Transition substrate

Abstract

The utility model relates to the technical field of display, in particular to a transition substrate which is placed on a vacuum adsorption table, a first surface of the transition substrate is adsorbed by the vacuum adsorption table, a holding structure is arranged on a second surface, opposite to the first surface, of the transition substrate, and the transition substrate is used for bearing a target substrate with the thickness smaller than a preset value. The target substrate is fixed through the holding structure, at the moment, the transition substrate is in direct adsorption contact with the vacuum adsorption table, so that the thin target substrate does not deform due to adsorption, and the target substrate is fixed on the transition substrate through the holding structure, so that the problem of sheet running is not easy to occur during subsequent spin-coating operation, and the service life of the target substrate is prolonged. And a relatively good spin-coating effect can be achieved.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and more specifically, to a transition substrate. Background Technology

[0002] Currently, for spin coating of liquid materials, a rigid substrate with a certain thickness is usually used, and the substrate is fixed on the spin coating equipment by vacuum adsorption for spin coating film formation. However, for some thin substrates, vacuum adsorption during spin coating can cause the substrate to deform, resulting in uneven film formation after spin coating, which cannot meet the film formation requirements. Utility Model Content

[0003] The purpose of this invention is to provide a transition substrate to solve the problem that thin substrates are easily adsorbed and deformed, making spin coating difficult.

[0004] This utility model is implemented as follows:

[0005] A transition substrate is provided, wherein the transition substrate is placed on a vacuum adsorption stage and a first surface is adsorbed by the vacuum adsorption stage, and a holding structure is provided on a second surface of the transition substrate opposite to the first surface. The transition substrate is used to support a target substrate with a thickness lower than a predetermined value, and the holding structure fixes the target substrate to facilitate spin coating of the target substrate.

[0006] Furthermore, the retaining structure includes a groove, and a groove is provided on the second surface, the size and shape of which match the size and shape of the target substrate.

[0007] Furthermore, a connecting groove is provided next to the groove, and the connecting groove is connected to the groove to facilitate the placement and removal of the target substrate.

[0008] Furthermore, the holding structure includes a first buckle, a second buckle, and a blocking plate. The first buckle and the second buckle are spaced apart by the width of the target substrate to jointly fix one side of the target substrate. The blocking plate is spaced apart by the length of the target substrate from the first buckle and the second buckle to fix the other side of the target substrate.

[0009] Furthermore, the holding structure includes three fixed baffles and one movable baffle. The three fixed baffles and one movable baffle together form a rectangular cavity. The movable baffle can be opened and closed around the fixed baffles connected to it to facilitate the placement and removal of the target substrate.

[0010] Furthermore, a stress buffer layer is provided on the side of the fixed or movable enclosure facing the target substrate.

[0011] Compared with the prior art, the present invention has the following advantages: The present invention provides a transition substrate, which is placed on a vacuum adsorption stage and its first surface is adsorbed by the vacuum adsorption stage. A holding structure is provided on the second surface of the transition substrate opposite to the first surface. The transition substrate is used to support a target substrate with a thickness lower than a predetermined value and to fix the target substrate by the holding structure. Since the transition substrate is in direct adsorption contact with the vacuum adsorption stage, the thin target substrate will not have deformation problems caused by adsorption. Moreover, the target substrate is fixed on the transition substrate by the holding structure, and it is not easy for the substrate to run off during subsequent spin coating operations, thus achieving a better spin coating effect.

[0012] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0013] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to illustrate selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0014] Figure 1 A schematic diagram of the application environment of a transition substrate provided by this utility model is shown.

[0015] Figure 2 (a) to (b) show schematic diagrams of a retaining structure provided by this utility model.

[0016] Figure 3 (a) to (c) show schematic diagrams of another holding structure provided by this utility model.

[0017] Figure 4 (a) to (c) show schematic diagrams of another holding structure provided by this utility model.

[0018] Illustration:

[0019] 100 - Transition substrate; 200 - Vacuum adsorption stage; 110 - First surface; 120 - Second surface; 300 - Target substrate; 130 - Groove; 140 - Connecting groove; 151 - First buckle; 152 - Second buckle; 153 - Baffle plate; 161 - Fixed enclosure plate; 162 - Movable enclosure plate. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] Please refer to Figure 1 This is a schematic diagram of the application environment of a transition substrate 100 provided by the present invention. The transition substrate 100 is placed on a vacuum adsorption stage 200 and the first surface 110 is adsorbed by the vacuum adsorption stage 200. A holding structure is provided on the second surface 120 of the transition substrate 100 opposite to the first surface 110. The transition substrate 100 is used to support a target substrate 300 with a thickness lower than a predetermined value, and the holding structure is used to fix the target substrate 300 so as to facilitate spin coating of the target substrate 300. It should be noted that, generally, for spin coating of liquid materials, a rigid substrate of a certain thickness is selected and adsorbed onto the vacuum adsorption stage 200 for spin coating. However, some thinner substrates also require spin coating. If the thinner substrate is directly placed on the vacuum adsorption stage 200, it is easy for the thinner substrate to deform, resulting in uneven spin coating and failing to meet the film formation requirements. Thinner substrates refer to substrates that are easily deformed by vacuum adsorption, such as substrates with a thickness of less than 500 μm, which may be affected. Experiments show that substrates with a thickness of 150 μm are particularly significantly affected. The transition substrate 100 provided in this application effectively solves this technical problem. Figure 1It is understood that the transition substrate 100 is directly vacuum-adsorbed by the vacuum adsorption stage 200, and then the target substrate 300 is placed on the transition substrate 100 for spin coating. On the one hand, the target substrate 300 does not need to directly contact the vacuum adsorption stage 200, so there will be no deformation problem. On the other hand, the target substrate 300 is fixed on the transition substrate 100 by the holding structure, so it will not shift during the spin coating operation, which can better complete the spin coating operation and achieve the film formation requirements.

