Charging device and charging pile
By partitioning the circuit board assembly and optimizing the heat dissipation structure, the problem of poor heat dissipation of the charging device under high power was solved, achieving a combination of portability and efficient heat dissipation, and ensuring the long-term efficient operation of the charging device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-04-10
AI Technical Summary
Existing charging devices tend to accumulate heat after increasing charging power, resulting in poor heat dissipation and affecting the portability and lifespan of the charging devices.
By dividing the circuit board into sections, the main heat-generating area is set to correspond to the main heat-dissipating area, and the secondary heat-generating area is set to correspond to the open cavity body. Heat dissipation is carried out using heat dissipation components with different heat dissipation effects. Combined with the design of the cooling fan and the outer shell, the heat dissipation airflow structure is optimized.
While ensuring the portability of the charging device, the heat dissipation efficiency is effectively improved, heat accumulation on the circuit board is avoided, and the charging device can output power efficiently for a long time.
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Figure CN224103897U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of charging equipment, in particular to a charging device and a charging pile. BACKGROUND
[0002] With the development of new energy vehicles, people's requirements for charging equipment are also constantly improving, and charging power and portability have become the primary demand for selecting and purchasing charging equipment. With the increase of charging power, the heat generated by the charging equipment itself will be more serious. If the heat generated by the charging equipment cannot be dissipated in time, the charging equipment will have a problem of heat accumulation, which will cause the charging power of the charging equipment to decrease significantly, and high temperature will also shorten the service life of the charging equipment.
[0003] Usually, in order to improve the heat dissipation effect of the charging equipment, the volume of the heat dissipation of the charging equipment is increased, but this will reduce the portability of the charging equipment. Therefore, on the basis of ensuring the portability of the charging equipment, it is urgent to improve the heat dissipation efficiency of the charging equipment. CONTENT OF THE INVENTION
[0004] In view of the above problems, the present application is proposed to solve the above problems or at least partially solve the above problems.
[0005] In an embodiment of the present application, a charging device is provided, comprising:
[0006] A bottom shell having a first face and a second face arranged opposite to each other, wherein the second face is provided with a heat dissipation assembly;
[0007] A circuit board group is arranged on the first face, and the board face of the circuit board group has a main heat generating area and a secondary heat generating area;
[0008] A top shell is connected to the first face of the bottom shell to form an inner cavity, and the circuit board group is located in the inner cavity;
[0009] Wherein, the first face has at least one recessed open cavity and at least one main heat dissipation area, the main heat generating area is arranged corresponding to the main heat dissipation area, and the secondary heat generating area is arranged corresponding to the open cavity;
[0010] The heat dissipation assembly comprises a first heat dissipation member and a second heat dissipation member, the first heat dissipation member is arranged corresponding to the main heat dissipation area, the second heat dissipation member is arranged corresponding to the second heat dissipation member, and the second surface heat dissipation area of the first heat dissipation member is greater than that of the second heat dissipation member.
[0011] Optionally, the depth of the first heat dissipation air duct formed by the first heat dissipation member is greater than the depth of the second heat dissipation air duct formed by the second heat dissipation member;
[0012] The first heat dissipation air duct is smoother than the second heat dissipation air duct.
[0013] Optionally, the first heat dissipation member and the second heat dissipation member are heat dissipation fins.
[0014] The first heat dissipation air duct and the second heat dissipation air duct are in a wave streamline shape.
[0015] Optionally, the main heat generating element is arranged on the main heat dissipation area, and the secondary heat generating element is arranged on the secondary heat dissipation area.
[0016] The main heat generating element is attached to the main heat dissipation area, and the secondary heat generating element is arranged in the open cavity.
[0017] Optionally, along the direction of the middle line of the bottom shell, the main heat dissipation area is located at the middle position of the bottom shell, and the two open cavities are located on the two sides of the main heat dissipation area.
[0018] Optionally, one side of the heat dissipation assembly is provided with a heat dissipation fan, and the air outlet direction of the heat dissipation fan is aligned with the first heat dissipation air duct and the second heat dissipation air duct.
[0019] Optionally, the circuit board group includes a plurality of circuit boards connected to each other, and the plurality of circuit boards are stacked in the inner cavity along the height direction of the charging device.
