Crystal oscillator grinder

Abstract

The utility model relates to the technical field of crystal oscillator grinding, and provides a crystal oscillator grinder which comprises an equipment frame and a conveying belt, the conveying belt is arranged in the equipment frame, a lifting controller is arranged on the outer side of the equipment frame, a grinding assembly is arranged in the conveying belt and the equipment frame, and a washing assembly is arranged at the top of the equipment frame. The grinding assembly comprises a plurality of mold bases, the mold bases are evenly distributed on the surface of the conveying belt, a plurality of shallow grooves are formed in the surfaces of the mold bases, through holes are formed in the bottoms in the shallow grooves and the conveying belt, a top cover is arranged at the output end of the lifting controller, and a grinding roller is rotationally connected into the top cover. By means of the technical scheme, the technical problems that according to an existing grinding mode in the prior art, crystal oscillators are put into a grinding disc for batch machining, the crystal oscillators need to stop to wait for the loading and unloading process every time, the waiting time is long, the continuous machining efficiency is low, and the ground crystal oscillators cannot be washed are solved.

Description

Technical Field

[0001] The embodiments disclosed herein relate to the field of crystal oscillator grinding technology, and more specifically, to a crystal oscillator grinder. Background Technology

[0002] A crystal oscillator is an electronic component made using the piezoelectric effect of quartz crystals. It is mainly used as a rate and thickness sensing element in film thickness control systems. Crystal oscillators are derived from polyhedral quartz rods, which are cut and ground into thin discs, typically 0.23 mm thick and 13.98 mm in diameter. After edge trimming, polishing, and cleaning, each disc is fully plated with metal electrodes on the front side and keyhole-shaped electrodes on the back side.

[0003] After the crystal oscillator is cut, it needs to be ground. The current grinding method is to put it into a grinding disc for batch processing. Each time, it is necessary to stop and wait for the loading and unloading process, which takes a long time and has low continuous processing efficiency. Moreover, it is impossible to wash the ground crystal oscillator.

[0004] Therefore, improvements have been made to address the aforementioned issues. Utility Model Content

[0005] To overcome the above-mentioned defects, the embodiments of this disclosure provide a crystal oscillator grinder, which solves the technical problems of the current grinding method in the prior art, which involves batch processing by placing the crystal oscillator into a grinding disc, requiring a break each time to wait for loading and unloading, resulting in long waiting times, low continuous processing efficiency, and the inability to rinse the ground crystal oscillator.

[0006] According to one aspect, at least one embodiment of this disclosure provides a crystal oscillator polisher, comprising:

[0007] The equipment frame and the conveyor belt, wherein the conveyor belt is disposed inside the equipment frame;

[0008] A lifting controller and a grinding assembly are provided, wherein the lifting controller is disposed on the outside of the equipment frame and the grinding assembly is disposed on the conveyor belt and inside the equipment frame;

[0009] A flushing assembly is disposed on top of the equipment rack;

[0010] The grinding assembly includes several mold seats, which are evenly distributed on the surface of the conveyor belt. Several shallow grooves are formed on the surface of the mold seats, and through holes are formed at the bottom of the shallow grooves and the conveyor belt. A top cover is provided at the output end of the lifting controller, and a grinding roller is rotatably connected inside the top cover.

[0011] As a further technical solution, the grinding roller is rotated by a motor, a vacuum cleaner is installed on the top of the top cover, a vacuum pump is installed inside the equipment frame, and a bottom cover is fixedly connected inside the equipment frame.

[0012] As a further technical solution, the upper surface of the bottom cover is slidably attached to the surface of the conveyor belt, the suction end of the vacuum pump is connected to the bottom cover, and both sides of the bottom cover have extension platforms.

[0013] As a further technical solution, the rinsing assembly includes a crossbeam, which is disposed on the top of the equipment frame. A drive screw is installed inside the crossbeam, and a pair of slide rails are provided inside the crossbeam, on which a movable frame is slidably connected.

