Splicing groove assembly and silicon rod slicing machine
By designing a wafer splicing groove assembly in the slicing machine, the coolant level is dynamically balanced to be flush with the lowest point of the diamond wire, solving the problems of silicon wafer edge chipping and diamond wire breakage caused by thinning the wire, thus improving slicing efficiency and stability.
Patent Information
- Application Number
- CN202520205811.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-02-10
AI Technical Summary
In existing slicing machines, the thinning of the wire leads to a reduction in the gap between silicon wafers. This causes silicon powder and diamond debris to accumulate and rub against each other, generating heat and affecting the edge chipping or silicon drop of the wafers. Furthermore, coolant cannot be sprayed into the gaps, affecting the diamond wire drawing speed and reducing slicing efficiency.
Design a wafer bonding tank assembly, including a tank body, a liquid level detection component, and a water outlet control component. By dynamically balancing the coolant level to be flush with the lowest point of the diamond wire, the coolant can effectively remove debris and heat, preventing silicon wafer edge chipping and diamond wire breakage.
It effectively prevents silicon wafer edge chipping or silicon drop, avoids diamond wire breakage, improves slicing efficiency, and maintains diamond wire stability and pulling speed.
Smart Images
Figure CN223933905U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon rod slicing machine technology, specifically to a wafer receiving groove assembly and a silicon rod slicing machine. Background Technology
[0002] A slicing machine is a device that cuts silicon blocks or rods into silicon wafers. Diamond wire slicing machines use tiny diamond particles fixed on a steel wire as cutting tools. The diamond wire runs at high speed, and cutting is achieved through the relative movement between the silicon block or rod and the diamond wire. Cooling is provided by a coolant. The wafer receiving slot assembly of the slicing machine can collect the coolant and the fragments and powder that fall off during the cutting process.
[0003] With the development of the photovoltaic industry, the diamond wires used in wafer slicing machines are gradually becoming thinner, evolving from thicker 35μm wires to thinner 28μm or even 25μm wires. However, this thinning of diamond wires presents several problems: the gaps between silicon wafers are constantly shrinking, making it easier for silicon powder and diamond debris to accumulate in the gaps. This accumulation causes friction and collisions with the wafers, leading to edge chipping or silicon drop. Simultaneously, due to the small gaps, coolant cannot be sprayed into the gaps, and the heat generated by friction cannot dissipate, further contributing to edge chipping or silicon drop. The falling silicon powder and diamond debris onto the diamond wire below, as well as the accumulation of silicon powder and diamond debris and the heat generated by friction, all easily lead to wire breakage. Furthermore, excessively thin diamond wires are unstable; if they penetrate deep into the coolant, the resistance of the liquid will affect the wire pulling speed, reducing slicing efficiency. Therefore, it is necessary to design a wafer slicing groove assembly that can prevent wafer chipping or silicon drop and diamond wire breakage, while simultaneously improving wafer slicing efficiency. Utility Model Content
[0004] To address at least one of the problems mentioned in the background art, this utility model provides a wafer slot assembly and a silicon rod slicing machine, which can prevent silicon wafer edge chipping or silicon drop, while avoiding diamond wire breakage, ensuring diamond wire pulling speed, and improving silicon wafer slicing efficiency.
[0005] The specific technical solution provided by this utility model is as follows:
[0006] In a first aspect, a wafer slot assembly is provided for a silicon rod slicing machine, comprising:
[0007] The tank body is formed as a container with an open top and located below the diamond wire and silicon rod in the wire cutting area, for receiving the coolant during the wire cutting process and the silicon wafer formed by the wire cutting of the silicon rod;
[0008] The outlet is located at the bottom of the tank body to discharge the coolant inside the tank body;
[0009] A liquid level detection device is installed inside the tank body to detect the liquid level of the coolant inside the tank body;
[0010] The water outlet control component is connected to the liquid level detection component. Based on the liquid level detected by the liquid level detection component, the discharge volume of the water outlet is adjusted to ensure that the liquid level of the coolant in the tank body is flush with the central axis of the lowest point of the diamond wire in the line-cutting area.
