High-frequency circuit board copper foil surface treatment cleaning device

Abstract

The utility model belongs to the technical field of circuit board cleaning, and particularly relates to a high-frequency circuit board copper foil surface treatment cleaning device which comprises a circuit board placing table, an ultrasonic generator is arranged on one side of the circuit board placing table, a cleaning pool is fixedly installed at the top of the ultrasonic generator, and a transducer is arranged at the top of the ultrasonic generator. A driving seat is arranged outside the circuit board placing table, a mounting frame is arranged at the top of the driving seat, an electric telescopic rod is fixedly mounted at the top of the mounting frame, and a clamping frame is fixedly mounted at one end of the electric telescopic rod. The ultrasonic generator, the cleaning pool and the transducer are matched for use, and high-frequency vibration waves of ultrasonic waves are spread in liquid, so that a series of tiny bubbles are generated. The bubbles expand and rapidly shrink in the liquid to form strong shock waves and tiny liquid jet effects, so that pollutants on the surface of the copper foil can be effectively removed, the cleaning effect can be conveniently improved, and meanwhile, the surface of the circuit board can be prevented from being easily damaged.

Description

Technical Field

[0001] This utility model relates to the field of circuit board cleaning technology, specifically to a high-frequency circuit board copper foil surface treatment and cleaning device. Background Technology

[0002] High-frequency printed circuit boards (HF-PCBs) are widely used in communications, radar, satellite, and medical equipment, playing a crucial role, especially in high-frequency signal transmission. Due to their high frequency requirements and fast signal transmission speeds, they place extremely high demands on the circuit's conductivity, stability, and anti-interference capabilities. HF-PCBs mainly consist of a substrate (such as PTFE or ceramic) and a copper foil layer. The quality of the copper foil layer directly affects the circuit's performance. During manufacturing, the quality and processing of the copper foil surface are critical. The cleanliness of the copper foil surface directly affects the success of subsequent processes such as electroplating, solder masking, and printing. Therefore, cleaning the copper foil surface is a key step in HF-PCB manufacturing. As the conductive substrate of the circuit board, the copper foil surface must undergo meticulous treatment to ensure good adhesion, corrosion resistance, and suitability for subsequent processes. During manufacturing, the copper foil surface is affected by various contaminants, such as oxides, oil, and dust. These contaminants can cause surface roughness, reduced conductivity, and even affect the adhesion of subsequent coatings. Therefore, cleaning the copper foil surface is extremely important.

[0003] The existing technology has the following shortcomings: The existing technology disclosed in CN202420103810.9 is a circuit board surface treatment device, which includes a treatment box and a conveyor belt. The conveyor belt is arranged in two sets and symmetrically. The inner walls of both sides of the treatment box are fixedly connected to the mounting brackets. The two sets of mounting brackets are rotatably connected to the rotating shaft at the position between the two sets of conveyor belts. The rotating shaft is flush with the surface of the conveyor belt. The outer wall of the rotating shaft is fixedly connected to the V-shaped frame in a circular array. The inner wall of the top of the treatment box is rotatably connected to two sets of rotating rods. The bottom of the rotating rods is fixedly connected to the cleaning disc. The two sets of cleaning discs are located on both sides of the rotating shaft and the bottom of the cleaning discs is fixedly connected to the brush.

[0004] While the aforementioned equipment facilitates cleaning of the circuit board surface using the cleaning disc and brush, it also carries the risk of damaging the circuit board surface during the cleaning process and makes it difficult to perform more thorough cleaning, resulting in certain limitations in its use. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a high-frequency circuit board copper foil surface treatment and cleaning device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-frequency circuit board copper foil surface treatment and cleaning device, comprising a circuit board placement platform, an ultrasonic generator disposed on one side of the circuit board placement platform, a cleaning tank fixedly installed on the top of the ultrasonic generator, a transducer disposed on the top of the ultrasonic generator, a drive seat disposed on the outside of the circuit board placement platform, a mounting frame disposed on the top of the drive seat, an electric telescopic rod fixedly installed on the top of the mounting frame, a clamping frame fixedly installed at one end of the electric telescopic rod, a conveyor platform disposed on one side of the mounting frame, and a drying box fixedly installed on the top of the conveyor platform.