[0014] As a further technical solution, the movable frame and the drive screw are connected by a threaded connection, a pair of flushing nozzles are provided on the top of the movable frame, a connecting pipe is provided at the upper end of the flushing nozzles, and a water collection tank is provided at the bottom of the equipment frame.

[0015] As a further technical solution, the ratio of the width of the bottom opening of the top cover to the width of the mold base is 2 to 1.

[0016] As a further technical solution, the flushing nozzle corresponds to the position of the shallow groove.

[0017] As a further technical solution, the depth of the shallow groove is less than the thickness of the crystal oscillator.

[0018] The beneficial effects of the embodiments disclosed herein are as follows:

[0019] 1. In this disclosure, a grinding assembly is provided. Through the interaction of structures such as mold base, shallow trough, top cover, grinding roller, dust collector and vacuum pump, grinding can be carried out continuously by conveying via conveyor belt. The crystal oscillator is fixed by vacuum negative pressure. The grinding effect is good and the stability is strong. There is no need to wait for loading and unloading time. It can grind continuously and has high production efficiency.

[0020] 2. In this disclosure, a rinsing assembly is provided. Through the interaction of structures such as the drive screw, slide rail, moving frame, rinsing nozzle and water collection tank, water can be continuously sprayed onto the position of the crystal oscillator to quickly rinse the crystal oscillator. The rinsed water can be collected for easy reuse. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are merely some exemplary embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on the content of the exemplary embodiments of this disclosure and these drawings without any creative effort.

[0022] Figure 1 This is a schematic diagram of a structure in one embodiment of the present disclosure;

[0023] Figure 2 This is an isometric drawing of the present disclosure;

[0024] Figure 3 This is an isometric sectional view of the present disclosure;

[0025] Figure 4 Appendix to this disclosure Figure 3 Enlarged view of part A in the middle;

[0026] In the diagram: 1. Equipment frame; 2. Conveyor belt; 3. Lifting controller; 4. Grinding assembly; 4-1. Mold base; 4-2. Shallow trough; 4-3. Through hole; 4-4. Top cover; 4-5. Grinding roller; 4-6. Vacuum cleaner; 4-7. Vacuum pump; 4-8. Bottom cover; 4-9. Extension table; 5. Washing assembly; 5-1. Horizontal frame; 5-2. Drive screw; 5-3. Slide rail; 5-4. Moving frame; 5-5. Flushing nozzle; 5-6. Connecting pipe; 5-7. Water collection tank. Detailed Implementation

[0027] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present disclosure and are not intended to limit the scope of the disclosure.

[0028] To keep the drawings concise, each drawing only schematically shows the parts relevant to the disclosure; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0029] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0030] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0031] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0032] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] like Figures 1-4 As shown, a crystal oscillator polisher according to an embodiment of the present disclosure includes:

[0034] Equipment frame 1 and conveyor belt 2, with conveyor belt 2 installed inside equipment frame 1;

[0035] The lifting controller 3 and the grinding assembly 4 are provided. The lifting controller 3 is located on the outside of the equipment frame 1, and the grinding assembly 4 is located inside the conveyor belt 2 and the equipment frame 1.

[0036] Rinse assembly 5 is located on top of equipment rack 1;

[0037] The grinding assembly 4 includes several mold seats 4-1, which are evenly distributed on the surface of the conveyor belt 2. Several shallow grooves 4-2 are opened on the surface of the mold seats 4-1. Through holes 4-3 are opened at the bottom of the shallow grooves 4-2 and the conveyor belt 2. A top cover 4-4 is provided at the output end of the lifting controller 3. A grinding roller 4-5 is rotatably connected inside the top cover 4-4. The grinding roller 4-5 is rotated by a motor. A vacuum cleaner 4-6 is provided on the top of the top cover 4-4. A vacuum pump 4-7 is provided inside the equipment frame 1. A bottom cover 4-8 is fixedly connected inside the equipment frame 1. The upper surface of the bottom cover 4-8 slides against the surface of the conveyor belt 2. The suction end of the vacuum pump 4-7 is connected to the bottom cover 4-8. There are extension platforms 4-9 on both sides of the bottom cover 4-8.

