Semiconductor wafer electroplating bath

Abstract

The utility model provides a semiconductor wafer electroplating bath, which relates to the technical field of electroplating baths, and comprises an electroplating bath body, the inner side of one end of an inner cavity of the electroplating bath body is fixedly connected with a partition plate, one end of the inner cavity of the electroplating bath body is provided with a diversion trench I, and the other end of the inner cavity of the electroplating bath body is provided with a diversion trench II. Deionized water is added into the inner cavity of the blending tank, the motor is started through the external controller, metal salt and other additives are added into the blending tank, the metal salt and the other additives are dissolved, the pump is started through the external controller to be pumped into the electroplating tank, and therefore the situation that the metal salt is directly poured into electroplating liquid to cause precipitation, and the electroplating effect is affected is avoided. The inner threaded cover is rotated, the inner threaded cover and the gasket are taken down, the filter pipe is extracted from the inner cavity of the outer threaded pipe, and then the surface of the filter pipe is cleaned, so that the filter pipe blocking substances insoluble in the electroplating liquid is conveniently cleaned, and the normal use of the electroplating bath is prevented from being influenced.

Description

Technical Field

[0001] This utility model relates to the field of electroplating tank technology, and in particular to a semiconductor wafer electroplating tank. Background Technology

[0002] Electroplating refers to the process of depositing a metal or alloy layer on the surface of a conductive material by using an external direct current (DC) to perform an electrolytic reaction in a solution. During electroplating, the anode of an electrode is connected to the electroplating solution, and the cathode is connected to the conductive workpiece. When current is applied, positively charged cations in the solution move towards the cathode, undergoing reduction on the surface of the workpiece and forming an electroplated layer. In typical wafer electroplating processes, the wafer is clamped in a wafer jig, and a robotic arm moves the jig into the electroplating tank for electroplating.

[0003] However, in the existing technology, it has been found that when using an electroplating tank to electroplat semiconductor wafers, the metal ion density in the electroplating solution decreases due to prolonged use, resulting in a thinner plating layer. In some cases, metal salts are directly added to the electroplating tank to replenish metal ions, which may lead to precipitation and affect the electroplating effect. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor wafer electroplating tank, comprising: an electroplating tank body, a partition plate fixedly connected to the inner side of one end of the inner cavity of the electroplating tank body, a first guide channel provided at one end of the inner cavity of the electroplating tank body, a second guide channel provided at the other end of the inner cavity of the electroplating tank body, a T-shaped groove provided at the bottom of the other end of the inner cavity of the electroplating tank body, the T-shaped groove communicating with the inner cavity of the second guide channel, an externally threaded pipe fixedly connected to the inner cavity of the T-shaped groove, the externally threaded pipe communicating with the inner cavity of the second guide channel, a stirring assembly provided at the top of one side of the partition plate and at one end of the inner cavity of the electroplating tank body, and a convenient cleaning filter assembly provided on the surface of the inner cavity of the second guide channel.

[0006] Furthermore, a drain pipe is fixedly embedded at the bottom of one end of the electroplating tank body, and the drain pipe communicates with the inner cavity of the guide channel. A drain pipe is fixedly embedded at the bottom of the other end of the electroplating tank body, and the drain pipe communicates with the inner cavity of the guide channel. An electrically controlled valve is installed at the other end of the inner cavity of the drain pipe and an electrically controlled valve is installed at the other end of the inner cavity of the drain pipe.

[0007] Furthermore, the stirring assembly includes a support plate, a motor plate is fixedly connected to the top of the support plate, a rotating shaft is embedded in the inside of the support plate through a bearing, a plurality of stirring blades are fixedly connected to the surface of the rotating shaft, a motor is connected to the top of the rotating shaft, the output end of the motor is fixedly connected to the center of the top of the rotating shaft, and the surface of the motor is fixedly connected to one side of the motor plate.

[0008] Furthermore, the convenient cleaning filter assembly includes a pump, the output end of which is fixedly connected to an infusion tube, and the input end of which is fixedly fitted with a support plate two. Multiple connecting rods are fixedly connected to the top and one side of one side of the support plate two, and a fixing pipe is fixedly connected to one side of the support plate two. The fixing pipe communicates with the inner cavity of the input end of the pump.