[0011] As a preferred embodiment of the above scheme, the tank body includes a bottom surface and four sides.
[0012] As a preferred embodiment of the above scheme, the groove body has mounting grooves that penetrate the sides on two opposite sides of the diamond wire in the wire-cutting area. A second guide wheel is installed in the mounting groove, wherein the axis of the second guide wheel is perpendicular to the length direction of the diamond wire in the wire-cutting area.
[0013] As a preferred embodiment of the above scheme, the second guide wheel is rotatably mounted on both sides of the groove body, and there is a gap between the second guide wheel and the top of the mounting groove, through which the diamond wire in the wire cutting area passes.
[0014] As a preferred embodiment of the above scheme, the width of the gap is greater than the diameter of the diamond wire.
[0015] As a preferred embodiment of the above solution, the water outlet control component includes a flow valve.
[0016] As a preferred embodiment of the above solution, the liquid level detection element is disposed on the inner wall of the tank body, and the liquid level detection element includes a liquid level sensor.
[0017] By employing the above technical solution, this utility model, through the setting of a tank body, a water outlet, a liquid level detection device, and a water outlet control device, enables the coolant level in the tank body to be dynamically balanced at a position flush with the central axis of the lowest point of the diamond wire. Firstly, with the central axis of the lowest point of the diamond wire flush with the coolant level, coolant can be carried into the silicon wafers through the pores between the diamonds on the diamond wire. This allows debris and powder generated during the cutting process to be carried out of the silicon wafers by the coolant and enter the coolant pool in the tank body. Secondly, the dynamic balance of the coolant in the tank body ensures a continuous influx of new coolant and a continuous discharge of old coolant mixed with debris and powder, thus removing debris and powder from the tank body. This keeps the debris and powder in the coolant in the tank body at a low level, preventing debris and powder from being carried back into the silicon wafers, causing edge chipping or silicon drop, and also preventing diamond wire breakage, thereby improving silicon wafer slicing efficiency.
[0018] In a second aspect, a silicon rod slicing machine is provided, including a plurality of first guide rollers and a plurality of diamond wires wound on the plurality of first guide rollers, wherein the diamond wires in the slicing area and the silicon rod are provided with the above-mentioned splicing groove assembly.
[0019] As a preferred embodiment of the above scheme, the silicon rod slicing machine also includes a diamond wire disposed in the slicing area and a coolant nozzle above the silicon rod.
[0020] As a preferred embodiment of the above scheme, the diameter of the first guide wheel is larger than the diameter of the second guide wheel. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of this utility model;
[0023] Figure 2 This is a schematic diagram of the structure of the present invention, the first guide wheel, and the silicon rod;
[0024] Figure 3 This utility model is for Figure 1 The cross-sectional view along AA shows the state of the tank body when the specified water level has not been reached;
[0025] Figure 4 This utility model is for Figure 1 The cross-sectional view along AA shows the state of the tank body when the specified water level is reached;
[0026] Figure 5 This is a schematic diagram showing the state of the silicon wafer during diamond wire cutting according to this utility model;
[0027] Figure 6 This is a schematic diagram showing the state of the groove body during silicon wafer cutting according to this utility model;
[0028] Figure 7 This is a schematic diagram showing the state of the diamond wire, the second guide wheel, and the mounting groove when the diamond wire is not fluctuating.
