Gradient heat pipe with capillary structure
By designing a gradient heat pipe structure, combined with braided wire layers and copper powder sintered capillary structure layers, the problems of heat pipe thermal conductivity and anti-gravity under space constraints were solved, achieving a heat dissipation effect with low thermal resistance and high thermal conductivity.
Patent Information
- Application Number
- CN202520241847.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-02-17
AI Technical Summary
Existing heat pipe structures cannot simultaneously meet the requirements of high thermal conductivity and anti-gravity performance due to the limited internal space of computers, and also suffer from problems such as high contact thermal resistance and high resistance to recirculation of the working fluid.
Design a gradient heat pipe with a structure of a large heating section and a small heat dissipation section, combined with a braided wire layer and a capillary structure layer sintered with copper powder. The copper powder thickness is 0.20-0.50mm and the copper powder is 100-150 mesh. The braided wire layer is used for gas-liquid separation, and the capillary structure layer is in close contact to reduce thermal resistance and improve anti-gravity performance.
It achieves low thermal resistance, high thermal conductivity and excellent heat dissipation, solves the performance deficiencies of traditional heat pipes under space constraints, improves the working fluid reflux capability and anti-gravity performance, and reduces contact thermal resistance and vapor carry-over resistance.
Smart Images
Figure CN223910104U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to heat pipe design field, more specifically to a kind of heat pipe with capillary structure of gradual change. BACKGROUND
[0002] Current common thin pipe structure and the following shortcomings are as follows:
[0003] (1) Copper mesh + braided wire structure: the defect copper mesh adhesion is poor, contact thermal resistance is big, copper wire adhesion is poor capillary force is weak;
[0004] (2) Single double cutting edge copper powder structure: the defect pure copper powder performance is low, gravity resistance is poor, contact thermal resistance is big;
[0005] (3) Full copper powder + copper wire structure: the defect is limited by space, copper wire thickness is weak performance, working medium backflow resistance is big, and it is suitable for T≥2.0mm above heat pipe.
[0006] (4) Due to the internal space limitation of computer, the width and thickness of the local area are limited in design, large-diameter heat pipes cannot be used, and small-diameter heat pipes cannot meet the demand of thermal resistance and power. INVENTION CONTENTS
[0007] In order to overcome the above-mentioned defects of the prior art, the utility model provides a kind of heat pipe with capillary structure of gradual change. Make large-diameter heat pipe in local area, and the diameter of the rest position is unchanged to avoid mechanism interference, so as to reduce thermal resistance, improve performance and enhance the effect of heat dissipation.
[0008] The technical scheme of the utility model is as follows:
[0009] A kind of heat pipe with capillary structure of gradual change, including heat pipe, braided wire layer, capillary structure layer;The heat pipe one end is large pipe, the other end is small pipe, and the connecting place of large pipe and small pipe is gradual slope;The braided wire layer is arranged in the middle position of the bottom surface of the heat pipe, and the inner wall of the heat pipe is provided with capillary structure layer;The inner wall of the heat pipe is connected with the braided wire layer on one side, and the capillary structure layer is tightly attached to and covered on the other side and upper and lower surface of the braided wire layer;The capillary structure layer is the porous structure formed by copper powder sintering.
[0010] The large pipe is heating part, and the small pipe is heat dissipation part.
[0011] The heat pipe is flat and hollow.
[0012] The braided wire layer extends from the heating part to the heat dissipation part of the heat pipe.
[0013] The capillary structure layer is sintered on the inner wall of the heat pipe, and the copper powder can be designed on one side or in a whole circle.
[0014] The capillary structure layer uses copper powder with a thickness of 0.20-0.50mm, and the copper powder is 100-150 mesh.
[0015] One end of the small tube is an arc-shaped elbow.
[0016] The technical effects and advantages of the utility model are as follows:
[0017] (1) Fine copper powder is conducive to heat conduction and heat exchange to reduce thermal resistance, and at the same time, thin powder thickness ensures sufficient steam passage and reduces contact thermal resistance; the wafer temperature can be effectively reduced; the thermal resistance is low, the power performance is good, and the process is more stable;
[0018] (2) The design can adopt thicker and wider copper wires, i.e., braided wire layers, than the traditional powder+wire heat pipe, has the working fluid backflow effect, and at the same time, adopts the gas-liquid separation design, the capillary force and the anti-gravity performance are greatly improved; can provide higher heat conduction performance and lower contact thermal resistance, and the overall heat conduction and heat exchange performance is greatly improved;
[0019] (3) The steam space of the heat dissipation end is larger, the pressure drop is small, the heat pipe temperature difference is small, there is no other capillary coverage, and the heat dissipation effect is better;
[0020] (4) The problem of sintering shedding of braiding is solved, and the copper powder in the heating area can effectively fix the braided wire to make the sintering adhesion better;
[0021] (5) The capillary structure on the upper and lower surfaces of the heat pipe is in close contact, reduces the steam carrying of the heating end to reduce the working fluid backflow resistance, and the heat conduction and heat exchange of the heat pipe are better.
