Adjustable grinding tool for chamfering 12-inch silicon wafer

Abstract

The utility model discloses an adjustable grinding tool for chamfering a twelve-inch silicon wafer, which is provided with a plurality of chamfering pieces which are detachably connected together through connecting pieces so as to randomly combine the chamfering pieces with different parameters. The chamfering piece comprises a chamfering disc and chamfering faces arranged on the edges of the two end faces of the chamfering disc, a chamfering area used for chamfering the edge of the silicon wafer is formed between every two adjacent chamfering faces, the circle center of the chamfering disc is provided with a connecting hole, a clamping hole and a clamping ring, the clamping hole and the clamping ring are matched with each other, and the connecting hole penetrates through the chamfering disc. The clamping hole and the clamping ring are arranged on the two end faces of the chamfering disc respectively. The connecting piece comprises a connecting cylinder with the two ends provided with a clamping cylinder and a threaded area respectively, the connecting cylinder can penetrate through the multiple connecting holes, so that the clamping cylinder is inserted into the clamping ring at the bottom, and the clamping cylinder is matched with a locking nut in threaded connection with the threaded area to fix the multiple chamfering discs together. The problem that in the prior art, a chamfer formed by polishing a silicon wafer through a mold is inconvenient to fix and flexibly adjust is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer processing, and particularly to an adjustable grinding tool for twelve-inch silicon wafer chamfering. BACKGROUND

[0002] In the field of semiconductor chip manufacturing, twelve-inch silicon wafers are important basic materials, and their quality and performance have a decisive influence on the quality of chips. With the continuous development and progress of semiconductor technology, the quality requirements for twelve-inch silicon wafers are becoming higher and higher.

[0003] In order to effectively reduce the probability of edge breakage of twelve-inch silicon wafers during production, transportation and subsequent processing, the method of chamfering the edge of the silicon wafer is generally used at present. Chamfering not only reduces the stress concentration of the edge of the silicon wafer and improves the mechanical strength of the silicon wafer, but also reduces the risk of breakage caused by sharp edges, thereby improving the yield of the silicon wafer.

[0004] However, the existing twelve-inch silicon wafer chamfering process has certain limitations. Among them, the mold used for chamfering is the key problem. In actual production, different production needs and process requirements often require corresponding adjustment of the angle, depth and other parameters of the silicon wafer chamfering. However, the existing chamfering mold is mostly fixed in structure and cannot be conveniently and flexibly adjusted according to actual needs. This results in the inability to flexibly adjust and replace to meet the precise requirements of some special processes for silicon wafer chamfering when facing diversified production needs, thereby affecting the quality and production efficiency of the silicon wafer. SUMMARY

[0005] The utility model aims at solving the problem of fixed and inconvenient flexible adjustment of the chamfer formed by the mold grinding the silicon wafer, and provides an adjustable grinding tool for twelve-inch silicon wafer chamfering.

[0006] To solve the above technical problems, the utility model adopts the technical scheme of an adjustable grinding tool for twelve-inch silicon wafer chamfering, which has a plurality of chamfering pieces vertically stacked and used for rotary chamfering, and the plurality of chamfering pieces are connected together through a connecting piece and can be disassembled to form a chamfering piece with different parameters in any combination.

[0007] The chamfering piece includes a chamfering disc and chamfering surfaces provided at the edge of the two end faces of the chamfering disc, and a chamfering area for chamfering the edge of the silicon wafer is formed between the two adjacent chamfering surfaces. A connecting hole, a clamping hole and a clamping ring are provided at the center of the chamfering disc, the connecting hole penetrates the chamfering disc, and the clamping hole and the clamping ring are respectively provided on the two end faces of the chamfering disc.

[0008] The connecting piece comprises a connecting cylinder provided with a clamping cylinder and a threaded area at two ends respectively, the connecting cylinder can pass through a plurality of connecting holes, the clamping cylinder is inserted into the clamping ring at the bottom, and a plurality of chamfering discs are fixed together by cooperating with the locking nut threaded with the threaded area.

[0009] As further optimization of the utility model discloses a twelve-inch silicon wafer chamfering adjustable grinding tool, the plurality of butt joint blocks are arranged on the outer circumferential surface of the clamping ring, the butt joint blocks are connected with the transition piece arranged between the adjacent two chamfering pieces, and the transition piece can round the edge of the chamfered silicon wafer.

