Novel double-sided circuit board

Abstract

The utility model relates to the technical field of double-sided circuit boards, in particular to a novel double-sided circuit board, which comprises a circuit board body, a connecting groove is arranged inside the circuit board body, mounting grooves are arranged at the top and the bottom of the circuit board body, and a first protection ring and a second protection ring are movably connected inside the mounting grooves. The second protection ring is sleeved with a rubber ring, the outer portion of the first protection ring is in threaded connection with the outer portion of the second protection ring, and cross-shaped grooves are formed in the end of the first protection ring and the end of the second protection ring. According to the utility model, through the arrangement of the first protection ring and the second protection ring, the service life of the circuit board is prolonged, through the opening in the circuit board body, the volume increase can be reduced to the greatest extent, the installation limitation is avoided, the circuit board body is convenient to install, and through the arrangement of the heat absorption sheet, the heat dissipation cover and the limiting screw, the heat dissipation efficiency is improved. And the heat dissipation effect of the heat dissipation cover is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of double-sided circuit board technology, and in particular to a novel double-sided circuit board. Background Technology

[0002] Currently, printed circuit boards (PCBs) provide electrical connections for electronic components. With the development of high technology, people need electronic products with high performance, small size, and multiple functions, which has prompted the manufacturing of printed circuit boards to develop towards being lighter, thinner, shorter, and smaller. In a limited space, more functions can be achieved, wiring density has increased, and aperture has become smaller.

[0003] Chinese utility model patent ZL202220871973.2 discloses a novel double-sided circuit board, comprising a circuit board body and heat dissipation rings clamped around the perimeter of the circuit board body. The circuit board body includes an upper heat-conducting layer and a lower heat-conducting layer arranged opposite each other, an upper circuit layer disposed above the upper heat-conducting layer, and a lower circuit layer disposed below the lower heat-conducting layer. A heat dissipation cavity is formed between the upper and lower heat-conducting layers and the inner wall of the heat dissipation rings. Multiple heat-absorbing fins are disposed in the heat dissipation cavity. Semiconductor cooling fins are symmetrically arranged on the left and right outer sides of the heat dissipation rings. The cooling end of the semiconductor cooling fin is adhered to the outer wall of the heat dissipation rings. One end of the heat-absorbing fin protrudes from the heat dissipation rings and connects to the cooling end of the semiconductor cooling fin. Multiple mounting holes are vertically formed on the heat dissipation rings. This utility model has good heat dissipation effect and a longer service life.

[0004] However, when the aforementioned double-sided circuit board is connected, it is connected to the outside through the mounting holes on the heat sink. Since the heat sink is added to the outside of the circuit board, it increases the volume of the circuit board, which restricts the installation of the circuit board. Therefore, a new type of double-sided circuit board is needed. Utility Model Content

[0005] In view of this, the present invention provides a novel double-sided circuit board, the main technical problem to be solved is that fixing the circuit board with screws can easily damage the circuit board.

[0006] To achieve the above objectives, this utility model adopts the following technical solution: A novel double-sided circuit board includes a circuit board body. A connecting groove is formed inside the circuit board body. Mounting grooves are formed at both the top and bottom of the circuit board body. A first protective ring and a second protective ring are movably connected inside the mounting grooves. A rubber ring is fitted around the outside of the second protective ring. The first and second protective rings are threadedly connected externally, with the bottom of the first protective ring fitting against the top of the rubber ring. A cross groove is formed at the ends of both the first and second protective rings. In use, the first and second protective rings are placed inside the connecting grooves. The first and second protective rings are rotated through the cross grooves, causing them to be threadedly connected. The rubber rings buffer the pressure generated during connection, preventing damage to the circuit board body and screws during connection, thus extending the service life of the circuit board.

[0007] As a further description of the above technical solution: the circuit board body includes two heat-absorbing sheets, a heat dissipation cavity is provided between the two heat-absorbing sheets, and a heat-conducting rod is fixedly connected between the two heat-absorbing sheets. The heat-conducting rod connects the two heat-absorbing sheets, thereby transferring heat from the inside of the circuit board body 1.