[0020] Optionally, an insulating sheet is arranged between the plurality of circuit boards, and the plurality of circuit boards are connected to the bottom shell by a support.
[0021] Optionally, one clamping groove is arranged on each side of the bottom shell, and an input wire harness and an output wire harness are fixed by the clamping grooves, respectively, and the input wire harness and the output wire harness are connected to one of the circuit boards in the circuit board group, respectively.
[0022] Optionally, the application further comprises an outer shell connected to the second surface of the bottom shell, and the heat dissipation assembly is arranged in the cavity formed by the outer shell and the bottom shell.
[0023] The outer shell is provided with a heat dissipation hole.
[0024] In another embodiment of the application, a charging pile is also provided, comprising:
[0025] a main body;
[0026] a charging device arranged on the main body, the charging device comprising:
[0027] a bottom shell having a first surface and a second surface arranged opposite to each other, and a heat dissipation assembly arranged on the second surface;
[0028] A circuit board set is arranged on the first surface, and a surface of the circuit board set has a main heat generating area and a secondary heat generating area;
[0029] A top shell is connected to the first surface of the bottom shell to form an inner cavity, and the circuit board set is located in the inner cavity;
[0030] The first surface has at least one concave open cavity and at least one main heat dissipation area, the main heat generating area is arranged corresponding to the main heat dissipation area, and the secondary heat generating area is arranged corresponding to the open cavity;
[0031] The heat dissipation assembly includes a first heat dissipation member and a second heat dissipation member, the first heat dissipation member is arranged corresponding to the main heat dissipation area, and the second heat dissipation member is arranged corresponding to the secondary heat dissipation area, and a second surface heat dissipation area of the first heat dissipation member is greater than a second surface heat dissipation area of the second heat dissipation member.
[0032] In the technical scheme of the embodiment of the present application, the surface of the circuit board set is divided into a main heat generating area and a secondary heat generating area, the main heat generating area is arranged corresponding to the main heat dissipation area, and the secondary heat generating area is arranged corresponding to the open cavity, the heat dissipation effect of the first heat dissipation member corresponding to the main heat generating area is better than that of the second heat dissipation member above the open cavity, so that in the case of a proper size of the charging device, the main heat generating area on the circuit board set can still be cooled in time, and the accumulation of heat on the circuit board is effectively avoided, and the output power of the charging device is affected. BRIEF DESCRIPTION OF DRAWINGS
[0033] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0034] Figure 1 An explosion schematic diagram of a charging device provided by the embodiment of the present application;
[0035] Figure 2 A first surface structure schematic diagram of a bottom shell provided by the embodiment of the present application;
[0036] Figure 3 A second surface structure schematic diagram of a bottom shell provided by the embodiment of the present application;
[0037] Figure 4 A sectional view of a bottom shell provided by the embodiment of the present application;
[0038] Figure 5 A structure schematic diagram of an outer shell provided by the embodiment of the present application;
[0039] Figure 6Part structure schematic diagram of a charging device provided by an embodiment of the present application.
[0040] Explanation of reference numerals:
[0041] Bottom shell 1, first face 11, second face 12; circuit board group 2, first circuit board 21, second circuit board 22, third circuit board 23, support stud 24; top shell 3, heat dissipation assembly 4, first heat dissipation piece 41, second heat dissipation piece 42; open cavity 5, main heat dissipation area 6, heat dissipation fan 7, metal bent bracket 71, fixing piece 72, fan fixing screw 73; insulating sheet 8, wire clamping groove 9, wire clamping ring 91, upper clamping ring 92, lower clamping ring 93, connecting screw 94; outer shell 10, heat dissipation hole 101; secondary heat generating element 14, input wire harness 15, circuit board fixing screw 16. DETAILED DESCRIPTION
[0042] In order for those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application.
[0043] The embodiments described in the present application are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application. The "comprising" mentioned in the specification and claims is an open-ended term, which should be interpreted as "comprising but not limited to". "Approximately" means that those skilled in the art can solve the technical problems within a certain error range and basically achieve the technical effects. In addition, in the embodiments of the present application, multiple means two or more. Those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of different embodiments or examples without contradicting each other. The "first", "second" and the like in this paper are used to distinguish different directions, structures, components, etc., not the order. In addition, the embodiments described below are only some of the embodiments of the present application, not all the embodiments.
