Heat-conducting silicone grease element with low thermal resistance

Abstract

The utility model discloses a heat-conducting silicone grease element with low thermal resistance, which relates to the technical field of heat-conducting silicone grease and comprises heat-conducting silicone grease coated on a radiating plate; the outer ring of the heat dissipation plate is connected with a heat dissipation frame in an attached mode, and mounting plates are arranged on the periphery of the bottom of the inner wall of the heat dissipation frame. The top of the mounting plate is provided with a spring pushing assembly connected with the heat dissipation plate. Mounting feet are arranged on the periphery of the heat dissipation frame; the pressing rod is pressed downwards forcibly from the two sides, the heat dissipation plate compresses the spring pushing assembly downwards, then heat conduction silicone grease is poured into the top of the heat dissipation plate, the heat conduction silicone grease is located in the heat dissipation frame, at the moment, the sealing ring abuts against the heating face of the electronic element, and then the pressing rod can be loosened; the spring pushing assembly pushes the heat dissipation plate to move in the heat dissipation frame through the reset elastic force, and therefore the heat conduction silicone grease is pushed to be evenly and tightly filled between the heat dissipation plate and the heating face of the electronic element.

Description

Technical Field

[0001] This utility model relates to the field of thermal grease technology, specifically a low thermal resistance thermal grease element. Background Technology

[0002] Thermal grease is a paste-like thermally conductive medium with high thermal conductivity and low thermal resistance. It can form a very good low thermal resistance interface between the heat source interface and the heat sink, and has excellent thermal conductivity. It also has low oil separation degree, and is resistant to high and low temperatures, water, superoxide, and weathering.

[0003] In heat dissipation and heat conduction applications, even two perfectly smooth surfaces will have gaps when they come into contact. The air in these gaps is a poor conductor of heat, hindering heat transfer to the heatsink. Thermal grease is a material that fills these gaps, allowing for smoother and faster heat conduction. When electronic components are operating, the heat generated is quickly transferred to the heatsink through the thermal grease, and then dissipated through the heatsink's surface area, thus achieving heat dissipation.

[0004] Thermal grease has a relatively short lifespan and usually needs to be reapplied every year. However, current low thermal resistance thermal greases are not easy to apply to the heat-generating surfaces of electronic components. Therefore, we propose a low thermal resistance thermal grease element. Utility Model Content

[0005] The purpose of this invention is to provide a low thermal resistance thermal grease element to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a low thermal resistance thermal grease element, comprising thermal grease, wherein the thermal grease is applied to a heat sink.

[0007] The outer ring of the heat sink is fitted with a heat sink frame, and mounting plates are provided around the bottom of the inner wall of the heat sink frame.

[0008] The top of the mounting plate is provided with a spring-driven assembly that is connected to the heat sink.

[0009] Mounting feet are provided around the perimeter of the heat sink frame;

[0010] The heat dissipation frame is evenly provided with heat dissipation fins around its perimeter.

[0011] As a preferred embodiment of the low thermal resistance thermal grease element of this utility model, pressure rods are provided on both sides of the heat sink, and the pressure rods extend to the outside of the heat sink frame.

[0012] As a preferred embodiment of the low thermal resistance thermal grease element of this utility model, the heat dissipation frame is provided with through grooves on both sides that are slidably connected to the pressure rod.

[0013] In a preferred embodiment of the low thermal resistance thermal grease element described in this utility model, a sealing ring is provided on the top of the heat dissipation frame.

[0014] In a preferred embodiment of the low thermal resistance thermal grease element of this utility model, the top of the heat sink is provided with a sealing frame that fits against the inner wall of the heat sink frame.

[0015] In a preferred embodiment of the low thermal resistance thermal grease element of this utility model, the spring pushing assembly includes a spring, the bottom of the spring is provided with a bottom plate that is bonded to the mounting plate, and the top of the spring is provided with a top plate that is bonded to the bottom of the heat sink.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. By pressing down on the pressure rods on both sides, the heat sink is compressed downwards to push the spring component. Then, thermal grease is poured onto the top of the heat sink, so that the thermal grease is located inside the heat sink frame. At this time, the sealing ring is pressed against the heat-generating surface of the electronic component. The pressure rods can then be released, allowing the spring component to push the heat sink to move within the heat sink frame through the reset elastic force. This pushes the thermal grease to be evenly and tightly filled between the heat sink and the heat-generating surface of the electronic component, thus facilitating the even and stable application of thermal grease to the electronic component.

[0018] 2. By setting a sealing frame on the top outer ring of the heat sink, the gap between the heat sink and the heat sink frame can be sealed to prevent thermal grease from flowing out. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a low thermal resistance thermal grease element according to the present invention.

[0020] Figure 2 This is a cross-sectional view of the overall structure of a low thermal resistance thermal grease element according to this utility model.