[0008] As a further description of the above technical solution: a first thermally conductive layer and a second thermally conductive layer are respectively provided at the top and bottom of the heat-absorbing sheet, and a first circuit layer is fixedly connected to the top of the first thermally conductive layer, and a second circuit layer is fixedly connected to the bottom of the second thermally conductive layer. The heat generated by the first circuit layer and the second thermally conductive layer is concentrated into the heat dissipation cavity using the first thermally conductive layer and the second thermally conductive layer.

[0009] As a further description of the above technical solution: The first circuit layer and the second circuit layer are fixedly connected to their side ends with protrusions. A heat dissipation cover is fitted over the protrusions, and a slot is formed inside the heat dissipation cover, with the protrusion located inside the slot. The protrusion engages with the slot, thereby limiting the position of the heat dissipation cover. The heat dissipation cover also protects the protrusions, preventing damage, and facilitates quick positioning of the heat dissipation cover.

[0010] As a further description of the above technical solution: a threaded hole is provided on the side surface of the heat-absorbing sheet, and a limiting screw is movably connected inside the heat dissipation cover, with the limiting screw connected to the internal thread of the threaded hole. During installation, the heat dissipation cover is fixed by connecting the limiting screw to the threaded hole.

[0011] As a further description of the above technical solution: a limiting groove is formed on the side surface of the heat-absorbing sheet, and a connecting rod is provided inside the heat dissipation cover, and the connecting rod engages with the inside of the limiting groove. Multiple limiting grooves are provided, which on the one hand facilitates the connection of the heat dissipation cover with the connecting rod, and on the other hand enhances the heat dissipation efficiency of the heat-absorbing sheet.

[0012] As a further description of the above technical solution: the outer surface of the heat sink cover is provided with heat dissipation grooves, and the number of heat dissipation grooves is set in multiple ways. By using multiple sets of heat dissipation grooves, the contact area between the heat sink cover and the outside air can be increased, thereby enhancing the heat dissipation effect.

[0013] As a further description of the above technical solution: Multiple heat-conducting rods are provided, and they are evenly distributed between two heat-absorbing plates. The heat-conducting rods can conduct the high temperature inside the heat dissipation cavity. During use, the heat dissipation cover is connected to the heat-absorbing plate using limiting screws, allowing the heat generated inside the circuit board to be transferred from the heat-absorbing plate through the heat-conducting rods, and the heat dissipation cover to dissipate the conducted heat.

[0014] By employing the above technical solution, the novel double-sided circuit board of this utility model has at least the following beneficial effects:

[0015] 1. Compared with the prior art, this novel double-sided circuit board, by setting a first protective ring and a second protective ring, allows the device to be used by placing the first and second protective rings into the connecting groove. The first and second protective rings are rotated through the cross groove, so that the first and second protective rings are threaded together. This reduces the damage to the circuit board when the circuit board body is connected to the screw, which helps to extend the service life of the circuit board. In addition, the opening inside the circuit board body can minimize the increase in volume and avoid installation restrictions, thus facilitating the installation of the circuit board body.

[0016] 2. Compared with the existing technology, this new type of double-sided circuit board, by setting heat-absorbing sheets, heat dissipation covers and limiting screws, connects the heat dissipation cover and heat-absorbing sheets with the limiting screws during use. This allows the heat generated inside the circuit board to be transferred from the heat-absorbing sheets through the heat-conducting rods. The heat dissipation cover dissipates the conducted heat, and the multiple sets of heat dissipation slots increase the contact area with the outside air, which helps to enhance the heat dissipation effect of the heat dissipation cover. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure proposed in this utility model;

[0018] Figure 2 This is a first-view schematic diagram of the internal structure proposed in this utility model;

[0019] Figure 3 The present utility model proposes Figure 2 Enlarged view of point A in the middle;

[0020] Figure 4 This is a second-view schematic diagram of the internal structure proposed in this utility model;

[0021] Figure 5 The present utility model proposes Figure 4 Enlarged view of section B in the middle.

