Welding tool jig for key chamber of semiconductor equipment

Abstract

The utility model relates to a welding tool jig for a key cavity of semiconductor equipment, and relates to the technical field of tool jigs. The device comprises a workbench, two groups of fixed columns are arranged on the surface of the workbench, telescopic pieces are arranged on the faces, close to each other, of the two fixed columns, piston rods of the two telescopic pieces are oppositely arranged, and clamping plates used for clamping a semiconductor are arranged at the ends of the piston rods of the telescopic pieces. According to the invention, the stability of the semiconductor key chamber during welding is improved, and the quality of semiconductor production is improved.

Description

Technical Field

[0001] This application relates to the field of tooling and fixture technology, and in particular to a welding tooling and fixture for key chambers of semiconductor equipment. Background Technology

[0002] Semiconductors are materials with electrical conductivity between that of insulators and conductors. Their conductivity is easily controlled, making them suitable as component materials for information processing. The quality requirements for semiconductor cavity welding are extremely high, necessitating the assurance of weld integrity, strength, and airtightness. Therefore, strict control of welding parameters, welding speed, and welding temperature is required during the welding process. Furthermore, rigorous inspection of the weld is necessary to ensure that the welding quality meets design requirements. However, current technologies for welding critical semiconductor cavities lack stable tooling fixtures, which cannot effectively maintain the stability of the semiconductor, thus affecting the production quality of the semiconductor. Therefore, improvements are needed. Utility Model Content

[0003] In order to improve the stability of semiconductor critical chamber welding and improve the quality of semiconductor production, this application provides a welding fixture for semiconductor equipment critical chambers.

[0004] This application provides a welding fixture for key chambers of semiconductor equipment, employing the following technical solution:

[0005] A welding fixture for a critical chamber of a semiconductor device includes a worktable. Two sets of fixed columns are provided on the surface of the worktable. Telescopic members are provided on the side of the two fixed columns that are close to each other. The piston rods of the two telescopic members are arranged facing each other. The end of the piston rod of the telescopic member is provided with a clamping plate for clamping the semiconductor.

[0006] By adopting the above technical solution, the semiconductor to be welded is placed on the surface of the workbench. The telescopic components on the two fixed columns drive the clamping plates to move closer to each other, thereby clamping the semiconductor equipment between the clamping plates on both sides, thus improving the stability of the semiconductor equipment during welding, and improving the subsequent welding quality and welding efficiency.

[0007] Optionally, both clamping plates have clearance grooves on their sides that are close to each other.

[0008] By adopting the above technical solution, the opening of the clearance groove can further improve the clamping tightness of the semiconductor equipment, reduce the probability of the semiconductor equipment falling off during the welding process, and improve the safety and stability of the welding process.

[0009] Optionally, the piston rod end of the telescopic component is provided with a mounting plate, and a rotating component is provided on the mounting plate, the output shaft of the rotating component being connected to the clamping plate.

[0010] By adopting the above technical solution, and setting up the mounting plate and rotating parts, it is convenient to drive the semiconductor equipment to rotate during the welding process, so that the staff can weld the inside of the semiconductor equipment from different angles, thereby improving the flexibility of the tooling fixture of this application.

[0011] Optionally, the output shaft of the rotating component is provided with a mounting flange on its peripheral wall, and the clamping plate is connected to the output shaft of the rotating component through the mounting flange.

[0012] By adopting the above technical solution, the installation flange is set to form a detachable connection between the clamping plate and the fixed column, so that the staff can replace the clamping plate with a relief groove that matches the semiconductor equipment according to different models of semiconductor equipment, so as to ensure the firmness of the clamping plate to the semiconductor equipment. Moreover, the installation flange connection method is simple and has high convenience.

[0013] Optionally, the fixed column includes a fixed end and a movable end. The fixed end is connected to the surface of the workbench, and the top wall of the fixed end is provided with an installation groove. A first lifting component is provided in the installation groove, and the piston rod of the first lifting component is connected to the movable end.

[0014] By adopting the above technical solution, the first lifting component can drive the movable end to rise and fall relative to the worktable, so as to prevent the semiconductor equipment from colliding with the worktable surface when the rotating component drives the semiconductor equipment to rotate and adjust, thereby protecting the structural safety of the semiconductor equipment and improving the stability and safety of the welding process.