[0044] With the development of new energy vehicles, people's requirements for charging equipment are also constantly improving, and charging power and portability have become the primary demand for purchasing charging equipment. Larger charging equipment can often obtain better heat dissipation performance, but larger charging equipment is not portable. If the charging equipment cannot timely dissipate the generated heat, the charging equipment cannot run for a long time after high temperature, and the load power of the charging equipment will be greatly discounted after a long time of work, so as to meet the user's use needs.
[0045] In order to solve the above technical problems as much as possible, seeFigures 1 to 3 In one embodiment of the present application, a charging device is provided, which comprises a bottom shell 1, a circuit board set 2 and a top shell 3.
[0046] The bottom shell 1 has a first face 11 and a second face 12 arranged oppositely, and the second face 12 is provided with a heat dissipation assembly 4. The heat generated by the electronic components inside the charging device during operation can be transferred to the bottom shell 1, and then exchanged with air through the heat dissipation assembly 4 to reduce the temperature. In general, in order to have better heat conduction effect, the bottom shell 1 is usually made of metal materials, such as aluminum alloy, brass, stainless steel, etc.
[0047] When the charging device is charging the device to be charged, one end of the charging device is connected to the power grid, and the other end is connected to the device to be charged, so as to convert high-voltage alternating current into high-voltage direct current or low-voltage direct current required by the charged device. And this process is mainly realized by various electronic components inside the charging device.
[0048] Generally, various electronic components are arranged on the circuit board set 2, and the circuit board set 2 is arranged on the first face 11 of the bottom shell 1. The board surface of the circuit board set 2 has a main heat generating area and a secondary heat generating area. The main heat generating area is mainly provided with main heat generating components, and this part of electronic components generates a relatively high amount of heat during operation. For reference, Figure 4 The secondary heat generating area is mainly provided with secondary heat generating components 14, and this part of electronic components generates a relatively low amount of heat during operation.
[0049] The number of main heat generating area and secondary heat generating area on the board surface of the circuit board set 2 can be one or more.
[0050] For reference, Figure 1 The top shell 3 is connected to the first face 11 of the bottom shell 1 to form an inner cavity, and the circuit board set 2 is located in the inner cavity. The top shell 3 and the bottom shell 1 are connected into one body, and the circuit board set 2 is located in the inner cavity formed by the two. In this way, not only can the circuit board set 2 be effectively isolated from the outside, but also can provide dustproof and waterproof effect for the circuit board set 2.
[0051] In order to make the charging device have better sealing performance, a sealing gasket can also be arranged at the connection between the top shell 3 and the bottom shell 1, or the sealing glue is filled. After the bottom shell 1 and the bottom shell 1 are connected, a closed inner cavity will be formed, and the circuit board set 2 is arranged in the closed inner cavity.
[0052] As mentioned above, the heat generated by the electronic components on the circuit board is conducted to the bottom shell 1 and then dissipated through the heat dissipation assembly 4 on the bottom shell 1. In order to facilitate the connection of the circuit board set 2 and the bottom shell 1, the first surface 11 has at least one recessed open cavity 5 and at least one main heat dissipation area 6, the main heat generating area of the circuit board set 2 is arranged corresponding to the main heat dissipation area 6, and the secondary heat generating area is arranged corresponding to the open cavity 5. The heat dissipation assembly 4 includes a first heat dissipation member 41 and a second heat dissipation member 42, as shown in Figure 3 , the heat dissipation member enclosed by the dashed box is the first heat dissipation member 41, the first heat dissipation member 41 is arranged corresponding to the main heat dissipation area 6, and the second heat dissipation member 42 is arranged corresponding to the open cavity 5, and the second surface 12 of the first heat dissipation member 41 has a larger heat dissipation area than the second surface 12 of the second heat dissipation member 42.
[0053] In the technical scheme provided in the present application, by partitioning the board surface of the circuit board set 2, the main heat generating area is arranged corresponding to the main heat dissipation area 6, and the secondary heat generating area is arranged corresponding to the open cavity 5, the heat dissipation effect of the first heat dissipation member 41 corresponding to the main heat generating area is better than that of the second heat dissipation member 42 corresponding to the open cavity 5, so that the main heat generating area on the circuit board set 2 can be cooled in time, effectively avoiding heat accumulation on the circuit board and affecting the output power of the charging device.
