Frame positioning device for wafer pin ball bonding

Abstract

The utility model provides a frame positioning device for wafer pin ball bonding. The frame positioning device comprises a bottom plate and a pressing plate. A connecting block is arranged in the center of the lower surface of the bottom plate, and an air inlet is formed in the center of the connecting block; a supporting table is arranged in the center of the upper surface of the bottom plate, and a plurality of air holes are evenly formed in the supporting table and communicate with the air inlet. At least two supporting raised lines are arranged on the upper surface of the bottom plate and positioned on the two sides of the supporting table; a hollowed-out area is arranged at the position, right opposite to the supporting table, of the pressing plate, and a plurality of grids are evenly arranged on the hollowed-out area. Pressing strips are arranged at the positions, right opposite to the supporting protruding strips, of the pressing plate. Connecting blocks are arranged at the two ends of the upper surface of the pressing plate, and the pressing plate is connected with an external driving device through the connecting blocks. According to the utility model, the frame is effectively prevented from tilting in the wafer welding process, and the welding precision is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor chip processing, and specifically relates to a wafer pin ball welding frame positioning device. BACKGROUND

[0002] Wafer is a very important technology in the semiconductor packaging process, which relates to using fine metal wires (such as gold wires, copper wires or aluminum wires) to connect the electrode lead on the wafer surface with the external lead of the substrate or lead frame through heat, pressure and ultrasonic energy, realizing the electrical interconnection between the chip and the substrate and the information intercommunication between the chips.

[0003] At present, in the process of ball welding of wafer pins and lead wires on the frame, the frame is easily warped under the influence of high temperature welding, and once the frame is warped, the precision of wafer and frame welding will be affected, resulting in increased scrap rate.

[0004] In view of the above prior art, it is expected to provide a wafer pin ball welding frame positioning device. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a wafer pin ball welding frame positioning device, which effectively prevents the frame from warping during welding and ensures the precision of welding.

[0006] A wafer pin ball welding frame positioning device, comprising a bottom plate and a pressing plate;

[0007] The lower surface of the bottom plate has a connecting block at the center position, and the connecting block has an air inlet hole at the center position;

[0008] The upper surface of the bottom plate is provided with a support table at the center position, and the support table is uniformly provided with a plurality of air holes, and the plurality of air holes are in communication with the air inlet hole;

[0009] At least two support protrusions are arranged on both sides of the support table on the upper surface of the bottom plate;

[0010] The pressing plate is provided with a hollow area at a position opposite to the support table, and the hollow area is uniformly provided with a plurality of grid cells;

[0011] The pressing plate is provided with a pressing strip at a position opposite to the support protrusion;

[0012] The upper surface of the pressing plate has a connecting block at both ends, and the pressing plate is connected with an external driving device through the connecting block.

[0013] Specifically, the number of support protrusions is four.

[0014] Specifically, the connecting block is provided with a connecting protrusion on both sides.

[0015] Specifically, the upper surface of the bottom plate is provided with a guide-in chute at both ends.

[0016] Preferably, the pressing plate is provided with a mounting through hole at the position where the pressing strip is mounted, the pressing strip is an elastic pressing strip, and the pressing strip is fixed on the mounting through hole through a screw.

[0017] Compared with the prior art, the semiconductor chip mounting machine conveying device has the following advantages:

[0018] (1) By setting air holes on the bottom plate and connecting with external vacuum equipment, setting support protrusions on the upper surface of the bottom plate, and setting pressing strips on the pressing plate, the frame is effectively pressed to avoid warping, thereby ensuring the welding precision;

[0019] (2) Simple structure and convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The structure of the bottom plate in the embodiment is shown Figure 1 ;

[0021] Figure 2 The structure of the bottom plate in the embodiment is shown Figure 2 ;

[0022] Figure 3 The structure of the wafer pin ball welding frame positioning device in the embodiment is shown

[0023] Figure 4 The structure of the pressing plate in the embodiment is shown. DETAILED DESCRIPTION

[0024] The utility model is further described below in combination with the drawings and specific embodiments.

[0025] A wafer pin ball welding frame positioning device comprises a bottom plate 1 and a pressing plate 2.

