All-steel tire code tracing chip laminating equipment
By combining a damping rod, a connecting spring, and a clamping frame, the problem of fixing the tire chip during bonding is solved, achieving precise bonding and stable data acquisition.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI GU DE INTELLIGENT TECH CO LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-01
AI Technical Summary
When implanting chips inside tires, it is difficult to ensure the accuracy of chip placement and tire fixation, leading to positional deviations that affect normal use and data collection.
The system employs a combination of damping rods, connecting springs, and clamping frames, and utilizes a servo motor and an electric telescopic rod to achieve stable tire fixation and precise chip bonding.
This ensures the stability of the tire patching process, avoids positional deviations, and guarantees the normal use of the chip and data acquisition efficiency.
Smart Images

Figure CN224183796U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of tire manufacturing technology, specifically relating to an all-steel tire traceability chip bonding device. Background Technology
[0002] The technology of implanting chips in tires is rapidly developing in the automotive industry. This technology mainly involves implanting radio frequency identification (RFID) chips in tires to enhance their functionality and safety.
[0003] Currently, when attaching chips inside tires, the accuracy of chip placement is required due to the specific requirements of the chip placement position. Furthermore, the tire position needs to be effectively fixed during the placement process to prevent tire movement from causing deviations in the placement position, which would affect the normal use of the tire and the normal data collection of the attached chip. Based on this, an all-steel tire traceability chip attaching device is proposed. Utility Model Content
[0004] The purpose of this invention is to provide a simple and reasonably designed all-steel tire traceability chip bonding device to solve the above problems.
[0005] This utility model achieves the above objectives through the following technical solutions:
[0006] A steel tire traceability chip bonding device includes a workbench, an electric slide table mounted on the top of the workbench, a slide frame mounted on the top of the electric slide table, a fixed frame fixedly connected to the top of the slide frame, a servo motor mounted on one side of the fixed frame, a threaded rod fixedly connected to the output end of the servo motor, a slider threaded through the outer surface of the threaded rod, a first electric telescopic rod fixedly connected to the bottom of the slider, a fixed plate fixedly connected to the bottom of the first electric telescopic rod, a patch bonding mechanism mounted on the bottom of the fixed plate, and a tire fixing mechanism fixedly connected to the top of the fixed plate.
[0007] As a further optimization of this utility model, the threaded rod passes through the fixed frame and is rotatably connected to the fixed frame, and the top of the slider is slidably connected to the fixed frame.
[0008] As a further optimization of this utility model, the patching mechanism includes a first rotary motor installed at the bottom of the fixed plate, a second electric telescopic rod installed on one side of the first rotary motor, a mounting bracket fixedly connected to the output end of the second electric telescopic rod, a second rotary motor installed on the mounting bracket, a rotating seat fixedly connected to the output end of the second rotary motor, a heating seat installed on the top of the rotating seat, and a placement groove opened on the top of the heating seat.
[0009] As a further optimization of this utility model, the rotating seat is rotatably connected to the mounting bracket.
[0010] As a further optimization of this utility model, the tire fixing mechanism includes a damping rod fixedly connected to the top of the fixing plate, a connecting spring sleeved on the outer surface of the damping rod, a connecting ring fixedly connected to the top of the damping rod, and a clamping frame fixedly connected to the outer surface of the connecting ring.
[0011] As a further optimization of this utility model, the top and bottom of the connecting spring are fixedly connected to the connecting ring and the fixing plate, respectively, and the connecting ring is sleeved on the outer surface of the first electric telescopic rod.
