Heat conduction capillary structure and vapor chamber

Abstract

The utility model relates to the technical field of heat conduction devices, in particular to a heat conduction capillary structure and a vapor chamber. The heat-conducting capillary structure comprises a heat-conducting ring formed by powder sintering; a capillary structure is formed on the heat conducting ring; first seams are longitudinally formed in the heat conduction ring, and the first seams can be closed together. The heat-conducting ring is manufactured by sintering metal powder, and the capillary structure is formed on the heat-conducting ring, so that the heat-conducting ring has a good heat-conducting effect. The first seam is longitudinally formed in the heat conduction ring, so that the heat conduction ring can be sleeved on the heat conduction column more conveniently, the heat conduction ring can be tightly attached to the heat conduction column, and the heat conduction efficiency is improved. In addition, after the first seam is formed in the heat-conducting ring, demolding of the heat-conducting ring is more convenient.

Description

Technical Field

[0001] This utility model relates to the field of thermal conductive device technology, and in particular to a thermally conductive capillary structure and a heat spreader. Background Technology

[0002] A vapor chamber, also known as a heat spreader or superconducting heat spreader, functions and works on the same principle as a heat pipe. It utilizes the evaporation and condensation circulation of fluid within a sealed plate-shaped cavity to achieve rapid temperature uniformity, thereby enabling rapid heat conduction and diffusion. Some commercially available vapor chambers incorporate copper powder rings on their internal heat-conducting pillars to enhance heat transfer efficiency.

[0003] Copper powder rings are usually made using powder sintering molds. Because the copper powder rings are very small and their ring walls are closed rings, a draft angle is often set on the mold core (that is, the outer wall of the mold core is inclined) to facilitate demolding. This design leaves a certain gap between the copper powder ring and the heat-conducting pillar, resulting in poor assembly tightness and affecting heat conduction efficiency.

[0004] For example, Chinese patent application number CN202121432113.0 discloses a three-sided heat dissipation bent heat spreader, specifically disclosing that "the first copper powder ring is sleeved on the first copper pillar" and "the second copper powder ring is sleeved on the second copper pillar". After the copper powder ring and copper pillar are assembled, there is a certain gap between the copper powder ring and the copper pillar, resulting in poor assembly tightness and affecting the heat conduction efficiency.

[0005] For example, Chinese patent application number CN202420235885.2 discloses a bent heat spreader, which specifically discloses "a copper powder ring fitted on the first connecting post". After the copper powder ring and the first connecting post are assembled, there is a certain gap between the copper powder ring and the first connecting post, resulting in poor assembly tightness and affecting the heat conduction efficiency. Utility Model Content

[0006] In view of this, the present invention addresses the deficiencies of the existing technology and its main objective is to provide a heat-conducting capillary structure, which has a first slit longitudinally arranged on the heat-conducting ring, so that the heat-conducting ring can be tightly attached to the heat-conducting column, resulting in good assembly tightness and high heat conduction efficiency, thereby overcoming the shortcomings of the existing technology.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] This application provides a thermally conductive capillary structure, including a powder-sintered thermally conductive ring; a capillary structure is formed on the thermally conductive ring; a first slit is longitudinally disposed on the thermally conductive ring, and the first slit can be closed together.

[0009] Preferably, the heat-conducting ring can undergo plastic deformation, and the first seam closes together.

[0010] Preferably, the width of the first slit is between 0.1 mm and 1 mm, and the wall thickness of the heat-conducting ring is between 0.5 mm and 2 mm.

[0011] Preferably, the heat-conducting ring has at least two capillary structures, with the porosity of the inner capillary structure being greater than that of the outer capillary structure.

[0012] Preferably, the first seam has a first seam wall and a second seam wall, the first seam wall is provided with an inlet, and the second seam wall is provided with an inlet block, which is embedded in the inlet.

[0013] Preferably, the inlet is an arc-shaped inlet, and the inlet is an arc-shaped block.

[0014] Preferably, the first slit is inclined or perpendicular to the heat-conducting ring.

[0015] Preferably, the wall thickness of the heat-conducting ring gradually decreases from the first end to the second end.

[0016] Preferably, the powder is copper powder.

[0017] This application provides a heat spreader, including the aforementioned heat-conducting capillary structure; the edges of the top cover and the bottom cover are welded together, and a heat-conducting column is welded between the top cover and the bottom cover, with the heat-conducting ring sleeved on the heat-conducting column.