[0022] Legend:

[0023] 1. Circuit board body; 101. Heat dissipation cavity; 102. Heat absorption sheet; 103. First heat-conducting layer; 104. Second heat-conducting layer; 105. First circuit layer; 106. Second circuit layer; 2. Connecting groove; 3. Mounting groove; 4. First protective ring; 5. Second protective ring; 6. Rubber ring; 7. Cross groove; 8. Protrusion; 9. Heat dissipation cover; 10. Threaded hole; 11. Limiting groove; 12. Slot; 13. Limiting screw. Detailed Implementation

[0024] Reference Figure 1-5 This utility model provides a novel double-sided circuit board, comprising a circuit board body 1, with a connecting groove 2 inside the circuit board body 1 for easy installation of a first protective ring 4 and a second protective ring 5, which fit snugly inside the connecting groove 2. Mounting grooves 3 are provided at the top and bottom of the circuit board body 1 for limiting the movement of the first protective ring 4 and the second protective ring 5. The first protective ring 4 and the second protective ring 5 are movably connected inside the mounting groove 3. A rubber ring 6 is fitted around the outside of the second protective ring 5. The first protective ring 4 and the second protective ring 5 are externally threaded together, with the bottom of the first protective ring 4 fitting snugly against the top of the rubber ring 6. The rubber ring 6 helps reduce friction between the first protective ring 4 and the second protective ring 5. A cross groove 7 is provided at the ends of both the first protective ring 4 and the second protective ring 5 for easy rotation. When the device is in use, the first protective ring 4 and the second protective ring 5 are placed inside the connecting groove 2. The first protective ring 4 and the second protective ring 5 are rotated through the cross groove 7, so that the first protective ring 4 and the second protective ring 5 are threaded together. This reduces the damage to the circuit board when the circuit board body 1 is connected to the screw, which helps to extend the service life of the circuit board. In addition, the opening inside the circuit board body 1 can minimize the increase in volume, avoid installation restrictions, and facilitate the installation of the circuit board body 1.

[0025] The circuit board body 1 includes two heat-absorbing sheets 102. A heat dissipation cavity 101 is provided between the two heat-absorbing sheets 102, and a heat-conducting rod is fixedly connected between the two heat-absorbing sheets 102. The heat-conducting rod connects the two heat-absorbing sheets 102, thereby transferring heat from the inside of the circuit board body 1.

[0026] A first thermally conductive layer 103 and a second thermally conductive layer 104 are respectively provided at the top and bottom of the heat-absorbing sheet 102. A first circuit layer 105 is fixedly connected to the top of the first thermally conductive layer 103, and a second circuit layer 106 is fixedly connected to the bottom of the second thermally conductive layer 104. The heat generated by the first circuit layer 105 and the second circuit layer 106 is concentrated into the heat dissipation cavity 101 by the first thermally conductive layer 103 and the second thermally conductive layer 104.

[0027] The first circuit layer 105 and the second circuit layer 106 are fixedly connected to the side ends of protrusions 8. A heat dissipation cover 9 is sleeved on the outside of the protrusions 8. A slot 12 is opened inside the heat dissipation cover 9, and the protrusions 8 are located inside the slot 12. The protrusions 8 are engaged with the slot 12 to limit the position of the heat dissipation cover 9.

[0028] The heat-absorbing fin 102 has a threaded hole 10 on its side surface. A limiting screw 13 is movably connected inside the heat sink 9, and the limiting screw 13 is threadedly connected to the threaded hole 10. During installation, the heat sink 9 is fixed by connecting the limiting screw 13 to the threaded hole 10.

[0029] The heat absorber 102 has a limiting groove 11 on its side surface, and the heat dissipation cover 9 has a connecting rod inside, which engages with the inside of the limiting groove 11. Multiple limiting grooves 11 are provided, which can facilitate the connection of the heat dissipation cover 9 with the connecting rod, and can also enhance the heat dissipation efficiency of the heat absorber 102.

