Special-shaped sealing ring for LED (Light Emitting Diode) tray of semiconductor machine
By setting deformation holes and protrusion structures inside the sealing ring, the problems of small contact surface and high radial deformation force of the sealing ring are solved, achieving better sealing and fixing effects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-22
- Publication Date
- 2026-04-14
AI Technical Summary
The existing sealing ring structure is a solid circle, which results in a small contact surface and high pressure, making it difficult to achieve a good sealing effect, and the force required for radial deformation is high.
The design incorporates a uniquely shaped sealing ring for the LED tray of a semiconductor equipment. The ring features internal deformation holes and protrusions to enhance deformation capabilities and disperse pressure through the protrusions, creating a high-pressure zone to prevent external air from entering.
It improves the deformation capacity and sealing performance of the sealing ring, prevents excessive local pressure, and enhances the stability and sealing effect of the wafer.
Smart Images
Figure CN224124564U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor sealing ring technology, and in particular to a special-shaped sealing ring for LED trays of semiconductor equipment. Background Technology
[0002] The manufacture of each semiconductor product requires hundreds of processes. The entire manufacturing process is divided into eight steps: wafer fabrication, oxidation, photolithography, etching, thin film deposition, interconnection, testing, and packaging. The purpose of all these steps is to fabricate the required circuit structure on the wafer to form a chip.
[0003] During wafer fabrication, the wafer needs to be fixed within the semiconductor equipment. To allow for processing space, adsorption is often used to secure one side of the wafer. Common adsorption methods include mechanical vacuum adsorption, electrostatic adsorption, and Bernoulli chucks, with mechanical vacuum adsorption being the most common. A vacuum pump creates a negative pressure environment by evacuating air from the adsorption area, thus reducing the pressure and creating a vacuum zone between the wafer and the adsorption plate. A sealing ring is typically required to ensure a tight seal in the adsorption area, preventing outside air from entering. This generates sufficient suction to stably hold the wafer.
[0004] Current sealing rings have a relatively simple structure, consisting of a solid circular cross-section. The small contact area with the wafer results in high pressure on the wafer. Furthermore, the solid circular cross-section requires a high force to cause radial deformation of the sealing ring, making it difficult to achieve a strong sealing capability. Utility Model Content
[0005] To overcome the problems that most sealing rings have a relatively simple structure, are rings with a solid circular cross-section, have a small contact area with the wafer, resulting in high pressure on the wafer, and have a solid circular cross-section, which means that the sealing ring requires a high force to produce radial deformation, making it difficult for the sealing ring to achieve a strong sealing ability.
[0006] The technical solution of this utility model is as follows: a special-shaped sealing ring for an LED tray of a semiconductor machine, including a sealing ring body and a deformation hole. A wafer is arranged on the top of the sealing ring body, and a vacuum suction cup for adsorbing and fixing the wafer is arranged on the bottom of the sealing ring body. An installation groove for installing the sealing ring body is opened at the connection between the vacuum suction cup and the sealing ring body. A deformation hole is opened on the inner side of the sealing ring body. First protrusions are arranged on the upper and lower sides of the sealing ring body, and second protrusions are arranged on the inner and outer sides of the sealing ring body.
[0007] Preferably, the sealing ring body is made of elastic material and is circular, and the deformation hole is also circular along with the sealing ring body.
[0008] Preferably, the sealing ring body has a connecting hole, which is equidistant from each other around the circumference and penetrates the sealing ring body.
[0009] Preferably, the first protrusion is located at the upper and lower edges of the sealing ring body, and the connecting hole is located in the middle of the sealing ring body.
[0010] Preferably, the second protrusion is located at the lower part of the sealing ring body and inside the mounting groove.
[0011] Preferably, the center of the deformable hole is at the same horizontal level as the center of the second protrusion.
[0012] Preferably, the first protrusion forms a sealed chamber after contacting the vacuum suction cup or vacuum suction cup.
[0013] The beneficial effects of this utility model are:
[0014] By creating deformation holes inside the sealing ring body, the sealing ring body is made easier to deform. The first protrusions on the upper and lower sides of the sealing ring body disperse the pressure and prevent excessive local pressure on the wafer. At the same time, the space formed by the two sets of first protrusions and the wafer or vacuum chuck can retain a certain amount of air. When the sealing ring body is deformed under pressure, a high-pressure zone can be generated to prevent external air from entering, thereby enhancing the sealing performance. Attached Figure Description
[0015] Figure 1 The diagram shown is a three-dimensional structural schematic of this utility model;
[0016] Figure 2 The diagram shown is a three-dimensional structural schematic of the sealing ring body of this utility model;
[0017] Figure 3 The diagram shown is a three-dimensional cross-sectional view of the sealing ring body of this utility model.
[0018] Figure 4 The diagram shown is a schematic cross-sectional planar structure of the sealing ring body of this utility model in its conventional state.
[0019] Figure 5 The diagram shown is a cross-sectional planar structure of the sealing ring body in a compressed state according to this utility model.