[0029] Figure 8 This is a schematic diagram showing the state of the diamond wire, the second guide wheel, and the mounting groove when the diamond wire is undulating. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0031] It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "upper," "lower," "inner," "outer," and "bottom," etc., used in this specification to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0032] Example 1
[0033] like Figure 1 As shown, this utility model provides a wafer slicing tank assembly, including a tank body 1, a liquid level detection element 2, and a water outlet control element 3. The wafer slicing tank assembly is used in a silicon rod slicing machine. The tank body 1 is formed as a container with an open top and is located below the diamond wire and silicon rod in the wire cutting area, serving to receive the coolant 300 and the silicon wafers formed by wire cutting the silicon rod during the wire cutting process. The liquid level detection element 2 is used to detect the liquid level of the coolant in the tank body 1. The liquid level detection element 2 is connected to the water outlet control element 3. The tank body 1 is provided with a water outlet 11, which is located at the bottom of the tank body for discharging the coolant inside the tank body 1. The water outlet 11 is connected to the water outlet control element 3, which is also connected to the liquid level detection element 2. Based on the liquid level detected by the liquid level detection element 2, the water outlet control element 3 controls the discharge rate of the water outlet 11 to ensure that the liquid level of the coolant in the tank body 1 is level with the central axis at the lowest position of the diamond wire 100 in the wire cutting area.
[0034] like Figure 1 , Figure 2 As shown, Figure 2 This is a side view, showing the first guide wheel of the silicon rod slicing machine, the diamond wire, and the wafer slot assembly. Figure 2The diagram shows the silicon rod before the diamond wire cuts it. The silicon rod moves downwards, and upon contact with the diamond wire, the diamond wire is pressed down, causing the rotating diamond wire to cut the silicon rod. The groove body 1 includes two opposing side plates 12, which are opposite each other along the length of the diamond wire in the cutting area. The upper part of each side plate 12 has a mounting groove 121 that penetrates the side plate 12. A second guide wheel 5 is rotatably mounted within the mounting groove 121. The axis of the second guide wheel 5 is perpendicular to the length of the diamond wire in the cutting area. A gap 6 is provided between the top of the second guide wheel 5 and the top of the mounting groove 121. The diamond wire 100 in the cutting area passes through the gap 6, and the width of the gap 6 is greater than the diameter of the diamond wire 100. Multiple grooves 51 are provided on the second guide wheel 5, each groove 51 used to accommodate the diamond wire 100. In this embodiment, since the diamond wire 100 is wound around the groove 51 of the second guide wheel 5, the winding distance of the diamond wire 100 on the guide wheel is shortened compared to the original method where the diamond wire 100 was only wound around the first guide wheel 41 (described in detail below). This improves the stability of the diamond wire 100 during cutting and prevents the diamond wire 100 from jumping out of the groove of the first guide wheel 41. Simultaneously, a gap 6 is provided between the upper end of the second guide wheel 5 and the side wall of the mounting groove 121. Figure 4 , Figure 7 , Figure 8 As shown, this provides a buffer space for the diamond wire 100 to fluctuate after passing through the liquid surface. This not only prevents the diamond wire 100 from jumping out of the groove 51 of the second guide wheel 5 and then out of the groove 51 of the first guide wheel 41, but also prevents the diamond wire 100 from cutting into the mounting groove 121 and causing damage to the side plate 12 when fluctuating. It should be noted that the gap 6 in this embodiment cannot be too large or too small. If it is too large, it will not be able to restrict the position of the fluctuating diamond wire 100, causing the diamond wire 100 to jump out of the groove 51 of the second guide wheel 5 and then out of the groove 41 of the first guide wheel. If it is too small, the fluctuating diamond wire 100 will cut into the side wall of the mounting groove 121 and cause damage to the side plate 12.