[0038] In some examples, to achieve continuous grinding, a grinding assembly 4 is designed. Multiple mold seats 4-1 are set on the conveyor belt 2. Multiple shallow grooves 4-2 are opened on the surface of the mold seats 4-1 and through holes 4-3 are opened inside. The shallow grooves 4-2 are used to place crystal oscillators. The through holes 4-3 penetrate the conveyor belt 2. The output end of the lifting controller 3 is connected to the top cover 4-4, which can control the lifting of the top cover 4-4. A grinding roller 4-5 is set inside the top cover 4-4, which can rotate at high speed to grind the crystal oscillators in the shallow grooves 4-2. A vacuum pump 4-7 and a bottom cover 4-8 are set inside the equipment frame 1, which can make the bottom cover 4-8 generate suction. The bottom cover 4-8 is attached to the inner surface of the conveyor belt 2 and is located directly below the top cover 4-4. It can cooperate with the top cover 4-4 to clamp the conveyor belt 2. The suction can fix the crystal oscillators in the shallow grooves 4-2. A vacuum cleaner 4-6 is also set on the top cover 4-4 to absorb dust.

[0039] like Figures 1-4 As shown, this embodiment proposes a rinsing assembly 5, which includes a crossbeam 5-1. The crossbeam 5-1 is set on the top of the equipment frame 1. A drive screw 5-2 is installed inside the crossbeam 5-1. A pair of slide rails 5-3 are provided inside the crossbeam 5-1. A movable frame 5-4 is slidably connected to the slide rails 5-3. The movable frame 5-4 is connected to the drive screw 5-2 by a threaded engagement. A pair of flushing nozzles 5-5 are provided on the top of the movable frame 5-4. A connecting pipe 5-6 is provided at the upper end of the flushing nozzles 5-5. A water collection tank 5-7 is opened at the bottom of the equipment frame 1.

[0040] In some examples, a rinsing assembly 5 is designed to achieve the effect of rinsing the ground crystal oscillator. A crossbeam 5-1 is set on the top of the equipment frame 1, and a drive screw 5-2 and a slide rail 5-3 are installed inside. A movable frame 5-4 is connected to the drive screw 5-2 and the slide rail 5-3. The movable frame 5-4 can be controlled to move linearly by a drive screw. Two flushing nozzles 5-5 and a connecting pipe 5-6 are installed on the movable frame 5-4, which can be connected to a water supply device to flush the crystal oscillator with downward water flow. A water collection tank 5-7 is opened at the bottom of the equipment frame 1 to collect the flushed water.

[0041] For example, such as Figure 3 As shown, the ratio of the bottom opening width of the top cover 4-4 to the width of the mold base 4-1 is 2:1.

[0042] In some examples, by increasing the size of the top cover 4-4, the mold base 4-1 can move inside the top cover 4-4, allowing the grinding roller 4-5 to move on the surface of the crystal oscillator, thus completing uniform grinding.

[0043] For example, such as Figure 4 As shown, the flushing nozzle 5-5 corresponds to the position of the shallow groove 4-2.

[0044] In some examples, the water flowing down can directly cover the surface of the crystal oscillator by the position of the flushing nozzle 5-5 corresponding to the shallow groove 4-2.

[0045] For example, such as Figure 4 As shown, the depth of the shallow groove 4-2 is less than the thickness of the crystal oscillator.

[0046] In some examples, the crystal oscillator protrudes from the surface of the mold base 4-1 and contacts the surface of the grinding roller 4-5 through the shallow groove 4-2 at a lower depth.