[0054] In the technical scheme provided in the present application, according to the heat generated by the electronic components when working, the electronic components are classified, some electronic components with high heat generation are arranged in the main heat generating area, and some electronic components with low heat generation are arranged in the secondary heat generating area. First, the high-temperature electronic components and the low-temperature electronic components can be effectively distinguished, and the low-temperature electronic components are not heated by the high-temperature electronic components, so as to avoid heat accumulation. Second, the main heat generating area is arranged corresponding to the first heat dissipation member 41 with better heat dissipation effect, and the heat in the main heat generating area can be fully dissipated to the outside air, thereby fully cooling the electronic components in the main heat generating area. When charging, the charging device can also maintain full power output for a long time, and is not prone to over-tightening and power reduction.
[0055] In addition, referring to Figures 1 to 3 , the open cavity 5 on the first surface 11 of the bottom shell 1 is recessed, that is, it is recessed from the first surface 11 to the second surface 12 of the bottom shell 1. The cavity opening of the open cavity 5 is on the same plane as the main heat dissipation area 6, so when the circuit board set 2 is connected to the first surface 11, the electronic components in the main heat generating area can be connected to the main heat dissipation area 6, and the electronic components in the secondary heat generating area can be arranged in the open cavity 5.
[0056] Generally, the electronic components in the main heat generating area are relatively small in size and generate a large amount of heat, such as diodes and the like, and the electronic components in the secondary heat generating area are relatively large in size and generate a relatively small amount of heat, such as capacitors, transformers, inductors, filters and the like. These electronic components of relatively large size can be arranged in the open cavity 5, so that the electronic components on the circuit board assembly 2 are more regular and evenly distributed.
[0057] As mentioned above, the open cavity 5 is recessed on the first surface 11 of the bottom shell 1, which will form a protruding shape on the second surface 12 of the bottom shell 1. By arranging different electronic components in different areas, the shape of the first heat dissipation member 41 corresponding to the main heat dissipation area 6 is more regular, and the formed heat dissipation air duct is smoother, so the heat dissipation effect of the first heat dissipation member 41 is better.
[0058] Further, the depth of the first heat dissipation air duct formed by the first heat dissipation member 41 is greater than the depth of the second heat dissipation air duct formed by the second heat dissipation member 42, and the contact area of the first heat dissipation member 41 with air is larger, so the heat dissipation capacity of the first heat dissipation member 41 is better. In addition, in order to further improve the heat dissipation capacity of the first heat dissipation member 41, the first heat dissipation air duct is smoother than the second heat dissipation air duct, and the first heat dissipation air duct is not affected by the open cavity 5.
[0059] When the height of the first heat dissipation member 41 and the second heat dissipation member 42 relative to the second surface 12 of the bottom shell 1 is the same, due to the protrusion of the open cavity 5, it will inevitably occupy the air duct formed by the second heat dissipation member 42, causing the heat dissipation capacity of the second heat dissipation member 42 to be weak. However, since the electronic components in the open cavity 5 generate a small amount of heat, the second heat dissipation member 42 can cope with it and will not cause heat accumulation.
[0060] The first heat dissipation member 41 corresponding to the main heat dissipation area 6 is not affected by the open cavity 5, and the first heat dissipation air duct formed by the first heat dissipation member 41 is better in terms of depth and smoothness, so the first heat dissipation member 41 has a better heat dissipation effect.
[0061] Therefore, by arranging electronic components of different heat generating amounts in different areas, the circuit board can be made more regular, and the main heat dissipation area 6 can have the best heat dissipation capacity in a suitable size, meeting the heat dissipation requirements of the electronic components in the main heat generating area and ensuring that the charging device does not overheat and reduce power.
[0062] In one specific embodiment, referring to Figure 3, the first and second heat dissipation fins 41 and 42 are heat dissipation fins, and the shapes of the first and second heat dissipation air ducts are wave streamline shapes. Compared with traditional straight-line heat dissipation fins, the heat dissipation area of the heat dissipation fins can be increased under the condition of the same number and same fin height. In addition, the spacing between the heat dissipation fins in the first heat dissipation fins 41 can be smaller than the spacing between the heat dissipation fins in the second heat dissipation fins 42.
