Tool for ball grid array (BGA) ball mounting
By introducing a quantitative adjustment mechanism into the BGA ball-mounting fixture, and using a servo motor and hydraulic rod in conjunction with a suspended ball and an extrusion block, the problem of unadjustable molten solder was solved, achieving precise control of the molten solder, avoiding waste, and improving economic efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 西安伟宇佰川电子科技有限公司
- Filing Date
- 2025-05-19
- Publication Date
- 2026-04-28
AI Technical Summary
Existing BGA ball-mounting fixtures cannot adjust the amount of solder liquid dispensed according to demand, resulting in solder waste and increased economic losses.
A tooling with a quantitative adjustment mechanism was designed. Through the cooperation of a servo motor and a hydraulic rod, the precise control of the solder liquid volume is achieved. The quantitative discharge and back suction functions of the solder liquid are realized by the cooperation of a suspension ball and an extrusion block.
This allows for precise adjustment of the solder volume according to demand, avoiding waste of solder and improving economic efficiency.
Smart Images

Figure CN224168947U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of circuit board technology, and specifically relates to a tooling for BGA ball planting. Background Technology
[0002] BGA chip ball placement is a ball grid array packaging technology that involves soldering solder balls onto the bottom surface of the BGA chip. During soldering, a flat steel sheet is placed on the bottom surface of the BGA chip. The steel sheet has multiple ball placement holes that correspond one-to-one with the solder ball positions on the BGA chip. The steel sheet is placed on the bottom surface of the BGA chip, solder balls are sprinkled on it, and finally it is fixed.
[0003] Currently, Chinese utility model patent CN217822672U discloses a BGA chip ball-planting fixture. Existing ball-planting fixtures cannot adjust the amount of solder dispensed according to requirements during the ball-planting process, resulting in a large amount of solder being wasted and increasing economic losses. Utility Model Content
[0004] The purpose of this invention is to provide a tooling for BGA ball planting, which has the advantage of being able to adjust the amount of molten solder output according to different adjustment conditions to avoid economic losses.
[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a tooling for BGA ball implantation, including a worktable, a protective shell provided at one end of the worktable, a quantitative adjustment mechanism provided inside the protective shell, the quantitative adjustment mechanism including a U-shaped limiting rod, the two ends of the U-shaped limiting rod being fixedly installed inside the worktable, a hydraulic rod being fixedly installed at the end of the worktable near the protective shell, and a solder implantation end being fixedly installed at the end of the hydraulic rod away from the worktable.
[0006] By adopting the above technical solution, the quantitative adjustment mechanism 7 can be activated during use to adjust the output of molten tin according to demand.
[0007] The present invention is further configured such that a sliding groove is provided inside both ends of the U-shaped limiting rod, and a slider is movably installed inside the sliding groove.
[0008] The above technical solution is adopted: a sliding groove is opened inside both ends of the U-shaped limiting rod, which can limit the movement during the up and down movement and prevent misalignment during use.
[0009] The present invention is further configured such that an adjusting hydraulic rod is fixedly installed on one side of the slider, and the output end of the adjusting hydraulic rod is fixedly installed on one side of the center of the U-shaped limiting rod.
[0010] The above technical solution involves fixing an adjusting hydraulic rod to one side of the slider, allowing the slider's height to be adjusted during use.
[0011] The present invention is further configured such that a rectangular sleeve rod is movably installed inside the end of the slider away from the adjusting hydraulic rod, and a rectangular rod is movably installed inside one end of the rectangular sleeve rod. The end of the rectangular rod away from the rectangular sleeve rod passes through the U-shaped limiting rod and is connected to the output shaft of the servo motor. The servo motor is fixedly installed inside the protective housing.
[0012] The above technical solution involves a rectangular rod that is movably mounted inside one end of a rectangular sleeve and can rotate under the drive of a servo motor.
[0013] The present invention is further configured such that the end of the rectangular sleeve rod away from the rectangular rod moves through the slider and is fixedly installed with a pressing block, and the pressing block moves in contact with the outer surface of the movable shell.
[0014] The above technical solution involves a pressing block that is fixedly installed by passing through a slider at the end of a rectangular sleeve rod away from the rectangular rod, which can extrude molten solder during use.
[0015] The present invention is further configured such that the extrusion block is movably sleeved inside the fixed inner tube, the fixed inner tube is fixedly installed at the bottom of the inner side of the protective shell, and a return spring is movably sleeved on the outer surface of one end of the fixed inner tube.
[0016] The above technical solution involves a return spring that is movably fitted onto the outer surface of one end of the fixed inner tube, allowing the movable outer shell to spring back and reset during use.
[0017] The present invention is further configured such that a second suspended ball is movably installed at one end of the fixed inner tube, and a first suspended ball is movably installed inside one end of the movable outer shell.
[0018] The above technical solution is adopted: a second suspended ball is movably installed at one end of the fixed inner tube, and a first suspended ball is movably installed inside one end of the movable outer shell. The two suspended balls can move in opposite directions during use, forming a unidirectional restriction.