[0047] When grinding is required, place the crystal oscillator into the shallow trough 4-2, start the conveyor belt 2 to begin conveying, and after the mold base 4-1 moves below the top cover 4-4, start the lifting controller 3 to cover the mold base 4-1 with the top cover 4-4 and clamp the conveyor belt 2 together with the bottom cover 4-8. Start the vacuum pump 4-7 and the grinding roller 4-5 to fix the crystal oscillator in the shallow trough 4-2 by suction. Start controlling the conveyor belt 2 to move slowly. During the movement, the grinding is completed by the grinding roller 4-5. During the grinding process, start the vacuum pump 4-7 to absorb the dust. While grinding, continue to put the crystal oscillator into the mold base 4-1. When it reaches below the flushing nozzle 5-5 after grinding, open the flushing nozzle 5-5 to flush downwards. At the same time, start the drive screw to control the moving frame 5-4 to move left and right repeatedly. The flushing water flows into the water collection tank 5-7. The mold base 4-1 falls downwards as the angle of the conveyor belt 2 changes, and can be placed in a container to collect it.

[0048] It should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure and are not intended to limit it. Although this disclosure has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this disclosure without departing from the spirit and scope of the technical solutions of this disclosure, and all such modifications and substitutions should be covered within the scope of the claims of this disclosure.

Claims

1. A crystal oscillator polisher, characterized in that, include: Equipment frame (1) and conveyor belt (2), the conveyor belt (2) being disposed inside the equipment frame (1); The lifting controller (3) and the grinding assembly (4) are provided. The lifting controller (3) is located outside the equipment frame (1), and the grinding assembly (4) is located inside the conveyor belt (2) and the equipment frame (1). A rinsing assembly (5) is disposed on top of the equipment rack (1); The grinding assembly (4) includes several mold seats (4-1), which are evenly distributed on the surface of the conveyor belt (2). Several shallow grooves (4-2) are opened on the surface of the mold seats (4-1). Through holes (4-3) are opened at the bottom of the shallow grooves (4-2) and the conveyor belt (2). A top cover (4-4) is provided at the output end of the lifting controller (3). A grinding roller (4-5) is rotatably connected inside the top cover (4-4).

2. The crystal oscillator polisher according to claim 1, characterized in that, The grinding roller (4-5) is rotated by a motor. A vacuum cleaner (4-6) is installed on the top of the top cover (4-4). A vacuum pump (4-7) is installed inside the equipment frame (1). A bottom cover (4-8) is fixedly connected inside the equipment frame (1).

3. A crystal oscillator polisher according to claim 2, characterized in that, The upper surface of the bottom cover (4-8) is slidably attached to the surface of the conveyor belt (2), the suction end of the vacuum pump (4-7) is connected to the bottom cover (4-8), and there are extension platforms (4-9) on both sides of the bottom cover (4-8).

4. A crystal oscillator polisher according to claim 1, characterized in that, The rinsing assembly (5) includes a crossbeam (5-1), which is located on the top of the equipment frame (1). A drive screw (5-2) is installed inside the crossbeam (5-1), and a pair of slide rails (5-3) are provided inside the crossbeam (5-1). A movable frame (5-4) is slidably connected to the slide rails (5-3).

5. A crystal oscillator polisher according to claim 4, characterized in that, The movable frame (5-4) is connected to the drive screw (5-2) by a threaded connection. A pair of flushing nozzles (5-5) are provided on the top of the movable frame (5-4). A connecting pipe (5-6) is provided on the upper end of the flushing nozzles (5-5). A water collection tank (5-7) is provided at the bottom of the equipment frame (1).

6. A crystal oscillator polisher according to claim 1, characterized in that, The ratio of the bottom opening width of the top cover (4-4) to the width of the mold base (4-1) is 2:

1.

7. A crystal oscillator polisher according to claim 5, characterized in that, The flushing nozzle (5-5) is positioned opposite to the shallow groove (4-2).

8. A crystal oscillator polisher according to claim 1, characterized in that, The depth of the shallow groove (4-2) is less than the thickness of the crystal oscillator.

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