[0063] Further, the main heat generating element is arranged on the main heat dissipation area, and the secondary heat generating element 14 is arranged on the open cavity 5. In order to better conduct the heat generated by the main heat generating element to the bottom shell 1, the heat-conducting silica gel is filled between the main heat generating element and the bottom shell 1. The secondary heat generating element 14 arranged in the open cavity 5 can be fixed and protected by filling the glue in the cavity, and the heat generated by the secondary heat generating element 14 can be conducted to the bottom shell 1, thereby improving the heat dissipation effect.
[0064] Specifically, referring to Figure 2 The screw hole can be added on the first surface 11 of the bottom shell 1, the device is directly fixed by the circuit board through the through hole of the main heat generating element, and the screw 16 is locked on the bottom shell 1 with the corresponding torque, so as to increase the contact pressure between the main heat generating element and the bottom shell 1 and achieve better heat dissipation effect.
[0065] In one embodiment, the first surface 11 of the bottom shell 1 has one main heat dissipation area 6 and two open cavities 5. Along the direction of the center line of the bottom shell 1, the main heat dissipation area 6 is located at the middle position of the bottom shell 1, and the two open cavities 5 are located on the two sides of the main heat dissipation area 6. The shape of the first surface 11 of the bottom shell 1 matches the shape of one of the circuit boards in the circuit board set 2, the main heat generating element is arranged at the middle position of the circuit board, and the secondary heat generating element 14 is arranged at the two sides of the circuit board.
[0066] Referring to Figure 1 In order to further improve the heat dissipation efficiency of the heat dissipation assembly 4, in one embodiment provided in the present application, the heat dissipation assembly 4 is provided with a heat dissipation fan 7 on one side, and the air outlet direction of the heat dissipation fan 7 is aligned with the first and second heat dissipation air ducts. One side of the second surface 12 of the bottom shell 1 is provided with a fan mounting position, the heat dissipation fan 7 is fixedly connected to the fan mounting position through a metal bending bracket 71, the metal bending bracket 71 is fixedly connected to the bottom shell 1 through a fixing piece 72, the metal bending bracket 71 can simultaneously fix multiple heat dissipation fans 7, and the heat dissipation fan 7 is fixedly connected to the metal bending bracket 71 through a fan fixing screw 73.
[0067] The charging device generally comprises a high-voltage circuit and a low-voltage circuit, in order to improve the safety of the charging device, the high-voltage circuit can be arranged on one circuit board, and the low-voltage circuit is arranged on another circuit board. In an embodiment provided in the present application, the circuit board group 2 comprises a plurality of circuit boards connected to each other, and the circuit boards are connected through a wire or a connector. Along the height direction of the charging device, the plurality of circuit boards are stacked in the inner cavity.
[0068] Referring to Figure 1 and Figure 6 In the technical solution provided in the present application, by stacking a plurality of circuit boards, the longitudinal space of the charging device can be fully utilized under the condition of insufficient horizontal space, thereby facilitating the reduction of the overall volume of the charging device.
[0069] In order to avoid the mutual influence of the plurality of stacked circuit boards, an insulating sheet 8 is arranged between the plurality of circuit boards, and the plurality of circuit boards are connected to the bottom shell 1 through a support. For example, the circuit board group 2 comprises a first circuit board 21, a second circuit board 22 and a third circuit board 23, the first circuit board 21 is connected to the first surface 11 of the bottom shell 1, the second circuit board 22 is located above the second circuit board 22, the four corners of the second circuit board 22 are connected to the first circuit board 21 through support studs 24, and the third circuit board 23 is also connected above the second circuit board 22 through the support studs 24. An insulating sheet 8 is arranged between the first circuit board 21 and the second circuit board 22, and between the second circuit board 22 and the third circuit board 23, and the insulating sheet 8 is a high-voltage resistant insulating sheet, which can effectively avoid short circuit between circuits.
[0070] Referring to Figure 1 , Figure 2 and Figure 6 In an embodiment provided in the present application, one clamping groove 9 is arranged on each side of the bottom shell 1, and the input wire harness 15 and the output wire harness are fixed through the clamping grooves 9, respectively. The input wire harness 15 and the output wire harness are connected to one of the circuit boards in the circuit board group 2.
