Core module bonding pad for electronic component integration

Abstract

The utility model relates to the technical field of modules, in particular to a core module bonding pad for electronic component integration. Comprising a module main board, the module main board is provided with external expansion interface assemblies packaged by stamp holes, the external expansion assemblies are arranged on the periphery of the module main board, and the module main board is provided with a processor and an antenna interface assembly used for being connected with an antenna; according to the utility model, the external expansion interface assembly packaged by the stamp hole is adopted, the production difficulty and the production cost are reduced, the common communication function is integrated, charging, backlight, an indicating lamp, a flash lamp and a display screen high-low voltage circuit are integrated in one IC, the design without the IC at the periphery can be realized, only required functional devices are added, the integration level is high, and the design is simple. The module mainboard adopting the ten-layer HDI gold immersion technology can have good electrical characteristics and anti-interference characteristics, and work is stable and reliable.

Description

Technical Field

[0001] This utility model belongs to the field of module technology, and specifically relates to a core module pad for electronic component integration. Background Technology

[0002] The core module is an electronic motherboard that encapsulates core functions. It integrates chips, memory, and power amplifier devices, and provides standard interfaces. These interfaces mainly include LCD circuits, camera circuits, USB circuits, SIM circuits, keyboard circuits, and other interface circuits. It has a built-in main control chip, memory, and communication module. Various terminals use the module to achieve different functions such as communication or positioning. The core module is widely used in POS, PDA, smart home, vehicle networking, medical devices, video surveillance, food traceability, and other industrial control fields.

[0003] The core module has poor electrical and anti-interference characteristics, is not stable and reliable during operation, and is cumbersome to operate when expanding the module. In addition, the module has low integration and simple functions, and has high processing and operating costs. Therefore, we need to propose a core module pad for electronic component integration to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a core module pad for electronic component integration. By improving the structure of the new core module, various functional interfaces are provided in the form of stamp holes, thereby achieving functional integration and miniaturization, and solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a core module pad for electronic component integration, including a module motherboard, wherein an external expansion interface component with stamp hole encapsulation is provided on the module motherboard, the external expansion interface component is disposed around the module motherboard, and a processor and an antenna interface component for connecting an antenna are provided on the module motherboard.

[0006] The external expansion interface component includes multiple stamp hole pins, which are located around the perimeter of the module motherboard and are equidistant from each other.

[0007] The stamp hole pins have a total of 162 pins.

[0008] Furthermore, the stamp hole pins on the left side of the module motherboard are respectively pin 1 for connecting the tri-color LED, pin 2 for connecting NFC, pin 3 for connecting the two serial ports, pin 4 for connecting SPI0, pin 5 for connecting the three I²C ports, and pin 6 for connecting the CTP.

[0009] Furthermore, the stamp hole pins on the lower side of the module motherboard are respectively pin 7 for connecting 2 SIM cards, pin 8 for connecting T cards, pin 9 for connecting LCM, and pin 10 for connecting audio headphones.

[0010] Furthermore, the stamp hole pins on the right side of the module motherboard are respectively pin 11 for connecting the three-in-one sensor, pin 12 for connecting SPI2, and pin 13 for connecting the button matrix.

[0011] Furthermore, the stamp hole pins on the upper side of the module motherboard are respectively pin 14 for connecting the front camera, pin 15 for connecting the flash, pin 16 for connecting the soft barcode, and pin 16 for connecting the rear camera.

[0012] Furthermore, the module motherboard is a module motherboard using a ten-layer HDI immersion gold process, and the dimensions of the module motherboard are 50mm*42mm*3.0mm.

[0013] Furthermore, the antenna interface assembly includes three sets of radio frequency connector interfaces for connecting the main antenna, diversity antenna and three-in-one antenna, and the three sets of radio frequency connector interfaces are respectively located at the three corners of the module motherboard.

