Printed circuit board and transparent display crystal film screen

Abstract

The utility model discloses a printed circuit board and a transparent display crystal film screen. The printed circuit board comprises a transparent substrate layer and a conductive layer which are stacked. The transparent substrate layer comprises a first surface and a second surface which are oppositely arranged. The conductive layer is arranged on the first surface of the transparent substrate layer. The conductive layer comprises a transparent bearing body and a conductive circuit arranged in the transparent bearing body, one side, far away from the first surface, of the transparent bearing body is a bearing surface, the transparent bearing body is provided with a patterned groove which is concavely arranged from the bearing surface through imprinting, the conductive circuit is filled and exposed in the groove, and the ratio of the depth to the width of the groove is greater than 1: 1; the thickness of the conductive circuit is larger than or equal to 10 micrometers, and the light transmittance of the printed circuit board is larger than 80%. The conductive circuit manufactured through the imprinting process breaks through the limitation of the depth-to-width ratio of the etching process, the depth-to-width ratio reaches 1: 1 or above, and the smaller line width is achieved while the high line thickness is kept, so that the light transmittance of transparent display is improved; and the narrow-line width and higher-line thickness are realized, so that the current-carrying capability is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic technical field especially relates to a printed circuit board and transparent display crystal membrane screen. BACKGROUND

[0002] In the field of semiconductor display technology, microelectronic manufacturing technology, etc., transparent display crystal membrane screen is an important display device. Transparent display crystal membrane screen includes a printed circuit board and a display module disposed on the printed circuit board. By making fine conductive lines on the transparent substrate, the conductive lines connect the display module to achieve the transmission and display of electrical signals. Among them, the line width and the line thickness of the conductive lines are two key factors affecting the performance of the transparent display crystal membrane screen. The smaller the line width, the higher the light transmittance; the greater the line thickness, the stronger the current-carrying capacity. The existing preparation process of the printed circuit board of the transparent display crystal membrane screen is mainly etching process. First, a layer of photoresist is coated on the transparent substrate attached with copper foil, then the line pattern is formed by exposure and development. After that, the excess copper layer is etched away by chemical or electrochemical method, leaving copper lines. Finally, the protective photoresist is removed by chemical method. However, the existing etching process has some problems. First, the etching process is limited by the aspect ratio and cannot achieve small line width with high line thickness. The aspect ratio is the ratio of the depth (line thickness) to the line width of the conductive line. In the etching process, the aspect ratio usually cannot exceed 1:1, otherwise it will lead to insufficient line thickness or line breakage. Second, the etching process has high equipment cost, complex process and low production efficiency, which is not conducive to large-scale production. SUMMARY

[0003] Therefore, it is necessary to provide a printed circuit board and a transparent display crystal membrane screen to solve the above technical problems.

[0004] One technical scheme of the utility model is: a printed circuit board, comprising:

[0005] a transparent substrate layer comprising a first surface and a second surface arranged oppositely;

[0006] a conductive layer disposed on the first surface of the transparent substrate layer, the conductive layer comprising a transparent carrier and a conductive line disposed in the transparent carrier, the side of the transparent carrier away from the first surface being a carrier surface, the transparent carrier being formed by compression molding to have a patterned groove recessed from the carrier surface, the conductive line filling and exposing the groove, the depth-to-width ratio of the groove being greater than 1:1, the line thickness of the conductive line being greater than or equal to 10 μm, and the light transmittance of the printed circuit board being greater than 78%.

[0007] In one embodiment, the aspect ratio of the line thickness and the line width of the conductive line is greater than or equal to 1.5:1.

[0008] In one embodiment, the conductive line has a line width less than or equal to 15 μm.

[0009] In one embodiment, the trench includes a bottom wall and side walls on both sides of the bottom wall, and the distance from the bottom wall to the first surface is greater than 2 μm.

[0010] In one embodiment, the side wall is a vertical wall or an inclined wall, and when the side wall is an inclined wall, the inclination angle is less than 30°.

[0011] In one embodiment, the bottom of the trench is filled with blackened material to form an anti-reflection part.

[0012] In one embodiment, the conductive layer is provided with two layers on the first surface and the second surface of the substrate layer, and the conductive lines of the two layers of the conductive layer are arranged in overlapping on the projection of the first surface of the substrate layer, and the overlapping amount is greater than 98%.

[0013] The utility model also provides a kind of transparent display crystal membrane screen, it includes the printed circuit board described above and the display module of being arranged in the printed circuit board, the display module is electrically connected with the printed circuit board.