[0019] The present invention is further configured such that one end of the fixed inner tube is connected to the input hose, one end of the movable outer shell is fixedly installed with an output hose, and the end of the output hose away from the movable outer shell passes through the protective outer shell and is connected to the workbench and the soldering end.
[0020] Using the above technical solution: by connecting the end of the output hose away from the movable housing through the protective housing to the workbench and the soldering end, a certain amount of molten solder can be exported.
[0021] In summary, this utility model has the following beneficial effects:
[0022] 1. By activating the servo motor in the quantitative adjustment mechanism, the servo motor can work with the rectangular rod to drive the rectangular sleeve rod to rotate. When the rectangular sleeve rod rotates, the pressing block set at one end will rotate and press against one end of the movable shell. At this time, the movable shell will move downward, and the first suspended ball set inside will move upward. At this time, it will be discharged to the output hose and discharged from the soldering end. When the movable shell is reset by the reset spring, it will be lifted and the first suspended ball will be pressed against the outlet, while the second suspended ball will move away from the fixed inner tube. At this time, the solder liquid can be drawn up. This process can be repeated to adjust the amount of solder output during use.
[0023] 2. By activating the adjusting hydraulic rod, the adjusting hydraulic rod will drive the slider to move. After moving, the extrusion block set at one end of the rectangular sleeve rod will move up and down. When the extrusion block rotates, the contact with the movable shell will be too deep or too shallow, thereby adjusting the descent depth of the movable shell and thus adjusting the discharge volume of the molten solder. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the overall structure of the front of this utility model;
[0025] Figure 2 This is a side view of the present invention;
[0026] Figure 3 This is a front view of the adjusting hydraulic rod of this utility model;
[0027] Figure 4 This is a side view of the adjusting hydraulic rod of this utility model;
[0028] Figure 5 This is the utility model Figure 4 A cross-sectional view at point AA.
[0029] Reference numerals: 1. Input hose; 2. Protective housing; 3. Worktable; 4. Soldering end; 5. Output hose; 6. Hydraulic rod; 7. Quantitative adjustment mechanism; 701. Adjusting hydraulic rod; 702. Slider; 703. Slide groove; 704. U-shaped limit rod; 705. Servo motor; 706. Rectangular rod; 707. Rectangular sleeve rod; 708. Extrusion block; 709. First suspended ball; 710. Movable housing; 711. Second suspended ball; 712. Fixed inner tube; 713. Return spring. Detailed Implementation
[0030] The present invention will be further described in detail below with reference to the accompanying drawings.
[0031] Example 1:
[0032] refer to Figures 1 to 2 A tooling for BGA ball implantation includes a worktable 3, one end of which is provided with a protective shell 2. A quantitative adjustment mechanism 7 is provided inside the protective shell 2. The quantitative adjustment mechanism 7 includes a U-shaped limiting rod 704, both ends of which are fixedly installed inside the worktable 3. A hydraulic rod 6 is fixedly installed at the end of the worktable 3 near the protective shell 2, and a solder implantation end 4 is fixedly installed at the end of the hydraulic rod 6 away from the worktable 3. During use, the quantitative adjustment mechanism 7 can be activated to adjust the amount of solder liquid output as needed.
[0033] refer to Figures 3 to 5 The U-shaped limiting rod 704 has a sliding groove 703 inside both ends, and a slider 702 is movably installed inside the sliding groove 703. By having a sliding groove 703 inside both ends of the U-shaped limiting rod 704, it can be limited during the up and down movement to prevent misalignment during use.
[0034] refer to Figures 3 to 5 An adjusting hydraulic rod 701 is fixedly installed on one side of the slider 702. The output end of the adjusting hydraulic rod 701 is fixedly installed on one side of the center of the U-shaped limit rod 704. The height of the slider 702 can be adjusted during use by fixing the adjusting hydraulic rod 701 on one side of the slider 702.
[0035] refer to Figures 3 to 5 The extrusion block 708 is movably sleeved inside the fixed inner tube 712. The fixed inner tube 712 is fixedly installed at the bottom of the inner side of the protective shell 2. A return spring 713 is movably sleeved on the outer surface of one end of the fixed inner tube 712. By movably sleeved on the outer surface of one end of the fixed inner tube 712 with a return spring 713, the movable shell 710 can be springed back and reset during use.
[0036] refer to Figures 3 to 5 A second suspended ball 711 is movably installed at one end of the fixed inner tube 712, and a first suspended ball 709 is movably installed inside one end of the movable outer shell 710. The two suspended balls can move in opposite directions during use, forming a unidirectional restriction.
[0037] refer to Figures 3 to 5One end of the fixed inner tube 712 is connected to the input hose 1, and one end of the movable outer shell 710 is fixedly installed with an output hose 5. The end of the output hose 5 away from the movable outer shell 710 passes through the protective outer shell 2 and is connected to the workbench 3 and the soldering end 4. By passing through the protective outer shell 2 and the workbench 3 and the soldering end 4, a certain amount of molten solder can be discharged.