[0021] In the diagram: 1. Thermal grease; 2. Heat sink; 3. Heat sink frame; 4. Mounting plate; 5. Mounting feet; 6. Heat sink fins; 7. Pressure rod; 8. Through groove; 9. Spring; 10. Base plate; 11. Top plate; 12. Sealing ring; 13. Sealing frame. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] As mentioned in the background section, existing thermal greases are difficult to apply. This invention proposes a low thermal resistance thermal grease element.

[0024] Example 1:

[0025] Reference Figures 1 to 2 A low thermal resistance thermal grease element includes thermal grease 1, which is applied to a heat sink 2.

[0026] The outer ring of the heat sink 2 is fitted with a heat sink frame 3, and the bottom of the inner wall of the heat sink frame 3 is provided with mounting plates 4.

[0027] The top of the mounting plate 4 is provided with a spring push assembly connected to the heat sink 2, and the spring push assembly is used to push the heat sink 2.

[0028] Mounting feet 5 are provided around the heat dissipation frame 3 to fix the heat dissipation frame 3.

[0029] Heat sinks 6 are evenly arranged around the heat sink frame 3 for heat dissipation.

[0030] Pressure rods 7 are provided on both sides of the heat sink 2, and the pressure rods 7 extend to the outside of the heat sink frame 3, so as to facilitate the movement of the heat sink 2 from the outside.

[0031] In order to enable the pressure rod 7 to be raised and lowered, through grooves 8 are provided on both sides of the heat dissipation frame 3 to be slidably connected to the pressure rod 7.

[0032] A sealing ring 12 is provided on the top of the heat sink frame 3 to better contact the electronic components and prevent the thermal grease 1 from leaving the heat sink frame 3. A sealing frame 13 is provided on the top of the heat sink plate 2 to fit against the inner wall of the heat sink frame 3, which can improve the sealing ability and prevent the thermal grease 1 from entering the gap between the heat sink plate 2 and the heat sink frame 3.

[0033] Example 2:

[0034] Reference Figures 1 to 2 The spring push assembly includes a high-elasticity spring 9, with a bottom plate 10 attached to the mounting plate 4 at the bottom of the spring 9 and a top plate 11 attached to the bottom of the heat sink 2 at the top of the spring 9. The adhesive method facilitates disassembly and assembly.

[0035] The rest of the structure is the same as in Example 1.

[0036] The user presses down on the pressure rods 7 on both sides to overcome the elastic force of the spring 9, causing the heat sink 2 to compress the spring 9 downwards. Then, the thermal grease 1 is poured onto the top of the heat sink 2, so that the thermal grease 1 is located inside the heat sink frame 3. At this time, the sealing ring 12 is pressed against the heating surface of the electronic component, and the pressure rods 7 can be released. The spring 9 pushes the heat sink 2 in the heat sink frame 3 towards the electronic component through the return elastic force. This allows the thermal grease 1 to be evenly and tightly filled between the heat sink 2 and the heating surface of the electronic component, thus facilitating the even and stable application of the thermal grease 1 on the electronic component.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A low thermal resistance, thermally conductive silicone grease element, characterized by: Include, The heat-conducting silicone grease (1) is applied on the heat dissipation plate (2); The outer ring of the heat dissipation plate (2) is connected with the heat dissipation frame (3), the inner wall of the heat dissipation frame (3) is provided with the mounting plate (4) around the bottom; The top of the mounting plate (4) is provided with the spring pushing assembly connected with the heat dissipation plate (2); The heat dissipation frame (3) is provided with the mounting foot (5) around; The heat dissipation frame (3) is provided with the heat dissipation fin (6) around.

2. A low thermal resistance thermally conductive silicone grease element according to claim 1, characterized in that: The both sides of the heat dissipation plate (2) are provided with the pressing rod (7), and the pressing rod (7) extends to the outside of the heat dissipation frame (3).

3. A low thermal resistance thermally conductive silicone grease element according to claim 2, characterized in that: The both sides of the heat dissipation frame (3) are provided with the through slot (8) slidably connected with the pressing rod (7).

4. A low thermal resistance thermally conductive silicone grease element according to claim 1, characterized in that: The top of the heat dissipation frame (3) is provided with the sealing ring (12).

5. A low thermal resistance thermally conductive silicone grease element according to claim 1, characterized in that: The top of the heat dissipation plate (2) is provided with the sealing frame (13) abutting with the inner wall of the heat dissipation frame (3).

6. A low thermal resistance thermally conductive silicone grease element according to claim 1, characterized in that: The spring pushing assembly comprises the spring (9), the bottom of the spring (9) is provided with the bottom plate (10) bonded on the mounting plate (4), and the top of the spring (9) is provided with the top plate (11) bonded on the bottom of the heat dissipation plate (2).

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