[0018] Compared with existing technologies, this invention has significant advantages and beneficial effects. Specifically, as shown in the above technical solution, the heat-conducting ring is made of sintered metal powder and has a capillary structure, resulting in excellent heat conduction. A first slit is longitudinally provided on the heat-conducting ring, allowing it to be more easily fitted onto the heat-conducting pillar, ensuring a tight fit and improving heat conduction efficiency. Furthermore, the first slit also facilitates demolding of the heat-conducting ring. Attached Figure Description

[0019] Figure 1 This is a front view schematic diagram of one embodiment of the present utility model.

[0020] Figure 2 This is a top view schematic diagram of one embodiment of the present utility model.

[0021] Figure 3 This is a top view schematic diagram of one embodiment of the present utility model.

[0022] Figure 4 This is a top view schematic diagram of Embodiment 2 of this utility model.

[0023] Figure 5 This is a cross-sectional schematic diagram of Embodiment 2 of this utility model.

[0024] Figure 6 This is an exploded view of Embodiment 3 of this utility model.

[0025] Explanation of reference numerals in the attached diagram:

[0026] 10. Heat-conducting ring; 11. First seam; 12. Insert; 13. Insert block; 20. Top cover; 21. Bottom cover; 22. Chamber; 23. Heat-conducting column. Detailed Implementation

[0027] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0028] Example 1

[0029] Please refer to Figures 1 to 3 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, which is a thermally conductive capillary structure.

[0030] The heat-conducting ring 10 is provided with a first slit 11, which facilitates mold demolding and allows the heat-conducting ring 10 to fit tightly against the heat-conducting pillar 23 when it is assembled, thereby improving the heat conduction efficiency.

[0031] This application provides a thermally conductive capillary structure, including a powder-sintered thermally conductive ring 10; a capillary structure is formed on the thermally conductive ring 10; a first slit 11 is longitudinally arranged on the thermally conductive ring 10, and the first slit 11 can be closed together. The thermally conductive ring 10 can undergo plastic deformation, and the first slit 11 closes together. The first slit 11 is inclined or perpendicular to the thermally conductive ring 10. The first slit 11 can be perpendicular to the thermally conductive ring 10, or it can be inclined to the copper powder ring. When the first slit 11 is inclined, after the first slit 11 is closed, there will also be friction between the inner walls of the first slit 11, making it more secure. In this embodiment, the first slit 11 is perpendicular to the thermally conductive ring 10. When assembling the heat spreader, the thermally conductive ring 10 is fitted onto the thermally conductive column 23, and then the thermally conductive ring 10 is clamped down, the thermally conductive ring 10 undergoes plastic deformation, and the thermally conductive ring 10 can be tightly fitted onto the thermally conductive column 23. Of course, the inner diameter of the heat-conducting ring 10 can be the same as the diameter of the heat-conducting column 23. Furthermore, due to the presence of the first slit 11, the heat-conducting ring 10 can be easily fitted onto the heat-conducting column 23. The main function of the capillary structure is to guide the working fluid to circulate within the heat-dissipating plate. The heat-conducting ring 10 can also have a certain degree of elasticity; during assembly, it is only necessary to fit the heat-conducting ring 10 onto the heat-conducting column 23, simply wrapping around it.

[0032] In this embodiment, the heat-conducting ring 10 is made using a powder sintering process for copper powder rings. Copper powder and other mixed materials are placed into a mold and sintered to produce the heat-conducting ring 10.

[0033] Preferably, the width of the first slit 11 is between 0.1mm and 1mm, and the wall thickness of the heat-conducting ring 10 is between 0.5mm and 2mm. The width of the first slit 11 is very small, and can be any number among 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.8mm, and 1.0mm. The first slit 11 facilitates the demolding of the heat-conducting ring 10 and its assembly, while also ensuring a close fit between the heat-conducting ring 10 and the heat-conducting pillar 23.

[0034] Example 2

[0035] Example 2 is largely the same as Example 1 in terms of structure. The structure and principle of the same parts will not be repeated. The specific differences are as follows:

[0036] Please refer to Figure 4 As shown, the first slit 11 has a first slit wall and a second slit wall. A notch 12 is provided on the first slit wall, and a block 13 is provided on the second slit wall. The block 13 is embedded in the notch 12. Preferably, the notch 12 is an arc-shaped opening, and the block 13 is an arc-shaped block. When the heat-conducting ring 10 is clamped and the first slit 11 closes, the block 13 is embedded in the notch 12. This design allows the heat-conducting ring 10 to close more tightly, preventing it from loosening and resulting in a better assembly effect.