[0007] In a preferred embodiment of this invention, the ultrasonic generator is connected to the transducer via a cable, and the transducer is fixedly installed at the bottom of the cleaning tank.

[0008] As a preferred technical solution of this utility model, the drive base includes an electric slide rail and a drive block. The drive base is provided with an electric slide rail, and the electric slide rail is provided with a drive block. The electric slide rail is electrically connected to an external power source through a wire. The drive block is slidably connected to the electric slide rail, and a mounting bracket is fixedly installed on the top of the drive block.

[0009] As a preferred embodiment of this utility model, the clamping frame includes a motor, a bidirectional threaded rod, a limiting rod, a movable plate, and a clamping plate. The motor is fixedly installed on one side of the clamping frame, and a bidirectional threaded rod is provided at one end of the motor. A limiting rod is fixedly installed inside the clamping frame, and a movable plate is provided inside the clamping frame. A clamping plate is fixedly connected to the bottom of the movable plate. The movable plate has a threaded hole and a through hole inside, and the inner diameter of the threaded hole and the through hole are respectively adapted to the outer diameter of the bidirectional threaded rod and the limiting rod.

[0010] As a preferred embodiment of this utility model, two clamping plates are provided and symmetrically distributed at the bottom of the movable plate.

[0011] As a preferred technical solution of this utility model, a heating and drying plate is fixedly installed inside the conveyor table, and a plurality of heating and drying plates are provided and symmetrically distributed inside the conveyor table.

[0012] As a preferred technical solution of this utility model, the drying box includes a drying heating wire mesh and a dryer. The drying heating wire mesh is fixedly installed inside the drying box, and the dryer is fixedly installed on the top of the drying box. Both the drying heating wire mesh and the dryer are electrically connected to an external power source through wires.

[0013] Compared with the prior art, this utility model provides a surface treatment and cleaning device for copper foil of high-frequency circuit boards, which has the following beneficial effects:

[0014] 1. This high-frequency circuit board copper foil surface treatment and cleaning device uses an ultrasonic generator, a cleaning tank, and a transducer in conjunction. The high-frequency vibration waves of the ultrasonic waves propagate in the liquid, generating a series of tiny bubbles (called cavitation bubbles). These bubbles expand and rapidly contract in the liquid, forming strong shock waves and a micro-liquid jet effect, effectively removing contaminants from the copper foil surface and improving cleaning efficiency. It also prevents damage to the circuit board surface. The device is equipped with a drive base, electric slide rail, drive block, mounting bracket, electric telescopic rod, clamping frame, motor, bidirectional threaded rod, limit rod, movable plate, and clamping plate for convenient clamping and placement of circuit boards, improving operational flexibility and automation.

[0015] 2. This high-frequency circuit board copper foil surface treatment and cleaning device features a transmission roller inside the conveyor table. The outer wall of the transmission roller has toothed grooves that mesh with the toothed grooves inside the conveyor belt. A conveyor motor is installed on the outside of the conveyor table, with its output end connected to the transmission roller. By controlling the operation of the conveyor motor, the cleaned circuit boards can be easily conveyed. A heating and drying plate is installed inside the conveyor table, along with a drying box, a drying heating wire mesh, and a wind dryer. During the conveying of the cleaned circuit boards, the device facilitates rapid and uniform heating and drying, which is beneficial for subsequent processing and production, and improves the device's structural practicality and functionality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the drive seat and mounting bracket structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the bottom structure of the cleaning tank of this utility model;

[0019] Figure 4 This is a schematic diagram of the clamping frame structure of this utility model;

[0020] Figure 5 This is a cross-sectional view of one side of the conveyor platform of this utility model.