[0009] Furthermore, a washer and a filter tube are movably fitted onto the surface of the fixed tube. One side of the washer is movably attached to one side of the support plate, one end of the filter tube is movably attached to the other side of the washer, and a gasket is movably attached to the other end of the filter tube. An internal threaded cap is movably attached to the other side of the gasket.

[0010] Furthermore, the two ends of the support plate are fixedly connected to the top of one side of the partition and one end of the inner cavity of the electroplating tank.

[0011] Furthermore, the inner thread of the inner threaded cap is threaded onto the surface of the outer threaded tube, the surface of the other end of the filter tube is movably fitted into the T-groove and the inner cavity of the outer threaded tube, one side of the gasket is movably fitted into one end of the outer threaded tube, the bottom of the pump is fixedly connected to the surface of the inner cavity of the second guide channel, the bottom of the second support plate is fixedly connected to the surface of the inner cavity of the second guide channel, the other side of the second support plate is fixedly connected to the surface of the partition, the other ends of the multiple connecting rods are fixedly connected to the surface of the inner cavity of the electroplating tank body, the other end of the infusion tube is located at the top of the other end of the inner cavity of the electroplating tank body, and the bottom of the top end of the infusion tube is fixedly connected to the top of the partition.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0013] 1. In this utility model, deionized water is added to the inner cavity of the mixing tank, and the motor is started by an external controller to add metal salts and other additives to the mixing tank. The metal salts and other additives dissolve, and the pump is started by an external controller to pump them into the electroplating tank. This design avoids the precipitation caused by directly pouring metal salts into the electroplating solution, which would affect the electroplating effect.

[0014] 2. In this utility model, the inner thread cover is rotated, the inner thread cover and gasket are removed, and the filter tube is pulled out from the inner cavity of the outer thread tube. Then the surface of the filter tube is cleaned. This design facilitates the cleaning of the filter tube that blocks substances that are insoluble in the electroplating solution, preventing it from affecting the normal use of the electroplating tank. Attached Figure Description

[0015] Figure 1 This utility model provides an overview structural diagram of a semiconductor wafer electroplating tank.

[0016] Figure 2 A partial exploded view of a semiconductor wafer electroplating tank provided for this utility model;

[0017] Figure 3 A front sectional view of a semiconductor wafer electroplating tank provided by this utility model;

[0018] Figure 4 A side cross-sectional view of a convenient cleaning and filtering assembly for a semiconductor wafer electroplating tank provided by this utility model;

[0019] Figure 5 A schematic diagram of point A in a semiconductor wafer electroplating tank provided by this utility model;

[0020] Figure 6 This is a schematic diagram of point B in a semiconductor wafer electroplating tank provided by this utility model.

[0021] Legend:

[0022] 1. Electroplating tank body; 101. Partition plate; 102. Flow guide channel one; 103. Drain pipe one; 104. Electrically controlled valve one; 105. Flow guide channel two; 106. Drain pipe two; 107. Electrically controlled valve two; 108. T-slot; 109. Externally threaded pipe; 2. Stirring assembly; 201. Support plate one; 202. Motor plate; 203. Rotating shaft; 204. Stirring blade; 205. Motor; 3. Easy-to-clean filter assembly; 301. Pump; 302. Infusion pipe; 303. Support plate two; 304. Connecting rod; 305. Fixing pipe; 306. Washer; 307. Filter pipe; 308. Gasket; 309. Internally threaded cap. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-6This utility model provides a technical solution: a semiconductor wafer electroplating tank, comprising: an electroplating tank body 1, a partition 101 fixedly connected to the inner side of one end of the inner cavity of the electroplating tank body 1, a first guide channel 102 opened at one end of the inner cavity of the electroplating tank body 1, a second guide channel 105 opened at the other end of the inner cavity of the electroplating tank body 1, a T-shaped groove 108 opened at the bottom of the other end of the inner cavity of the electroplating tank body 1, the T-shaped groove 108 communicating with the inner cavity of the second guide channel 105, an external threaded pipe 109 fixedly connected to the inner cavity of the T-shaped groove 108, the external threaded pipe 109 communicating with the inner cavity of the second guide channel 105, a stirring assembly 2 provided at the top of one side of the partition 101 and one end of the inner cavity of the electroplating tank body 1, and a convenient cleaning filter assembly 3 provided on the surface of the inner cavity of the second guide channel 105.