[0015] Optionally, the worktable surface is provided with limiting posts for positioning the semiconductor chamber.

[0016] By adopting the above technical solution, during the welding process, the opening of the semiconductor equipment chamber is set downward, and the semiconductor equipment is sleeved on the limiting post through the chamber, which facilitates the rapid positioning of the semiconductor equipment, so that the clamping plates on both sides can clamp the semiconductor equipment more conveniently and accurately, thereby improving the accuracy and practicality of the tooling fixture of this application.

[0017] Optionally, the worktable has a drive cavity, and a second lifting component is provided in the drive cavity. The piston rod of the second lifting component is connected to the limiting post.

[0018] By adopting the above technical solution, after clamping the semiconductor equipment, the second lifting component can drive the limiting post into the driving cavity, thereby preventing the semiconductor equipment from colliding with the limiting post during rotation adjustment and improving the safety of the welding process.

[0019] Optionally, the limiting post includes a mounting base and a replacement part. The mounting base is connected to the piston rod of the second lifting component. The surface of the mounting base is provided with mounting studs, and the bottom wall of the replacement part is provided with mounting screw holes for the mounting studs to enter.

[0020] By adopting the above technical solution, mounting studs and mounting screw holes are set to form a detachable connection between the mounting base and the replacement part, so that the staff can replace the replacement part with one that matches the size of the chamber opening of the semiconductor equipment based on different models of semiconductor equipment, thereby ensuring more efficient and accurate positioning of the semiconductor equipment.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. Place the semiconductor to be soldered on the workbench surface. The telescopic components on the two fixed columns drive the clamping plates to move closer together, thereby clamping the semiconductor device between the clamping plates on both sides, thus improving the stability of the semiconductor device during soldering, and improving the subsequent soldering quality and soldering efficiency.

[0023] 2. The mounting plate and rotating parts are provided to facilitate the rotation of the semiconductor equipment during the welding process, so that the staff can weld the inside of the semiconductor equipment from different angles, which improves the flexibility of the tooling fixture of this application;

[0024] 3. During the welding process, the semiconductor equipment chamber opening is set downward, and the semiconductor equipment is sleeved on the limiting post through the chamber, which facilitates the rapid positioning of the semiconductor equipment, so that the clamping plates on both sides can clamp the semiconductor equipment more conveniently and accurately, thereby improving the accuracy and practicality of the tooling fixture of this application. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a welding fixture for a key chamber of a semiconductor device according to an embodiment of this application.

[0026] Figure 2 This is a cross-sectional view of the workbench in an embodiment of this application.

[0027] Figure 3 yes Figure 2 A magnified view of a portion of point A in the middle.

[0028] Explanation of reference numerals in the attached drawings: 1. Worktable; 11. Drive cavity; 12. Second lifting component; 2. Fixed column; 21. Fixed end; 22. Movable end; 23. Mounting groove; 24. First lifting component; 3. Telescopic component; 4. Clamping plate; 41. Clearance groove; 5. Mounting plate; 51. Rotating component; 52. Mounting flange; 6. Limiting post; 61. Mounting seat; 62. Replacement part; 63. Mounting stud; 64. Mounting screw hole. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0030] This application discloses a welding fixture for critical chambers in semiconductor equipment. (Refer to...) Figure 1 and Figure 2 The system includes a worktable 1 with a limiting post 6 on its surface for positioning the opening of the semiconductor device's chamber. The limiting post 6 includes a mounting base 61 and a replacement part 62. The mounting base 61 has a vertically arranged mounting stud 63 on its surface, and the bottom wall of the replacement part 62 has a mounting screw hole 64 for the mounting stud 63 to enter. In this embodiment, the replacement part 62 has several different sizes and models, which can be flexibly replaced based on the size of the chamber of different models of semiconductor devices. The worktable 1 has a drive cavity 11, and the drive cavity 11 has a second lifting member 12. The second lifting member 12 is a cylinder with a vertically arranged piston rod connected to the mounting base 61 to drive the limiting post 6 to move up and down. After the semiconductor device is positioned, the limiting post 6 is removed.