[0035] like Figure 1 , Figures 3 to 6As shown, in this embodiment, the tank body 1 also includes two side plates 13 and a bottom plate 14 that are opposite each other in a direction perpendicular to the length direction of the diamond wire in the wire-cutting area. The side plates 13 and 12 are fixedly connected end to end, and the bottom plate 14 is fixedly connected to the bottom of the side plates 13 and 12. The area enclosed by the side plates 13, 12 and 14 is used to hold coolant. The outlet 11 is located at the lower part of one side plate 13, and the liquid level detection element 2 is located on the inner wall of the other side plate 13. The liquid level detection element 2 includes a liquid level sensor, and the water outlet control element 3 includes a flow valve. In this embodiment, the liquid level sensor is an infrared sensor. The infrared sensor is positioned above the liquid surface to achieve non-contact detection. The infrared sensor includes an infrared emitter and an infrared receiver. The infrared emitter emits an infrared beam, which shines on the liquid surface. The infrared beam reflected from the liquid surface is received by the infrared receiver and then converted into an electrical signal. The height of the liquid surface affects the angle and intensity of the reflected light. Therefore, the infrared sensor can determine the height of the liquid surface by detecting the intensity and angle of the received signal, thereby realizing the detection of the liquid level. During silicon wafer cutting, the silicon rod 200 descends to a certain height, and the moving diamond wire 100 cuts the silicon rod 200 into silicon wafers 202. During cutting, coolant sprays from the coolant nozzle to rinse and cool the diamond wire 100. The tank body 1 receives the coolant. When the infrared sensor detects that the coolant has reached the designated water level (which is level with the central axis at the lowest position of the diamond wire 100), the water outlet control component 3 opens the water outlet 11. The amount of coolant flowing into the tank body 1 is equal to the amount of coolant flowing out of the water outlet 11. The coolant in the tank body 1 is in motion while the water level remains unchanged. The flowing coolant carries away the silicon powder and diamond fragments 201 and the accumulated heat from the gaps in the silicon wafer.
[0036] The splice slot assembly of this utility model can be adapted to existing diamond wire slicing machines and can be installed without replacing other parts of the slicing machine, making it convenient for disassembly and maintenance.
[0037] like Figures 1 to 6As shown, in the wafer slab assembly of this invention, the coolant level in the slab body 1 can be dynamically balanced to a position flush with the central axis at the lowest point of the diamond wire 100. Firstly, with the central axis at the lowest point of the diamond wire 100 flush with the coolant level, coolant can be carried into the spaces between the diamonds on the diamond wire 100, allowing debris and powder generated during the cutting process to be carried out of the spaces between the silicon wafers 202 and into the coolant pool in the slab body 1. Secondly, the dynamic balance of the coolant in the slab body 1 ensures a continuous influx of new coolant and a continuous discharge of old coolant mixed with debris and powder, thus removing debris and powder from the slab body 1. This keeps the level of debris and powder in the coolant in the slab body 1 low, preventing debris and powder from being carried back into the spaces between the silicon wafers 202, which could cause edge chipping or silicon drop, and also preventing the diamond wire 100 from breaking, thereby improving silicon wafer slicing efficiency.
[0038] Example 2
[0039] This utility model provides a silicon rod slicing machine, including multiple first guide rollers 41 and multiple diamond wires 100 wound on the first guide rollers 41. A wafer receiving groove assembly as described in Embodiment 1 is provided below the diamond wires 100 and the silicon rod 200 in the slicing area. The diameter of the first guide rollers 41 is larger than the diameter of the second guide rollers 5. The diamond wires 100 are wound on the grooves of the first guide rollers 41 and the second guide rollers 5, and pass through the groove body 1. The silicon rod slicing machine also includes a coolant nozzle (not shown) and a feeding mechanism (not shown) disposed above the diamond wires and silicon rod in the slicing area. The coolant nozzle is disposed above the groove body, and the feeding mechanism is used to drive the silicon rod feeding movement.