[0025] Specifically: Deionized water is added to the inner cavity of the mixing tank. The motor 205 is started by the external controller, and metal salts and other additives are added to the mixing tank. The metal salts and other additives dissolve, and the pump 301 is started by the external controller to pump them into the electroplating tank. This design avoids the direct pouring of metal salts into the electroplating solution, which would cause precipitation and affect the electroplating effect. The inner threaded cover 309 is rotated, and the inner threaded cover 309 and gasket 308 are removed. The filter tube 307 is then pulled out from the inner cavity of the outer threaded tube 109. The surface of the filter tube 307 is then cleaned. This design facilitates the cleaning of the filter tube 307, which blocks substances that are insoluble in the electroplating solution, and prevents it from affecting the normal use of the electroplating tank.

[0026] In one embodiment, a drain pipe 103 is fixedly embedded at the bottom of one end of the electroplating tank body 1, and the drain pipe 103 communicates with the inner cavity of the guide channel 102. A drain pipe 2 106 is fixedly embedded at the bottom of the other end of the electroplating tank body 1, and the drain pipe 2 106 communicates with the inner cavity of the guide channel 2 105. An electrically controlled valve 104 is installed at the other end of the inner cavity of the drain pipe 103, and an electrically controlled valve 2 107 is installed at the other end of the inner cavity of the drain pipe 2 106.

[0027] Specifically, such as Figure 2-4 As shown: The heavily contaminated waste liquid inside the electroplating tank can be discharged by opening the electric control valve 104 through the external controller; the heavily contaminated waste liquid inside the mixing tank can be discharged by opening the electric control valve 107 through the external controller.

[0028] In one embodiment, the stirring assembly 2 includes a support plate 201, a motor plate 202 is fixedly connected to the top of the support plate 201, a rotating shaft 203 is installed inside the support plate 201 through a bearing, a plurality of stirring blades 204 are fixedly connected to the surface of the rotating shaft 203, a motor 205 is connected to the top of the rotating shaft 203, the output end of the motor 205 is fixedly connected to the center of the top of the rotating shaft 203, and the surface of the motor 205 is fixedly connected to one side of the motor plate 202.

[0029] Specifically, such as Figure 4 As shown: The motor 205 is fixed to the surface of the motor plate 202 to prevent the motor 205 from shaking during operation and affecting the normal use of the electroplating tank.

[0030] In one embodiment, the easy-clean filter assembly 3 includes a pump 301, an infusion tube 302 is fixedly connected to the output end of the pump 301, a support plate 303 is fixedly sleeved on the input end of the pump 301, a plurality of connecting rods 304 are fixedly connected to the top and one side of one side of the support plate 303, and a fixing pipe 305 is fixedly connected to one side of the support plate 303, the fixing pipe 305 communicating with the inner cavity of the input end of the pump 301.

[0031] Specifically, such as Figure 5-6 As shown: Pump 301 is a commonly used pump in the electroplating industry for drawing electroplating solution. It has the characteristics of corrosion resistance, acid and alkali resistance and leak prevention according to the usage requirements. The specific structure will not be described in detail here; connecting rod 304 protects filter tube 307.

[0032] In one embodiment, a washer 306 and a filter tube 307 are movably fitted on the surface of the fixed tube 305. One side of the washer 306 is movably attached to one side of the support plate 303, one end of the filter tube 307 is movably attached to the other side of the washer 306, and a gasket 308 is movably attached to the other end of the filter tube 307. An internal threaded cap 309 is movably attached to the other side of the gasket 308.

[0033] Specifically, such as Figure 6 As shown: Gasket 306 has properties such as corrosion resistance, acid and alkali resistance, and sealing, which meet the application requirements. Gasket 306 prevents electroplating solution from flowing out from the gap between filter tube 307 and support plate 303 without being filtered by filter tube 307.

