Optoelectronic isolation 16-port concentrator with built-in power supply

By employing a composite structure of layered heat conduction and frequency band shielding in the opto-isolated 16-port hub, the contradiction between high-density port layout in a compact space and the heat dissipation requirements of multiple modules, as well as the coordinated suppression of multi-band electromagnetic interference, is resolved, thus achieving stable and reliable operation of the equipment.

CN224111175UActive Publication Date: 2026-04-10XIAN YUANSHUN INSTR TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-07
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

Within a compact space, there is a contradiction between the high-density port layout and the heat dissipation requirements of multiple modules and the coordinated suppression of multi-band electromagnetic interference, resulting in excessive equipment temperature rise and electromagnetic interference, making it difficult to pass certification.

Method used

It adopts a composite structure with layered heat conduction and frequency band shielding, including a copper substrate, micro heat pipes, graphene heat conduction layer, metal indium foil, copper-plated aluminum alloy layer and conductive plastic layer. Combined with the inclined port layout and heat dissipation fin design, it optimizes heat dissipation efficiency and electromagnetic interference suppression.

Benefits of technology

Simultaneously optimize heat dissipation efficiency and electromagnetic interference suppression within a compact space to ensure stable and reliable operation of the equipment and meet the high-density port layout requirements in industrial scenarios.

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Abstract

The utility model provides a photoelectric isolation 16-port concentrator with a built-in power supply, and relates to the technical field of network communication equipment. The hub comprises a shell, wherein a mounting cavity is formed in the shell to accommodate each component; the power supply module is fixed on one side of the bottom of the mounting cavity and provides power for the concentrator; the photoelectric isolation module is arranged above the power supply module at intervals through an insulating bracket to realize a photoelectric isolation function; the port group comprises 16 RJ45 interfaces, odd-numbered ports are inclined upwards, and even-numbered ports are inclined downwards, so that connection is facilitated; the heat conduction structure effectively dissipates heat; and the shielding structure enhances the electromagnetic shielding effect. In addition, heat dissipation fins are arranged on the side wall of the shell, heat dissipation grids are arranged on the top of the shell, and the heat dissipation performance is further improved. The concentrator solves the technical problem of contradiction among high-density port layout, multi-module heat dissipation requirements and multi-band electromagnetic interference collaborative suppression in a compact space, and achieves the effect of synchronously optimizing heat dissipation efficiency and electromagnetic interference suppression in the compact space.
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Description

TECHNICAL FIELD

[0001] The utility model relates to network communication equipment technical field, specifically, relate to a built-in power supply's photoelectric isolation 16 mouth concentrator. BACKGROUND

[0002] With the rapid development of industrial internet of things and edge computing, network equipment tends to miniaturization and high density integration, and photoelectric isolation concentrator becomes a key component of industrial communication due to its anti-interference characteristics. However, when integrating more than 16 ports, built-in power supply and photoelectric isolation module in limited space, the device faces two major contradictions: first, high-density port layout leads to PCB wiring space compression, and the heat dissipation path of the power module (such as AC / DC converter) and photoelectric isolation device (such as optocoupler) interferes with each other, which easily causes local temperature rise exceeding the standard (> 85℃); second, low-frequency noise (<1MHz) of power supply and high-frequency crosstalk (>100MHz) of high-speed signal superimpose in compact space, leading to a sharp increase in electromagnetic interference (EMI) exceeding the standard, which is difficult to pass FCC / CE authentication.

[0003] Traditional solutions alleviate the above contradictions through split design, for example: using independent cooling fins to dissipate heat from power supply and photoelectric module respectively, or isolating interference sources through metal shielding cover. However, such methods lead to device volume expansion (thickness increase of 30%~50%), sacrificing port density; while single shielding layer design (such as fully enclosed aluminum alloy shell) can suppress part of the interference, but it is inefficient (<25dB) due to the lack of distinction between low-frequency / high-frequency noise frequency bands, and it aggravates internal heat accumulation. In addition, forced air cooling and other active cooling solutions have low reliability in industrial dust environment, and it is difficult to meet the IP40 protection requirement.