[0021] In the diagram: 1. Circuit board placement platform; 2. Ultrasonic generator; 3. Cleaning tank; 4. Transducer; 5. Drive base; 501. Electric slide rail; 502. Drive block; 6. Mounting frame; 7. Electric telescopic rod; 8. Clamping frame; 801. Motor; 802. Bidirectional threaded rod; 803. Limiting rod; 804. Movable plate; 805. Clamping plate; 9. Conveyor table; 901. Heating and drying plate; 10. Drying box; 1001. Drying and heating wire mesh; 1002. Air dryer. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-5 In this embodiment: a high-frequency circuit board copper foil surface treatment cleaning device includes a circuit board placement platform 1, an ultrasonic generator 2 is provided on one side of the circuit board placement platform 1, a cleaning tank 3 is fixedly installed on the top of the ultrasonic generator 2, a transducer 4 is provided on the top of the ultrasonic generator 2, a drive seat 5 is provided on the outside of the circuit board placement platform 1, a mounting frame 6 is provided on the top of the drive seat 5, an electric telescopic rod 7 is fixedly installed on the top of the mounting frame 6, a clamping frame 8 is fixedly installed at one end of the electric telescopic rod 7, a conveyor platform 9 is provided on one side of the mounting frame 6, and a drying box 10 is fixedly installed on the top of the conveyor platform 9.

[0024] Reference Figure 1 , Figure 2 and Figure 3 The ultrasonic generator 2 is connected to the transducer 4 via a cable, and the transducer 4 is fixedly installed at the bottom of the cleaning tank 3.

[0025] Specifically: By controlling the ultrasonic generator 2, it is possible to perform ultrasonic cleaning on the circuit board inside the cleaning tank 3.

[0026] Reference Figure 1 and Figure 2 The drive base 5 includes an electric slide rail 501 and a drive block 502. The drive base 5 is equipped with an electric slide rail 501 and a drive block 502. The electric slide rail 501 is electrically connected to an external power source through a wire. The drive block 502 is slidably connected to the electric slide rail 501. A mounting bracket 6 is fixedly installed on the top of the drive block 502.

[0027] Specifically: By controlling the operation of the electric slide rail 501, the movable displacement of the mounting bracket 6 can be easily adjusted.

[0028] Reference Figure 1 , Figure 2 and Figure 4The clamping frame 8 includes a motor 801, a bidirectional threaded rod 802, a limiting rod 803, a movable plate 804, and a clamping plate 805. The motor 801 is fixedly installed on one side of the clamping frame 8, and the bidirectional threaded rod 802 is provided at one end of the motor 801. The limiting rod 803 is fixedly installed inside the clamping frame 8. The movable plate 804 is provided inside the clamping frame 8, and the clamping plate 805 is fixedly connected to the bottom of the movable plate 804. The movable plate 804 is provided with threaded holes and through holes, and the inner diameter of the threaded holes and through holes are respectively adapted to the outer diameter of the bidirectional threaded rod 802 and the limiting rod 803. There are two clamping plates 805, which are symmetrically distributed at the bottom of the movable plate 804.

[0029] Specifically: It facilitates the clamping and placement of circuit boards, improving the level of automation in the work process.

[0030] Reference Figure 1 and Figure 5 The conveyor table 9 has a heating and drying plate 901 fixedly installed inside. Several heating and drying plates 901 are provided and symmetrically distributed inside the conveyor table 9. The drying box 10 includes a drying and heating wire mesh 1001 and a dryer 1002. The drying and heating wire mesh 1001 is fixedly installed inside the drying box 10, and the dryer 1002 is fixedly installed on the top of the drying box 10. The drying and heating wire mesh 1001 and the dryer 1002 are both electrically connected to an external power source through wires.

[0031] Specifically, it facilitates the rapid and uniform drying of the cleaned circuit boards, making them easier to use in subsequent processes.