[0014] In one embodiment, the conductive line of the printed circuit board is a copper wire, and the printed circuit board further includes a tin solder pad electrically connected to the copper wire and the display module.

[0015] In one embodiment, it further includes a protective layer laminated to the conductive layer and covering the display module.

[0016] The utility model has the advantages that: the transparent carrier has patterned trenches recessed from the self-bearing surface by compression molding, the conductive lines are filled and exposed in the trenches, the depth and width ratio of the trenches is greater than 1:1, the line thickness of the conductive lines is greater than or equal to 10 μm, and the light transmittance of the printed circuit board is greater than 78%. The conductive lines made by the compression molding process break through the limitation of the etching process depth-width ratio, achieve a depth-width ratio of more than 1:1, maintain high line thickness, realize smaller line width, and thus improve the light transmittance of transparent display; the conductive lines have higher line thickness while having narrow line width, and improve current carrying capacity. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a cross-sectional structure schematic view of the printed circuit board of the utility model;

[0018] Figure 2 It is another cross-sectional structure schematic view of the printed circuit board of the utility model;

[0019] Figure 3 It is another cross-sectional structure schematic view of the printed circuit board of the utility model;

[0020] Figure 4 FIG. 1 is a cross-sectional view of a transparent display crystal film screen according to an embodiment of the present application.

[0021] Figure 5 FIG. 2 is another cross-sectional view of a transparent display crystal film screen according to an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the relevant drawings. The drawings show a preferred embodiment of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described below. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0025] The utility model discloses a printed circuit board, it includes transparent substrate layer and conductive layer of laminated arrangement. Transparent substrate layer includes the first surface and second surface of opposite arrangement. Conductive layer sets up in the first surface of transparent substrate layer. Conductive layer includes transparent carrier and the conductive circuit of setting in transparent carrier, and the side of transparent carrier away from the first surface is the bearing surface, and transparent carrier has the graphical groove recessed from the bearing surface through the coining forming, and the conductive circuit fills and exposes in the groove, and the depth and width ratio of groove is greater than 1:1, and the line thickness of conductive circuit is greater than or equal to 10um, and the light transmittance of printed circuit board is greater than 78%. The conductive circuit made through the coining process breaks through the limitation of etching process depth-width ratio, reaches the depth-width ratio 1:1 above, realizes smaller line width while maintaining high line thickness, thereby improving the light transmittance of transparent display, and the light transmittance reaches 78%, 80%, even 90% above, has higher line thickness while having narrow line width, improves current-carrying capacity, makes its application more extensive in power and size. In addition, it is favorable to circuit layout, thereby reducing the number of conductive layer, optimizing circuit layout, improving conductive performance and display performance. Compared with the existing etching process, the cost of equipment is lower, and the process flow is also simpler. The coining process does not need expensive photoetching machine and complex developing and etching steps, and production efficiency is high, which is favorable to large-scale production. Adopting the coining die to make the circuit pattern can accurately control the shape and size of the circuit, thereby improving production precision. The coining process does not need to use harmful chemical reagents, such as acid and alkali, reduces environmental pollution, and has better environmental protection.

[0026] Specifically, the conductive material, such as silver material or copper material, is filled in the groove, and the conductive circuit embedded in the groove is formed after sintering, the line thickness of the conductive circuit is substantially equal to the depth of the groove, and the depth-width ratio of the line thickness and line width of the conductive circuit is greater than 1:1, thereby realizing the conductive circuit with high depth-width ratio. The line width of the conductive circuit is less than or equal to 15um, and the conductive circuit with more fine line width can be made to meet the transparency requirement.

[0027] Further, the groove includes a bottom wall and side walls located on both sides of the bottom wall, and the distance from the bottom wall to the first surface is greater than 2um. When the groove is formed by coining, residual glue is left at the bottom of the groove, which is beneficial to the formation of the groove. The side wall is a vertical wall or an inclined wall, and when the side wall is an inclined wall, the inclination angle is less than 30°, which is beneficial to demolding.

[0028] In one embodiment, the groove bottom is filled with blackening material to form an anti-reflection part, thereby improving the light transmittance and increasing the display effect.

[0029] In one embodiment, the conductive layer is provided with two layers, respectively on the first surface and the second surface of the substrate layer, the conductive lines of the two layers of the conductive layer are arranged in overlapping manner on the projection of the first surface of the substrate layer, and the overlapping amount is greater than 98%. When the lines are arranged on both sides of the substrate layer, the conductive layer is arranged on the first surface and the second surface of the substrate, and the conductive layers on the first surface and the second surface have substantially the same line distribution and are arranged in alignment, and due to the narrow line width, under certain alignment conditions, the transparent display still has high light transmittance.