[0071] Specifically, the clamping groove 9 is designed with a circular arc opening on one side so that the wire harness (input wire harness 15, output wire harness) can pass through, and a rib is designed on each side. After the hexagonal clamping ring 91 is installed in the clamping groove 9, the rib can limit the rotation of the clamping ring, thereby limiting the rotation of the wire harness, and the circular arc opening can facilitate the wire harness to pass through, but can block the hexagonal clamping ring 91, thereby preventing the wire harness from entering the inside of the charging device too much, pressing the circuit board and causing product damage. When the product top shell 3 is installed, the clamping ring 91 can also be tightly attached to the inner wall of the top shell 3 to prevent the user from pulling the wire harness outward and causing product damage.
[0072] The cable clamping ring 91 comprises an upper clamping ring 92 and a lower clamping ring 93, the cable passes through the hollow between the upper clamping ring 92 and the lower clamping ring 93, and the upper clamping ring 92 and the lower clamping ring 93 are fastened by the connecting screw 94, so that the cable can be clamped and fixed by the upper clamping ring 92 and the lower clamping ring 93.
[0073] Referring to Figure 1 and Figure 5 In an embodiment provided in the present application, the charging device further comprises a shell 10 connected to the second surface 12 of the bottom shell 1, and the heat dissipation assembly 4 is located in the cavity formed by the shell 10 and the bottom shell 1. Specifically, the shell 10 is a square box structure, and the shell 10 can be buckled on the second surface 12, so as to cover the entire heat dissipation assembly 4.
[0074] The shell 10 not only provides a certain protection function for the heat dissipation assembly 4, but also makes the appearance of the charging device more beautiful. In order to facilitate the flow of air, the shell 10 is provided with heat dissipation holes 101. Specifically, the two sides of the shell 10 are designed with a large number of long strip-shaped hollow designs to form a large number of heat dissipation holes 101. The heat dissipation holes 101 on the two sides correspond to the heat dissipation fan 7 and the end of the heat dissipation air duct respectively, and the air convection speed inside the shell 10 can be accelerated under the action of the heat dissipation fan 7, the flow of air around the heat dissipation assembly 4 is accelerated by the heat dissipation fan 7 to take away heat, which is beneficial to enhance the heat dissipation capacity of the equipment.
[0075] In an embodiment of the present application, a charging pile is also provided, which comprises a main body and a charging device. The charging device is arranged on the main body, which can be a pile column or a box body, and the charging device is connected to the pile column or the box body, so as to facilitate the use of the user.
[0076] Further, one charging device can be arranged on the main body, or a plurality of charging devices can be arranged at the same time.
[0077] The charging device comprises a bottom shell 1, a circuit board group 2 and a top shell 3. The bottom shell 1 has a first surface 11 and a second surface 12 arranged oppositely, and the second surface 12 is provided with a heat dissipation assembly 4. The circuit board group 2 is arranged on the first surface 11, and the board surface of the circuit board group 2 has a main heat generating area and a secondary heat generating area. The top shell 3 is connected to the first surface 11 of the bottom shell 1 to form an inner cavity, and the circuit board group 2 is located in the inner cavity. Among them, the first surface 11 has at least one concave open cavity 5 and at least one main heat dissipation area 6, the main heat generating area is arranged corresponding to the main heat dissipation area 6, and the secondary heat generating area is arranged corresponding to the open cavity 5. The heat dissipation assembly 4 comprises a first heat dissipation member 41 and a second heat dissipation member 42, the first heat dissipation member 41 is arranged corresponding to the main heat dissipation area 6, and the second heat dissipation member 42 is arranged corresponding to the second heat dissipation member 42, the second surface 12 heat dissipation area of the first heat dissipation member 41 is larger than the second surface 12 heat dissipation area of the second heat dissipation member 42.
[0078] For the specific structure of the charging device, please refer to the description in the foregoing, which will not be repeated here.
[0079] To sum up, in the technical solutions provided in the present application, by partitioning the board surfaces of the circuit board group, the main heat generating area is arranged corresponding to the main heat dissipation area, and the secondary heat generating area is arranged corresponding to the open cavity, the air duct formed by the first heat dissipation member corresponding to the main heat generating area is better in both the depth and the flow, so that the main heat generating area on the circuit board group can be cooled in time, effectively avoiding the accumulation of heat on the circuit board and affecting the output power of the charging device. In addition, the shell is further arranged outside the heat dissipation assembly, which can not only provide a certain protection function for the heat dissipation assembly, but also make the appearance of the charging device more beautiful.
