Storage and taking assembly for large-size silicon wafer single-face grinding

Abstract

The utility model discloses an access component for single-sided grinding of large-size silicon wafers, which is provided with a connecting piece capable of storing the silicon wafers and being matched with a fixing piece included in grinding equipment, a butt joint groove is arranged on the connecting piece, a butt joint piece is matched with the butt joint groove, and the butt joint piece can be separated from the butt joint groove, so that the connecting piece is stored in the fixing piece. Or the connecting piece is taken out from the fixing piece through butt joint; the connecting piece comprises a connecting plate and a plurality of supporting columns vertically arranged on the connecting plate, and clamping columns are arranged on the supporting columns; the butt joint groove comprises a plurality of narrow ring grooves and wide ring grooves which vertically penetrate through the connecting piece, the distance between the inner walls of the narrow ring grooves in the circumferential direction is larger than the outer diameter of the supporting columns and smaller than the outer diameter of the clamping columns, penetrating holes with the inner diameter larger than that of the clamping columns are formed in the upper side faces of the narrow ring grooves and penetrate through the narrow ring grooves to be communicated with the wide ring grooves, and the distance between the inner walls of the wide ring grooves is larger than the outer diameter of the clamping columns. The problems that in the prior art, ground silicon wafers are not prone to being taken out of grinding equipment, and then the production efficiency and the yield of the silicon wafers are affected are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer processing, and particularly relates to a storage and taking assembly for single-side grinding of large-size silicon wafers. BACKGROUND

[0002] In the field of semiconductor and integrated circuit manufacturing, silicon wafers, as important basic materials, have a decisive effect on the performance and reliability of final products due to their quality and performance. The surface quality of silicon wafers is extremely high, and the grinding process is one of the key processes for ensuring that the flatness and smoothness of the surface of a silicon wafer meet the standards. Through grinding, the damage layer, impurities and uneven parts on the surface of a silicon wafer can be effectively removed, thereby providing a high-quality substrate for subsequent precision processes such as photolithography and etching.

[0003] However, in actual production, the silicon wafers are often difficult to take out from the grinding equipment after grinding. This is mainly due to the fact that the bonding force between the silicon wafer and the fixing member changes due to various factors during the grinding process. On the one hand, the heat generated during the grinding process may cause physical or chemical changes in the contact interface between the silicon wafer and the fixing member, such as the occurrence of a small amount of adhesion; on the other hand, the abrasives and cooling liquids used in grinding may also remain on the surface of the silicon wafer and dry, which may increase the friction between the silicon wafer and the fixing member, making it difficult for the silicon wafer to be separated.

[0004] The problem that the silicon wafers are difficult to take out after grinding not only reduces production efficiency, prolongs the production cycle and increases production costs, but also may cause damage to the silicon wafers, such as scratches and cracks, during the forced removal of the silicon wafers, thereby affecting the quality and yield of the silicon wafers. SUMMARY

[0005] The utility model aims at solving the problem that the silicon wafers are difficult to take out from the grinding equipment after grinding in the prior art, thereby affecting the production efficiency and yield of the silicon wafers, and provides a storage and taking assembly for single-side grinding of large-size silicon wafers.

[0006] To solve the above technical problems, the utility model adopts the technical scheme of a storage and taking assembly for single-side grinding of large-size silicon wafers, which has a connecting piece that can store silicon wafers and cooperate with the fixing member included in the grinding equipment, a butt joint groove is arranged on the connecting piece, a butt joint piece is arranged in cooperation with the butt joint groove, and the butt joint piece can be separated from the butt joint groove to enable the connecting piece to be stored in the fixing member or taken out from the fixing member by butt joint;

[0007] The connecting piece includes a connecting plate and a plurality of support columns vertically arranged on the connecting plate, and a clamping column is arranged on the support column;

[0008] The docking groove comprises narrow ring grooves and wide ring grooves vertically penetrating the connecting piece, the inner wall interval of the narrow ring groove in the circumferential direction is greater than the outer diameter of the supporting column and less than the outer diameter of the clamping column, the upper side of the narrow ring groove is provided with a penetrating hole with an inner diameter greater than the clamping column, the penetrating hole communicates with the wide ring groove through the narrow ring groove, and the inner wall interval of the wide ring groove is greater than the outer diameter of the clamping column.

