pipe joint 8, sealing ring 9;

[0032] First screw hole 11, second screw hole 12, notch 13, square groove 14, round hole 15, threaded hole 16, first countersunk hole 17, through hole 18;

[0033] Pin hole 21, second countersunk hole 22, notch 23, notch 24, inclined surface block 25, middle boss 26, side push installation groove 27, vacuum adsorption hole 261;

[0034] Base 71, pin shaft 72, first spring 73, pressing block 74, screw 75, retaining cap 76, retaining ring 77, second spring 78. DETAILED DESCRIPTION

[0035] The specific embodiments of the utility model will be further described in detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but not to limit the scope of the utility model.

[0036] In order to make the personnel in the technical field better understand the utility model scheme, the technical scheme in the utility model embodiment will be described clearly and completely below in combination with the drawings in the utility model embodiment. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. The components of the utility model embodiments described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the scope of protection of the utility model.

[0037] As Figures 1 to 6 shown, a Wafer blue film chip laser marking jig comprises, from bottom to top, a jig base plate 1, a jig tray 2 and a blue film tray 5.

[0038] A rotary module 6 is installed at the middle position of the bottom of the jig base plate 1. The rotary module 6 drives the upper blue film tray 5 to rotate. The rotary module 6 is installed at the bottom of the jig base plate 1 through a plurality of first countersunk holes 17.

[0039] The middle boss 26 is arranged in the middle position of the top of the jig disc 2, and arc contact edges are arranged on both sides of the middle boss 26, a side pushing installation slot 27 for installing a side pushing mechanism 7 is arranged in the middle of the arc contact edge of the front end of the middle boss 26, the side pushing mechanism 7 is used for clamping the rear end blue film carrier disc 5, and the inclined blocks 25 are arranged on both sides of the arc contact edge of the rear end of the middle boss 26.

[0040] The positioning pins 4 are arranged on the periphery of the jig bottom plate 1 through the first screw holes 11, and the bushings 3 matched with the positioning pins 4 are arranged on the jig disc 2 above the positioning pins 4 through the pin holes 21.

[0041] The notches 13 are arranged on the left and right sides of the jig bottom plate 1, and the notches 23 matched with the notches 13 are arranged on the left and right sides of the jig disc 2.

[0042] The square slot 14 is arranged on the top of the jig bottom plate 1 close to the outer side, and the sealing ring 9 is arranged in the square slot 14, the screw thread hole 16 is arranged in the middle position of the square slot 14, the rotary air pipe joint 8 is arranged in the bottom of the screw thread hole 16, the plurality of round holes 15 are arranged at the edge of the square slot 14, the through hole 18 is arranged on the jig bottom plate 1 on one side, and the plurality of vacuum adsorption holes 261 are uniformly arranged on the middle boss 26.

[0043] The notched corner 24 is arranged at one diagonal corner of the jig disc 2.

[0044] The side pushing mechanism 7 comprises a base 71, a pin shaft 72 and a pressing block 74, the base 71 is arranged on the front end of the side pushing installation slot 27, the pin shaft 72 is arranged in the base 71 and can move along the front and back directions, the pressing block 74 is arranged on the rear end of the pin shaft 72, the stepped slot is arranged on the top of the base 71 and is distributed along the front and back directions, the screw 75 is arranged in the stepped slot and is connected with the pin shaft 72 below, the cap 76 is arranged on the screw 75 close to the top and can be embedded in the stepped slot below in the rotating downward operation, the first spring 73 is arranged on the pin shaft 72 between the pressing block 74 and the rear end of the base 71, the stop ring 77 is arranged on the pin shaft 72 of the front end of the base 71, and the second spring 78 is arranged between the screw 75 and the cap 76.

[0045] The first embodiment of the utility model:

[0046] The utility model provides a kind of Wafer blue film chip laser marking jig, mainly include jig base plate 1, jig tray 2, blue film carrier tray 5, rotary module 6 and side push mechanism 7.Blue film carrier tray 5 is placed on jig tray 2, under the action of side push mechanism 7, it is pasted to two inclined surface blocks 25 on jig tray 2, to realize horizontal and vertical direction positioning.Jig tray 2 is also equipped with vacuum suction hole 261, guarantee blue film suction flat, its below is equipped with jig base plate 1, is connected by bushing 3 and positioning pin 4, is equipped with sealing ring 9 in middle, it is also equipped with counterbore and corresponding threaded hole, can be connected by bolt to strengthen.Jig base plate 1 is penetrated threaded hole in middle, is connected external vacuum by rotatable air pipe joint, below is connected with rotary module 6 by screw thread, can realize angle adjustment of blue film carrier tray 5.

[0047] Specifically, the relationship between each component is as follows:

[0048] Jig base plate 1: it is equipped with the first screw hole 11 of M6 and connected with jig tray 2, the second screw hole 12 of M5 beside is used to install positioning pin 4, and is matched with bushing 3 installed on jig tray 2.The notch 13 on the left and right sides corresponds to the notch 23 on the jig tray 2, and a square groove 14 for installing a sealing ring 9 is also provided on it.9 sets of round holes 15 inside not only guide the vacuum of the blue film carrier tray 5, but also can be used for the feeding mode of GEL-PACK box, the middle round hole is equipped with the through screw thread hole 16 of M5 for installing rotatable air pipe joint 8, and a set of first counterbore 17 around is connected to fix the rotary module 6 below;The side is also opened with a long through hole 18 for guiding the vacuum air path corresponding to the round hole 15.