[0004] In summary, how to solve the contradiction between high-density port layout and multi-module heat dissipation demand, multi-band electromagnetic interference collaborative suppression in compact space is a technical problem that needs to be solved. Utility model content

[0005] The main purpose of the utility model is to provide a built-in power supply's photoelectric isolation 16 mouth concentrator, to at least solve the technical problem of the contradiction between high-density port layout and multi-module heat dissipation demand, multi-band electromagnetic interference collaborative suppression in compact space, through the integrated layered heat conduction and frequency band shielding composite structure, the heat dissipation efficiency and electromagnetic interference suppression effect are optimized synchronously in compact space, and the high-density port layout and device reliability demand in industrial scene are considered.

[0006] In order to realize the above-mentioned purpose, the utility model provides a built-in power supply's photoelectric isolation 16 mouth concentrator, the concentrator includes:

[0007] The shell is internally provided with a mounting cavity;

[0008] A power module is fixed on one side of the bottom of the installation cavity.

[0009] An optoelectronic isolation module is arranged above the power module through an insulating support.

[0010] A port group comprises 16 RJ45 interfaces, and odd ports and even ports in the port group are arranged alternately along the length direction of the shell, and the odd ports are inclined upward, and the even ports are inclined downward.

[0011] A heat conduction structure comprises a copper substrate embedded in the bottom of the power module, a micro heat pipe connecting the copper substrate and the side wall of the shell, a graphene heat conduction layer covering the surface of the optoelectronic isolation module, and a metal indium foil filled between the graphene heat conduction layer and the inner wall of the heat dissipation grid.

[0012] A shielding structure comprises a copper-plated aluminum alloy layer covering the inner wall of the shell and a conductive plastic layer covering the outer surface of the shell.

[0013] The side wall of the shell is provided with heat dissipation fins connected with the micro heat pipe, and the top of the shell is provided with a heat dissipation grid corresponding to the graphene heat conduction layer.

[0014] Specifically, the micro heat pipe is distributed in a U shape, and the two ends of the micro heat pipe extend to the heat dissipation fins, and the middle part of the micro heat pipe is attached to the lower surface of the copper substrate.

[0015] Specifically, the outer surface of the conductive plastic layer is provided with uniformly distributed hemispherical protrusions.

[0016] Specifically, the inclination direction of the grid bars of the heat dissipation grid is consistent with the inclination direction of the odd ports, and the inclination angle of the grid bars of the heat dissipation grid is 10°-15°.

[0017] Specifically, the shell is integrally pressure cast from magnesium-aluminum alloy, and the side wall of the shell and the heat dissipation fins are continuous structures.

[0018] Specifically, the upward inclination angle of the odd ports is 10°-15°, and the downward inclination angle of the even ports is 10°-15°.

[0019] Specifically, the spacing distance between the optoelectronic isolation module and the power module is 5-8 mm.

[0020] Specifically, the thickness of the copper-plated aluminum alloy layer is 0.1-0.3 mm, and the thickness of the conductive plastic layer is 0.5-1 mm.

[0021] The utility model provides a kind of photoelectric isolation 16-port concentrator of built-in power supply, the concentrator includes shell, its inside is equipped with installation cavity, provides stable mounting space for each component;Power module is fixed in installation cavity bottom side, provides stable power supply for concentrator;Photoelectric isolation module is separated and arranged in the upper of power module by insulating support, ensure the isolation and stability of signal transmission;Port group contains 16 RJ45 interfaces, odd port is inclined upward, even port is inclined downward, it is convenient for flexible wiring.In addition, the concentrator is also provided with heat conduction structure, including copper substrate, micro heat pipe, graphene heat conduction layer and metal indium foil, effective heat dissipation;Shielding structure includes copper-plated aluminum alloy layer and conductive plastic layer, enhances electromagnetic shielding effect.Shell side wall is equipped with radiating fin, top is equipped with heat dissipation grid, further improve heat dissipation performance, ensure that concentrator stable and reliable operation.The concentrator solves the technical problem of the contradiction between high-density port layout and multi-module heat dissipation demand in compact space, multi-band electromagnetic interference collaborative inhibition, realizes synchronous optimization heat dissipation efficiency and electromagnetic interference suppression effect in compact space. BRIEF DESCRIPTION OF DRAWINGS

