Improved radiator assembly structure
By setting an alignment structure and clearance opening between the heatsink and the bracket, installation can be achieved without disassembling the fan, solving the problems of complex installation and easily damaged components in the prior art, and improving installation efficiency and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG YAJUN COMPUTER DEV CO LTD
- Filing Date
- 2025-04-23
- Publication Date
- 2026-04-14
AI Technical Summary
Existing air-cooled radiators require the fan to be removed before installation, making the installation process complicated, time-consuming, and labor-intensive, and easily damaging surrounding components.
An improved heatsink assembly structure was designed, wherein the heatsink body is aligned with the bracket, the bracket has mounting holes, and the heatsink has clearance openings, allowing it to be installed on the motherboard without removing the fan and secured with bolts.
The installation process has been simplified, the installation difficulty has been reduced, the installation efficiency has been improved, and the risk of component damage has been reduced, making it especially suitable for novice users.
Smart Images

Figure CN224122963U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer accessory research and development design technology, and in particular to an improved heat sink assembly structure. Background Technology
[0002] An air-cooled radiator is a device for dissipating heat from electronic devices. Its core function is to quickly conduct and dissipate the heat generated during the operation of the device, thereby ensuring that the device operates stably within a safe temperature range.
[0003] However, most common heat sinks on the market mount the fan on one side of the heat sink. This design makes it easy to replace or clean the fan separately, but because the fan blocks the mounting holes of the bracket, the fan must be removed before the heat sink can be installed. This makes the installation process troublesome and complicated, time-consuming and laborious, and not user-friendly for novice users. In addition, the removal of the fan can easily damage surrounding components. Therefore, further improvements to the existing technology are needed. Summary of the Invention
[0004] The purpose of this utility model is to provide an improved radiator assembly structure designed to solve at least one technical problem in the background art.
[0005] To achieve the above objectives, the present invention adopts the following solution: an improved radiator assembly structure, including a radiator body and a bracket, wherein the radiator body is assembled on the bracket and the radiator body and the bracket are aligned and aligned, the bracket is provided with mounting holes for mounting bolts, and the radiator body is provided with clearance openings corresponding to the mounting holes.
[0006] Wherein, one side of the radiator body is aligned with one side of the bracket; or the center of the radiator body is aligned with the center of the bracket.
[0007] The radiator body includes a first heat sink, a second heat sink, and a heat pipe, wherein the first heat sink and the second heat sink are respectively mounted on the heat pipe.
[0008] The first heat sink and the second heat sink are in one or more sets, and the multiple sets of the first heat sink and the second heat sink are alternately assembled on the heat pipe;
[0009] and / or
[0010] Multiple sets of the first heat sink and the second heat sink are assembled alternately on the heat pipe.
[0011] The recessed opening is recessed from one side of the first heat sink into the interior of the first heat sink.
[0012] The second heat sink has an arc-shaped surface corresponding to the relief opening.
[0013] The radiator body includes a heat sink base, on which a mounting groove corresponding to the heat sink pipe is provided, and the heat sink pipe is at least partially assembled in the mounting groove.
[0014] The heat sink is provided with a fixing groove corresponding to the bracket, and the bracket is at least partially assembled in the fixing groove.
[0015] This includes a motherboard, and the bracket is assembled onto the motherboard by bolts engaging with the mounting holes.
[0016] This includes a cooling fan, which is mounted on the side wall of the radiator body and located on one side of the relief opening.
[0017] The advantages of this utility model are: the structure of this application can be installed on the motherboard without disassembling the fan, which simplifies the installation process, reduces the difficulty of installation, reduces the number of installation steps, and improves the efficiency of installation, enabling users to complete the installation more quickly and conveniently, making it easier for novice users to use, and reducing the risk of damage to surrounding components during the installation process. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the improved radiator assembly structure. Figure 1 ;
[0019] Figure 2 This is a schematic diagram of the improved radiator assembly structure. Figure 2 ;
[0020] Figure 3 This is a schematic diagram of the structure of the first heat sink;
[0021] Figure 4 This is a schematic diagram of the second heat sink;
[0022] Figure 5 This is a schematic diagram of the improved radiator assembly structure. Figure 3 ;
[0023] Figure 6 This is a schematic diagram of the improved radiator assembly structure. Figure 4 . Detailed Implementation
[0024] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so as to intuitively and vividly understand each technical feature and overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.
[0025] In the description of this utility model, if directional descriptions are involved, such as "up," "down," "front," "back," "left," "right," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing this utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. When a feature is referred to as "set," "fixed," or "connected" to another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, or connected to the other feature.
[0026] In the description of this utility model, the term "several" means one or more, and "multiple" means two or more. The terms "greater than," "less than," and "exceeding" should be understood as excluding the stated number. The terms "above," "below," and "within" should be understood as including the stated number. The terms "first" and "second" should be understood as distinguishing technical features and not as indicating or implying relative importance, the quantity of indicated technical features, or the sequential relationship between indicated technical features.
[0027] Furthermore, unless otherwise defined, the technical and scientific terms used in this invention have the same meanings as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for the purpose of describing particular embodiments only and not for limiting the invention. It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof.