[0010] As further optimization of the utility model discloses a twelve-inch silicon wafer chamfering adjustable grinding tool, the transition piece comprises a transition disc provided with a butt joint groove in the center, the butt joint groove is connected with the clamping ring and the butt joint block to be connected with the chamfering disc, and the transition disc is provided with a transition surface in the outer periphery and connected with the starting positions of the adjacent two chamfering surfaces.

[0011] As further optimization of the utility model discloses a twelve-inch silicon wafer chamfering adjustable grinding tool, the transition surface is arranged in a circular arc shape.

[0012] As further optimization of the utility model discloses a twelve-inch silicon wafer chamfering adjustable grinding tool, the plurality of butt joint blocks are arranged on the outer circumferential surface of the clamping ring, the butt joint blocks are connected with the transition piece arranged between the adjacent two chamfering pieces, and the transition piece can round the edge of the chamfered silicon wafer.

[0013] As further optimization of the utility model discloses a twelve-inch silicon wafer chamfering adjustable grinding tool, the plurality of butt joint blocks are arranged on the outer circumferential surface of the clamping ring, the butt joint blocks are connected with the transition piece arranged between the adjacent two chamfering pieces, and the transition piece can round the edge of the chamfered silicon wafer.

[0014] As further optimization of the utility model discloses a twelve-inch silicon wafer chamfering adjustable grinding tool, the plurality of butt joint blocks are arranged on the outer circumferential surface of the clamping ring, the butt joint blocks are connected with the transition piece arranged between the adjacent two chamfering pieces, and the transition piece can round the edge of the chamfered silicon wafer.

[0015] As further optimization of the utility model discloses a twelve-inch silicon wafer chamfering adjustable grinding tool, the plurality of butt joint blocks are arranged on the outer circumferential surface of the clamping ring, the butt joint blocks are connected with the transition piece arranged between the adjacent two chamfering pieces, and the transition piece can round the edge of the chamfered silicon wafer.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] The utility model discloses a connecting piece is set up to detachable connection of multiple vertical stack arrangement chamfer spare, this connection mode gives the staff great operational flexibility, makes it can according to different production demand, the chamfer spare of different parameters is freely combined, specifically, the chamfer face including on adjacent chamfer spare constitutes chamfer area jointly, through the combination of different parameter chamfer spare, this chamfer area can be processed to the edge of silicon wafer, accurately polish out the chamfer of meeting corresponding parameter requirement, the mould of multiple chamfer spare constitutes has the flexible adjustment function, compared with traditional mould, it can better adapt to diversified production task, effectively reduces the adverse effect of the fixed mould parameter to the quality of silicon wafer and production efficiency, while meeting the chamfer demand of different specifications silicon wafer, can also improve the fluency and efficiency of production process, significantly improve production efficiency and product quality.

[0018] Further, the utility model discloses still set up the transition piece between adjacent two chamfer spare, make the edge of silicon wafer that passes through chamfer processing present the smooth form. The smooth edge not only improves the appearance quality of silicon wafer, more important, further optimizes the chamfer quality of silicon wafer, significantly enhances the mechanical property of silicon wafer edge place. Through reducing the potential problem such as edge stress concentration, the application of transition piece provides more reliable quality guarantee for the silicon wafer in subsequent processing and use process. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the front view structure schematic drawing of the utility model;

[0020] Figure 2 It is the section structure schematic drawing of the utility model;

[0021] Figure 3 It is the structure schematic drawing of connecting piece of the utility model;

[0022] Figure 4 It is the structure schematic drawing of transition piece of the utility model;

[0023] Figure 5 It is the section structure schematic drawing of chamfer spare of the utility model;

[0024] Mark in the drawing: 1, transition piece;101, transition disc;102, transition face;103, heat dissipation hole;104, butt joint groove;2, chamfer spare;201, chamfer disc;202, chamfer face;203, cooperation hole;204, clamping ring;205, clamping hole;206, butt joint block;207, connecting hole;3, connecting piece;301, lock nut;302, connecting barrel;303, butt joint strip;304, clamping barrel. DETAILED DESCRIPTION

[0025] In order to better understand the utility model, the content of the utility model is further illustrated below in conjunction with examples, but the content of the utility model is not limited to the following examples.