[0012] The beneficial effects of this utility model are as follows:
[0013] This invention utilizes a damping rod, connecting spring, connecting ring, and clamping frame in combination. As the patching mechanism moves downwards into the tire, the clamping frame first contacts the tire. Then, as the patching mechanism continues to move downwards, the clamping frame, through the damping rod, connecting spring, and connecting ring, presses the tire firmly, ensuring stability during the tire patching process. This prevents tire displacement during patching, avoiding positional deviations and ensuring patch quality. Ultimately, this guarantees the tire's normal operation and the chip's accurate data collection from the tire. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall frontal three-dimensional structure of this utility model;
[0015] Figure 2 This is a schematic diagram of the overall three-dimensional structure of the back of this utility model;
[0016] Figure 3 This is a side sectional view of the present invention;
[0017] Figure 4 This is the utility model Figure 3 Enlarged structural diagram at point A in the middle;
[0018] Figure 5 This is a schematic diagram of the frontal cross-section of this utility model;
[0019] Figure 6 This is the utility model Figure 5 Enlarged structural diagram at point B.
[0020] In the diagram: 1. Worktable; 2. Electric slide table; 3. Carriage; 4. Fixing frame; 5. Servo motor; 6. Threaded rod; 7. Slider; 8. First electric telescopic rod; 9. Fixing plate; 10. First rotary motor; 11. Second electric telescopic rod; 12. Mounting frame; 13. Second rotary motor; 14. Rotating seat; 15. Heating seat; 16. Placement slot; 17. Damping rod; 18. Connecting spring; 19. Connecting ring; 20. Clamping frame. Detailed Implementation
[0021] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.
[0022] Example: Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, an all-steel tire traceability chip bonding device includes a workbench 1, an electric slide table 2 mounted on the top of the workbench 1, a slide frame 3 mounted on the top of the electric slide table 2, a fixed frame 4 fixedly connected to the top of the slide frame 3, a servo motor 5 mounted on one side of the fixed frame 4, a threaded rod 6 fixedly connected to the output end of the servo motor 5, the threaded rod 6 passing through the fixed frame 4 and rotatably connected to the fixed frame 4, a slider 7 threadedly connected to the outer surface of the threaded rod 6, the top of the slider 7 slidably connected to the fixed frame 4, and a first electric telescopic rod 8 fixedly connected to the bottom of the slider 7. A fixing plate 9 is fixedly connected to the bottom of the electric telescopic pole 8. A patch mechanism is installed at the bottom of the fixing plate 9. A tire fixing mechanism is fixedly connected to the top of the fixing plate 9. The tire fixing mechanism includes a damping rod 17 fixedly connected to the top of the fixing plate 9. A connecting spring 18 is sleeved on the outer surface of the damping rod 17. A connecting ring 19 is fixedly connected to the top of the damping rod 17. The top and bottom of the connecting spring 18 are fixedly connected to the connecting ring 19 and the fixing plate 9, respectively. The connecting ring 19 is sleeved on the outer surface of the first electric telescopic pole 8. A clamping frame 20 is fixedly connected to the outer surface of the connecting ring 19.
[0023] In use, first place the tire on top of the workbench 1, then place the chip in the placement mechanism. At this point, activate the electric slide 2 and servo motor 5, causing the carriage 3 to move on the electric slide 2, changing the position of the first electric telescopic rod 8. During this process, the servo motor 5 will cause the threaded rod 6 to rotate, thereby moving the slider 7 on the fixed frame 4, changing the position of the first electric telescopic rod 8 so that it is aligned with the tire's axis. Then, activate the first electric telescopic rod 8 to move the fixed plate 9 downwards. As the fixed plate 9 moves downwards, it will cause the chip to be placed... The patching mechanism moves downward, allowing it to enter the tire. During this process, the clamping frame 20 first contacts the tire. Then, the continued extension of the first electric telescopic rod 8 stretches the damping rod 17 and the connecting spring 18, causing the clamping frame 20 to press the tire firmly through the damping rod 17 and the connecting spring 18. This ensures stability during the tire patching process, prevents tire displacement during patching, avoids deviations in patch position, and guarantees patch quality. This, in turn, ensures normal tire use and proper data acquisition by the chip.