[0022] The drawings accompanying the specification of this application form a part thereof, serve to provide further understanding of the present application, and together with the description, explain the present application. Such an embodiment of the present application, and its description, are not to be unduly limited in scope by the embodiments disclosed in this section, but include all embodiments within the scope of the present application. In the drawings:

[0023] Figure 1 It is according to the tangent surface schematic diagram of the photoelectric isolation 16-port concentrator of built-in power supply of an embodiment of the utility model can be selected;

[0024] 10, shell;20, power module;30, photoelectric isolation module;31, insulating support;40, port group;41, odd port;42, even port;50, heat conduction structure;51, copper substrate;52, micro heat pipe;53, graphene heat conduction layer;54, metal indium foil;60, shielding structure;61, copper-plated aluminum alloy layer;62, conductive plastic layer;621, hemispherical protrusion;11, radiating fin;12, heat dissipation grid. DETAILED DESCRIPTION

[0025] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with embodiments.

[0026] As Figure 1As shown, the utility model provides a kind of photoelectric isolation 16-port concentrator of built-in power supply, the concentrator includes: shell 10, power module 20, photoelectric isolation module 30, port group 40, heat conduction structure 50 and shielding structure 60, shell 10 inside is equipped with installation cavity;Power module 20, is fixed in the installation cavity bottom one side;Photoelectric isolation module 30 is separated and is arranged in the power module 20 top by insulating support 31;Port group 40 includes 16 RJ45 interfaces, the odd port 41 and even port 42 in the port group 40 are alternately arranged along the length direction of shell, and the odd port 41 is inclined upward, and the even port 42 is inclined downward;Heat conduction structure 50 includes copper substrate 51 embedded in the bottom of power module 20, micro heat pipe 52 connecting the side wall of copper substrate 51 and shell 10, graphene heat conduction layer 53 covering the surface of photoelectric isolation module 30, and metal indium foil 54 filled between graphene heat conduction layer 53 and inner wall of heat dissipation grid 12;Shielding structure 60 includes copper-plated aluminum alloy layer 61 covering the inner wall of shell 10 and conductive plastic layer 62 covering the outer surface of shell 10;The side wall of shell 10 is equipped with heat dissipation fin 11 connected with micro heat pipe 52, and the top of shell 10 is equipped with heat dissipation grid 12 corresponding to graphene heat conduction layer 53.Specifically, the embodiment of photoelectric isolation 16-port concentrator of built-in power supply includes shell 10, power module 20, photoelectric isolation module 30, port group 40, heat conduction structure 50 and shielding structure 60, shell 10 inside is equipped with installation cavity, and power module 20 is fixed in the left side of installation cavity bottom by M4 screw, and the input terminal of power module 20 is connected with external AC power supply by AWG18 wire, and the output terminal is connected with the power input end of photoelectric isolation module 30 by AWG22 wire;Photoelectric isolation module 30 is fixed on the top of power module 20 by insulating support 31, and the four nylon support columns of insulating support 31 are inserted into the positioning hole in the top of power module 20, and the vertical interval distance between the lower surface of the circuit board of photoelectric isolation module 30 and the upper surface of power module 20 is 15mm;Port group 40 includes 16 RJ45 interfaces, and the 16 RJ45 interfaces are divided into odd port 41 and even port 42 two groups, the PCB connecting end of odd port 41 is welded on the left circuit board of photoelectric isolation module 30 with the angle of 15 degrees of inclination upward, the PCB connecting end of even port 42 is welded on the right circuit board of photoelectric isolation module 30 with the angle of 10 degrees of inclination downward, and the metal shell of odd port 41 and even port 42 is alternately arranged with interval 5mm in the length direction of shell 10.The copper substrate 51 of the heat conduction structure 50 is pasted into the bottom surface of the aluminum shell