[0009] As a further optimization of the utility model discloses a large-size silicon wafer single-sided grinding access assembly, the connecting piece comprises a supporting ring matched with the fixing piece and a limiting portion arranged on the inner wall of the supporting ring, and the limiting portion can store the silicon wafer into the supporting ring.

[0010] As a further optimization of the utility model discloses a large-size silicon wafer single-sided grinding access assembly, the limiting portion is matched with the chamfer of the outer edge of the silicon wafer, so that the silicon wafer exceeds the supporting ring on the side of the limiting portion.

[0011] As a further optimization of the utility model discloses a large-size silicon wafer single-sided grinding access assembly, the docking groove and the supporting column are provided with four.

[0012] As a further optimization of the utility model discloses a large-size silicon wafer single-sided grinding access assembly, the connecting piece is provided in a C shape, and the docking groove and the supporting column are provided with three.

[0013] As a further optimization of the utility model discloses a large-size silicon wafer single-sided grinding access assembly, the supporting column is provided with a plurality of clamping columns uniformly distributed, the wide ring groove is arranged at the center of the narrow ring groove, the lower side of the narrow ring groove is provided with a through hole concentric with the penetrating hole, and the supporting column is connected with the plurality of connecting pieces.

[0014] As a further optimization of the utility model discloses a large-size silicon wafer single-sided grinding access assembly, the inner wall interval of the narrow ring groove away from the penetrating hole gradually decreases on one side, so as to limit the movement of the supporting column.

[0015] As a further optimization of the utility model discloses a large-size silicon wafer single-sided grinding access assembly, the connecting plate is fixedly provided with a holding handle on the side away from the supporting column.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] The utility model discloses a connecting piece is set up this key component, make silicon wafer can be with the fixed part of grinding equipment firm connection, and then can smoothly cooperate grinding equipment, accurately carry out polishing operation to silicon wafer. In addition, through setting up the butt joint piece of adapting to connecting piece, provide great convenience for staff to pull out connecting piece from the fixed part of grinding equipment. Staff can use butt joint piece to separate connecting piece from the fixed part easily through simple operation. When need to place silicon wafer to the fixed part, reverse operation butt joint piece, and connecting piece and the fixed part can be connected quickly again. The cooperation of connecting piece and butt joint piece can make staff feel easy and convenient when placing or taking out silicon wafer, greatly improve the previous problem that silicon wafer is difficult to take out from grinding equipment, not only significantly improve the production efficiency of silicon wafer, but also improve the finished product rate of product, have very high practical value and economic benefit. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the front view structure schematic diagram of embodiment 1 of the utility model;

[0019] Figure 2 It is the front view structure schematic diagram of embodiment 2 of the utility model;

[0020] Figure 3 It is the section structure schematic diagram of butt joint groove of the utility model;

[0021] Figure 4 It is the structure schematic diagram of connecting piece use state of the utility model;

[0022] Figure 5 It is the enlarged structure schematic diagram of A of the utility model;

[0023] Mark in drawing: 1, connecting piece;101, support ring;102, limit portion;2, butt joint groove;201, pass-in hole;202, narrow annular groove;203, wide annular groove;204, pass-out hole;3, silicon wafer;4, butt joint piece;401, clamping column;402, support column;403, connecting plate;404, hold handle;5, grinding equipment;6, fixed part. DETAILED DESCRIPTION

[0024] In order to better understand the utility model, the content of the utility model is further illustrated below in conjunction with examples, but the content of the utility model is not limited to the following examples.