[0022] Furthermore, such as Figure 2 (a) and Figure 2 As shown in (b), the holding structure may include a groove 130, the size and shape of which match the size and shape of the target substrate 300. The groove 130 can be formed by etching a certain depth onto the second surface 120 of the transition substrate 100. Furthermore, a connecting groove 140 is provided next to the groove 130, communicating with the groove 130 to facilitate the placement and removal of the target substrate 300. The depth of the groove 130 is greater than or equal to the thickness of the target substrate 300 to facilitate the holding of the periphery of the target substrate 300. The depth of the connecting groove 140 may be equal to, greater than, or less than the depth of the groove 130; there is no specific limitation, as long as it facilitates the placement and removal of the target substrate 300.

[0023] Furthermore, such as Figure 3 (a) Figure 3 (b) and Figure 3 (c) shows a schematic diagram of another holding structure provided by this utility model. This holding structure includes a first latch 151, a second latch 152, and a blocking plate 153. The first latch 151 and the second latch 152 are spaced apart by the width of the target substrate 300 to jointly fix one side of the target substrate 300. The blocking plate 153 is spaced apart by the length of the first latch 151 and the second latch 152 from the target substrate 300 to fix the other side of the target substrate 300. One end of the blocking plate 153 is fixed to the second surface 120, while the other end is freely movable. When placing or removing the target substrate 300, one end of the blocking plate 153 can be moved. That is to say, one end of the target substrate 300 is fixed at two corners by the first buckle 151 and the second buckle 152 respectively, and the other end is fixed by pressing the baffle plate 153 onto the surface of the target substrate 300. When the target substrate 300 needs to be removed from the transition substrate 100, the baffle plate 153 can be moved away from the surface of the target substrate 300, which is relatively convenient.

[0024] Furthermore, such as Figure 4 (a) Figure 4 (b) Figure 4(c) shows a schematic diagram of another holding structure provided by this utility model. This holding structure includes three fixed baffles 161 and one movable baffle 162. The three fixed baffles 161 and the movable baffle 162 together form a rectangular cavity, which is used to hold the target substrate 300. The movable baffle 162 can be opened and closed around the fixed baffles 161 connected to it to facilitate the placement and removal of the target substrate 300. Furthermore, the height of the rectangular cavity is greater than or equal to the thickness of the target substrate 300 to better fix the target substrate 300. To better protect the sides of the target substrate 300, stress buffer layers are provided on the side of each of the three fixed baffles 161 and the movable baffle 162 facing the target substrate 300. These stress buffer layers can be, but are not limited to, flexible materials such as cotton pads or silicone.

[0025] Furthermore, the holding structure can be adjusted according to the shape of the target substrate 300. For example, if the target substrate 300 is not a regular rectangle but an irregular structure, such as a rhombus or an ellipse, etc. Figure 3 or Figure 4 The holding structure can be adjusted accordingly to better stabilize the target substrate 300 and facilitate spin coating.

[0026] In summary, the present invention provides a transition substrate, which is placed on a vacuum adsorption stage and its first surface is adsorbed by the vacuum adsorption stage. A holding structure is provided on the second surface of the transition substrate opposite to the first surface. The transition substrate is used to support a target substrate with a thickness lower than a predetermined value and is fixed by the holding structure. Since the transition substrate is in direct adsorption contact with the vacuum adsorption stage, the thin target substrate will not experience deformation problems caused by adsorption. Furthermore, since the target substrate is fixed on the transition substrate by the holding structure, it is not easy for the substrate to slip during subsequent spin coating operations, thus achieving a better spin coating effect.

[0027] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only used for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. For those skilled in the art, this utility model can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A transition substrate, characterized by, The transition substrate is placed on a vacuum chuck and a first surface thereof is attracted by the vacuum chuck, and a second surface opposite to the first surface is provided with a holding structure, the transition substrate is used to carry a target substrate with a thickness less than a predetermined value, and the holding structure is used to fix the target substrate to facilitate spin coating operation of the target substrate.

2. The transition substrate of claim 1, wherein, The holding structure comprises a groove, and the second surface is provided with the groove, and the size and shape of the groove are matched with the size and shape of the target substrate.

3. The transition substrate of claim 2, wherein, A connecting groove is further provided beside the groove, and the connecting groove is connected with the groove to facilitate pick-and-place operation of the target substrate.

4. The transition substrate of claim 1, wherein, The holding structure comprises a first buckle, a second buckle and a blocking plate, the first buckle and the second buckle are arranged at intervals of the width of the target substrate to jointly fix one side of the target substrate, and the blocking plate is arranged at intervals of the length of the target substrate with the first buckle and the second buckle to fix the other side of the target substrate.

5. The transition substrate of claim 1, wherein, The holding structure comprises three fixed surrounding plates and one movable surrounding plate, the three fixed surrounding plates and the one movable surrounding plate jointly form a rectangular cavity, and the movable surrounding plate can be opened and closed around the fixed surrounding plate connected therewith to facilitate pick-and-place operation of the target substrate.

6. The transition substrate of claim 5, wherein, The fixed surrounding plate or the movable surrounding plate is provided with a stress buffer layer towards one side of the target substrate.

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