[0024] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the chip mounting mechanism includes a first rotary motor 10 mounted on the bottom of the fixed plate 9. A second electric telescopic rod 11 is mounted on one side of the first rotary motor 10. A mounting bracket 12 is fixedly connected to the output end of the second electric telescopic rod 11. A second rotary motor 13 is mounted on the mounting bracket 12. A rotating seat 14 is fixedly connected to the output end of the second rotary motor 13. The rotating seat 14 is rotatably connected to the mounting bracket 12. A heating seat 15 is mounted on the top of the rotating seat 14. A placement groove 16 is opened on the top of the heating seat 15. The chip is placed in the placement groove 16, and the thickness of the chip is greater than the depth of the placement groove 16.
[0025] In use, the chip is first placed in the placement slot 16. When the chip-mounting mechanism enters the tire, the first rotary motor 10 is activated to adjust the chip's position until it is aligned with the chip-mounting position on the tire. Then, the second electric telescopic rod 11 is activated to send the chip into the tire sidewall, positioning it below the chip-mounting position inside the tire. The second rotary motor 13 is then activated according to the chip-mounting position, and the rotating seat 14 is used to adjust the chip's position, aligning it with the tire-mounting position. Finally, the first electric telescopic rod 8 is activated to retract, allowing the chip to... Once the chip is applied to the tire, the heating seat 15 can be activated to heat the chip and the tire, thus ensuring a tight bond between the chip and the tire's vulcanized layer. Then, the heating seat 15 is turned off, causing the first electric telescopic rod 8 to extend again. At this point, the chip detaches from the placement slot 16. Then, the second electric telescopic rod 11 is activated to fully retract, and the first electric telescopic rod 8 can be activated again to fully retract, allowing the tire to be removed. The operation is simple and quick, with high chip application efficiency, and it is suitable for chip application operations on tires of different sizes.
[0026] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.
Claims
1. A steel tire traceability chip bonding device, comprising a workbench (1), characterized in that: An electric slide table (2) is installed on the top of the workbench (1). A slide frame (3) is installed on the top of the electric slide table (2). A fixed frame (4) is fixedly connected to the top of the slide frame (3). A servo motor (5) is installed on one side of the fixed frame (4). A threaded rod (6) is fixedly connected to the output end of the servo motor (5). A slider (7) is threaded through the outer surface of the threaded rod (6). A first electric telescopic rod (8) is fixedly connected to the bottom of the slider (7). A fixed plate (9) is fixedly connected to the bottom of the first electric telescopic rod (8). A patching mechanism is installed at the bottom of the fixed plate (9). A tire fixing mechanism is fixedly connected to the top of the fixed plate (9).
2. The all-steel tire traceability chip bonding device according to claim 1, characterized in that: The threaded rod (6) passes through the fixed frame (4) and is rotatably connected to the fixed frame (4), and the top of the slider (7) is slidably connected to the fixed frame (4).
3. The all-steel tire traceability chip bonding device according to claim 1, characterized in that: The patching mechanism includes a first rotary motor (10) installed at the bottom of the fixed plate (9). A second electric telescopic rod (11) is installed on one side of the first rotary motor (10). A mounting bracket (12) is fixedly connected to the output end of the second electric telescopic rod (11). A second rotary motor (13) is installed on the mounting bracket (12). A rotating seat (14) is fixedly connected to the output end of the second rotary motor (13). A heating seat (15) is installed on the top of the rotating seat (14). A placement groove (16) is opened on the top of the heating seat (15).
4. The all-steel tire traceability chip bonding device according to claim 3, characterized in that: The rotating seat (14) is rotatably connected to the mounting bracket (12).
5. The all-steel tire traceability chip bonding device according to claim 1, characterized in that: The tire fixing mechanism includes a damping rod (17) fixedly connected to the top of the fixing plate (9), a connecting spring (18) is sleeved on the outer surface of the damping rod (17), a connecting ring (19) is fixedly connected to the top of the damping rod (17), and a clamping frame (20) is fixedly connected to the outer surface of the connecting ring (19).
6. The all-steel tire traceability chip bonding device according to claim 5, characterized in that: The top and bottom of the connecting spring (18) are fixedly connected to the connecting ring (19) and the fixing plate (9) respectively, and the connecting ring (19) is sleeved on the outer surface of the first electric telescopic rod (8).