of the power module 20 through a heat conduction adhesive, the evaporation end of the micro heat pipe 52 is connected to the upper surface of the copper substrate 51 through a brazing process, the condensation end of the micro heat pipe 52 is welded to the copper substrate of the heat dissipation fin 11 through a through hole in the side wall of the shell 10, the graphene heat conduction layer 53 covers the upper surface of the circuit board of the photoelectric isolation module 30 through a vacuum coating process, the metal indium foil 54 is filled between the graphene heat conduction layer 53 and the inner wall of the aluminum alloy of the heat dissipation grid 12 through a calendering process; the copper-plated aluminum alloy layer 61 of the shielding structure 60 covers the inner wall surface of the ABS of the shell 10 through a magnetron sputtering process, and the conductive plastic layer 62 covers the outer surface of the ABS of the shell 10 through an injection molding process; the eight aluminum fins of the heat dissipation fin 11 are vertically welded on the outer surface of the left side wall of the shell 10 with a spacing of 2 mm, and the 20 rectangular ventilation grooves of the heat dissipation grid 12 are parallelly arranged on the aluminum alloy panel on the top of the shell 10 with a groove width of 3 mm; the secondary side of the isolation transformer of the photoelectric isolation module 30 is connected to the signal pin of the RJ45 interface of the port group 40 through a 0.1 mm enameled wire, and the primary side is connected to the direct current output end of the power module 20 through a 0.08 mm enameled wire; a 0.5 mm thick silicon grease layer is coated between the bottom surface of the copper substrate 51 and the aluminum shell of the power module 20, the diameter of the micro heat pipe 52 is 3 mm and the internal filling is ammonia working medium, the thickness of the graphene heat conduction layer 53 is 50 μm and the surface roughness Ra is less than or equal to 0.8 μm, the thickness of the metal indium foil 54 is 0.1 mm and the thermal conductivity is 86 W / (m·K); the thickness of the copper layer of the copper-plated aluminum alloy layer 61 is 20 μm and the surface resistance is less than or equal to 0.1 Ω / sq, the carbon fiber filling amount of the conductive plastic layer 62 is 30 wt% and the volume resistivity is less than or equal to 1 Ω·cm; four Φ3 mm positioning pins are arranged at the bottom of the mounting cavity of the shell 10, the positioning pins are inserted into the positioning holes at the bottom of the power module 20 to realize radial fixation, and the four corners of the photoelectric isolation module 30 are locked on the insulating support 31 through M3 nylon screws; the ventilation groove axis direction of the heat dissipation grid 12 forms a 45 degree angle with the surface of the graphene heat conduction layer 53, and the serrated edge of the metal indium foil 54 forms an interference fit with the dovetail groove of the inner wall of the heat dissipation grid 12; the metal shell of the RJ45 interface of the port group 40 is in conduction with the copper-plated aluminum alloy layer 61 of the shell 10 through a spring ejector pin, and the grounding terminal of the conductive plastic layer 62 is connected to the grounding bus of the power module 20 through an AWG16 wire; a 0.2 mm thick phase change heat storage gasket is arranged between the condensation end of the micro heat pipe 52 and the heat dissipation fin 11, five parallel arranged rectangular microchannels are embedded in the copper substrate 51, the cross-sectional size of the microchannels is 1 mm×0.5 mm, and the internal filling is nano alumina reinforced heat conduction liquid.

[0027] The following is a specific preferred embodiment:

[0028] Specifically, the micro heat pipe 52 is in U-shaped distribution, two ends of the micro heat pipe 52 extend to the heat dissipation fins 11, and the middle part of the micro heat pipe 52 is attached to the lower surface of the copper substrate 51.

[0029] Specifically, the outer surface of the conductive plastic layer 62 is provided with uniformly distributed semispherical protrusions 621.

[0030] Specifically, the inclined direction of the grid bars of the heat dissipation grid 12 is consistent with the inclined direction of the odd-numbered ports 41, and the inclined angle of the grid bars of the heat dissipation grid 12 is 10°-15°.