[0080] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A charging device, characterized by, The application relates to a charging device, comprising: a bottom shell with a first surface and a second surface arranged oppositely, wherein the second surface is provided with a heat dissipation assembly; a circuit board group arranged on the first surface, wherein the surface of the circuit board group is provided with a main heat generating area and a secondary heat generating area; a top shell connected to the first surface of the bottom shell to form an inner cavity, and the circuit board group is arranged in the inner cavity; wherein the first surface is provided with at least one concave open cavity and at least one main heat dissipation area, the main heat generating area is arranged corresponding to the main heat dissipation area, and the secondary heat generating area is arranged corresponding to the open cavity; the heat dissipation assembly comprises a first heat dissipation piece and a second heat dissipation piece, the first heat dissipation piece is arranged corresponding to the main heat dissipation area, the second heat dissipation piece is arranged corresponding to the second heat dissipation piece, and the second surface heat dissipation area of the first heat dissipation piece is larger than that of the second heat dissipation piece.
2. The charging device of claim 1, wherein, the depth of a first heat dissipation air duct formed by the first heat dissipation piece is larger than that of a second heat dissipation air duct formed by the second heat dissipation piece; the first heat dissipation air duct is smoother than the second heat dissipation air duct.
3. The charging device of claim 2, wherein, the first heat dissipation piece and the second heat dissipation piece are heat dissipation fins; the shapes of the first heat dissipation air duct and the second heat dissipation air duct are wave streamline shapes.
4. The charging device of claim 1, wherein, the main heat generating area is provided with a main heat generating element, and the secondary heat generating area is provided with a secondary heat generating element; the main heat generating element is connected to the main heat dissipation area in a fit mode, and the secondary heat generating element is arranged in the open cavity.
5. The charging device of claim 4, wherein, along the direction of the middle line of the bottom shell, the main heat dissipation area is located at the middle position of the bottom shell, and the two open cavities are located on the two sides of the main heat dissipation area.
6. The charging device of claim 2, wherein, one side of the heat dissipation assembly is provided with a heat dissipation fan, and the air outlet direction of the heat dissipation fan is aligned with the first heat dissipation air duct and the second heat dissipation air duct.
7. The charging device of claim 1, wherein, the circuit board group comprises a plurality of circuit boards connected to each other, and along the height direction of the charging device, the plurality of circuit boards are arranged in the inner cavity in a stacked mode.
8. The charging device of claim 7, wherein, insulating sheets are arranged between the plurality of circuit boards, and the plurality of circuit boards are connected to the bottom shell through supporting pieces.
9. The charging device of claim 8, wherein, one clamping groove is arranged on each side of the bottom shell, and input and output wire harnesses are fixed through the clamping grooves, and the input and output wire harnesses are connected to one of the circuit boards in the circuit board group.
10. The charging device of claim 1, wherein, the application further comprises an outer shell connected to the second surface of the bottom shell, and the heat dissipation assembly is arranged in the cavity formed by the outer shell and the bottom shell; the outer shell is provided with heat dissipation holes.
11. A charging post, characterized in that the application relates to a charging device, comprising: a main body; a charging device arranged on the main body, wherein the charging device comprises: a bottom shell with a first surface and a second surface arranged oppositely, wherein the second surface is provided with a heat dissipation assembly; a circuit board group arranged on the first surface, wherein the surface of the circuit board group is provided with a main heat generating area and a secondary heat generating area; a top shell connected to the first surface of the bottom shell to form an inner cavity, and the circuit board group is arranged in the inner cavity; wherein the first surface is provided with at least one concave open cavity and at least one main heat dissipation area, the main heat generating area is arranged corresponding to the main heat dissipation area, and the secondary heat generating area is arranged corresponding to the open cavity; The heat dissipation assembly comprises a first heat dissipation member and a second heat dissipation member, the first heat dissipation member is arranged corresponding to the main heat dissipation area, the second heat dissipation member is arranged corresponding to the second heat dissipation area, and the second surface heat dissipation area of the first heat dissipation member is greater than that of the second heat dissipation member.