[0026] As Figure 1 and Figure 2 A kind of adjustable grinding tool for twelve-inch silicon wafer chamfering is shown in the drawings, which is composed of multiple vertically stacked chamfering pieces 2, which are detachably connected by connecting pieces 3.Its unique feature is that workers can flexibly replace chamfering pieces 2 with different parameters according to actual needs.By combining chamfering pieces 2 with different parameters or the same parameters, different chamfering parameters can be polished at different height positions of the silicon wafer to meet special processing requirements, and the same chamfering parameters can be polished at all height positions to adapt to regular production needs.This high flexibility enables the grinding tool to be widely used in various twelve-inch silicon wafer chamfering processing scenarios with different requirements, greatly improving the adaptability and convenience of processing.

[0027] As Figure 2 and Figure 5 The core component of chamfering piece 2 is chamfering disc 201, which has a connecting hole 207 in the center position.The edge ends of chamfering disc 201 are designed with chamfering surfaces 202, and the adjacent two chamfering surfaces 202 form a chamfering area for chamfering the edge of the silicon wafer.Due to the different inclination angles of chamfering surfaces 202, the chamfering areas formed are also different, so that chamfers with different parameters can be processed on the edge of the silicon wafer to meet diversified production standards.The two end faces of chamfering disc 201 are respectively provided with clamping ring 204 and clamping hole 205, which are mutually adapted and concentrically arranged with connecting hole 207.The existence of clamping hole 205 and clamping ring 204 not only enables the precise butt joint of multiple chamfering discs 201, but also effectively limits the synchronous rotation of multiple chamfering discs 201, ensuring the stable rotation of multiple chamfering surfaces 202 during processing, so as to ensure that the quality of silicon wafer edge chamfering reaches a high level.In particular, clamping hole 205 adopts external hexagonal design, and clamping ring 204 is an internal hexagonal structure.When clamping ring 204 is inserted into clamping hole 205, a stable and firm connection can be formed, effectively preventing loosening or displacement during rotation. Figure 3As shown, the connecting piece 3 is composed of a connecting cylinder 302, and two butt strips 303 are symmetrically arranged on the inner wall of the connecting cylinder 302. The butt strips 303 can facilitate the workers to connect the connecting cylinder 302 with the driving piece, specifically, the connecting cylinder 302 is connected with the output shaft of the motor, so that the motor drives the connecting cylinder 302 and the corresponding chamfering disc 201 to rotate stably and at high speed, to polish the edge of the twelve-inch silicon wafer. The two ends of the connecting cylinder 302 are respectively provided with a clamping cylinder 304 and a threaded area. The connecting cylinder 302 can smoothly pass through the connecting holes 207 of the plurality of chamfering discs 201, so that the clamping cylinder 304 is accurately inserted into the clamping hole 205 of the lowermost chamfering disc 201, thereby realizing the synchronous and stable rotation of the connecting cylinder 302 and the plurality of chamfering discs 201. The clamping cylinder 304 is also provided with an inner hexagonal structure, and is stably connected with the clamping hole 205. The threaded area passing through the uppermost connecting hole 207 can be threadedly connected with the locking nut 301, so as to tightly connect the plurality of chamfering discs 201 together, realizing the detachable connection of the plurality of chamfering discs 201. This design enables chamfering discs 201 with different parameters to be combined as needed, providing great flexibility and convenience for silicon wafer chamfering processing.

[0028] The chamfering disc 201 is also provided with a plurality of matching holes 203 vertically penetrating through it. The plurality of matching holes 203 can be staggered or aligned according to actual needs. Such a design can significantly improve the air circulation in the plurality of chamfering discs 201, accelerate the heat dissipation speed of the chamfering area during the chamfering process of the silicon wafer, effectively avoid the decline of processing quality caused by overheating, and further improve the quality of chamfering of the silicon wafer by the chamfering area.

[0029] As shown in Figure 1 and Figure 4 , on one side of the chamfering disc 201 corresponding to the clamping ring 204, four butt blocks 206 are uniformly distributed, which are arranged in a ring around the clamping ring 204. The four butt blocks 206 are connected with the transition piece 1, and the transition piece 1 is arranged between the adjacent two chamfering discs 201. The transition piece 1 is composed of a transition disc 101, and the outer periphery of the transition disc 101 is tightly engaged with the inward edges of the adjacent two chamfering surfaces 202, specifically, the transition disc 101 is engaged with the starting positions of the adjacent two chamfering surfaces 202. The transition surface 102 is designed in a circular arc shape, which can round the edges of the silicon wafer, effectively avoiding the situation that the edges of the chamfered silicon wafer are too sharp or have stress concentration, thereby better maintaining the mechanical properties of the edges of the silicon wafer and improving the overall quality of the silicon wafer.