[0030] The outer surface of the heat sink 9 is provided with heat dissipation grooves, and the number of heat dissipation grooves is set in multiple ways. By using multiple sets of heat dissipation grooves, the contact area between the heat sink 9 and the outside air can be increased, thereby enhancing the heat dissipation effect.

[0031] Multiple heat-conducting rods are provided and evenly distributed between the two heat-absorbing plates 102. The heat-conducting rods can be used to conduct the high temperature inside the heat dissipation cavity 101.

[0032] Working principle: When using the device, the first protective ring 4 and the second protective ring 5 are placed inside the connecting groove 2. The first protective ring 4 and the second protective ring 5 are rotated through the cross groove 7, so that the first protective ring 4 and the second protective ring 5 are threaded together. This reduces the damage to the circuit board when the circuit board body 1 is connected to the screw, which helps to extend the service life of the circuit board. The opening inside the circuit board body 1 can minimize the increase in volume and avoid installation restrictions, making it convenient to install the circuit board body 1. The heat sink 9 and the heat absorption plate 102 are connected by the limiting screw 13, so that the heat generated inside the circuit board body 1 is transferred from the heat sink 101 through the heat conduction rod to the heat absorption plate 102. The heat sink 9 dissipates the conducted heat, and the multiple heat sink grooves increase the contact area with the outside air, which helps to enhance the heat dissipation effect of the heat sink 9. When installing the circuit board body 1, the screw can be passed through the first protective ring 4 and the second protective ring 5, and the screw can be turned to fix the circuit board body 1 in the required installation position.

[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel double-sided circuit board comprising a circuit board body (1), characterized by: The inside of the circuit board body (1) is provided with a connecting groove (2), the top and bottom of the circuit board body (1) are provided with mounting grooves (3), the inside of the mounting grooves (3) is movably connected with first and second protective rings (4) and (5), the outside of the second protective ring (5) is sleeved with a rubber ring (6), the outside of the first and second protective rings (4) and (5) is threadedly connected, the bottom of the first protective ring (4) is attached to the top of the rubber ring (6), and the ends of the first and second protective rings (4) and (5) are provided with cross grooves (7).

2. A novel double-sided circuit board according to claim 1, characterized by: The circuit board body (1) comprises heat absorbing sheets (102), the number of the heat absorbing sheets (102) is two, a heat dissipation cavity (101) is arranged between the two heat absorbing sheets (102), and a heat conducting rod is fixedly connected between the two heat absorbing sheets (102).

3. A novel double-sided circuit board according to claim 2, characterized in that: The top and bottom of the heat absorbing sheet (102) are respectively provided with first and second heat conducting layers (103) and (104), the top of the first heat conducting layer (103) is fixedly connected with a first circuit layer (105), and the bottom of the second heat conducting layer (104) is fixedly connected with a second circuit layer (106).

4. The novel double-sided circuit board according to claim 3, characterized by: The side end of the first and second circuit layers (105) and (106) is fixedly connected with a protrusion (8), the outside of the protrusion (8) is sleeved with a heat dissipation cover (9), the inside of the heat dissipation cover (9) is provided with a clamping groove (12), and the protrusion (8) is located in the clamping groove (12).

5. A novel double-sided circuit board according to claim 4, characterized in that: The side surface of the heat absorbing sheet (102) is provided with a threaded hole (10), the inside of the heat dissipation cover (9) is movably connected with a limiting screw (13), and the limiting screw (13) is threadedly connected with the inside of the threaded hole (10).

6. A novel double-sided circuit board according to claim 5, characterized in that: The side surface of the heat absorbing sheet (102) is provided with a limiting groove (11), the inside of the heat dissipation cover (9) is provided with a connecting rod, and the connecting rod is engaged with the inside of the limiting groove (11).

7. A novel double-sided circuit board according to claim 6, characterized in that: The outer surface of the heat dissipation cover (9) is provided with a plurality of heat dissipation grooves.

8. A novel double-sided circuit board according to claim 2, characterized by: The number of the heat conducting rods is multiple, and they are evenly distributed between the two heat absorbing sheets (102).

Images