[0028] Example: Figure 1-6As shown, the improved heatsink assembly structure includes a heatsink body 1 and a bracket 2. The heatsink body 1 is mounted on the bracket 2 and the heatsink body 1 and the bracket 2 are aligned. The bracket 2 is provided with mounting holes 20 for mounting bolts, and the heatsink body 1 is provided with clearance openings 10 corresponding to the mounting holes 20. The structure of this application can be installed on the motherboard without disassembling the fan, which simplifies the installation process, reduces the difficulty of installation, reduces the number of installation steps, and improves the efficiency of installation. This allows users to complete the installation more quickly and conveniently, making it easier for novice users to use and reducing the risk of damage to surrounding components during installation.
[0029] The heatsink body has one side aligned with one side of the bracket; or the center of the heatsink body is aligned with the center of the bracket. This allows the heatsink to be installed on the motherboard without removing the fan, simplifying the installation process, reducing the difficulty of installation, reducing the number of installation steps, and improving the efficiency of installation. This allows users to complete the installation more quickly and conveniently, making it easier for novice users to use and reducing the risk of damage to surrounding components during installation.
[0030] The radiator body 1 includes a first heat sink 11, a second heat sink 12, and a heat pipe 13. The first heat sink 11 and the second heat sink 12 are respectively mounted on the heat pipe 13. The first heat sink 11 and the second heat sink 12 have one or more sets, and multiple sets of the first heat sink 11 and the second heat sink 12 are alternately mounted on the heat pipe 13.
[0031] and / or
[0032] Multiple sets of the first heat sink 11 and the second heat sink 12 are assembled alternately on the heat pipe 13 to reduce the air intake resistance of the fan.
[0033] The recess 10 is recessed from one side of the first heat sink 11 into the interior of the first heat sink 11. The recess allows the fan to be installed on the motherboard without disassembling it, simplifying the installation process, reducing the difficulty of installation, reducing the number of installation steps, improving the efficiency of installation, enabling users to complete the installation more quickly and conveniently, making it easier for novice users to use, and reducing the risk of damage to surrounding components during installation.
[0034] The second heat sink 12 is provided with an arc-shaped surface 121 corresponding to the relief opening 10, and the arc-shaped surface is provided to prevent the second heat sink from blocking the relief opening.
[0035] The heat sink body 1 includes a heat sink base 14, on which a mounting groove 140 corresponding to the heat sink pipe 13 is provided. The heat sink pipe 13 is at least partially assembled in the mounting groove 140. The heat sink base 14 is placed below the first heat sink 11 and / or the second heat sink 12. The heat sink base is provided so that the heat sink body can contact the central processing unit.
[0036] The heat sink 14 is provided with a fixing groove 141 corresponding to the bracket 2. The bracket 2 is at least partially assembled in the fixing groove 141, so that the heat sink body can be assembled with the bracket.
[0037] This includes a motherboard, and the bracket 2 is assembled onto the motherboard by bolts engaging with the mounting holes 20.
[0038] This includes a cooling fan, which is mounted on the side wall of the radiator body 1 and located on one side of the relief opening 10. The fan enhances the heat dissipation effect, accelerates airflow, and thus improves heat dissipation efficiency.
[0039] The heat sink 14 is provided with a first connecting hole 142, and the bracket 2 is provided with a second connecting hole 21 corresponding to the first connecting hole 142. Bolts are installed in the first connecting hole 142 and the second connecting hole 21 so that the heat sink body can be assembled with the bracket.
[0040] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. An improved heat sink assembly structure comprising a heat sink body, a bracket, characterized in that: The heat-dissipating body is assembled on the support and is arranged in alignment with the support, the support is provided with a mounting hole for assembling a bolt, and the heat-dissipating body is provided with a clearance opening corresponding to the mounting hole.
2. The improved heat sink assembly structure according to claim 1, wherein: One side of the heat-dissipating body is arranged in alignment with one side of the support, or the center of the heat-dissipating body is arranged in alignment with the center of the support.
3. The improved heat sink assembly structure according to claim 1, wherein: The heat-dissipating body comprises a first heat-dissipating fin, a second heat-dissipating fin and a heat-dissipating pipe, and the first heat-dissipating fin and the second heat-dissipating fin are respectively assembled on the heat-dissipating pipe.
4. The improved heat sink assembly structure according to claim 3, wherein: The first heat-dissipating fin and the second heat-dissipating fin have one or more groups, and multiple groups of the first heat-dissipating fin and the second heat-dissipating fin are alternately assembled on the heat-dissipating pipe. And / or Multiple groups of the first heat-dissipating fin and the second heat-dissipating fin are spaced apart and assembled on the heat-dissipating pipe.
5. The improved heat sink assembly structure according to claim 3, wherein: The clearance opening is recessed from one side of the first heat-dissipating fin to the inside of the first heat-dissipating fin.
6. The improved heat sink assembly structure according to claim 3, wherein: The second heat-dissipating fin is provided with an arc surface portion corresponding to the clearance opening.
7. The improved heat sink assembly structure according to claim 3, wherein: The heat-dissipating body comprises a heat-dissipating seat, the heat-dissipating seat is provided with a mounting groove corresponding to the heat-dissipating pipe, and the heat-dissipating pipe is at least partially assembled in the mounting groove.
8. The improved heat sink assembly structure according to claim 7, wherein: The heat-dissipating seat is provided with a fixing groove corresponding to the support, and the support is at least partially assembled in the fixing groove.
9. The improved heat sink assembly structure of claim 1, wherein: The support is assembled on a mainboard through cooperation of the bolt and the mounting hole.
10. The improved heat sink assembly structure according to any one of claims 1-9, wherein: The heat-dissipating fan is assembled on the side wall of the heat-dissipating body and located at one side of the clearance opening.