Multilayer modular controller

Abstract

The utility model discloses a multilayer modularized controller, belonging to the motor controller technology field, the multilayer modularized controller comprises a controller bottom shell, a layer of aluminum substrate is tightly attached to the controller bottom shell, a central control board is arranged above the aluminum substrate at intervals, and the upper side of the central control board is provided with a layer of function board. According to the multi-layer modularized controller, electrical components of the central control board are differentiated to a multi-layer board body structure, and the multi-layer board body is provided with different electrical components and has different functions, so that the circuit integration layout is more reasonable, the space layout of the controller is better, the heat dissipation effect is better, and the multi-layer modularized board body structure is more convenient to assemble and disassemble. And meanwhile, the controller is more convenient to process and produce, and the processing efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of motor controller technology, specifically relating to a multi-layer modular controller. Background Technology

[0002] A motor controller is a device used to control a motor. The core component of the controller is the central control board, which integrates various electrical components and control chips to regulate the motor's operating status. In conventional motor controllers, the electrical components are integrated into the central control board. However, as the functional requirements of controllers increase, the number of electrical components also increases. The dense packing of components in conventional integrated controller structures makes manufacturing difficult and inefficient. Furthermore, the packing of different components significantly affects heat dissipation and convection, thus impacting the controller's performance. Utility Model Content

[0003] The purpose of this invention is to provide a multi-layer modular controller to solve the problems mentioned in the background section regarding the use of existing motor controllers.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a multi-layer modular controller, including a controller bottom shell, an aluminum substrate being tightly mounted on the controller bottom shell, a central control plate being spaced apart above the aluminum substrate, and a functional plate being disposed on the upper side of the central control plate.

[0005] Preferably, the aluminum substrate is equipped with multiple sets of pins, the central control board is integrated with resistors, capacitors and control chips, and the function board is equipped with multiple sets of independent functional components.

[0006] Preferably, the size of the functional board is set according to the functional components, which include an exhaust valve and a pin.

[0007] Preferably, the central control panel has multiple through holes.

[0008] Preferably, a heat sink is provided on the bottom shell of the controller, the aluminum substrate is closely attached to the heat sink, and the bottom shell of the controller is connected to the outer shell of the controller by bolts.

[0009] Compared with the prior art, the beneficial effects of this utility model are:

[0010] The multi-layer modular controller distributes the electrical components of the central control board onto a multi-layer board structure. Different electrical components are installed on the multi-layer boards and have different functions. This allows for a more reasonable circuit integration layout, better space layout of the controller, and better heat dissipation. The multi-layer modular board structure also makes the controller manufacturing process more convenient and improves processing efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model.

[0012] In the diagram: 1. Controller bottom shell; 2. Aluminum base plate; 3. Central control board; 4. Function board; 5. Exhaust valve; 6. Pin; 7. Through hole. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] Reference Figure 1 A multi-layer modular controller includes a controller base shell 1, an aluminum substrate 2 is mounted on the controller base shell 1, a central control board 3 is spaced above the aluminum substrate 2, and a functional board 4 is arranged on the upper side of the central control board 3.

[0015] To address the issues of excessive components, overly compact structure, inconvenient manufacturing, and poor heat dissipation in existing controllers' internal control board 3, this technical solution addresses these problems. The control board 3 is layered, consisting of an aluminum substrate 2, the control board 3 itself, and a function board 4, arranged sequentially from bottom to top. This differentiates the integrated components on the control board 3. The aluminum substrate 2 is located at the bottom layer, directly contacting the controller's bottom shell 1 to aid in heat conduction and dissipation. The control board 3 is installed in the middle layer, with gaps between it and both the aluminum substrate 2 and the function board 4. This allows for convenient installation of electrical components and facilitates airflow, further aiding in controller heat dissipation. The function board 4 houses specialized functional components (generally larger) without affecting the circuit layout on the control board 3. This results in a better spatial layout and improved heat dissipation for the controller. The multi-layered modular structure also simplifies controller manufacturing and increases production efficiency.

[0016] Furthermore, multiple sets of pins are installed on the aluminum substrate 2, resistors, capacitors and control chips are integrated on the central control board 3, and multiple sets of independent functional components are installed on the function board 4.

[0017] Furthermore, the size of the function board 4 is set according to the function components, which include an exhaust valve 5 and a pin 6.

[0018] Through this technical solution, the functional board 4 is set in terms of specifications and size according to the functional components used, thereby flexibly adjusting the functional board 4 so that it can be designed specifically for the functional components installed.

[0019] Furthermore, the central control panel 3 has multiple through holes 7.

[0020] The through hole 7 on the central control board 3 allows the copper pillars of the aluminum substrate 2 to pass through, and the through hole 7 also improves the air convection inside the controller, thus improving the controller's heat dissipation capacity.

[0021] Furthermore, a heat sink is provided on the bottom shell 1 of the controller, the aluminum base plate 2 is tightly attached to the heat sink, and the bottom shell 1 of the controller is connected to the outer shell of the controller by bolts.

[0022] Working Principle: In this technical solution, the central control board 3 within the controller is arranged in layers, from bottom to top, including an aluminum substrate 2, the central control board 3, and a function board 4. This differentiates the components integrated on the central control board 3. The aluminum substrate 2 is located at the bottom layer, directly and tightly contacting the controller's bottom shell 1, which helps with heat conduction and dissipation. The central control board 3 is installed in the middle layer, with certain gaps between it and both the aluminum substrate 2 and the function board 4, facilitating the installation of electrical components. The gaps between it and the aluminum substrate 2 and the function board 4 allow for airflow, aiding in controller heat dissipation. The function board 4 is specifically designed to house the controller's functional components (generally larger), thus not affecting the circuit layout on the central control board 3. This results in a better spatial layout and better heat dissipation for the controller. The multi-layered modular board structure also makes the controller's manufacturing process more convenient and improves processing efficiency.

[0023] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In the description of this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this invention, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, those skilled in the art can combine different embodiments or examples and features of different embodiments or examples described in this invention without contradiction.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-layer modular controller, characterized in that: The controller includes a bottom housing, on which an aluminum substrate is attached. A central control board is spaced above the aluminum substrate, and a functional board is disposed on the upper side of the central control board.

2. The multi-layer modular controller according to claim 1, characterized in that: Multiple sets of pins are mounted on the aluminum substrate, resistors, capacitors and control chips are integrated on the central control board, and multiple sets of independent functional components are mounted on the function board.

3. A multi-layer modular controller according to claim 2, characterized in that: The size of the functional board is set according to the functional components, which include an exhaust valve and a pin.

4. A multi-layer modular controller according to claim 1, characterized in that: The central control panel has multiple through holes.

5. A multi-layer modular controller according to claim 1, characterized in that: A heat sink is provided on the bottom shell of the controller, and the aluminum substrate is closely attached to the heat sink. The bottom shell of the controller is connected to the outer shell of the controller by bolts.

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