[0030] In one embodiment, the substrate layer is a transparent glass layer, a transparent polymer layer such as PI, PET, PMMA, etc.

[0031] The utility model discloses still reveal a kind of transparent display crystal membrane screen, it includes the printed circuit board described above and the display module of being arranged in printed circuit board, display module and printed circuit board electrically connected. Transparent display crystal membrane screen is OLED transparent screen, LED transparent screen or LCD transparent screen, display module generally includes OLED module, miniLED module, LCD module etc.

[0032] In one embodiment, the conductive lines of the printed circuit board are copper lines, and the printed circuit board further includes a tin solder pad electrically connected to the copper lines and the display module.

[0033] In one embodiment, the transparent display crystal membrane screen further includes a protective layer laminated to the conductive layer and covering the display module.

[0034] Below, please refer to drawing, example describes the transparent implementation crystal membrane screen of the printed circuit board of the utility model.

[0035] Please refer to Figure 1 The utility model discloses a kind of printed circuit board 100, it includes transparent substrate layer 1 and conductive layer 2 of laminated arrangement. Transparent substrate layer 1 includes oppositely arranged first surface 11 and second surface 12. Conductive layer 2 is arranged on the first surface 11 of transparent substrate layer 1. Conductive layer 2 includes transparent carrier 21 and the conductive line 22 of being arranged in transparent carrier 21. The side of transparent carrier 21 away from first surface 11 is bearing face 211, transparent carrier 21 is formed with patterned groove 212 from bearing face 211 recess, conductive line 22 fills and is exposed to groove 212, the depth H of groove 212 is 20 μm, width W is 8 μm, depth and width ratio is 2.5:1;The line thickness of conductive line is 20 μm, line width is 8 μm, depth-width ratio is 2.5:1. The light transmittance of printed circuit board is greater than 82%. While maintaining high line thickness, smaller line width is realized, so as to improve the light transmittance of transparent display;While having narrow line width, higher line thickness is had, and current-carrying capacity is improved.

[0036] Further, the trench 212 is filled with copper material, and after sintering, copper lines are formed. In other embodiments, the trench 212 is filled with silver material, and after sintering, silver lines are formed. The trench 212 includes a bottom wall 2121 and side walls 2122 on both sides of the bottom wall 2121. The distance L between the bottom wall 2121 and the first surface 11 is 5 μm. In another embodiment, please refer to Figure 2 The bottom wall 2121 of the trench 212 is filled with blackened material such as carbon powder, and the carbon powder forms an anti-reflection portion 23 to improve the light transmittance and increase the display effect.

[0037] The printed circuit board 100 is prepared as follows:

[0038] Step 1: A substrate layer 1 is provided, which is PET. A layer of UV structural adhesive is coated on the surface of the PET, i.e., the first surface 11, and the thickness of the coating is 25 μm. A patterned mold is used to press a patterned trench on the UV structural adhesive. Step 2: The pressed UV structural adhesive is quickly subjected to UV curing. The cured structural adhesive forms a transparent carrier 21 having a trench 211, and the depth of the trench 211 is 20 μm and the width is 8 μm. Step 3: The trench 211 is filled with copper material, and the filling thickness of the copper material is equal to that of the trench 211. Then, the UV structural adhesive filled with the copper material is placed in a sintering furnace for sintering and curing. After sintering and curing, the copper material in the trench 211 forms copper lines, and the copper lines form the required conductive circuit 22. The copper lines prepared by the pressing process have a greater depth and a narrower width, which improves the light transmittance and the current carrying capacity, and the production cost is low, the process flow is simple, and the production efficiency is improved. In other embodiments, the substrate layer 1 is PC, PI, PMMA, glass, or other substrates. The transparent carrier 21 can also use heat-cured glue.

[0039] Please refer to Figure 3 Another printed circuit board 200 is disclosed in the embodiment, which includes a substrate layer 3, a first conductive layer 4, and a second conductive layer 5 arranged in layers. The substrate layer 3 includes a first surface 31 and a second surface 32 arranged oppositely, the first conductive layer 4 is arranged on the first surface 31, and the second conductive layer 5 is arranged on the second surface 32. The first conductive layer 4 has a first conductive circuit 41, and the second conductive layer 5 has a second conductive circuit 51. The aspect ratio of the first conductive circuit 41 is greater than 1:1, and the aspect ratio of the second conductive circuit 51 is greater than 1:1. Preferably, the first conductive circuit 41 and the second conductive circuit 51 are arranged in overlap on the projection of the first surface 31, and the overlap amount is greater than 98%. While maintaining a high line thickness, a smaller line width is achieved, thereby improving the light transmittance of the transparent display; while having a narrow line width, a higher line thickness is achieved, thereby improving the current carrying capacity. The preparation process is simple, and the performance, cost, production efficiency, precision, and environmental protection are superior.