[0020] Explanation of reference numerals in the attached drawings: 1. Sealing ring body; 101. First protrusion; 102. Second protrusion; 103. Connecting hole; 104. Deformation hole; 105. Chamber; 2. Vacuum chuck; 201. Mounting groove; 3. Wafer. Detailed Implementation
[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0022] Please see Figures 1-5This utility model provides an embodiment of a special-shaped sealing ring for an LED tray of a semiconductor machine, including a sealing ring body 1 and a deformation hole 104. A wafer 3 is disposed on the top of the sealing ring body 1, and a vacuum suction cup 2 for adsorbing and fixing the wafer 3 is disposed on the bottom of the sealing ring body 1. An installation groove 201 for installing the sealing ring body 1 is provided at the connection between the vacuum suction cup 2 and the sealing ring body 1. A deformation hole 104 is provided on the inner side of the sealing ring body 1. First protrusions 101 are provided on the upper and lower sides of the sealing ring body 1, and second protrusions 102 are provided on the inner and outer sides of the sealing ring body 1. By opening the deformation hole 104 inside the sealing ring body 1, the sealing ring body 1 is easier to deform. The first protrusions 101 on the upper and lower sides of the sealing ring body 1 disperse the pressure and prevent the local pressure on the wafer 3 from being too high. At the same time, the space formed by the two sets of first protrusions 101 and the wafer 3 or the vacuum suction cup 2 can retain a certain amount of air. When the sealing ring body 1 is deformed under pressure, a high-pressure zone can be generated to prevent external air from entering, thereby enhancing the sealing performance.
[0023] Please see Figures 3-4 In this embodiment, the sealing ring body 1 has a connecting hole 103. The connecting holes 103 are equidistant around the circumference and penetrate the sealing ring body 1. After the first protrusion 101 contacts the vacuum suction cup 2, a sealed chamber 105 is formed. The connecting hole 103 connects and communicates the deformation hole 104 with the chamber 105 formed by the first protrusion 101 on the upper and lower sides.
[0024] When the vacuum chuck 2 adsorbs and fixes the wafer 3, the wafer 3 is pulled downward by the suction force and squeezes the sealing ring body 1. The sealing ring body 1 is deformed by the force, and the circular deformation hole 104 becomes elliptical. At the same time, the second protrusion 102 is squeezed out laterally and comes into close contact with the mounting groove 201 to enhance the sealing performance. While the sealing ring body 1 is deformed by pressure, the space between the chamber 105 and the connecting hole 103 becomes smaller, so that the air pressure in the chamber 105 is higher than that in the outside, forming a barrier to prevent the gas outside the sealing ring body 1 from entering the inside of the sealing ring body 1, thereby enhancing the sealing performance of the sealing ring body 1.
[0025] Through the above steps, by opening deformation holes 104 inside the sealing ring body 1, the sealing ring body 1 is made easier to deform. The first protrusions 101 on the upper and lower sides of the sealing ring body 1 disperse the pressure and prevent the local pressure of the wafer 3 from being too high. At the same time, the space formed by the two sets of first protrusions 101 and the wafer 3 or vacuum chuck 2 can retain a certain amount of air. When the sealing ring body 1 is deformed under pressure, a high-pressure zone can be generated to prevent external air from entering, thereby enhancing the sealing performance.
Claims
1. A special-shaped sealing ring for an LED tray of a semiconductor machine, comprising a sealing ring body (1); characterized in that: It also includes a deformation hole (104), a wafer (3) is provided on the top of the sealing ring body (1), a vacuum chuck (2) for adsorbing and fixing the wafer (3) is provided on the bottom of the sealing ring body (1), an installation groove (201) for installing the sealing ring body (1) is provided at the connection between the vacuum chuck (2) and the sealing ring body (1), a deformation hole (104) is provided on the inner side of the sealing ring body (1), a first protrusion (101) is provided on the upper and lower sides of the sealing ring body (1), and a second protrusion (102) is provided on the inner and outer sides of the sealing ring body (1).
2. The irregular-shaped sealing ring for the LED tray of a semiconductor machine according to claim 1, characterized in that: The sealing ring body (1) is made of elastic material and is circular, and the deformation hole (104) is also circular along with the sealing ring body (1).
3. The irregularly shaped sealing ring for the LED tray of a semiconductor machine according to claim 1, characterized in that: The sealing ring body (1) has a connecting hole (103), which is equidistant from each other around the circumference and penetrates the sealing ring body (1).
4. The irregularly shaped sealing ring for the LED tray of a semiconductor machine according to claim 3, characterized in that: The first protrusion (101) is located at the upper and lower edges of the sealing ring body (1), and the connecting hole (103) is located in the middle of the sealing ring body (1).
5. The irregularly shaped sealing ring for the LED tray of a semiconductor machine according to claim 1, characterized in that: The second protrusion (102) is located on the lower part of the sealing ring body (1) and inside the mounting groove (201).
6. The irregularly shaped sealing ring for the LED tray of a semiconductor machine according to claim 1, characterized in that: The center of the deformable hole (104) is at the same horizontal level as the center of the second protrusion (102).
7. The irregularly shaped sealing ring for the LED tray of a semiconductor machine according to claim 1, characterized in that: After the first protrusion (101) comes into contact with the vacuum chuck (2) or the vacuum chuck (2), a sealed chamber (105) is formed.