[0034] In one embodiment, the two ends of the support plate 201 are fixedly connected to the top of one side of the partition 101 and one end of the inner cavity of the electroplating tank body 1.

[0035] Specifically, such as Figure 1 As shown: The two ends of the support plate 201 are fixedly connected to the inner cavity of the partition plate 101 and the electroplating tank body 1, which plays a role in fixing and supporting the stirring assembly 2.

[0036] In one embodiment, the inner thread of the inner threaded cap 309 is threaded onto the surface of the outer threaded tube 109, the other end of the filter tube 307 is movably fitted into the inner cavity of the T-groove 108 and the outer threaded tube 109, one side of the gasket 308 is movably fitted onto one end of the outer threaded tube 109, the bottom of the pump 301 is fixedly connected to the surface of the inner cavity of the second guide channel 105, the bottom of the second support plate 303 is fixedly connected to the surface of the inner cavity of the second guide channel 105, the other side of the second support plate 303 is fixedly connected to the surface of the partition 101, the other end of the multiple connecting rods 304 is fixedly connected to the surface of the inner cavity of the electroplating tank body 1, the other end of the infusion tube 302 is located at the top of the other end of the inner cavity of the electroplating tank body 1, and the bottom of the top end of the infusion tube 302 is fixedly connected to the top of the partition 101.

[0037] Specifically, such as Figure 6 As shown: Gasket 308 has properties such as corrosion resistance, acid and alkali resistance, and sealing to meet the usage requirements. Gasket 308 prevents electroplating solution from flowing out from the gap between gasket 308 and external threaded tube 109. The top end of infusion tube 302 is fixedly connected to the top of partition 101, which plays a role in fixing and supporting infusion tube 302.

[0038] Working principle: Connect this device to an external power supply device, which provides power to the electrically controlled valve 104, electrically controlled valve 207, motor 205 and pump 301. The external controller is associated with and controls electrically controlled valve 104, electrically controlled valve 207, motor 205 and pump 301. In the initial state, electrically controlled valve 104 and electrically controlled valve 207 are in the closed state.

[0039] The partition 101 divides the inner cavity of the electroplating tank body 1 into two parts: one part is the electroplating tank, and the other part is the electroplating solution preparation tank. The pump 301 is installed at the bottom of the inner cavity of the preparation tank. First, deionized water is added to the inner cavity of the preparation tank. Then, the motor 205 is started by the external controller. The output end of the motor 205 drives the rotating shaft 203 to rotate. The rotating shaft 203 drives the stirring blade 204 to rotate. Then, metal salts and other additives are added to the preparation tank in sequence. Under the stirring action of the stirring blade 204, the metal salts and other additives dissolve. Finally, the pump 301 is started by the external controller. The pump 301 filters the prepared electroplating solution through the filter tube 307 and then pumps it into the electroplating tank through the delivery tube 302.

[0040] This design avoids the precipitation caused by directly pouring metal salts into the electroplating solution, which would affect the electroplating effect.

[0041] The filter tube 307 prevents substances insoluble in the electroplating solution from entering the electroplating tank. Over time, these substances will adhere to the surface of the filter tube 307, affecting the pumping capacity of the pump 301. When there is no liquid in the mixing tank, rotate the inner threaded cover 309, remove the inner threaded cover 309 and the gasket 308 in sequence, and pull out the filter tube 307 from the inner cavity of the outer threaded tube 109. Then clean the surface of the filter tube 307. The installation can be completed by reversing the operation.

[0042] This design facilitates the cleaning of the filter tube 307, which blocks substances insoluble in the electroplating solution, preventing any impact on the normal use of the electroplating tank.