[0049] Jig tray 2: it is equipped with two sets of pin holes 21 for installing bushing 3, and 4 sets of second counterbores 22 for reinforcing connection with jig base plate 1;It is also provided with symmetrical notches 23, which is convenient for personnel to put blue film carrier up and down.The notch 24 at the upper left corner is a foolproof design to prevent personnel from putting the jig tray 2 wrong.The two inclined surface blocks 25 on the upper side will be in line contact with the blue film carrier tray 5 under the action of the side push mechanism 7 installed at 27, and the inclined surface blocks 25 and the push block 74 will be precisely positioned in horizontal and vertical directions.The middle boss 26 contacts with the blue film, and the vacuum suction hole 261 is provided on it, which is sucked flat under the action of the vacuum at the bottom.

[0050] Side push mechanism 7: the middle of its base 71 is provided with a through hole, which is matched with the pin shaft 72 and the pressing block 74 of the fixed head through the first spring 73 and the stop ring 77, and the upper side is provided with a stepped notch, which is matched with the stop cap 76 to realize different state positions of the pressing block 74.The pin shaft 72 is provided with a screw hole connected with the screw 75, and the second spring 78 is further provided between the screw 75 and the stop cap 76 to facilitate the position adjustment of the pressing block 74.

[0051] The utility model greatly promotes the positioning accuracy and stability of blue film carrier, improves the marking efficiency and quality of blue film chip.

[0052] In the description of the utility model, it is to be understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or position relationship shown based on the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0053] In the description of the utility model, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connection" and "connection" should be understood broadly, for example, it can be fixed connection, can also be detachable connection, or integral connection, can be mechanical connection, can also be electrical connection, can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements.

[0054] The above is only the preferred embodiment of the utility model, and is not used to limit the utility model, and it should be pointed out that, for ordinary skilled persons in the technical field, on the premise of not departing from the technical principles of the utility model, a number of improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection range of the utility model.

Claims

1. Wafer blue film chip laser marking jig, from bottom to top in turn including jig bottom plate (1), jig tray (2) and blue film tray (5); characterized in that The rotating module (6) is installed in the middle position of the bottom of the jig bottom plate (1), which drives the blue film tray (5) above to rotate; The middle boss (26) for placing the blue film tray (5) is arranged at the top middle position of the jig tray (2), the arc contact edges are arranged on both sides of the jig tray (2) in front of and behind the middle boss (26), the middle part of the arc contact edge at the front end of the middle boss (26) is provided with a side pushing installation slot (27) for installing a side pushing mechanism (7), the side pushing mechanism (7) is used for clamping the blue film tray (5) at the rear end, and the inclined blocks (25) are arranged on both sides of the arc contact edge at the rear end of the middle boss (26).

2. The Wafer Blue film chip laser marking fixture of claim 1, wherein, The positioning pins (4) are installed on the periphery of the jig bottom plate (1) through the first screw holes (11), and the bushings (3) matched with the positioning pins (4) are installed on the jig tray (2) above the positioning pins (4) through the pin holes (21); a plurality of second screw holes (12) are also arranged on the periphery of the jig bottom plate (1), and the second countersunk holes (22) matched with the second screw holes (12) are arranged on the jig tray (2) above the second screw holes (12).

3. The Wafer Blue film chip laser marking fixture of claim 1, wherein, The notches (13) are arranged on the left and right sides of the jig bottom plate (1), and the notches (13) matched with the notches (13) are arranged on the left and right sides of the jig tray (2).

4. The Wafer Blue film chip laser marking fixture of claim 1, wherein, The square groove (14) is arranged at the top of the jig bottom plate (1) near the outer side, the screw thread hole (16) is arranged at the middle position in the square groove (14), the rotating air pipe joint (8) is installed at the bottom in the screw thread hole (16), a plurality of round holes (15) are arranged at the edge in the square groove (14), the through hole (18) is arranged on one side of the jig bottom plate (1), and a plurality of vacuum suction holes (261) are uniformly distributed on the middle boss (26).

5. The Wafer Blue film chip laser marking fixture of claim 4, wherein, The sealing ring (9) is installed in the square groove (14).

6. The Wafer Blue film chip laser marking fixture of claim 1, wherein, The rotating module (6) is installed at the bottom of the jig bottom plate (1) through a plurality of first countersunk holes (17).

7. The Wafer Blue film chip laser marking fixture of claim 1, wherein, The notches (24) are arranged at one of the diagonal positions of the jig tray (2).

8. The Wafer Blue film chip laser marking fixture of claim 1, wherein, The side pushing mechanism (7) comprises a base (71), a pin shaft (72) and a pressing block (74), the base (71) is installed at the front end of the side pushing installation slot (27), the pin shaft (72) is freely movable in the front-rear direction in the base (71), the pressing block (74) is installed at the rear end of the pin shaft (72), the stepped groove is arranged on the top of the base (71) and distributed in the front-rear direction, the screw (75) in the stepped groove is connected with the pin shaft (72) below, the cap (76) is installed at the position near the top of the screw (75), and the cap (76) can be embedded in the stepped groove below during the downward rotation.

9. The Wafer Blue film chip laser marking fixture of claim 8, wherein, A first spring (73) is installed on the pin shaft (72) between the rear end of the pressing block (74) and the base (71), and a retaining ring (77) is installed on the pin shaft (72) at the front end of the base (71).

10. The Wafer Blue film chip laser marking fixture of claim 8, wherein, A second spring (78) is installed between the screw (75) and the retaining cap (76).

Citation Information

Patent Citations

  • A fixture for blue membrane-assisted cutting

    CN218802393U