Heater for heating semiconductor

Abstract

The utility model relates to the technical field of semiconductor preparation, and discloses a heater for heating a semiconductor, which comprises a heater upper cover plate, a D-shaped heating pipe and a heater lower cover plate, and is characterized in that the heater upper cover plate is provided with a D-shaped groove; the D-shaped heating pipe is installed in the D-shaped groove and matched with the D-shaped groove, and the D-shaped heating pipe comprises a shell, a heating wire arranged in the shell and a filling medium filled between the shell and the heating wire; the heater lower cover plate is fixedly connected to the heater upper cover plate, and the D-shaped heating pipe is packaged between the heater upper cover plate and the heater lower cover plate through the heater upper cover plate and the heater lower cover plate. According to the heater for heating the semiconductor, the D-shaped groove and the D-shaped heating pipe are matched with each other, so that the contact area between the D-shaped groove and the D-shaped heating pipe can be increased, the D-shaped heating pipe and the D-shaped groove can be tightly attached, and the efficiency of heating a device to be manufactured by the heater can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor fabrication technology, and in particular to a heater for heating semiconductors. Background Technology

[0002] With the development of semiconductor-related technologies, the manufacturing processes of semiconductor devices and chips are also rapidly evolving. In the manufacturing process of semiconductor devices, heaters are typically used. The device to be manufactured is placed on the heater, which then heats it uniformly to meet the temperature requirements of the manufacturing process. A heater generally includes an upper cover plate, a lower cover plate, and heating wires positioned between the upper and lower cover plates. In use, the device to be manufactured is placed on the upper cover plate, which transfers the heat generated by the heating wires to the device. However, due to the small contact area between the heating wires and the upper cover plate, and the insufficient tightness of the fit between them, the efficiency of the heater in heating the device is affected.

[0003] Therefore, there is an urgent need for a heater for semiconductor heating to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to provide a heater for semiconductor heating, which can solve the problem that the contact area between the heating wire and the upper cover plate is small and the fit between the heating wire and the upper cover plate is not tight enough, resulting in a slow heat transfer from the heating wire to the upper cover plate, thus affecting the efficiency of the heater in heating the device to be manufactured.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A heater for heating semiconductors, comprising,

[0007] The heater's upper cover plate has a D-shaped groove;

[0008] A D-shaped heating tube is installed in the D-shaped groove and matches the D-shaped groove. The D-shaped heating tube includes a housing, a heating wire disposed inside the housing, and a filling medium filled between the housing and the heating wire.

[0009] The heater lower cover plate is fixedly connected to the heater upper cover plate. The opening of the D-shaped groove faces the heater lower cover plate, and the curved part of the D-shaped groove is away from the heater lower cover plate. The heater upper cover plate and the heater lower cover plate encapsulate the D-shaped heating tube between the heater upper cover plate and the heater lower cover plate.

[0010] As an alternative, the arcuate surface of the D-shaped groove is away from the lower cover plate of the heater, and the surface of the lower cover plate adjacent to the D-shaped groove is a plane.

[0011] As an alternative, the filling medium is magnesium oxide powder.

[0012] As an alternative, the housing is made of aluminum.

[0013] As an alternative, a mounting post is also included, which is connected to the lower cover plate of the heater and is used to securely mount the heater for semiconductor heating onto other equipment.

[0014] As an alternative, the mounting post is provided with a wire hole, and the D-shaped heating tube is electrically connected to the power supply by a wire, with at least a portion of the wire passing through the wire hole.

[0015] As an optional solution, the heater cover plate has a first gas flow channel on the surface opposite to the D-shaped groove, and the mounting column has a second gas flow channel. One end of the second gas flow channel is connected to the first gas flow channel, and the other end of the second gas flow channel is connected to a negative pressure source.

[0016] As an alternative, the end of the mounting post away from the lower cover plate of the heater is provided with a mounting hole, which is used to fix the mounting post to other equipment.