[0014] The beneficial effects of this utility model are:

[0015] 1. This utility model adopts an external expansion interface component with stamp hole packaging, which reduces production difficulty and production cost. It not only integrates the usual communication functions, but also integrates charging circuit, audio power amplifier and backlight circuit. It can realize a completely IC-free design, only adding connectors is required. It has high integration and simple design.

[0016] 2. The module motherboard of this utility model adopts a ten-layer HDI immersion gold process, which enables the module motherboard to have good electrical characteristics and anti-interference characteristics, and to work stably and reliably.

[0017] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the module stacking structure and pin order of this utility model;

[0020] Figure 2 For the present utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0021] Figure 3 For the present utility model Figure 1 Enlarged structural diagram at point B;

[0022] Figure 4 For the present utility model Figure 1 Enlarged structural diagram at point C.

[0023] In the diagram: 1. Module motherboard; 2. RF connector interface; 3. Stamp hole pin. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] Please see Figure 1-4 This utility model provides a technical solution:

[0026] This utility model embodiment provides a core module pad for electronic component integration.

[0027] The system includes a module motherboard 1, on which an external expansion interface component with a stamp hole encapsulation is provided. The external expansion interface component is disposed around the perimeter of the module motherboard 1. The module motherboard 1 is provided with a processor and an antenna interface component for connecting an antenna.

[0028] The external expansion interface component includes multiple stamp hole pins 3, which are located around the perimeter of the module motherboard 1, and the multiple stamp hole pins 3 around the perimeter of the module motherboard 1 are equidistant.

[0029] With external expansion interface components, the high integration enables a completely IC-free design. It comes with built-in WIFI, Bluetooth, GPS, USB, UART, SPI, I2C, GPIO, and NFC functions, offering rich functionality. The pins use a stamp hole process, reducing production difficulty and cost. In addition to the usual communication functions, it also integrates charging circuits, audio power amplifiers, and backlight circuits, enabling a completely IC-free design with only connectors required. It boasts high integration and a simple design.

[0030] The processor used is the MT6765 processor.

[0031] The stamp hole pins 3 on the left side of the main board 1 of the module are respectively: pin 1 for connecting the tri-color LED, pin 2 for connecting NFC, pin 3 for connecting the two serial ports, pin 4 for connecting SPI0, pin 5 for connecting the three I²C ports, and pin 6 for connecting the CTP.

[0032] Pin 1 is Figure 1 Pins 1-3, pin 2 is Figure 1 Pins 4-7 in the diagram, pin 3 is... Figure 1 Pins 8-11 in the diagram, pin 4 is... Figure 1 Pins 11-15 in the diagram, pin 5 is... Figure 1 Pins 16-21, pin 6 is Figure 1 Foot 26-29.

[0033] The stamp hole pins 3 on the lower side of the main board 1 are pin 7 for connecting two SIM cards, pin 8 for connecting a T card, pin 9 for connecting an LCM, and pin 10 for connecting an audio headset.

[0034] Pin 7 is Figure 1 Pins 34-41 in the diagram, pin 8 is... Figure 1 Pins 43-48 in the diagram, pin 9 is... Figure 1 Pins 49-65 in the diagram, pin 10 is... Figure 1 Foot 68-78.

[0035] The stamp hole pins 3 on the right side of the main board 1 of the module are pin 11 for connecting the three-in-one sensor, pin 12 for connecting SPI2, and pin 13 for connecting the button matrix.

[0036] The pin 11 is Figure 1 Pins 96-101 in the diagram, pin 12 is... Figure 1 Pins 102-105 in the diagram, pin 13 is... Figure 1 Foot 106-116 in the middle.

[0037] The stamp hole pins 3 on the upper side of the main board 1 of the module are pin 14 for connecting the front camera, pin 15 for connecting the flash, pin 16 for connecting the soft barcode, and pin 16 for connecting the rear camera.

[0038] Pin 14 is Figure 1 Pins 117-128 in the diagram, pin 15 is... Figure 1 Pin 136 in the middle, pin 16 is Figure 1 Pins 145-150 in the diagram, pin 17 is... Figure 1 Feet 151-162 in the middle.