[0025] As Figure 1 And 3As shown, the embodiment provides a large-size silicon wafer single-side grinding access assembly, which has a connecting piece 1 for connecting the silicon wafer 3, and a plurality of docking grooves 2 are uniformly distributed on the surface of the connecting piece 1. These docking grooves 2 play an important role, which can be closely matched with the docking piece 4, and then realize the separation of the plurality of connecting pieces 1 connected to each other one by one, and then realize the efficient positioning and convenient operation of the silicon wafer in the grinding process. As shown in Figure 4 and Figure 5 As shown, through the cooperation of the docking groove 2 and the docking piece 4, the plurality of connecting pieces 1 can be connected with the fixing piece 6 contained in the grinding equipment 5 one by one. In this way, the silicon wafer 3 connected by the connecting piece 1 can be accurately positioned on the fixing piece 6, so as to smoothly cooperate with the grinding equipment 5 to carry out polishing work on the silicon wafer 3. After the polishing work of the silicon wafer 3 is completed, the docking piece 4 can be connected with the connecting piece 1 again, and in this way the silicon wafer 3 can be easily taken out from the fixing piece 6 for subsequent processing operation, fully embodying the flexibility and practicality of the assembly design.

[0026] Further, the connecting piece 1 includes an annular support ring 101 and a limiting part 102 arranged on the inner wall of the support ring 101. The limiting part 102 cooperates with the support ring 101 to effectively position and limit the silicon wafer 3 inside the support ring 101. This design greatly facilitates the movement of the silicon wafer 3 by the staff, so that it can be smoothly transferred to different positions for use. At the same time, the structure of the support ring 101 can perfectly cooperate with the placing hole prearranged on the fixing piece 6, so as to realize the stable connection between the silicon wafer 3 and the fixing piece 6, and then the side of the silicon wafer 3 away from the limiting part 102 can be accurately ground. More preferably, the shape of the limiting part 102 is adapted to the chamfer of the outer periphery of the silicon wafer 3, which not only stably limits the silicon wafer 3 inside the support ring 101, but also completely exposes the side of the silicon wafer 3 towards the limiting part 102. In this way, the corresponding side of the silicon wafer 3 can be accurately polished by the grinding equipment 5, which provides the necessary conditions for realizing the double-side polishing of the silicon wafer.

[0027] The docking groove 2 includes four narrow ring grooves 202 evenly arranged on the support ring 101, which penetrates the whole of the support ring 101. In the center of the narrow ring groove 202, a wide ring groove 203 is also provided, and at the end of the narrow ring groove 202, a penetrating hole 201 is provided and communicates with the wide ring groove 203. The structure of the docking piece 4 includes a holding handle 404 and four support columns 402, and the holding handle 404 and the four support columns 402 are tightly connected by a connecting plate 403. On the surface of the support column 402, a clamping column 401 is provided, which can smoothly enter the wide ring groove 203 through the penetrating hole 201 under the forceful support of the support column 402 in actual use. Then, the staff can rotate the connecting plate 403 through the holding handle 404, so that the four support columns 402 rotate together. After the four support columns 402 rotate, they will move away from the penetrating hole 201, and at this time the clamping column 401 will be tightly limited in the wide ring groove 203 by the narrow ring groove 202. Through such operation, the holding handle 404 can be used to connect multiple support rings 101, and cooperate with the limiting part 102 to realize convenient access and efficient transfer of the silicon wafer 3, greatly improving the work efficiency.

[0028] Further, the support column 402 can be evenly distributed with multiple clamping columns 401, and the lower side of the narrow ring groove 202 is provided with a penetrating hole 204 concentric with the penetrating hole 201 and communicating with the wide ring groove 203, and the clamping column 401 can pass through the narrow ring groove 202 and the wide ring groove 203 under the forceful support of the support column 402, that is, pass through a support ring 101 to connect with another support ring 101. The distance between the inner walls of the narrow ring groove 202 away from the penetrating hole 201 gradually decreases, so that the four support columns 402 can rotate to limit the clamping column 401 while locking the support column 402, to improve the friction of the rotation of the support column 402, that is, to facilitate the stable transfer of multiple silicon wafers 3 to different positions by the staff.

[0029] <Embodiment 2>

[0030] As shown in Figure 2 , the embodiment is basically the same as embodiment 1 in overall structure and function, but there are differences in some details. Specifically, the support ring 101 in this embodiment adopts a unique C-shaped design. This C-shaped support ring 101 design has significant advantages, which can facilitate the staff to easily take out the silicon wafer 3 for detailed observation and detection after taking it out from the fixing piece 6. Through such operation, the accuracy of the judgment of whether the silicon wafer is qualified can be quickly made, thereby improving the efficiency of product quality detection.