[0017] This utility model has at least the following beneficial effects:

[0018] In the heater for semiconductor heating provided by this utility model, the D-shaped groove and the D-shaped heating tube cooperate to increase the contact area between the two and enable the D-shaped heating tube and the D-shaped groove to fit tightly together, thereby improving the heating efficiency of the heater of this application for heating the device to be manufactured. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments of this utility model will be briefly introduced below.

[0020] Figure 1 A schematic diagram of the structure of a heater for semiconductor heating provided in an embodiment of this utility model;

[0021] Figure 2 A schematic diagram of the structure of a heater for semiconductor heating provided in an embodiment of this utility model from another angle;

[0022] Figure 3A cross-sectional view of a heater for semiconductor heating provided in an embodiment of this utility model;

[0023] Figure 4 for Figure 3 A magnified view of part A in the middle.

[0024] Figure label:

[0025] 1. Heater upper cover plate; 11. First gas flow channel; 2. Heater lower cover plate; 3. Mounting column; 31. Wire hole; 32. Second gas flow channel; 33. Mounting hole; 4. Wire; 5. D-shaped heating tube. Detailed Implementation

[0026] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0027] In the prior art, a heater generally includes an upper cover plate, a lower cover plate, and a heating wire disposed between the upper and lower cover plates. During use, the device to be manufactured is placed on the upper cover plate, and the upper cover plate transfers the heat generated by the heating wire to the device. However, because the contact area between the heating wire and the upper cover plate is small, and the fit between the heating wire and the upper cover plate is not tight enough, the efficiency of the heater in heating the device to be manufactured is affected.

[0028] Therefore, such as Figures 1 to 4 As shown, an embodiment of this utility model provides a heater for semiconductor heating to solve the above-mentioned technical problems.

[0029] Specifically, a heater for heating semiconductors includes an upper heater cover plate 1, a D-shaped heating tube 5, and a lower heater cover plate 2. The upper heater cover plate 1 has a D-shaped groove. The D-shaped heating tube 5 is installed within the D-shaped groove, and the shape of the D-shaped heating tube 5 matches the shape of the D-shaped groove. The D-shaped heating tube 5 includes a housing, a heating wire disposed inside the housing, and a filling medium filling the space between the housing and the heating wire. The lower heater cover plate 2 is fixedly connected to the upper heater cover plate 1. The opening of the D-shaped groove faces the lower heater cover plate 2, and the curved portion of the D-shaped groove is away from the lower heater cover plate 2. The upper heater cover plate 1 and the lower heater cover plate 2 encapsulate the D-shaped heating tube 5 between them. The interaction between the D-shaped groove and the D-shaped heating tube 5 increases the contact area between them and allows the D-shaped heating tube 5 to fit tightly against the D-shaped groove, thereby improving the efficiency of the heater in heating the device to be manufactured.

[0030] In some embodiments, in order to ensure a tight fit between the D-shaped heating tube 5 and the D-shaped groove, the arcuate surface of the D-shaped groove is away from the lower heater cover plate 2, and the surface of the lower heater cover plate 2 adjacent to the D-shaped groove is flat. When the lower heater cover plate 2 is connected to the upper heater cover plate 1, the lower heater cover plate 2 at least partially abuts against the D-shaped heating tube 5. The connection between the lower heater cover plate 2 and the upper heater cover plate 1 can be achieved by welding the lower heater cover plate 2 and the upper heater cover plate 1 together, or by providing mounting holes on both the lower heater cover plate 2 and the upper heater cover plate 1, and fixing the lower heater cover plate 2 and the upper heater cover plate 1 together through the mounting holes and bolts.

[0031] In some embodiments, to improve the safety of the D-shaped heating tube 5, the filling medium is preferably magnesium oxide powder. Since magnesium oxide powder has a high thermal conductivity and good insulation and dielectric strength, it can ensure the safety of the D-shaped heating tube 5 without affecting the heat transfer efficiency of the D-shaped heating tube.