[0039] The module motherboard 1 is a module motherboard 1 using a ten-layer HDI immersion gold process, and the dimensions of the module motherboard 1 are 50mm*42mm*3.0mm.

[0040] The mainboard 1 adopts a ten-layer HDI immersion gold process, which has good electrical characteristics and anti-interference characteristics, and is stable and reliable in operation.

[0041] The antenna interface assembly includes three sets of RF connector interfaces 2 for connecting the main antenna, diversity antenna and three-in-one antenna. The three sets of RF connector interfaces 2 are located at the three corners of the main board 1. The RF connector interfaces 2 are configured as third-generation RF connector interfaces. The third-generation RF connector interface is designed to achieve stable and efficient transmission of RF signals, which can ensure low-loss transmission of signals between different devices or components and improve the signal quality of communication.

[0042] In use, Module Motherboard 1 employs an octa-core processor and a 4G full-network communication module, providing functional support through external expansion interface components. Its high integration allows for a completely IC-free external design. It features built-in WIFI, Bluetooth, GPS, USB, UART, SPI, I2C, GPIO, and NFC functions, offering a rich set of features. Module Motherboard 1 is a full-network 4G core module, using an MT6765 processor. The PCB utilizes a ten-layer HDI immersion gold process, exhibiting excellent electrical and anti-interference characteristics, ensuring stable and reliable operation. The module integrates 4G (LTE), 3G (WCDMA), GSM, GPS, WIFI, Bluetooth, audio management, and low-power power management functions, running on Android 11 / 12 operating systems. It operates simply by connecting a battery, making it an ideal choice for realizing portable mobile devices. Furthermore, Module Motherboard 1 not only integrates typical communication functions but also charging circuits, audio amplifiers, and backlight circuits, enabling a completely IC-free external design with high integration and simple design.

[0043] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A core module pad for electronic component integration, characterized in that: Includes a module motherboard (1), on which an external expansion interface component with a stamp hole encapsulation is provided, the external expansion interface component is disposed around the module motherboard (1), and the module motherboard (1) is provided with a processor and an antenna interface component for connecting an antenna; The external expansion interface component includes multiple stamp hole pins (3), which are located around the module motherboard (1) and are equidistant from each other.

2. A core module pad for electronic component integration according to claim 1, wherein: The stamp hole pins (3) on the left side of the module motherboard (1) are respectively: pin 1 for connecting the three-color lamp, pin 2 for connecting NFC, pin 3 for connecting the two serial ports, pin 4 for connecting SPI0, pin 5 for connecting the three I²C ports, and pin 6 for connecting the CTP.

3. A core module pad for electronic component integration according to claim 2, wherein: The stamp hole pins (3) on the lower side of the main board (1) of the module are respectively pin 7 for connecting 2 SIM cards, pin 8 for connecting T cards, pin 9 for connecting LCM and pin 10 for connecting audio headphones.

4. A core module pad for electronic component integration according to claim 3, wherein: The stamp hole pins (3) on the right side of the module motherboard (1) are respectively pin 11 for connecting the three-in-one sensor, pin 12 for connecting SPI2 and pin 13 for connecting the button matrix.

5. A core module pad for electronic component integration according to claim 4, wherein: The stamp hole pins (3) on the upper side of the main board (1) of the module are respectively pin 14 for connecting the front camera, pin 15 for connecting the flash, pin 16 for connecting the soft barcode and pin 16 for connecting the rear camera.

6. A core module pad for electronic component integration according to claim 5, wherein: The module motherboard (1) is a module motherboard (1) using a ten-layer HDI immersion gold process, and the module motherboard (1) has a size of 50mm*42mm*3.0mm.

7. A core module pad for electronic component integration according to claim 6, wherein: The antenna interface assembly includes three sets of radio frequency connector interfaces (2) for connecting the main antenna, diversity antenna and three-in-one antenna, and the three sets of radio frequency connector interfaces (2) are located at the three corners of the module motherboard (1).

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