[0040] like Figure 2 As shown, the silicon rod slicing machine also includes a third guide wheel 42 that cooperates with the first guide wheel 41. The third guide wheel 42 and the first guide wheel 41 form an approximately triangular shape. The diamond wire 100 is wound around the two first guide wheels 41 and the third guide wheel 42 and moves under the drive of the first guide wheels 41 and the third guide wheel 42. A wire cutting area is formed between the two first guide wheels 41, and the diamond wire between the two first guide wheels 41 performs a sawing action. The silicon rod 200 moves towards the diamond wire 100 between the second guide wheels 5 under the drive of the feeding mechanism and presses down the diamond wire 100, finally cutting it into silicon wafers 202. The pressed diamond wire 100 has a lowest point, and the central axis of the lowest point is flush with the coolant in the tank body 1.
[0041] During silicon wafer cutting, the silicon rod slicing machine is operated, and the diamond wire 100 moves to form a sawing action. The feeding mechanism drives the silicon rod 200 to be cut to descend. Driven by the feeding mechanism, the silicon rod 200 moves towards the diamond wire 100 between the second guide wheels 5 and presses down the diamond wire 100, finally cutting it into silicon wafer 202. During the cutting process, coolant sprays out coolant from the coolant nozzle to rinse and cool the diamond wire 100. The tank body 1 receives the coolant. The infrared sensor detects that the coolant has reached the specified water level (the specified water level is level with the central axis at the lowest position of the diamond wire 100). The water outlet control component 3 opens the water outlet 11. The amount of coolant flowing into the tank body 1 and the amount of coolant flowing out of the water outlet 11 are equal. The coolant in the tank body 1 is in a state of motion while the water level remains unchanged. The flowing coolant carries away the silicon powder and diamond debris in the gaps of the silicon wafer as well as the accumulated heat.
[0042] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.
[0043] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.
Claims
1. A wafer slot assembly for a silicon rod slicing machine, characterized in that, include: The tank body is formed as a container with an open top and located below the diamond wire and silicon rod in the wire cutting area, for receiving the coolant during the wire cutting process and the silicon wafer formed by the wire cutting of the silicon rod; A water outlet is located at the bottom of the tank body to discharge the coolant inside the tank body; A liquid level detection element is installed inside the tank body to detect the liquid level of the coolant inside the tank body; A water outlet control component is connected to the liquid level detection component. Based on the liquid level of the coolant detected by the liquid level detection component, the discharge volume of the water outlet is adjusted to ensure that the liquid level of the coolant in the tank body is flush with the central axis of the lowest point of the diamond wire in the wire-cutting area.
2. The splice slot assembly according to claim 1, characterized in that, The tank body includes a bottom surface and four sides.
3. The splice slot assembly according to claim 2, characterized in that, The groove body has mounting grooves that penetrate the two opposite sides of the diamond wire in the wire-cutting area. A second guide wheel is provided in the mounting groove, wherein the axis of the second guide wheel is perpendicular to the length direction of the diamond wire in the wire-cutting area.
4. The splice slot assembly according to claim 3, characterized in that, The second guide wheel is rotatably disposed on the two sides of the groove body, and there is a gap between the second guide wheel and the top of the mounting groove, through which the diamond wire in the wire-cutting area passes.
5. The splice slot assembly according to claim 4, characterized in that, The width of the gap is greater than the diameter of the diamond wire.
6. The splice slot assembly according to claim 5, characterized in that, The water outlet control component includes a flow valve.
7. The splice slot assembly according to claim 6, characterized in that, The liquid level detection element is disposed on the inner wall of the tank body, and the liquid level detection element includes a liquid level sensor.
8. A silicon rod slicing machine, characterized in that, It includes a plurality of first guide wheels and a plurality of diamond wires wound on the plurality of first guide wheels, wherein a splice groove assembly according to any one of claims 1-7 is provided below the diamond wires and silicon rods in the wire-cut region.
9. The silicon rod slicing machine according to claim 8, characterized in that, The silicon rod slicing machine also includes the diamond wire disposed in the online slicing area and the coolant nozzle above the silicon rod.
10. The silicon rod slicing machine according to claim 8, characterized in that, The diameter of the first guide wheel is larger than the diameter of the second guide wheel.