[0032] The working principle and usage process of this utility model are as follows: The operator controls the electric slide rail 501 to work and the drive block 502 to adjust the displacement, which allows the mounting frame 6 to move left and right. By controlling the electric telescopic rod 7 to work, the clamping frame 8 is raised and lowered, which facilitates the clamping of the circuit board on the circuit board placement platform 1 and then placing it into the cleaning tank 3. By controlling the ultrasonic generator 2 to work, the circuit board inside the cleaning tank 3 can be quickly cleaned and impurities removed. After cleaning, the cleaned circuit board can be placed on the top of the conveyor table 9 through the clamping frame and transported through the conveyor table 9. A heating and drying plate 901 is set inside the conveyor table 9, and a drying box 10 is set on top of it to work together to facilitate the rapid heating and drying of the cleaned circuit board for subsequent use.

[0033] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A surface treatment and cleaning device for copper foil of high-frequency circuit boards, comprising a circuit board placement table (1), characterized in that: An ultrasonic generator (2) is provided on one side of the circuit board placement platform (1). A cleaning tank (3) is fixedly installed on the top of the ultrasonic generator (2). A transducer (4) is provided on the top of the ultrasonic generator (2). A drive seat (5) is provided on the outside of the circuit board placement platform (1). A mounting frame (6) is provided on the top of the drive seat (5). An electric telescopic rod (7) is fixedly installed on the top of the mounting frame (6). A clamping frame (8) is fixedly installed at one end of the electric telescopic rod (7). A conveyor table (9) is provided on one side of the mounting frame (6). A drying box (10) is fixedly installed on the top of the conveyor table (9).

2. The high-frequency circuit board copper foil surface treatment and cleaning device according to claim 1, characterized in that: The ultrasonic generator (2) is connected to the transducer (4) via a cable, and the transducer (4) is fixedly installed at the bottom of the cleaning tank (3).

3. The high-frequency circuit board copper foil surface treatment and cleaning device according to claim 1, characterized in that: The drive base (5) includes an electric slide rail (501) and a drive block (502). The drive base (5) is provided with an electric slide rail (501) inside. The electric slide rail (501) is provided with a drive block (502) inside. The electric slide rail (501) is electrically connected to an external power source through a wire. The drive block (502) is slidably connected to the electric slide rail (501). A mounting bracket (6) is fixedly installed on the top of the drive block (502).

4. The high-frequency circuit board copper foil surface treatment and cleaning device according to claim 1, characterized in that: The clamping frame (8) includes a motor (801), a bidirectional threaded rod (802), a limiting rod (803), a movable plate (804), and a clamping plate (805). The motor (801) is fixedly installed on one side of the clamping frame (8), and a bidirectional threaded rod (802) is provided at one end of the motor (801). A limiting rod (803) is fixedly installed inside the clamping frame (8). A movable plate (804) is provided inside the clamping frame (8), and a clamping plate (805) is fixedly connected to the bottom of the movable plate (804). A threaded hole and a through hole are provided inside the movable plate (804), and the inner diameter of the threaded hole and the through hole are respectively adapted to the outer diameter of the bidirectional threaded rod (802) and the limiting rod (803).

5. The high-frequency circuit board copper foil surface treatment and cleaning device according to claim 4, characterized in that: Two clamping plates (805) are provided and are symmetrically distributed at the bottom of the movable plate (804).

6. The high-frequency circuit board copper foil surface treatment and cleaning device according to claim 1, characterized in that: A heating and drying plate (901) is fixedly installed inside the conveyor table (9). Several heating and drying plates (901) are provided and symmetrically distributed inside the conveyor table (9).

7. The high-frequency circuit board copper foil surface treatment and cleaning device according to claim 1, characterized in that: The drying chamber (10) includes a drying and heating wire mesh (1001) and a dryer (1002). The drying and heating wire mesh (1001) is fixedly installed inside the drying chamber (10), and the dryer (1002) is fixedly installed on the top of the drying chamber (10). Both the drying and heating wire mesh (1001) and the dryer (1002) are electrically connected to an external power source through wires.

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