[0037] Please refer to Figure 5 As shown, preferably, the wall thickness of the heat-conducting ring 10 gradually decreases from the first end to the second end. In this design, the heat-conducting ring 10 is larger at the top and smaller at the bottom. The upper end of the heat-conducting ring 10 corresponds to the heat dissipation area, the low-temperature area, while the lower end corresponds to the heat absorption area, the heat source area. This design allows the cold medium to return to the heat source area more quickly.

[0038] Preferably, the heat-conducting ring 10 has at least two capillary structures, with the porosity of the inner capillary structure being greater than that of the outer capillary structure. The capillary structure can have multiple layers; in this embodiment, it has two layers, with the inner layer having a higher porosity than the outer layer. This design allows the refrigerant to quickly return to the heat source along the inner capillary structure. Simultaneously, the multi-layered capillary structure design, in addition to accelerating refrigerant flow, also prevents interference from external heat sources, resulting in more distinct thermal zoning.

[0039] Example 3

[0040] Example 3 utilizes the thermally conductive capillary structure from Example 1 or Example 2 to fabricate a heat spreader. Please refer to... Figure 6The vapor chamber shown includes a heat-conducting capillary structure. The edges of a top cover 20 and a bottom cover 21 are welded together, and a heat-conducting column 23 is welded between the top cover 20 and the bottom cover 21. A heat-conducting ring 10 is fitted onto the heat-conducting column 23. The edges of the top cover 20 and the bottom cover 21 can be welded together using reflow soldering or laser soldering. The heat-conducting column 23 is welded to the top cover 20 and the bottom cover 21 using reflow soldering. After welding, a chamber 22 is formed inside the top cover 20 and the bottom cover 21, and a refrigerant, such as water, alcohol, acetone, etc., is injected into the chamber 22. The bottom cover 21 is connected to a heat source for heat absorption. The top cover 20 is used for heat dissipation and is connected to a radiator for rapid heat dissipation. The heat-conducting ring 10 can be threaded onto the heat-conducting column 23 manually or mechanically. The heat-conducting ring 10 is threaded through the heat-conducting column 23, and then the clamp gently pinches the heat-conducting ring 10 to close the first slit 11, so that the heat-conducting ring 10 and the heat-conducting column 23 are tightly fitted together.

[0041] In summary, the key design feature of this utility model is that the first slot 11 of the heat-conducting ring 10 not only facilitates mold demolding and assembly, but also allows the heat-conducting ring 10 to fit tightly against the heat-conducting pillar 23 when it is assembled, thereby improving the heat conduction efficiency.

[0042] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A thermally conductive wicking structure, characterized by: A heat conducting ring comprising powder sintering; The heat conducting ring is provided with a capillary structure, and is provided with a first slit in a longitudinal direction, and the first slit can be closed together; the heat conducting ring can be plastically deformed, and the first slit is closed together.

2. A thermosyphon according to claim 1, characterized in that: The width of the first slit is between 0.1mm and 1mm, and the wall thickness of the heat conducting ring is between 0.5mm and 2mm.

3. A thermosyphon according to claim 1, characterized in that: The heat conducting ring is provided with at least two layers of capillary structures, and the porosity of the inner capillary structure is greater than that of the outer capillary structure.

4. A thermosyphon according to claim 1, characterized in that: The first slit is provided with a first slit wall and a second slit wall, the first slit wall is provided with a notch, and the second slit wall is provided with a block, and the block is embedded in the notch.

5. A thermosyphon according to claim 4, characterized in that: The notch is an arc-shaped notch, and the block is an arc-shaped block.

6. A thermosyphon according to claim 1, characterized in that: The first slit is inclined or perpendicular to the heat conducting ring.

7. A thermosyphon according to claim 1, characterized in that: The wall thickness of the heat conducting ring gradually decreases from the first end to the second end of the heat conducting ring.

8. A thermosyphon according to any of claims 1 to 7, characterized in that: The powder is copper powder.

9. A vapor chamber, characterized by: A heat conducting capillary structure according to any one of claims 1-8; the edges of the top cover and the bottom cover are welded together, the heat conducting column is welded between the top cover and the bottom cover, and the heat conducting ring is sleeved on the heat conducting column.

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