[0031] In the aspect of the setting of the docking grooves 2, the embodiment is also different from the embodiment 1. The docking grooves 2 in the embodiment are provided with three, and are uniformly distributed on the support ring 101. Correspondingly, the support columns 402 contained in the docking piece 4 are also provided with only three, and correspond to the number of the docking grooves 2 one by one. Such design can not only maintain the basic function of the docking piece 4 connecting three docking grooves 2, but also can ensure that the docking piece 4 has good stability when connecting the support ring 101, thereby guaranteeing the reliability of the silicon wafer in the process of storage and transfer.

[0032] The specific embodiments of the utility model are described above. It needs to be understood that the utility model is not limited to the above specific implementation, and the person skilled in the art can make various deformations or modifications within the scope of claims, which does not affect the essential content of the utility model.

Claims

1. A storage and retrieval component for single-sided grinding of large-size silicon wafers, characterized in that: It has a connector (1) that can store silicon wafers (3) and can cooperate with the fixing part (6) included in the grinding equipment (5). The connector (1) is provided with a docking groove (2). The docking groove (2) is fitted with a docking part (4). The docking part (4) can be separated from the docking groove (2) so that the connector (1) can be stored in the fixing part (6) or the connector (1) can be removed from the fixing part (6) by docking. The connector (1) includes a connecting plate (403) and a plurality of support columns (402) vertically disposed on the connecting plate (403), and the support columns (402) are provided with snap-fit ​​columns (401); The docking groove (2) includes a plurality of narrow annular grooves (202) and wide annular grooves (203) of vertically penetrating connectors (1). The inner wall spacing of the narrow annular groove (202) in the circumferential direction is greater than the outer diameter of the support column (402) and less than the outer diameter of the snap-fit ​​column (401). The upper side of the narrow annular groove (202) is provided with an insertion hole (201) with an inner diameter greater than that of the snap-fit ​​column (401). The insertion hole (201) passes through the narrow annular groove (202) and communicates with the wide annular groove (203). The inner wall spacing of the wide annular groove (203) is greater than that of the snap-fit ​​column (401).

2. The access component for single-sided grinding of large-size silicon wafers as described in claim 1, characterized in that: The connector (1) includes a support ring (101) that cooperates with the fixing member (6) and a limiting part (102) provided on the inner wall of the support ring (101). The limiting part (102) allows the silicon wafer (3) to be stored in the support ring (101).

3. The access component for single-sided grinding of large-size silicon wafers as described in claim 2, characterized in that: The limiting part (102) is adapted to the chamfer of the outer edge of the silicon wafer (3) so that one side of the silicon wafer (3) facing the limiting part (102) extends beyond the support ring (101).

4. The access component for single-sided grinding of large-size silicon wafers as described in claim 1, characterized in that: The docking groove (2) and the support column (402) are each provided with four.

5. The access component for single-sided grinding of large-size silicon wafers as described in claim 1, characterized in that: The connector (1) is C-shaped, and there are three docking grooves (2) and three support columns (402).

6. The access component for single-sided grinding of large-size silicon wafers as described in claim 1, characterized in that: The support column (402) is provided with a plurality of evenly distributed snap-fit ​​posts (401), a wide annular groove (203) is provided at the center of the narrow annular groove (202), and the lower side of the narrow annular groove (202) is provided with an exit hole (204) concentric with the insertion hole (201) for the support column (402) to connect with a plurality of connectors (1).

7. The access component for single-sided grinding of large-size silicon wafers as described in claim 1, characterized in that: The distance between the inner wall of the narrow annular groove (202) and the side opposite to the insertion hole (201) gradually decreases to restrict the movement of the support column (402).

8. The access component for single-sided grinding of large-size silicon wafers as described in claim 1, characterized in that: A handle (404) is fixedly provided on the side of the connecting plate (403) away from the support column (402).

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