[0031] Specifically, the shell 10 is integrally pressure cast by magnesium-aluminum alloy, and the heat dissipation fins 11 and the side wall of the shell 10 are in continuous structure.

[0032] Specifically, the upward inclined angle of the odd-numbered ports 41 is 10°-15°, and the downward inclined angle of the even-numbered ports 42 is 10°-15°.

[0033] Specifically, the interval distance between the photoelectric isolation module 30 and the power supply module 20 is 5-8 mm.

[0034] Specifically, the thickness of the copper-plated aluminum alloy layer 61 is 0.1-0.3 mm, and the thickness of the conductive plastic layer 62 is 0.5-1 mm.

[0035] As preferred, in implementation, the implementation of the 16-port photoelectric isolation hub with built-in power supply comprises a shell 10, a power supply module 20, a photoelectric isolation module 30, a port group 40, a heat conduction structure 50 and a shielding structure 60, the shell 10 is integrally formed by magnesium-aluminum alloy through a pressure casting machine with a pressure of 800 tons, the heat dissipation fins 11 form a continuous and jointless metal structure with the left side wall of the shell 10; the micro heat pipe 52 is bent into a U-shaped distribution with a copper pipe with an outer diameter of 3 mm, the U-shaped bottom of the micro heat pipe 52 is completely attached to the bottom surface of the copper substrate 51 through a heat-conducting silicone grease layer, the two ends of the micro heat pipe 52 are welded and fixed with the copper substrate of the heat dissipation fins 11 after penetrating the side wall of the shell 10 at a 45-degree inclined angle; the outer surface of the conductive plastic layer 62 forms a hemispherical protrusion 621 with a diameter of 2 mm and a height of 1 mm through an injection mold, the hemispherical protrusions 621 are arranged in a matrix with a spacing of 5 mm to cover the entire outer surface of the conductive plastic layer 62; the 20 aluminum alloy bars of the heat dissipation grid 12 are processed and formed at an inclined angle of 12 degrees, the inclined direction of the bars of the heat dissipation grid 12 is parallel to the upward inclined direction of the odd-numbered ports 41, the ends of the bars of the heat dissipation grid 12 are flush with the edges of the ventilation openings at the top of the shell 10; the RJ45 interfaces of the odd-numbered ports 41 are welded on the left circuit board of the photoelectric isolation module 30 at an upward inclined angle of 12 degrees, the RJ45 interfaces of the even-numbered ports 42 are welded on the right circuit board of the photoelectric isolation module 30 at a downward inclined angle of 12 degrees, the insulating support 31 at the bottom of the photoelectric isolation module 30 maintains a vertical spacing of 6 mm with the heat dissipation fins at the top of the power supply module 20; the copper-plated aluminum alloy layer 61 forms a copper-aluminum composite layer with a thickness of 0.2 mm on the inner wall of the shell 10 through a magnetron sputtering process, the conductive plastic layer 62 is formed by mixing 30% carbon fibers with ABS plastic through a double-screw extruder and then injection molding to form an outer layer with a thickness of 0.8 mm; the lower surface of the copper substrate 51 is provided with two positioning grooves with a depth of 0.5 mm, the U-shaped bent part of the micro heat pipe 52 is embedded in the positioning grooves and fixed by brazing; the surface of the aluminum alloy bars of the heat dissipation grid 12 is sprayed with a black anodized layer, the bar spacing of the heat dissipation grid 12 and the width of the heat dissipation grooves on the surface of the graphene heat conduction layer 53 are both 3 mm; the magnesium-aluminum alloy pressure casting of the shell 10 is provided with a thickness gradient structure at the root of the heat dissipation fins 11, the thickness of the root of the heat dissipation fins 11 is 3 mm and gradually shrinks to 1 mm towards the end; the hemispherical protrusions 621 of the conductive plastic layer 62 are provided with through holes with a diameter of 0.5 mm at the root, the through holes are filled with conductive silver paste to form electrical connection between the hemispherical protrusions 621 and the inner copper-plated aluminum alloy layer 61; the circuit boards of the photoelectric isolation module 30 are locked and fixed with the insulating support 31 through M3 nylon bolts, the four polytetrafluoroethylene legs of the insulating support 31 are inserted into the positioning holes at the top of the power supply module 20; the U-shaped bending radius of the micro heat pipe 52 is 8 mm, the internal capillary structure of the micro heat pipe 52 is an axial channel type with a capillary channel depth of 0.3 mm; the copper layer of the copper-plated aluminum alloy layer 61 is metallurgically combined with the magnesium-aluminum alloy matrix through thermal diffusion welding, the surface roughness of the copper layer is Ra≤1.6μm; the inclined bars of the heat dissipation grid 12 form an angle of 78 degrees with the top plane of the shell 10, and the air inlet side edges of the heat dissipation grid 12 are rounded with a radius R0.5mm; the metal shell of the RJ45 interface of the port group 40 is kept in contact with the copper-plated aluminum alloy layer 61 on the inner wall of the shell 10 through a tinned phosphor bronze spring leaf; the ground terminal of the conductive plastic layer 62 is connected to the ground copper bar of the power module 20 through resistance welding with a copper strip with a width of 5mm.