[0031] Reference Figure 1 and Figure 2 Two sets of fixed columns 2 are provided on the surface of the workbench 1. The limiting column 6 is located between the two fixed columns 2. The fixed column 2 includes a fixed end 21 and a movable end 22. The fixed end 21 is vertically connected to the surface of the workbench 1 by welding. The top wall of the fixed end 21 is provided with an installation groove 23. A second lifting component 12 is provided in the installation groove 23. In this embodiment, the second lifting component 12 is a cylinder. The piston rod of the second lifting component 12 is connected to the movable end 22 to drive the movable end 22 to move up and down relative to the workbench 1.

[0032] Reference Figure 2 and Figure 3 Both sides of the movable ends 22 are provided with telescopic components 3 on their adjacent sidewalls. In this embodiment, the telescopic component 3 is a cylinder with its piston rod horizontally arranged. The end of the piston rod of the telescopic component 3 is provided with a mounting plate 5. A rotating component 51 is provided inside the mounting plate 5. The rotating component 51 is a small motor. The output shaft of the rotating component 51 is provided with a mounting flange 52. A clamping plate 4 for clamping the semiconductor device housing is provided on the mounting flange 52. The clamping plates 4 are provided with clearance grooves 41 on their adjacent sides.

[0033] The implementation principle of a welding fixture for a key chamber of a semiconductor device according to an embodiment of this application is as follows: Based on the size and specifications of the semiconductor device chamber to be welded, a suitable replacement part 62 and clamping plate 4 are selected and installed. The opening of the semiconductor device chamber is placed downwards on the limiting post 6. The telescopic member 3 is activated to drive the clamping plates 4 on both sides to move closer to each other so that the semiconductor device enters the clearance groove 41. After positioning is completed, the second lifting member 12 is activated so that the limiting post 6 enters the driving cavity 11. Then, the first lifting member 24 is activated so that the movable end 22 rises. During the welding process, the opening direction of the semiconductor device chamber can be adjusted by the rotating member 51 to perform precise welding.

[0034] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A semiconductor equipment key chamber welding tooling fixture, characterized by: The utility model provides a semiconductor processing device, including workbench (1), workbench (1) surface is provided with two groups of fixed stand (2), two fixed stand (2) are provided with telescopic piece (3) on the side close to each other, the piston rod of two telescopic piece (3) is set to each other, the end of telescopic piece (3) piston rod is provided with the clamping plate (4) for clamping the semiconductor, the piston rod end of telescopic piece (3) is provided with mounting plate (5), be provided with rotating part (51) on mounting plate (5), the output shaft of rotating part (51) is connected with clamping plate (4), the output shaft of rotating part (51) is provided with mounting flange (52) on the wall, and clamping plate (4) is connected with the output shaft of rotating part (51) through mounting flange (52), workbench (1) surface is provided with the limiting post (6) for positioning the semiconductor cavity.

2. The semiconductor device critical chamber bonding tooling fixture of claim 1, wherein: Two clamping plates (4) are provided with a let go slot (41) on the side close to each other.

3. The semiconductor device critical chamber bonding tooling fixture of claim 1, wherein: The fixed stand (2) includes a fixed end (21) and a movable end (22), the fixed end (21) is connected to the surface of the workbench (1), the top wall of the fixed end (21) is provided with a mounting slot (23), the first lifting device (24) is arranged in the mounting slot (23), and the piston rod of the first lifting device (24) is connected with the movable end (22).

4. The semiconductor device critical chamber bonding tooling fixture of claim 1, wherein: The driving cavity (11) is arranged in the workbench (1), the second lifting device (12) is arranged in the driving cavity (11), and the piston rod of the second lifting device (12) is connected with the limiting post (6).

5. The semiconductor device critical chamber bonding tooling fixture of claim 4, wherein: The limiting post (6) includes a mounting seat (61) and a replacement part (62), the mounting seat (61) is connected with the piston rod of the second lifting device (12), the mounting seat (61) is provided with a mounting stud (63) on the surface, and the bottom wall of the replacement part (62) is provided with a mounting screw hole (64) for the mounting stud (63).

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