[0043] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A semiconductor wafer electroplating cell, characterized by, Include: The electroplating tank body (1), the inner side of one end of the inner cavity of the electroplating tank body (1) is fixedly connected with a partition plate (101), a guide groove (102) is arranged at one end of the inner cavity of the electroplating tank body (1), a guide groove (105) is arranged at the other end of the inner cavity of the electroplating tank body (1), a T-shaped groove (108) is arranged at the bottom of the other end of the inner cavity of the electroplating tank body (1), the inner cavity of the T-shaped groove (108) is in communication with the inner cavity of the guide groove (105), an external thread pipe (109) is fixedly connected with the inner cavity of the T-shaped groove (108), the inner cavity of the external thread pipe (109) is in communication with the inner cavity of the guide groove (105), a stirring assembly (2) is arranged at the top of one side of the partition plate (101) and one end of the inner cavity of the electroplating tank body (1), and a convenient cleaning and filtering assembly (3) is arranged on the surface of the inner cavity of the guide groove (105).

2. The semiconductor wafer electroplating cell of claim 1, wherein: The bottom of one end of one side of the electroplating tank body (1) is fixedly embedded with a drain pipe (103), the inner cavity of the drain pipe (103) is in communication with the inner cavity of the guide groove (102), the bottom of the other end of one side of the electroplating tank body (1) is fixedly embedded with a drain pipe (106), the inner cavity of the drain pipe (106) is in communication with the inner cavity of the guide groove (105), an electric control valve (104) is embedded and installed at the other end of the inner cavity of the drain pipe (103), and an electric control valve (107) is embedded and installed at the other end of the inner cavity of the drain pipe (106).

3. The semiconductor wafer electroplating cell of claim 1, wherein: The stirring assembly (2) comprises a support plate (201), the top of the support plate (201) is fixedly connected with a motor plate (202), a rotating shaft (203) is embedded and installed in the support plate (201) through a bearing, a plurality of stirring blades (204) are fixedly connected with the surface of the rotating shaft (203), the top end of the rotating shaft (203) is connected with a motor (205), the output end of the motor (205) is fixedly connected at the center of the top end of the rotating shaft (203), and the surface of the motor (205) is fixedly connected on one side of the motor plate (202).

4. The semiconductor wafer electroplating cell of claim 1, wherein: The convenient cleaning and filtering assembly (3) comprises a pump (301), the output end of the pump (301) is fixedly connected with a liquid delivery pipe (302), the input end of the pump (301) is fixedly sleeved with a support plate (303), a plurality of connecting rods (304) are fixedly connected with the top of one side and the side of the support plate (303), a fixed pipe (305) is fixedly connected with one side of the support plate (303), and the inner cavity of the input end of the pump (301) is in communication with the fixed pipe (305).

5. The semiconductor wafer electroplating cell of claim 4, wherein: The surface of the fixed pipe (305) is movably sleeved with a gasket (306) and a filter pipe (307), one side of the gasket (306) is movably attached to one side of the support plate (303), one end of the filter pipe (307) is movably attached to the other side of the gasket (306), the other end of the filter pipe (307) is movably attached with a gasket (308), and the other side of the gasket (308) is movably attached with an internal thread cover (309).

6. The semiconductor wafer electroplating cell of claim 3, wherein: Two ends of the support plate one (201) are fixedly connected to the top of one side of the partition plate (101) and one end of the inner cavity of the electroplating tank body (1).

7. The semiconductor wafer electroplating cell of claim 5, wherein: The inner cavity of the inner threaded cover (309) is threadedly sleeved on the surface of the outer threaded pipe (109), the surface of the other end of the filter pipe (307) is movably attached and embedded in the inner cavity of the T-shaped groove (108) and the outer threaded pipe (109), one side of the gasket (308) is movably attached to one end of the outer threaded pipe (109), the bottom of the pump (301) is fixedly connected to the surface of the inner cavity of the flow guide groove two (105), the bottom of the support plate two (303) is fixedly connected to the surface of the inner cavity of the flow guide groove two (105), the other side of the support plate two (303) is fixedly connected to the surface of the partition plate (101), the other ends of the plurality of connecting rods (304) are fixedly connected to the surface of the inner cavity of the electroplating tank body (1), the other end of the infusion pipe (302) is located at the top of the other end of the inner cavity of the electroplating tank body (1), and the bottom of the top end of the infusion pipe (302) is fixedly connected to the top of the partition plate (101).

Images