[0032] In some embodiments, in order to ensure that the D-shaped heating tube 5 fits tightly with the D-shaped groove, the housing is made of aluminum. When the lower cover plate 2 of the heater is connected to the upper cover plate 1 of the heater, the upper cover plate 1 of the heater can exert a force on the housing to deform the housing, thereby making the D-shaped heating tube 5 fit more tightly with the D-shaped groove.

[0033] In some embodiments, in order to facilitate the installation of the heater of this application on other devices, the heater of this application further includes a mounting post 3, which is connected to the lower cover plate 2 of the heater. The end of the mounting post 3 away from the lower cover plate 2 of the heater is provided with a mounting hole 33, which is used to fix the mounting post 3 on other devices.

[0034] In some embodiments, in order to facilitate the electrical connection of the D-shaped heating tube 5 to an external power source, a wire hole 31 is provided in the mounting post 3. When the D-shaped heating tube 5 is electrically connected to the external power source by a wire 4, the wire 4 is at least partially inserted into the wire hole 31.

[0035] In some embodiments, to facilitate fixing the device to be manufactured onto the heater cover plate 1, a first gas flow channel 11 is provided on the surface of the heater cover plate 1 opposite to the D-shaped groove, and a second gas flow channel 32 is provided on the mounting post 3. One end of the second gas flow channel 32 is connected to the first gas flow channel 11, and the other end of the second gas flow channel 32 is connected to a negative pressure source. When the device to be manufactured is placed on the heater cover plate 1, the device to be manufactured at least partially covers the first gas flow channel 11, thereby forming a relatively closed airflow channel. Under the action of the negative pressure source, a negative pressure is formed in the first gas flow channel 11. Due to the action of atmospheric pressure, the device to be manufactured can be fixed to the heater cover plate 1. The negative pressure source mentioned here can be a suction pump.

[0036] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A heater for semiconductor heating, characterized by, The utility model relates to a semiconductor heating device, including, The heater upper cover plate (1) is equipped with D-shaped recess; D-shaped heating pipe (5) is installed in the D-shaped recess and matches with the D-shaped recess, and the D-shaped heating pipe (5) includes shell, heating wire arranged in the shell interior, and filling medium filled between the shell and the heating wire; The heater lower cover plate (2) is fixedly connected on the heater upper cover plate (1), the opening of the D-shaped recess faces the heater lower cover plate (2), the curved surface part of the D-shaped recess is away from the heater lower cover plate (2), and the heater upper cover plate (1) and the heater lower cover plate (2) encapsulate the D-shaped heating pipe (5) between the heater upper cover plate (1) and the heater lower cover plate (2).

2. The heater for semiconductor heating according to claim 1, wherein The arc surface of the D-shaped recess is away from the heater lower cover plate (2), and the surface adjacent to the D-shaped recess of the heater lower cover plate (2) is a plane.

3. The heater for semiconductor heating according to claim 1, wherein The filling medium is magnesium oxide powder.

4. The heater for semiconductor heating according to claim 1, wherein The material of the shell is aluminum.

5. The heater for semiconductor heating according to any one of claims 1 to 4, wherein Further including mounting column (3), the mounting column (3) is connected with heater lower cover plate (2), and the mounting column (3) is used to fix the semiconductor heating heater and install on other equipment.

6. A heater for semiconductor heating according to claim 5, wherein The mounting column (3) is provided with wire hole (31), the D-shaped heating pipe (5) is electrically connected with power supply by wire (4), and the wire (4) is at least partially arranged in the wire hole (31).

7. The heater for semiconductor heating according to claim 5, wherein The first gas flow channel (11) is arranged on the surface of the heater upper cover plate (1) away from the D-shaped recess, the mounting column (3) is provided with second gas flow channel (32), one end of the second gas flow channel (32) is communicated with the first gas flow channel (11), and the other end of the second gas flow channel (32) is communicated with negative pressure source.

8. The heater for semiconductor heating according to claim 5, wherein The mounting hole (33) is arranged at the end of the mounting column (3) away from the heater lower cover plate (2), and the mounting hole (33) is used to fix the mounting column (3) on other equipment.

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