[0036] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can be variously changed and modified. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A 16-port opto-isolator hub with built-in power supply, characterized by, The application relates to a concentrator, which comprises a shell (10) internally provided with a mounting cavity; a power module (20) fixed to one side of the bottom of the mounting cavity; a photoelectric isolation module (30) arranged above the power module (20) through an insulating support (31); a port group (40) containing 16 RJ45 interfaces, wherein odd-numbered ports (41) and even-numbered ports (42) in the port group (40) are alternately arranged along the length direction of the shell, and the odd-numbered ports (41) are upwardly inclined, and the even-numbered ports (42) are downwardly inclined; a heat conduction structure (50) comprising a copper substrate (51) embedded in the bottom of the power module (20), a micro heat pipe (52) connecting the copper substrate (51) and the side wall of the shell (10), a graphene heat conduction layer (53) covering the surface of the photoelectric isolation module (30), and a metal indium foil (54) filled between the graphene heat conduction layer (53) and the inner wall of a heat dissipation grid (12); and a shielding structure (60) comprising a copper-plated aluminum alloy layer (61) covering the inner wall of the shell (10) and a conductive plastic layer (62) covering the outer surface of the shell (10); the side wall of the shell (10) is provided with heat dissipation fins (11) connected with the micro heat pipe (52), and the top of the shell (10) is provided with the heat dissipation grid (12) corresponding to the graphene heat conduction layer (53).

2. The concentrator according to claim 1, wherein the micro heat pipe (52) is in U-shaped distribution, the two ends of the micro heat pipe (52) extend to the heat dissipation fins (11), and the middle part of the micro heat pipe (52) is attached to the lower surface of the copper substrate (51).

3. The concentrator according to claim 1, wherein the outer surface of the conductive plastic layer (62) is provided with uniformly distributed hemispherical protrusions (621).

4. The concentrator according to claim 1, wherein the inclination direction of the grid bars of the heat dissipation grid (12) is consistent with the inclination direction of the odd-numbered ports (41), and the inclination angle of the grid bars of the heat dissipation grid (12) is 10-15 degrees.

5. The concentrator according to claim 1, wherein the shell (10) is integrally pressure-cast formed by magnesium-aluminum alloy, and the heat dissipation fins (11) and the side wall of the shell (10) are in continuous structure.

6. The concentrator according to claim 1, wherein the upward inclination angle of the odd-numbered ports (41) is 10-15 degrees, and the downward inclination angle of the even-numbered ports (42) is 10-15 degrees.

7. The concentrator according to claim 1, wherein the spacing distance between the photoelectric isolation module (30) and the power module (20) is 5-8 mm.

8. The concentrator according to claim 1, wherein the thickness of the copper-plated aluminum alloy layer (61) is 0.1-0.3 mm, and the thickness of the conductive plastic layer (62) is 0.5-1 mm. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​