[0038] Brief description of the usage process: By activating the servo motor 705 in the quantitative adjustment mechanism 7, the servo motor 705 can work with the rectangular rod 706 to drive the rectangular sleeve rod 707 to rotate. When the rectangular sleeve rod 707 rotates, the pressing block 708 set at one end will rotate and press against one end of the movable housing 710. At this time, the movable housing 710 will move downward, and the first suspended ball 709 set inside will move upward. At this time, it will be discharged to the output hose 5 and discharged from the soldering end 4. When the movable housing 710 is reset by the reset spring 713, it will be raised and the first suspended ball 709 will be pressed against the outlet, while the second suspended ball 711 will move away from the fixed inner tube 712. At this time, the solder liquid can be drawn up. This process can be repeated to adjust the amount of solder dispensed during use.
[0039] Example 2:
[0040] Including references Figures 3 to 5 A tooling for BGA ball implantation is provided, wherein a rectangular sleeve rod 707 is movably mounted inside the end of the slider 702 away from the adjusting hydraulic rod 701, and a rectangular rod 706 is movably mounted inside the other end of the rectangular sleeve rod 707. The other end of the rectangular rod 706 away from the rectangular sleeve rod 707 passes through a U-shaped limiting rod 704 and is connected to the output shaft of a servo motor 705. The servo motor 705 is fixedly mounted inside the protective housing 2, and can rotate under the drive of the servo motor 705 through the rectangular rod 706 movably mounted inside the other end of the rectangular sleeve rod 707.
[0041] refer to Figures 3 to 5 The rectangular sleeve 707, with one end away from the rectangular rod 706, moves through the slider 702 and is fixedly installed with an extrusion block 708. The extrusion block 708 movably contacts the outer surface of the movable housing 710. The extrusion block 708, with one end of the rectangular sleeve 707 away from the rectangular rod 706, moves through the slider 702 and is fixedly installed with an extrusion block 708, can extrude molten solder during use.
[0042] Brief description of the usage process: By activating the adjusting hydraulic rod 701, the adjusting hydraulic rod 701 will drive the slider 702 to move. After moving, the extrusion block 708 set at one end of the rectangular sleeve rod will move up and down. When the extrusion block 708 rotates, the contact with the movable outer shell 710 will be too deep or too shallow, thereby adjusting the descent depth of the movable outer shell 710, thereby adjusting the discharge volume of molten solder.
[0043] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.
Claims
1. A fixture for BGA ball planting, comprising a worktable (3), characterized in that: One end of the workbench (3) is provided with a protective shell (2), and a quantitative adjustment mechanism (7) is provided inside the protective shell (2). The quantitative adjustment mechanism (7) includes a U-shaped limiting rod (704). The two ends of the U-shaped limiting rod (704) are fixedly installed inside the workbench (3). A hydraulic rod (6) is fixedly installed at the end of the workbench (3) near the protective shell (2), and a soldering end (4) is fixedly installed at the end of the hydraulic rod (6) away from the workbench (3).
2. The tooling for BGA ball planting according to claim 1, characterized in that: The U-shaped limiting rod (704) has a sliding groove (703) inside both ends, and a slider (702) is movably installed inside the sliding groove (703).
3. The tooling for BGA ball planting according to claim 2, characterized in that: An adjusting hydraulic rod (701) is fixedly installed on one side of the slider (702), and the output end of the adjusting hydraulic rod (701) is fixedly installed on one side of the center of the U-shaped limit rod (704).
4. The tooling for BGA ball planting according to claim 2, characterized in that: A rectangular sleeve (707) is movably installed inside the end of the slider (702) away from the adjusting hydraulic rod (701). A rectangular rod (706) is movably installed inside the end of the rectangular sleeve (707). The end of the rectangular rod (706) away from the rectangular sleeve (707) passes through the U-shaped limiting rod (704) and is connected to the output shaft of the servo motor (705). The servo motor (705) is fixedly installed inside the protective shell (2).
5. The tooling for BGA ball planting according to claim 4, characterized in that: The end of the rectangular sleeve (707) away from the rectangular rod (706) moves through the slider (702) and is fixedly installed with a pressing block (708), which makes contact with the outer surface of the movable housing (710).
6. The tooling for BGA ball planting according to claim 5, characterized in that: The extrusion block (708) is movably sleeved inside the fixed inner tube (712), which is fixedly installed at the bottom of the inner side of the protective shell (2). A return spring (713) is movably sleeved on the outer surface of one end of the fixed inner tube (712).
7. The tooling for BGA ball planting according to claim 6, characterized in that: A second suspended ball (711) is movably installed at one end of the fixed inner tube (712), and a first suspended ball (709) is movably installed inside one end of the movable outer shell (710).
8. The tooling for BGA ball planting according to claim 6, characterized in that: One end of the fixed inner tube (712) is connected to the input hose (1), and one end of the movable outer shell (710) is fixedly installed with an output hose (5). The end of the output hose (5) away from the movable outer shell (710) passes through the protective shell (2) and is connected to the workbench (3) and the soldering end (4).
Citation Information
Patent Citations
BGA (ball grid array) chip ball mounting tool jig
CN217822672U