[0022] (6) There is no need to expand the hole of the copper pipe outer diameter to cause pipe wall damage, and the capillary structure manufacturing also does not need to make a special stepped center rod according to the gradually changing outer diameter. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 is a schematic view of the heat pipe as a whole;
[0024] Figure 2 is an A-A sectional view of Figure 1 ; is a layout view of the braided wire layer 2;
[0025] Figure 3 is a schematic view of the heat pipe inside.
[0026] Figure 4 is a schematic view of the heat pipe inside. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below, obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without creative labor belong to the protection scope of the utility model.
[0028] Embodiment one
[0029] As Figures 1 to 4 A kind of gradient heat pipe with capillary structure shown in the figure, including heat pipe 1, braided wire layer 2, capillary structure layer 3;The heat pipe one end is big pipe 11, the other end is small pipe 12, the connecting place of big pipe and small pipe is gradient inclined plane 13;The big pipe is heating part 14, and the small pipe is heat dissipation part 15;The braided wire layer 2 is arranged in the middle position of the bottom surface of the heat pipe, and the inner wall of the heat pipe is sintered with capillary structure layer;Braided wire layer 2 right side surface is sintered in the inner wall of heat pipe 1, and capillary structure layer 3 is partially adhered and covered on the outer top surface and two side surfaces of braided wire layer;The capillary structure layer is the porous structure formed by copper powder sintering.
[0030] Further, the heat pipe 1 is flat and hollow, and the hollow part is the steam passage C.
[0031] Further, the braided wire layer extends from the heating part to the heat dissipation part of the heat pipe.
[0032] Further, the capillary structure layer is sintered on the inner wall of the heat pipe, and the copper powder can be designed on one side or in a whole circle.
[0033] Further, the capillary structure layer uses copper powder with a thickness of 0.20-0.50 mm, and the copper powder is 100-150 mesh.
[0034] Further, the small pipe is an arc-shaped elbow pipe 16 at one end.
[0035] Embodiment two
[0036] Technical requirements:
[0037] (1) The first capillary structure, i.e., the capillary structure layer, uses copper powder with a thickness of 0.20-0.50 mm (which can reduce thermal resistance);The copper powder is 100-150 mesh, and too thin copper powder is difficult to process and unevenly filled with powder, and too thick copper powder blocks the steam passage;Select the appropriate powder thickness according to the thickness of the flattened heat pipe;The copper powder filling width covers the heating area;It is appropriate to be just over;
[0038] (2) The second capillary structure, i.e., the braided wire layer, uses braided wire (copper wire);The braided wire is designed to have a thickness to separate the air path and the water path, reduce steam carrying at the heating end, and enhance the capillary lifting power and anti-gravity performance;
[0039] (3) The first capillary and the second capillary on the upper and lower surfaces of the heat pipe heating area are in close contact;
[0040] (4) The heat dissipation area only uses a woven wire capillary structure.
[0041] The above only describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A graded heat pipe having a capillary structure, characterized by: The heat pipe, the braided wire layer and the capillary structure layer are included; one end of the heat pipe is a large pipe, the other end is a small pipe, and the connection part of the large pipe and the small pipe is a gradual inclined surface; the braided wire layer is arranged at the middle position of the bottom surface of the heat pipe, and the inner wall of the heat pipe is provided with the capillary structure layer; one side surface of the braided wire layer is connected with the inner wall of the heat pipe, and the capillary structure layer is locally attached to and covers the other side surface and the upper and lower surfaces of the braided wire layer; the capillary structure layer is a porous structure formed by sintering of copper powder.
2. The graded heat pipe with capillary structure according to claim 1, characterized in that: The large pipe is a heating part, and the small pipe is a heat dissipation part.
3. The graded heat pipe with capillary structure according to claim 1, wherein: The heat pipe is flat and hollow.
4. The graded heat pipe with capillary structure according to claim 1, wherein: The braided wire layer extends from the heating part to the heat dissipation part of the heat pipe.
5. The capillary-structured graded heat pipe according to claim 1, wherein: The capillary structure layer is sintered on the inner wall of the heat pipe, and the copper powder can be designed to be single-sided or full-circle.
6. The capillary-structured graded heat pipe according to claim 1, wherein: The thickness of the copper powder used in the capillary structure layer is 0.20-0.50 mm, and the copper powder is 100-150 mesh.
7. The capillary-structured, graded heat pipe of claim 1, wherein: One end of the small pipe is an arc-shaped elbow pipe.