[0026] As shown in Figure 1 and Figure 2 , the bottom plate 1 has a connecting block 3 at the center position of the lower surface, and the connecting block 3 has an air inlet hole 4 at the center position; the upper surface of the bottom plate 1 is provided with a support table 5 at the center position, and the support table 5 is uniformly provided with a plurality of air holes 6, and the plurality of air holes 6 are connected with the air inlet hole 4; the upper surface of the bottom plate 1 is provided with at least two support protrusions 7 on both sides of the support table 5. In the embodiment, the number of the support protrusions 7 is four.

[0027] In the embodiment, in order to facilitate the connection between the bottom plate 1 and the external vacuum equipment, the connecting block 3 is provided with connecting protrusions 8 on the front and rear sides.

[0028] In the embodiment, in order to facilitate the installation of the bottom plate 1 on the support platform, the upper surface of the bottom plate 1 is provided with a guide-in sliding groove 9 at both ends.

[0029] As shown in Figure 3 , the pressing plate 2 is provided with a hollow area 10 at a position opposite to the support table 5, and a plurality of sub-grid bars 11 are uniformly arranged on the hollow area 10 to separate the wafers on the frame; the pressing plate 2 is provided with a pressing strip 12 at a position opposite to the support convex strip 7; in this way, during the pressing of the pressing plate 2, the support convex strip 7 on the bottom plate 1 supports the frame, and the pressing strip 12 cooperates with the support convex strip 7 to press the chip frame, so as to avoid the chip frame from being warped.

[0030] In the embodiment, as shown in Figure 3 and Figure 4 , the pressing plate 2 is provided with a mounting through hole 13 at a position where the pressing strip 12 is mounted, the pressing strip 12 is an elastic pressing strip, and the pressing strip 12 is fixed on the mounting through hole 13 through a screw; in this way, on the one hand, detachable connection is realized, which is convenient for subsequent maintenance and replacement, and on the other hand, the pressing strip 12 has a certain elasticity, which plays a buffering role and avoids damaging the frame.

[0031] Both ends of the upper surface of the pressing plate 2 have a connecting block 14, and the pressing plate 2 is connected with an external driving device through the connecting block 14.

[0032] When the frame positioning device works, the pressing plate is fixed on an external platform, the air inlet hole of the connecting block is connected with a vacuumizing equipment, the vacuumizing equipment is started, the frame is sucked and preliminarily positioned, the external driving device is started, the pressing plate is pressed down, the sub-grid bars on the hollow area are matched with the wafers on the frame, and the pressing strip cooperates with the support convex strip to press the chip frame, so as to avoid the chip frame from being warped.

[0033] Although the embodiments of the utility model have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and cannot be understood as limiting the utility model, and the ordinary skilled in the art can change, modify, replace and transform the above-mentioned embodiments within the scope of the utility model.

Claims

1. A frame positioning device for chip lead ball bonding, characterized in that, Includes base plate and pressure plate; The bottom surface of the base plate has a connecting block at its center, and the connecting block has an air inlet at its center. A support platform is provided at the center of the upper surface of the base plate, and a plurality of air holes are evenly provided on the support platform, and the plurality of air holes are connected to the air inlet. The upper surface of the base plate is provided with at least two support ridges on both sides of the support platform; The pressure plate has a hollow area at the position opposite the support platform, and the hollow area is evenly provided with several grids. Each pressure plate is provided with a pressure strip at a position directly opposite the support protrusion; The pressure plate has connecting blocks at both ends of its upper surface, and the pressure plate is connected to an external driving device through the connecting blocks.

2. The frame positioning device for chip lead ball bonding as described in claim 1, characterized in that, The number of supporting protrusions is four.

3. The frame positioning device for chip lead ball bonding as described in claim 1, characterized in that, The connecting block has connecting protrusions on both the front and rear sides.

4. The frame positioning device for chip lead ball bonding as described in claim 1, characterized in that, The upper surface of the base plate is provided with guide grooves at both ends.

5. A frame positioning device for chip lead ball bonding as described in any one of claims 1 to 4, characterized in that, The pressure plate has a mounting through hole at the position where the pressure strip is installed. The pressure strip is an elastic pressure strip and is fixed to the mounting through hole by screws.

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