[0040] Please refer to Figure 4The utility model discloses a kind of transparent display crystal membrane screen 300, it includes printed circuit board 100 and the display module 301 of being set to printed circuit board 100, display module 301 is electrically connected with printed circuit board 100. Figure 5 The transparent display crystal membrane screen 300 further includes a protective layer 303 laminated to the conductive layer 2 and covering the display module 301. The protective layer 303 is a PI film layer or a UV glue layer, etc., which has good packaging performance and can prevent collision, water, etc.

[0041] The printed circuit board and the transparent display crystal membrane screen can break through the limitation of the existing etching process, realize small line width and high line thickness at the same time, thereby improving the light transmittance and current-carrying capacity, and improving the performance of the transparent display crystal membrane screen. In addition, the process of the present technical solution is simple, the equipment cost is low, and it is beneficial to mass production, so it has a broad application prospect in the field of display equipment manufacturing. Secondly, in the field of microelectronic manufacturing technology, the present technical solution provides a new microelectronic component manufacturing process, which can break through the limitation of the existing etching process and realize high-precision and high-reliability microelectronic component manufacturing. Since the process of the present technical solution is simple, the equipment cost is low, and it is beneficial to mass production, so it has a broad application prospect in the field of microelectronic manufacturing.

[0042] To make the above-mentioned purposes, features and advantages of the present utility model more apparent, the specific embodiments of the present utility model are described in detail above in conjunction with the drawings. In the above description, many specific details are set forth in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from the above description, and those skilled in the art can make similar improvements without departing from the concept of the present utility model, so the present utility model is not limited by the above disclosed specific embodiments. Moreover, the technical features of each of the above-described embodiments can be combined arbitrarily, and in order to make the description concise, each technical feature in the above-described embodiments is not described in all possible combinations, however, as long as the combination of these technical features does not exist contradictory, it should be considered as the scope of the present specification.

[0043] The above-described embodiments only express several implementation ways of the present utility model, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the present utility model patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present utility model, a number of modifications and improvements can be made, which are within the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent should be subject to the appended claims.

Claims

1. A printed circuit board, characterized by, It comprises: a transparent substrate layer comprising a first surface and a second surface arranged oppositely; a conductive layer arranged on the first surface of the transparent substrate layer, the conductive layer comprising a transparent carrier and a conductive circuit arranged in the transparent carrier, a bearing surface being on the side of the transparent carrier away from the first surface, the transparent carrier being formed by embossing to have a patterned groove recessed from the bearing surface, the conductive circuit filling and being exposed to the groove, the depth and width ratio of the groove being greater than or equal to 1:1, the line thickness of the conductive circuit being greater than or equal to 10μm, and the light transmittance of the printed circuit board being greater than 78%.

2. The printed circuit board of claim 1, wherein, The depth and width ratio of the line thickness and line width of the conductive circuit is greater than or equal to 1.5:

1.

3. The printed circuit board of claim 1, wherein, The line width of the conductive circuit is less than or equal to 15μm.

4. The printed circuit board of claim 1, wherein, The groove comprises a bottom wall and side walls on both sides of the bottom wall, the distance from the bottom wall to the first surface being greater than 2μm.

5. The printed circuit board of claim 4, wherein, The side walls are vertical walls or inclined walls, and the inclination angle of the inclined walls is less than 30°.

6. A printed circuit board as claimed in claim 1, characterized in that The groove bottom is filled with blackening material to form an anti-reflection part.

7. A printed circuit board as claimed in claim 1, wherein, The conductive layer is arranged in two layers on the first surface and the second surface of the substrate layer, the conductive circuits of the two layers of the conductive layer being arranged in overlapping projection on the first surface of the substrate layer, and the overlapping amount being greater than 98%.

8. A transparent display crystal film screen, characterized in that, It comprises the printed circuit board according to any one of claims 1 to 7 and a display module arranged on the printed circuit board, the display module being electrically connected with the printed circuit board.

9. The transparent display film of claim 8, wherein, The conductive circuit of the printed circuit board is a copper wire, and the printed circuit board further comprises a tin solder pad electrically connecting the copper wire and the display module.

10. The transparent display film of claim 9, wherein, It further comprises a protective layer laminated on the conductive layer and covering the display module.

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