[0030] The transition disc 101 is provided with a butt joint groove 104 matched with the butt joint block 206, through the butt joint groove 104, the transition disc 101 can realize accurate butt joint with the chamfer disc 201 and keep synchronous rotation. Meanwhile, the butt joint groove 104 is communicated with the heat dissipation hole 103 vertically penetrating the transition disc 101, the heat dissipation hole 103 can realize matched communication or staggered arrangement with the matched hole 203, further enhances the ventilation and heat dissipation function inside the multiple chamfer discs 201 and the transition disc 101, ensures that the grinding tool always keeps good working state in the long-time processing process, provides powerful guarantee for high-quality silicon wafer chamfer processing.

[0031] The specific embodiments of the present application are described above. It should be understood that the present application is not limited to the specific embodiments described above, and various modifications or changes can be made by those skilled in the art within the scope of the claims, which does not affect the essential content of the present application.

Claims

1. An adjustable grinding tool for chamfering a twelve inch silicon wafer, characterized by: The application discloses a vertical stack setting and is used for rotating chamfering, a plurality of chamfering pieces (2) are detachably connected through connecting pieces (3) to form different parameters of chamfering pieces (2) in any combination. The chamfering piece (2) comprises a chamfering disc (201) and chamfering surfaces (202) arranged at the edges of the two end surfaces of the chamfering disc (201), the chamfering surfaces (202) between two adjacent chamfering surfaces (202) form a chamfering area for chamfering the edges of a silicon wafer, a connecting hole (207) and a clamping hole (205) and a clamping ring (204) matched with each other are arranged at the center of the chamfering disc (201), the connecting hole (207) penetrates through the chamfering disc (201), and the clamping hole (205) and the clamping ring (204) are arranged on the two end surfaces of the chamfering disc (201) respectively. The connecting piece (3) comprises a connecting cylinder (302) provided with a clamping cylinder (304) and a threaded area at two ends respectively, the connecting cylinder (302) can pass through a plurality of connecting holes (207), the clamping cylinder (304) is inserted into the clamping ring (204) at the bottom, and the plurality of chamfering discs (201) are fixed together by cooperating with a locking nut (301) threadedly connected with the threaded area.

2. The adjustable grinding tool for chamfering a 12-inch silicon wafer according to claim 1, wherein: The clamping ring (204) is provided with a plurality of abutting blocks (206) on the outer circumferential surface, the abutting blocks (206) are connected with a transition piece (1) arranged between two adjacent chamfering pieces (2), and the transition piece (1) can round the chamfered edges of the silicon wafer.

3. The adjustable grinding tool for chamfering a 12-inch silicon wafer according to claim 2, wherein: The transition piece (1) comprises a transition disc (101) provided with an abutting groove (104) at the center, the abutting groove (104) is connected with the chamfering disc (201) by cooperating with the clamping ring (204) and the abutting block (206), and the transition disc (101) is provided with a transition surface (102) engaged with the starting positions of two adjacent chamfering surfaces (202) on the outer periphery.

4. The adjustable grinding tool for chamfering a 12-inch silicon wafer according to claim 3, wherein: The transition surface (102) is arranged in a circular arc shape.

5. The adjustable grinding tool for chamfering a twelve inch silicon wafer as recited in claim 3, wherein: The abutting groove (104) is communicated with a plurality of heat dissipation holes (103) arranged on the transition disc (101) and vertically penetrating through the transition disc (101).

6. The adjustable grinding tool for chamfering a twelve inch silicon wafer as recited in claim 1, wherein: The chamfering disc (201) is uniformly provided with a plurality of matching holes (203) vertically penetrating through the chamfering disc (201).

7. The adjustable grinding tool for chamfering a twelve inch silicon wafer as recited in claim 1, wherein: The connecting cylinder (302) is provided with an abutting strip (303) for abutting a driving piece on the inner wall.

8. The adjustable grinding tool for chamfering a twelve inch silicon wafer according to claim 1, wherein: The clamping hole (205) is arranged in an outer hexagonal shape, and the clamping cylinder (304) and the clamping ring (204) are arranged in an inner hexagonal shape matched with the clamping hole (205).

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